CN214428618U

CN214428618U - Semiconductor processing equipment

Info

Publication number: CN214428618U
Application number: CN202022341788.6U
Authority: CN
Inventors: 包安勇
Original assignee: Jiangsu Aisi Semiconductor Technology Co ltd
Current assignee: Jiangsu Aisi Semiconductor Technology Co ltd
Priority date: 2020-10-20
Filing date: 2020-10-20
Publication date: 2021-10-19
Anticipated expiration: 2030-10-20

Abstract

The utility model discloses a semiconductor processing device, which comprises a machine body, a first gear is fixedly sleeved on a driving end of a first motor, a second gear is meshed on one side of the first gear, a rotating rod is fixedly sleeved inside the second gear, one end of the rotating rod extending into the machine body is fixedly connected with a threaded column, the threaded column is rotatably connected with the bottom of the machine body, the outer wall of the threaded column is in threaded connection with a first transverse plate, one side of the first transverse plate, which is far away from the threaded column, is in sliding connection with a supporting column, an evaporation device is fixedly installed at the top of the first transverse plate, a nozzle is fixedly installed at the top of the evaporation device, a second motor is fixedly installed at one side of the machine body, a rotating rod is fixedly installed at the driving end of the second motor, a vacuum suction cup is fixedly installed at one end of the rotating rod, which is far away from the second motor, when the coating degree is required to be changed according to the situation, the rotating of the threaded column can make the evaporation device move up and down, the distance can be adjusted at will, the operation is convenient, and the practicability is high.

Description

Semiconductor processing equipment

Technical Field

The utility model relates to a semiconductor processing technology field specifically is a semiconductor processing equipment.

Background

The substance has various forms, and is classified according to the conductivity of the substance, and the substance can be classified into an insulator and a conductor, the insulator has poor conductivity, such as common amber, ceramic and the like, while the conductor has good conductivity, such as gold, silver, iron and other materials, different from the insulator and the conductor, the semiconductor is a material between the conductor and the insulator, the conductivity can be controlled, and the semiconductor has many applications, particularly in the fields of computers, mobile phones and the like, and in factories, when the semiconductor is processed, the semiconductor needs to be polished, coated and the like.

The semiconductor evaporation coating is to heat and volatilize a coating material to be attached to the surface of a semiconductor element to form a coating layer, but the existing semiconductor coating processing equipment cannot adjust the distance between an evaporation device and the semiconductor element, cannot change the coating effect in real time according to the requirement and has the limitation of coating.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor processing equipment to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a semiconductor processing device comprises a machine body, a device box is fixedly mounted at the top of the machine body, a first motor is fixedly mounted inside the device box, a first gear is fixedly sleeved at the driving end of the first motor, a second gear is meshed at one side of the first gear and is positioned above the device box, a rotating rod is fixedly sleeved inside the second gear and is rotatably connected with the device box, a threaded column is fixedly connected at one end of the rotating rod extending into the machine body and is rotatably connected with the bottom of the machine body, a first transverse plate is connected with the outer wall of the threaded column in a threaded manner, a supporting column is slidably connected at one side of the first transverse plate far away from the threaded column, an evaporation device is fixedly mounted at the top of the first transverse plate, a nozzle is fixedly mounted at the top of the evaporation device, a second motor is fixedly mounted at one side of the machine body, and a rotary rod is fixedly mounted at the driving end of the second motor, one end fixed mounting that motor two was kept away from to the rotary rod has vacuum chuck, the top swing joint of organism has the threaded rod, threaded rod bottom swing joint have with organism inner wall fixed connection's diaphragm two, the back fixed mounting of organism has the cylinder.

As a further aspect of the present invention: the utility model discloses a quick-witted fixed telescopic link, including the threaded rod, the both sides threaded connection of threaded rod has slider one, one side that slider one is close to the wheel of polishing articulates there is the catch bar, the catch bar is kept away from that the one end of slider one articulates there is the L template, and is two sets of one side that the catch bar is close to each other is equipped with the dog of symmetric distribution, and dog and catch bar fixed connection, and is two sets of fixed mounting has flexible post, one of them between the L template slip recess three has been seted up at the top of L template, slip recess three inside sliding connection has fixed telescopic link, fixed telescopic link internally mounted has the second spring, fixed telescopic link's top fixed mounting has slider two, slider two and organism sliding connection.

As a further aspect of the present invention: the utility model discloses a portable electronic device, including organism, slider, threaded rod, fixed recess, screw hole, fixed recess, fixed block inner wall sliding connection, the top of organism is seted up slip recess one, the outer wall of threaded rod rotates and is connected with slider three, and slider three and slip recess sliding connection, fixed recess has been seted up to one side at slider three top, set up threaded hole on the slider three, and threaded hole and fixed recess bottom are linked together, two promotion recesses have been seted up at the organism top, promote recess inner wall sliding connection and have the fixed block, and fixed block and fixed recess looks adaptation, the fixed block stretches into one side fixed mounting that promotes the recess has first spring, the other end of first spring is connected with promotion recess inner wall.

As a further aspect of the present invention: and a second sliding groove is formed in the top of the second transverse plate, a fourth sliding block is rotatably connected to the outer wall of the bottom of the threaded rod, and the fourth sliding block is slidably connected with the second sliding groove.

As a further aspect of the present invention: the output end of the air cylinder is fixedly connected with a U-shaped frame, a motor III is fixedly mounted on one side, far away from the air cylinder, of the U-shaped frame, and a polishing wheel is fixedly mounted at the driving end of the motor III.

As a further aspect of the present invention: the both sides screw thread opposite direction of threaded rod, the top fixed mounting of threaded rod has the handle, threaded connection has the screw thread nail on the fixed block, and screw thread nail and screw hole looks adaptation.

Compared with the prior art, the beneficial effects of the utility model are that:

1. when polishing, a semiconductor workpiece is placed between L-shaped plates, a handle is rotated to enable a threaded rod to rotate, the threaded rod drives two first sliding blocks to approach each other, the first sliding blocks push the L-shaped plates to the left through a first pushing rod, when the first sliding blocks move continuously, a pushing rod is contacted with a stop block and is limited by the stop block, the pushing rod drives the L-shaped plates to move up and down to clamp the workpiece up and down, after the L-shaped plates clamp the semiconductor workpiece, the handle is loosened, the third sliding block slides, when the semiconductor workpiece is aligned with a polishing wheel, when a fixed block is abutted against the inner wall of a fixed groove, a threaded nail and a threaded hole are positioned on the same straight line, the threaded nail is rotated to fix the threaded rod, an air cylinder is started, the semiconductor workpiece is polished through the polishing wheel, and the left and right movement of the semiconductor workpiece can be realized by adjusting the position of the threaded rod, convenient to control, the operation of tight takedown is pressed from both sides to the work piece to the rotatory handle of accessible, be convenient for adjust, when the degree of polishing of needs according to the circumstances control semiconductor work piece, accessible cylinder adjusts around going on the wheel of polishing, high use efficiency, when need not press from both sides the tight time to semiconductor work piece, because the effect of fixed telescopic link and second spring, the skew of L template has been avoided, avoid influencing the normal use of L template, because fixed telescopic link bottom and L template sliding connection, fixed telescopic link top fixed connection's slider two and organism sliding connection, make the integrated device can unrestricted removal, the simple operation, the clamp of the work piece of being convenient for is tight and fixed, the efficiency of polishing is improved.

2. During coating, after polishing, the screw thread nail rotates, after fixed recess and fixed block separation, slip slider three, the threaded rod removes to semiconductor work piece and vacuum chuck after adsorbing, the fixed threaded rod, the rotation handle, make two sets of sliders I keep away from each other, drive the L template and keep away from each other, start evaporation plant, make coating material upwards evaporate through the nozzle and adhere to on semiconductor work piece, starter motor two, make semiconductor work piece rotatory, realize even cover, when needs change coating film degree according to the circumstances, starter motor one, make gear drive gear two rotate, gear two drives the dwang and rotates, the dwang drives the screw thread post and rotates, the screw thread post rotates and makes evaporation plant reciprocate, can adjust the distance at will, and the operation is convenient for, and the practicality is high.

Drawings

FIG. 1 is a schematic diagram of a semiconductor processing apparatus;

FIG. 2 is a schematic side view of a semiconductor processing apparatus;

FIG. 3 is an enlarged view of FIG. 2 taken at A in a semiconductor processing apparatus;

fig. 4 is a schematic view illustrating the installation of a fixing block in a semiconductor processing apparatus.

In the figure: the machine body comprises a machine body 1, a threaded column 2, a rotating rod 3, an evaporation device 4, a first transverse plate 5, a supporting column 6, a rotating rod 7, a vacuum sucker 8, a threaded rod 9, a second transverse plate 10, a cylinder 11, a polishing wheel 12, a first gear 13, a second gear 14, a first sliding block 15, a pushing rod 16, a fixed telescopic rod 17, a second sliding block 18, an L-shaped plate 19, a telescopic column 20, a stop block 21, a third sliding block 22, a fixed groove 23 and a fixed block 24.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, in an embodiment of the present invention, a semiconductor processing apparatus includes a machine body 1, a device box is fixedly installed on a top of the machine body 1, a motor i is fixedly installed inside the device box, a gear i 13 is fixedly sleeved on a driving end of the motor i, a gear ii 14 is engaged on one side of the gear i 13, the gear i 13 and the gear ii 14 are both located above the device box, a rotating rod 3 is fixedly sleeved inside the gear ii 14, the rotating rod 3 is rotatably connected with the device box, a threaded column 2 is fixedly connected to one end of the rotating rod 3 extending into the machine body 1, the threaded column 2 is rotatably connected with a bottom of the machine body 1, a cross plate i 5 is threadedly connected to an outer wall of the threaded column 2, a support column 6 is slidably connected to one side of the cross plate i 5 away from the threaded column 2, an evaporation device 4 is fixedly installed on a top of the cross plate i 5, a nozzle is fixedly installed on a top of the evaporation device 4, a second motor is fixedly arranged on one side of the machine body 1, a rotary rod 7 is fixedly arranged at the driving end of the second motor, a vacuum sucker 8 is fixedly arranged at one end of the rotary rod 7 far away from the second motor, the top of the machine body 1 is movably connected with a threaded rod 9, the bottom of the threaded rod 9 is movably connected with a second transverse plate 10 fixedly connected with the inner wall of the machine body 1, an air cylinder 11 is fixedly arranged on the back surface of the machine body 1, two sides of the threaded rod 9 are in threaded connection with first sliders 15, one sides of the first sliders 15 close to the polishing wheel 12 are hinged with a push rod 16, one ends of the push rods 16 far away from the first sliders 15 are hinged with L-shaped plates 19, one sides of the two groups of push rods 16 close to each other are provided with symmetrically distributed stop blocks 21, the stop blocks 21 are fixedly connected with the push rods 16, a telescopic column 20 is fixedly arranged between the two groups of L-shaped plates 19, a third sliding groove is formed in the top of one L-shaped plate 19, and a fixed telescopic rod 17 is slidably connected inside the third sliding groove, the second spring is arranged in the fixed telescopic rod 17, the second slide block 18 is fixedly arranged at the top of the fixed telescopic rod 17, the second slide block 18 is connected with the machine body 1 in a sliding manner, the top of the machine body 1 is provided with a first sliding groove, the outer wall of the threaded rod 9 is connected with a third slide block 22 in a rotating manner, the third slide block 22 is connected with the first sliding groove in a sliding manner, one side of the top of the third slide block 22 is provided with a fixed groove 23, the third slide block 22 is provided with a threaded hole, the threaded hole is communicated with the bottom of the fixed groove 23, the top of the machine body 1 is provided with two pushing grooves, the inner wall of each pushing groove is connected with a fixed block 24 in a sliding manner, the fixed block 24 is matched with the fixed groove 23, one side of the fixed block 24 extending into the pushing groove is fixedly provided with the first spring, the other end of the first spring is connected with the inner wall of the pushing groove, the top of the transverse plate two 10 is provided with a second sliding groove, the outer wall of the bottom of the threaded rod 9 is connected with a fourth slide block in a rotating manner, the sliding block four is connected with the sliding groove two in a sliding manner, so that the whole device can move without limit, the operation is convenient, the clamping and fixing of a workpiece are convenient, the polishing efficiency is improved, the output end of the air cylinder 11 is fixedly connected with a U-shaped frame, one side of the U-shaped frame, which is far away from the air cylinder 11, is fixedly provided with a motor three, the driving end of the motor three is fixedly provided with a polishing wheel 12, the distance can be adjusted at will, the operation is convenient, the practicability is high, the directions of threads on two sides of the threaded rod 9 are opposite, the top of the threaded rod 9 is fixedly provided with a handle, a threaded nail is connected on the fixing block 24 in a threaded manner and is matched with the threaded hole, the left and right movement of the semiconductor workpiece can be realized by adjusting the position of the threaded rod 9, the control is convenient, the workpiece can be clamped and taken off by rotating the handle, the adjustment is convenient, when the polishing degree of the semiconductor workpiece is required to be controlled according to the situation, the grinding wheel 12 can be adjusted back and forth through the air cylinder 11, and the using efficiency is high.

The utility model discloses a theory of operation is:

when polishing, a semiconductor workpiece is placed between the L-shaped plates 19, the handle is rotated to enable the threaded rod 9 to rotate, the threaded rod 9 drives the two first sliding blocks 15 to approach each other, the first sliding blocks 15 push the L-shaped plates 19 to the left through the first pushing rods 16, when the first sliding blocks 15 continue to move, the pushing rods 16 are in contact with the stop blocks 21, the pushing rods 16 are limited by the stop blocks 21, the pushing rods 16 drive the L-shaped plates 19 to move up and down to clamp the workpiece up and down, after the L-shaped plates 19 clamp the semiconductor workpiece, the handle is loosened, the third sliding blocks 22 slide, when the semiconductor workpiece is aligned with the polishing wheel 12, when the fixing blocks 24 are abutted against the inner wall of the fixing groove 23, the threaded nails and the threaded holes are located on the same straight line, the threaded nails are rotated to fix the threaded rod 9, the air cylinder 11 is started, the semiconductor workpiece is polished through the polishing wheel 12, and left and right movement of the semiconductor workpiece can be realized by adjusting the position of the threaded rod 9, convenient to control, the operation of accessible rotation handle pressing from both sides tight the taking off is carried out to the work piece, be convenient for adjust, when the degree of polishing of needs according to circumstances control semiconductor work piece, accessible cylinder 11 is adjusted around going on polishing wheel 12, high use efficiency, when need not press from both sides tight semiconductor work piece, because the effect of fixed telescopic link 17 and second spring, the offset of L template 19 has been avoided, avoid influencing L template 19's normal use, because fixed telescopic link 17 bottom and L template 19 sliding connection, fixed telescopic link 17 top fixed connection's two 18 of slider and organism 1 sliding connection, make the overall device can unrestricted removal, the simple operation, the clamp of the work piece of being convenient for is tight and fixed, the efficiency of polishing has been improved.

During film coating, after polishing, the screw thread nail rotates, after the fixed groove 23 is separated from the fixed block 24, the third sliding block 22 slides, the threaded rod 9 moves to the position where a semiconductor workpiece is adsorbed by the vacuum chuck 8, the threaded rod 9 is fixed, the handle is rotated, the first two groups of sliding blocks 15 are far away from each other, the L-shaped plate 19 is driven to be far away from each other, the evaporation device 4 is started, the coating material is upwards evaporated through the nozzle and attached to the semiconductor workpiece, the second motor is started, the semiconductor workpiece rotates, uniform covering is achieved, when the coating degree is changed according to the situation, the first gear 13 drives the second gear 14 to rotate, the second gear 14 drives the rotating rod 3 to rotate, the rotating rod 3 drives the threaded column 2 to rotate, the threaded column 2 rotates to enable the evaporation device 4 to move up and down, the distance can be adjusted at will, operation is convenient, and the practicability is high.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. A semiconductor processing apparatus comprising a body (1), characterized in that: the top fixed mounting of organism (1) has the device box, the inside fixed mounting of device box has motor one, the fixed cover of drive end of motor one has connect gear one (13), one side meshing of gear one (13) has gear two (14), and gear one (13) and gear two (14) all are located the top of device box, the inside fixed dwang (3) that has cup jointed of gear two (14), and dwang (3) and device box rotate to be connected, the one end fixedly connected with screw thread post (2) that dwang (3) stretched into organism (1), and screw thread post (2) and the bottom of organism (1) rotate to be connected, the outer wall threaded connection of screw thread post (2) has diaphragm one (5), one side sliding connection that screw thread post (2) was kept away from in diaphragm (5) has support column (6), the top fixed mounting of diaphragm one (5) has evaporation plant (4), the top fixed mounting of evaporation plant (4) has the nozzle, one side fixed mounting of organism (1) has motor two, the drive end fixed mounting of motor two has rotary rod (7), the one end fixed mounting that motor two was kept away from in rotary rod (7) has vacuum chuck (8), the top swing joint of organism (1) has threaded rod (9), threaded rod (9) bottom swing joint has diaphragm two (10) with organism (1) inner wall fixed connection, the back fixed mounting of organism (1) has cylinder (11).

2. The semiconductor processing apparatus of claim 1, wherein: two sides of the threaded rod (9) are in threaded connection with a first sliding block (15), one side of the first sliding block (15) close to the grinding wheel (12) is hinged with a push rod (16), one end of each push rod (16) far away from the first sliding block (15) is hinged with an L-shaped plate (19), one side of each two groups of push rods (16) close to each other is provided with symmetrically distributed stop blocks (21), the stop block (21) is fixedly connected with the push rod (16), a telescopic column (20) is fixedly arranged between the two groups of L-shaped plates (19), the top of one of the L-shaped plates (19) is provided with a third sliding groove, the inside of the third sliding groove is connected with a fixed telescopic rod (17) in a sliding way, fixed telescopic link (17) internally mounted has the second spring, the top fixed mounting of fixed telescopic link (17) has slider two (18), slider two (18) and organism (1) sliding connection.

3. The semiconductor processing apparatus of claim 1, wherein: the top of organism (1) is seted up slip recess one, the outer wall of threaded rod (9) is rotated and is connected with slider three (22), and slider three (22) and a slip recess sliding connection, fixed recess (23) have been seted up to one side at slider three (22) top, set up threaded hole on slider three (22), and threaded hole and fixed recess (23) bottom are linked together, two promotion recesses have been seted up at organism (1) top, promote recess inner wall sliding connection has fixed block (24), and fixed block (24) and fixed recess (23) looks adaptation, one side fixed mounting that promotes the recess is stretched into in fixed block (24) has first spring, the other end of first spring is connected with the promotion recess inner wall.

4. The semiconductor processing apparatus of claim 1, wherein: and a second sliding groove is formed in the top of the second transverse plate (10), a fourth sliding block is rotatably connected to the outer wall of the bottom of the threaded rod (9), and the fourth sliding block is slidably connected with the second sliding groove.

5. The semiconductor processing apparatus of claim 1, wherein: the output end of the air cylinder (11) is fixedly connected with a U-shaped frame, a motor III is fixedly mounted on one side, away from the air cylinder (11), of the U-shaped frame, and a grinding wheel (12) is fixedly mounted at the driving end of the motor III.

6. A semiconductor processing apparatus according to claim 3, wherein: the both sides screw thread opposite direction of threaded rod (9), the top fixed mounting of threaded rod (9) has the handle, threaded connection has the screw on fixed block (24), and screw hole looks adaptation.