CN214427186U - Chip bonding interface shear strength test equipment - Google Patents
Chip bonding interface shear strength test equipment Download PDFInfo
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- CN214427186U CN214427186U CN202120572577.5U CN202120572577U CN214427186U CN 214427186 U CN214427186 U CN 214427186U CN 202120572577 U CN202120572577 U CN 202120572577U CN 214427186 U CN214427186 U CN 214427186U
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- Prior art keywords
- workbench
- bearing
- shear strength
- top surface
- plate
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- 238000012360 testing method Methods 0.000 title claims abstract description 45
- 239000012790 adhesive layer Substances 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000002052 molecular layer Substances 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 2
- 238000010008 shearing Methods 0.000 abstract description 9
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Abstract
The utility model provides a chip bonding interface shear strength test device, which relates to the technical field of chip testing and comprises a bearing base, support columns and a bearing top plate, wherein the four corners of the top surface of the bearing base are fixedly provided with the support columns, the top ends of the support columns are welded with the four corners of the bottom surface of the bearing top plate, the central position of the top surface of the bearing base is fixedly provided with a workbench, a test device is arranged between the support columns at the two sides of the workbench and comprises an air cylinder, a push plate and a dynamometer, a measuring scale is fixedly arranged at the position where the top surface of the bearing bottom plate is abutted against the edge of the top surface of the workbench, the measuring length is equal to the length and the width of the workbench, an adhesive layer is coated on the top surface of the workbench, the bottom surface of the bearing top plate is respectively provided with a conveying device and a limiting device, the measuring scale accurately positions of chips on the surface of the workbench, the chip bonding area of the chips is calculated, and the shearing force of the dynamometer after the chips are bonded is monitored by the promotion of the test device, the shearing strength of the chip can be accurately calculated, and the calculation precision of the shearing strength is improved.
Description
Technical Field
The utility model relates to a chip test technical field especially relates to chip bonding interface shear strength test equipment.
Background
The shear strength represents the maximum breaking load of the adhesive in unit area when the adhesive is stressed in the tangential direction, and can be divided into tensile shear strength, compressive shear strength, torsional shear strength, bending shear strength and the like according to the stress mode, wherein the tensile shear strength is most commonly used, and the shear strength of a chip in the actual production process is an important test performance.
When the existing shear strength of the chip is tested, the direct test of the shear force is usually carried out by adopting thrust, the shear area of the bottom surface of the chip cannot be accurately measured, so that the measurement of the shear strength is not accurate enough, and the actual production test of the chip is not facilitated.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the shortcoming that exists among the prior art, and the chip bonding interface shear strength test equipment who proposes.
In order to achieve the above purpose, the utility model adopts the following technical scheme: chip bonding interface shear strength test equipment, including bearing base, support column and bearing roof, the fixed support column that is equipped with in bearing base top surface four corners, support column top and bearing roof bottom surface four corners welded fastening, bearing base top surface central point puts the fixed workstation that is equipped with, all be equipped with testing arrangement between the support column of workstation both sides, testing arrangement includes cylinder, push pedal and dynamometer, the fixed dipperstick that is equipped with in bearing bottom plate top surface and workstation top surface edge counterbalance department, measuring length is the same with workstation length width homogeneous phase, workstation top surface coating is equipped with the adhesive linkage, bearing roof bottom surface is equipped with conveyer and stop device respectively, and bearing roof (4) bottom surface has seted up the cavity.
Preferably, all be equipped with first linear electric motor between the support column of workstation both sides, and first linear electric motor's output shaft is fixed with support column side parallel key, first linear electric motor's side and cylinder bottom surface fixed connection, and the cylinder level is placed, one side top surface that first linear electric motor was kept away from to the cylinder is fixed and is equipped with the dynamometer, and the output shaft electric connection of dynamometer and cylinder, the output shaft end fixing of cylinder is equipped with the push pedal.
Preferably, the cavity is formed in the bottom surface of the bearing top plate, the limiting device comprises a second linear motor and a limiting plate, an output shaft of the second linear motor is fixedly connected with the inner side surface of the bearing top plate, a limiting telescopic rod is fixedly arranged on the bottom surface of the second linear motor, and the bottom end of the limiting telescopic rod is fixedly connected with the center of the top surface of the limiting plate.
Preferably, conveyer includes conveyer belt and mechanical clamping jaw, the inside front of bearing roof and back department symmetric distribution are equipped with the power shaft, and power shaft both ends embedding bearing roof side, the vertical central point of power shaft puts the back department and all fixes and is equipped with the fixed pulley, the fixed pulley surface winding is equipped with the conveyer belt, the conveyer belt is close to one side surface of bottom and cup joints and is equipped with the sliding block, the fixed centre gripping telescopic link that is equipped with in sliding block bottom, the fixed mechanical clamping jaw that is equipped with in centre gripping telescopic link bottom.
Preferably, the bottom surface of the push plate of the testing device and the top surface of the bonding layer are located on the same horizontal plane, and a silica gel layer is arranged on the side surface, far away from the first linear motor, of the push plate.
Preferably, the bonding layer on the surface of the workbench is a nano layer, and the testing devices on the two sides of the workbench are electrically connected.
Preferably, one surface of the limiting plate, which is far away from the limiting telescopic rod, is subjected to smooth polishing treatment, and the outer edge of the limiting plate is subjected to round angle smooth treatment.
Advantageous effects
The utility model discloses in, adopt the dipperstick to carry out the accurate positioning to the position of the chip on workstation surface, carry out the calculation of chip bonding area, carry out vertical spacing to the chip top surface through stop device, prevent that the chip from damaging under the effect of shear force, through testing arrangement's promotion, make the dynamometer monitor the shear force after the chip bonds, the accurate shear strength who calculates the chip of being convenient for increases the precision that shear strength calculated.
Drawings
FIG. 1 is a schematic perspective view of a device for testing shear strength of a chip bonding interface;
FIG. 2 is an enlarged view of FIG. 1-A;
FIG. 3 is a front cross-sectional view of a shear strength testing apparatus for a die attach interface;
FIG. 4 is an internal structure diagram of the shear strength testing apparatus for chip bonding interface;
fig. 5 is a side sectional view of the chip bonding interface shear strength testing apparatus.
Illustration of the drawings:
1. a load-bearing base; 2. a testing device; 201. a first linear motor; 202. a cylinder; 203. pushing the plate; 204. a force gauge; 3. a support pillar; 4. a load bearing top plate; 5. a work table; 6. an adhesive layer; 7. measuring a scale; 8. a conveying device; 801. a power shaft; 802. a fixed pulley; 803. a conveyor belt; 804. a slider; 805. clamping the telescopic rod; 806. a mechanical jaw; 9. a limiting device; 901. a second linear motor; 902. limiting the telescopic rod; 903. and a limiting plate.
Detailed Description
In order to make the technical means, the creation features, the achievement purposes and the functions of the present invention easy to understand, the present invention will be further explained below with reference to the following embodiments and the accompanying drawings, but the following embodiments are only the preferred embodiments of the present invention, and not all embodiments are included. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention.
Specific embodiments of the present invention will be described below with reference to the accompanying drawings.
The specific embodiment is as follows:
referring to fig. 1-5, a chip bonding interface shear strength testing device comprises a bearing base 1, support columns 3 and a bearing top plate 4, wherein the support columns 3 are fixedly arranged at four corners of the top surface of the bearing base 1, the top ends of the support columns 3 are welded and fixed with four corners of the bottom surface of the bearing top plate 4, a workbench 5 is fixedly arranged at the center position of the top surface of the bearing base 1, a testing device 2 is arranged between the support columns 3 at two sides of the workbench 5, the testing device 2 comprises an air cylinder 202, a push plate 203 and a dynamometer 204, a measuring scale 7 is fixedly arranged at the position where the top surface of the bearing top plate 4 is abutted to the edge of the top surface of the workbench 5, the measuring length is equal to the length and the width of the workbench 5, a bonding layer 6 is coated on the top surface of the workbench 5, a conveying device 8 and a limiting device 9 are respectively arranged on the bottom surface of the workbench 5, the bonding of the bottom of a chip is bonded through the bonding layer 6, the measuring scale 7 corresponding to the bottom surface of the chip is vertical through observation, calculate the back record to chip bottom surface area, adopt dipperstick 7 to carry out the accurate positioning to the position of the chip on workstation 5 surface, carry out the calculation of chip bonding area, conveyer 8 conveys the chip to workstation 5 surface, carry out vertical spacing to the chip top surface through stop device 9, prevent that the chip from damaging under the effect of shearing force, promotion through testing arrangement 2, make dynamometer 204 monitor the shearing force after the chip bonds, the accurate shear strength who calculates the chip of being convenient for, increase the precision that shear strength calculated.
The first linear motor 201 is arranged between the support columns 3 at two sides of the workbench 5, the output shaft of the first linear motor 201 is fixed with the side surface flat keys of the support columns 3, the side surface of the first linear motor 201 is fixedly connected with the bottom surface of the air cylinder 202, the air cylinder 202 is horizontally arranged, the top surface of one side of the air cylinder 202 far away from the first linear motor 201 is fixedly provided with the dynamometer 204, the dynamometer 204 is electrically connected with the output shaft of the air cylinder 202, the end part of the output shaft of the air cylinder 202 is fixedly provided with the push plate 203, the position of the whole testing device 2 is adjusted according to the position of the chip by the first linear motor 201, the push plate 203 is matched with the side surface of the chip, the push plate 203 is driven to be close to and abutted against the side surface of the chip at the top surface of the workbench 5 by the extension of the output shaft of the air cylinder 202, so that the push plate 203 of the testing device 2 at one side of the chip continuously performs thrust action on the chip, and the chip stops after the minimum displacement occurs on the surface of the adhesive layer, at the moment, the dynamometer 204 of the testing device 2 at the other side of the chip records the shearing force, the dynamometer 204 is observed to display numerical values, the shearing force is recorded, the shearing force is divided by the area of the bottom surface of the chip, the obtained numerical values are recorded as the shearing strength of the chip, the bottom surface of the bearing top plate 4 is provided with a cavity, the limiting device 9 comprises a second linear motor 901 and a limiting plate 903, the output shaft of the second linear motor 901 is fixedly connected with the inner side surface of the bearing top plate 4, the bottom surface of the second linear motor 901 is fixedly provided with a limiting telescopic rod 902, the bottom end of the limiting telescopic rod 902 is fixedly connected with the central position of the top surface of the limiting plate 903, the limiting device 9 is driven by the second linear motor 901 to move, the limiting plate 903 is positioned on the top surface of the chip, the bottom surface of the limiting plate 903 is abutted against the surface of the chip by extending the limiting telescopic rod 902, and the chip is limited in the vertical direction, the chip is prevented from being bent in the vertical direction after the chip is pushed by the testing device 2 to move, and the chip is protected.
The conveying device 8 comprises a conveying belt 803 and a mechanical clamping jaw 806, wherein power shafts 801 are symmetrically distributed on the front side and the back side inside the bearing top plate 4, two ends of each power shaft 801 are embedded into the side surface of the bearing top plate 4, a fixed pulley 802 is fixedly arranged on the back side of the vertical center position of each power shaft 801, the conveying belt 803 is wound on the surface of each fixed pulley 802, a sliding block 804 is sleeved on the surface of one side, close to the bottom, of each conveying belt 803, a clamping telescopic rod 805 is fixedly arranged at the bottom of each sliding block 804, a mechanical clamping jaw 806 is fixedly arranged at the bottom end of each clamping telescopic rod 805, the fixed pulleys 802 of the power shafts 801 rotate to enable the conveying belts 803 to convey, the sliding blocks 804 and the mechanical clamping jaws 806 to change positions and extend the clamping telescopic rods 805, chips on the top surface of the workbench 5 are placed and taken out through the mechanical clamping jaws 806, the bottom surface of the push plate 203 of the testing device 2 and the top surface of the bonding layer 6 are positioned on the same horizontal plane, and the side surface, far away from the first linear motor 201, of the push plate 203, is provided with a silica gel layer, the adhesive linkage 6 on 5 surfaces of workstation is the nanolayer, 2 electric connection of testing arrangement of 5 both sides of workstation, and the one side smooth polishing treatment of spacing telescopic link 902 is kept away from to limiting plate 903, and limiting plate 903 outside edge all adopts fillet smooth processing, advances the protection to the chip surface, prevents chip damage in the shear strength test process.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. Chip bonding interface shear strength test equipment, including bearing base (1), support column (3) and bearing roof (4), its characterized in that: support columns (3) are fixedly arranged at four corners of the top surface of the bearing base (1), the top ends of the support columns (3) are fixedly welded with four corners of the bottom surface of the bearing top plate (4), a workbench (5) is fixedly arranged at the center of the top surface of the bearing base (1), a testing device (2) is arranged between the supporting columns (3) at the two sides of the workbench (5), the testing device (2) comprises a cylinder 202, a push plate (203) and a dynamometer (204), a measuring ruler (7) is fixedly arranged at the position where the top surface of the bearing top plate (4) is propped against the edge of the top surface of the workbench (5), the measuring length is the same as the length and the width of the workbench (5), the top surface of the workbench (5) is coated with an adhesive layer (6), the bottom surface of the bearing top plate (4) is respectively provided with a conveying device (8) and a limiting device (9), and the bottom surface of the bearing top plate (4) is provided with a cavity.
2. The die attach interface shear strength test apparatus of claim 1, wherein: all be equipped with first linear electric motor (201) between support column (3) of workstation (5) both sides, and the output shaft of first linear electric motor (201) is fixed with support column (3) side parallel key, the side and cylinder (202) bottom surface fixed connection of first linear electric motor (201), and cylinder (202) level is placed, one side top surface that first linear electric motor (201) was kept away from in cylinder (202) is fixed and is equipped with dynamometer (204), and dynamometer (204) and the output shaft electric connection of cylinder (202), the output shaft end fixing of cylinder (202) is equipped with push pedal (203).
3. The die attach interface shear strength test apparatus of claim 1, wherein: the limiting device (9) comprises a second linear motor (901) and a limiting plate (903), an output shaft of the second linear motor (901) is fixedly connected with the inner side face of the bearing top plate (4), a limiting telescopic rod (902) is fixedly arranged on the bottom face of the second linear motor (901), and the bottom end of the limiting telescopic rod (902) is fixedly connected with the center of the top face of the limiting plate (903).
4. The die attach interface shear strength test apparatus of claim 1, wherein: conveyer (8) are including conveyer belt (803) and mechanical clamping jaw (806), the inside front of bearing roof (4) is equipped with power shaft (801) with back department symmetric distribution, and power shaft (801) both ends embedding bearing roof (4) side, power shaft (801) vertical central point puts back department and all fixes and is equipped with fixed pulley (802), fixed pulley (802) surface winding is equipped with conveyer belt (803), conveyer belt (803) are close to one side surface cup joint of bottom and are equipped with sliding block (804), sliding block (804) bottom is fixed and is equipped with centre gripping telescopic link (805), centre gripping telescopic link (805) bottom mounting is equipped with mechanical clamping jaw (806).
5. The die attach interface shear strength test apparatus of claim 1, wherein: the bottom surface of a push plate (203) of the testing device (2) and the top surface of the bonding layer (6) are located on the same horizontal plane, and a silica gel layer is arranged on the side face, far away from the first linear motor (201), of the push plate (203).
6. The die attach interface shear strength test apparatus of claim 1, wherein: the adhesive layer (6) on the surface of the workbench (5) is a nano layer, and the testing devices (2) on the two sides of the workbench (5) are electrically connected.
7. The die attach interface shear strength test apparatus of claim 3, wherein: one surface, far away from the limiting telescopic rod (902), of the limiting plate (903) is subjected to smooth polishing treatment, and the outer edge of the limiting plate (903) is subjected to round angle smooth treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120572577.5U CN214427186U (en) | 2021-03-22 | 2021-03-22 | Chip bonding interface shear strength test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120572577.5U CN214427186U (en) | 2021-03-22 | 2021-03-22 | Chip bonding interface shear strength test equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214427186U true CN214427186U (en) | 2021-10-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120572577.5U Expired - Fee Related CN214427186U (en) | 2021-03-22 | 2021-03-22 | Chip bonding interface shear strength test equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214427186U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114002088A (en) * | 2021-11-04 | 2022-02-01 | 北京无线电测量研究所 | Microwave device weld joint shear strength testing device and method |
-
2021
- 2021-03-22 CN CN202120572577.5U patent/CN214427186U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114002088A (en) * | 2021-11-04 | 2022-02-01 | 北京无线电测量研究所 | Microwave device weld joint shear strength testing device and method |
| CN114002088B (en) * | 2021-11-04 | 2023-10-20 | 北京无线电测量研究所 | Device and method for testing shear strength of welding seam of microwave device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211019 |
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| CF01 | Termination of patent right due to non-payment of annual fee |