CN214412565U - Point power supply module - Google Patents
Point power supply module Download PDFInfo
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- CN214412565U CN214412565U CN202022332051.8U CN202022332051U CN214412565U CN 214412565 U CN214412565 U CN 214412565U CN 202022332051 U CN202022332051 U CN 202022332051U CN 214412565 U CN214412565 U CN 214412565U
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Abstract
The utility model relates to a power field discloses a some power supply module. Which comprises a circuit board and at least two point power supply modules, wherein each point power supply module comprises a power supply main body, a contact pin, a spherical welding spot and a plug hole, the contact pin is arranged on one side of the power supply main body, the spherical welding spots are at least arranged on the second side and the third side of the power supply main body, and the plug hole is arranged on the power supply main body and is positioned on the different side of the power supply main body with the contact pin, the at least two point power supply modules comprise a first point power supply module and a second point power supply module, the two point power supply modules are arranged on the circuit board side by side and are respectively connected with the circuit board through spherical welding points, the heat generated by the LED lamp can be dissipated through the spherical welding points and the circuit board, the heat dissipation of the point power supply assembly is enhanced, and two point power supply modules are connected through a contact pin and a jack or through a spherical welding spot, and the point power supply modules are connected in multiple connection modes, so that the functions of the point power supply assembly are expanded online.
Description
Technical Field
The utility model discloses embodiment relates to the power field, especially relates to a some power supply module.
Background
Some power module in some power supply module has multiple encapsulation mode, can connect through multiple connected mode, and present some power supply module can be through the connection of each some power module, and power, voltage and the electric current isoparametric of power supply module are ordered in the extension, but the increase of some power supply module in some power supply module quantity can produce more heats, and present some power supply module can't guarantee the heat dissipation function yet, and then brings the accident potential.
SUMMERY OF THE UTILITY MODEL
The utility model discloses embodiment aims at providing a some power supply module to can be online extension some power supply module's function, and strengthen the heat dissipation function.
In order to solve the technical problem, the utility model discloses a technical scheme be: there is provided a point power supply assembly comprising:
a circuit board;
the point power supply modules comprise power supply main bodies, contact pins, spherical welding points and insertion holes;
the contact pin is arranged on the first side of the power supply main body;
the spherical welding points are at least arranged on the second side and the third side of the power supply main body; and
the plug hole is arranged on the power supply main body and is positioned on different sides of the power supply main body with the contact pin;
the at least two point power supply modules comprise a first point power supply module and a second point power supply module, the first point power supply module and the second point power supply module are arranged on the circuit board side by side, and the first point power supply module and the second point power supply module are connected through a contact pin and a plug hole or connected through a spherical welding spot; the first point power supply module and the second point power supply module are respectively connected with the circuit board through the spherical welding points.
In some embodiments, the plug hole is located on a side of the power supply body facing away from the pin.
In some embodiments, the second side is a side different from the side where the pin and the receptacle are located, and the third side is the side where the receptacle is located.
In some embodiments, the power supply main body is further provided with a heat sink, and the heat sink is located on a side of the power supply main body different from the side where the pins, the insertion holes and the ball-shaped solder points are located.
In some embodiments, the power supply body includes a housing and a circuit substrate;
the spherical welding points are arranged on one surface, back to the inside of the power supply main body, of the circuit substrate, the plug holes comprise plug hole bodies and through holes formed in the centers of the plug hole bodies, the through holes penetrate through the circuit substrate, one ends of the contact pins are arranged on the plug hole bodies, and the other ends of the pin bodies are exposed on one side, back to the circuit substrate, of the shell.
In some embodiments, the heat sink is threadably connected to the housing.
In some embodiments, the power supply main body further includes at least one of a BUCK step-down circuit, a BOOST step-up circuit, a BUCK-BOOST step-up circuit, a unidirectional non-isolated type circuit, or a bidirectional non-isolated type circuit;
the at least one circuit is electrically connected with the circuit substrate.
In some embodiments, the pins, the ball pads, and the vias are connected in parallel through the circuit substrate.
In some embodiments, the circuit substrate is a bending plate.
In some embodiments, the at least two point power modules further include a third point power module, and the third point power module is connected to one side of the first point power module facing away from the circuit board or one side of the second point power module facing away from the circuit board through the spherical solder joint.
The utility model discloses embodiment's beneficial effect is: different from the prior art, the embodiment of the present invention provides a point power supply assembly, which comprises a circuit board and at least two point power supply modules, wherein each point power supply module comprises a power supply main body, a contact pin, a spherical welding point and a plug hole, the contact pin is arranged on one side of the power supply main body, the spherical welding point is arranged on at least the second side and the third side of the power supply main body, and the plug hole is arranged on the power supply main body and is located on the different side of the power supply main body from the contact pin, wherein the at least two point power supply modules comprise a first point power supply module and a second point power supply module, the first point power supply module and the second point power supply module are arranged side by side on the circuit board, and the first point power supply module and the second point power supply module are respectively connected to the circuit board through the spherical welding point, so that heat generated by the point power supply modules can be dissipated through the circuit board, and the heat dissipation of the point power supply assembly is enhanced, and first some power module and second point power module pass through contact pin and jack connection, or connect through globular solder joint, consequently, some power module in this some power module can connect through multiple connected mode, and then realize the connection of internal circuit, the function of online extension some power module.
Drawings
Fig. 1a is a perspective view of a point power module according to an embodiment of the present invention;
fig. 1b is a perspective view of a power module according to an embodiment of the present invention;
FIG. 2 is a front view of the point power module shown in FIGS. 1a and 1b, wherein the housing of the point power module is obscured;
FIG. 3 is a left side view of the point power module shown in FIGS. 1a and 1b, wherein the housing of the point power module is obscured;
FIG. 4 is an upper left-hand side view of the point power module shown in FIGS. 1a and 1b, wherein the housing of the point power module is obscured;
FIG. 5 is a right side view of the point power module shown in FIGS. 1a and 1b, wherein the housing of the point power module is obscured;
FIG. 6 is a lower right isometric view of the point power module shown in FIGS. 1a and 1b, wherein the housing of the point power module is obscured;
FIG. 7 is a top view of the point power module shown in FIGS. 1a and 1b, wherein the housing of the point power module is obscured;
FIG. 8 is a bottom view of the point power module shown in FIGS. 1a and 1b, wherein the housing of the point power module is obscured;
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described in more detail with reference to the accompanying drawings and embodiments. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for descriptive purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The point power supply module is a power supply device which can be directly attached to a printed circuit board and is characterized by supplying power to an Application Specific Integrated Circuit (ASIC), a Digital Signal Processor (DSP), a microprocessor, a memory, a Field Programmable Gate Array (FPGA) and other digital or analog loads. Generally, such modules are referred to as point-of-load (POL) power supply systems or point-of-use power supply systems (PUPS).
In order to make the installation method more flexible, the packaging method of the point power module may take various packaging forms, such as dual in-line package (DIP) or DIP package (DIP or DIL for short) and ball grid array package (bga). Ball Grid Array (BGA) packaging is a package in which an Array is formed on the bottom of a substrate of a package body, and ball pads are used as I/O terminals of a circuit and are interconnected with a Printed Circuit Board (PCB).
In the point power supply module, a plurality of point power supply modules are assembled together to expand the functions of the point power supply module on line by expanding parameters such as power, voltage, and current of the point power supply module.
Therefore, in order to achieve both on-line expansion and heat dissipation, please refer to fig. 1a and 1b, one embodiment of the present invention provides a power module assembly, which includes at least two power modules 100 and a circuit board 200, wherein the power modules 100 include a power main body 10, a pin 20, a ball-shaped solder joint 30 and a plug hole 40. The pins 20 are disposed on one side of the power main body 10 and arranged in a row, one end of each pin 20 is connected to a socket body 41 in the socket 40, the other end of each pin passes through the power module 100 and is exposed to the outside, the spherical pads 30 are disposed on at least a second side and a third side of the power main body 10, wherein the second side is a side different from the side where the pin 20 and the socket 40 are disposed, the third side is a side where the socket 40 is disposed, and the socket 40 and the pins 20 are located on different sides of the power main body 10, i.e., the spherical pads 30 are disposed on at least two sides of the power main body 10, one side of each pin 40 and the other side of each pin 40 are located on the same side of the power main body 10, and the other sides of each pin 20 are different, the socket 40 is a semi-closed hole and comprises a socket body 41 and a through hole 42 disposed in the center of the socket body 41, and the socket body 41 is inserted into the power main body 10 and connected to one end of the pin 20, the through hole is disposed on the side of the power supply body 10 opposite to the pin 20.
The point power module 100 has two packaging methods, namely a BGA packaging method and a DIP packaging method, in the point power module, at least two point power modules include a first point power module 100A and a second point power module 100B, the first point power module 100A and the second point power module 100B are arranged side by side on a circuit board 200, the first point power module 100A and the second point power module 100B are respectively connected to the circuit board 200 through a ball-shaped solder joint 30, therefore, heat generated by the point power modules can be dissipated through the ball-shaped solder joint 30 and the circuit board 200, heat dissipation of the point power module is enhanced, the first point power module 100A and the second point power module 100B are connected through a pin 20 and a plug hole 40 or through the ball-shaped solder joint 30, therefore, the point power modules 100 in the point power module can be connected through a plurality of connection methods, further, the connection of internal circuits and the functions of the on-line extension point power supply module, such as parameters of power, voltage, and current of the on-line extension point power supply module, are realized.
Referring to fig. 1 to 8, the power supply main body 10 includes a housing 11, an internal circuit 12 and a circuit substrate 13, the internal circuit 1 includes at least one of a BUCK step-down circuit, a BOOST step-up circuit, a BUCK-BOOST step-up circuit, a unidirectional non-isolated type circuit or a bidirectional non-isolated type circuit, and the at least one circuit is electrically connected to the circuit substrate.
It should be noted that the electrical connection can be connected through some conductors, such as wires, terminals, etc., or each type of circuit is provided with some special pads, such as surface mount pads, etc., through which the electrical connection is directly connected to the circuit substrate 13.
In some embodiments, the power supply body 10 is further provided with a heat sink 300, the heat sink 300 is located on a side of the power supply body 10 different from the side where the pins 20, the insertion holes 40 and the ball pads 30 are located, and specifically, the heat sink 300 is screwed with the housing 11 different from the side where the pins 20, the insertion holes 40 and the ball pads 30 are located. The heat of each point power module 100 is dissipated through the heat sink 300, thereby enhancing heat dissipation.
The spherical welding spot 30 is arranged on one side of the circuit substrate 13, which faces away from the inside of the power supply main body, the plug hole 40 comprises a plug hole body 41 and a through hole 42 arranged in the center of the plug hole body 41, the through hole 42 penetrates through the circuit substrate, one end of the contact pin 20 is arranged on the plug hole body 41, and the other end of the contact pin 20 penetrates through the shell 11 and is exposed on one side of the shell 11, which faces away from the circuit substrate 13. The circuit substrate 13 is a printed circuit board, also called PCB, which is a provider of electrical connection of electronic components.
It is understood that the circuit board 13 is a U-shaped bent plate, and the circuit board 13 is not limited to the U-shape, and the circuit board 13 may be a T-shape, an L-shape, or the like, and the ball pads 30 are provided on different sides of the circuit board 13.
The both sides of shell 11 are provided with a plurality of and hold the chamber, and every holds the chamber and all is provided with a contact pin 20, and one end in the both ends of contact pin 20 is pegged graft on spliced eye body 41 to be connected with circuit substrate 13, the other end exposes shell 11 one side of circuit substrate 13 dorsad, and the one end that exposes is for setting up the grafting portion that is sharp thorn form or be the platykurtic, and grafting portion can insert in another power module's spliced eye 40 without welding ground. Fig. 1-7 only show examples where the mating portion of pin 20 is spike-shaped.
The jack 40 sets up in the intracavity that holds of shell 11, be located the same one side of power main part 10 with the globular solder joint 30 of one side wherein, namely, jack 40 is located the third side of power main part 10, and be located power main part 10 one side of contact pin 20 dorsad, be semi-closed form, confined one end is jack body 41, jack body 41 is connected with contact pin 20, opening one end is circularly, opening one end is for setting up the through-hole at jack body 41 center, the through-hole link up circuit substrate 13, or the shape of through-hole 42 and the shape phase-match of contact pin 20 grafting portion, and jack 40 and circuit substrate 13 electric connection. The number of mating holes 40 matches the number of pins 20, which are present in pairs.
In some embodiments, the pin 20 is located on a first side of the power supply main body 10, the ball-shaped solder 30 on one side is located on a second side of the power supply main body 10, the socket hole 40 and the ball-shaped solder 30 on one side are located on a third side of the power supply main body 10, the first side and the third side are adjacent to each other, and one end of the pin 20 is connected in parallel with the socket hole 40 and the ball-shaped solder 30 and is electrically connected to the circuit substrate 13.
In some embodiments, the pins 20 are located on a first side of the power supply body 10, the ball-shaped pads 30 on one side are located on a second side of the power supply body 10, the socket 40 and the ball-shaped pads 30 on one side are located on a third side of the power supply body 10, and the ball-shaped pads 30 and the socket 40 are located on different planes from the third side, for example, a side of the power supply body 10 includes a first plane and a second plane, and the first plane is lower than the second plane, the ball-shaped pads 30 and the socket 40 are respectively located on the first plane and the second plane, or the socket 40 is located on the first plane and the ball-shaped pads 30 are located on the second plane.
Furthermore, not only the spherical pads 30 are I/O terminals of the point power module 100, but also the insertion holes 40 and the pins 20 are I/O terminals of the point power module 100, and the three are connected in parallel through the circuit substrate 13, and in the point power module, the pins 20 of one point power module 100 are inserted into the insertion holes 40 of another point power module 100, or the spherical pads 30 of one point power module 100 are connected with the spherical pads 30 of another point power module 100, so that the parallel connection of the internal circuits of the two point power modules 100 can be realized, and the power of the point power module is expanded online, and functions such as higher current or higher voltage are provided for the load.
In the point power supply assembly, the point power supply module 100 may be plugged into another point power supply module 100 or connected through the ball-shaped solder 30, or may be plugged into a control module or other functional modules in the point power supply module 100 online as needed to expand the functions of the point power supply assembly, but the expanded control module or functional module must have the same packaging method as the point power supply module 100, for example, the pin 20, the plug hole 40, or the ball-shaped solder 30, and thus, the application range of the point power supply assembly is further expanded.
In some embodiments, the point power module further comprises a third point power module 100C, and the third point power module 100C is connected to the side of the first point power module 100A facing away from the circuit board 200 or the side of the second point power module 100B facing away from the circuit board 200 by the ball-shaped solder joint 30. The third point power module 100C can further expand the functions of the point power module without occupying the area of the circuit board 200.
Has the advantages that: the utility model provides a some power supply modules, when the power of needs online expansion power supply modules, electric current isoparametric, can be with some power module 100 disect insertion another some power module 100's spliced eye 40 in some power supply modules, perhaps connect through globular solder joint 30, and then realize the electric connection of internal circuit, the function of online extension some power supply modules.
In addition, the first point power module 100A and the second point power module 100B in the point power module are arranged on the circuit board 200 side by side, and the first point power module 100A and the second point power module 100B are respectively connected to the circuit board 200 through the spherical welding points 30, so that the point power modules dissipate heat through the spherical welding points 30 and the circuit board 200, the heat dissipation area is increased, and further the heat dissipation of the point power module is enhanced.
It should be noted that the preferred embodiments of the present invention are described in the specification and the drawings, but the present invention can be realized in many different forms, and is not limited to the embodiments described in the specification, and these embodiments are not provided as additional limitations to the present invention, and are provided for the purpose of making the understanding of the disclosure of the present invention more thorough and complete. Moreover, the above features are combined with each other to form various embodiments not listed above, and all of them are considered as the scope of the present invention described in the specification; further, modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A point power module, comprising:
a circuit board;
the point power supply modules comprise power supply main bodies, contact pins, spherical welding points and insertion holes;
the contact pin is arranged on the first side of the power supply main body;
the spherical welding points are at least arranged on the second side and the third side of the power supply main body; and
the plug hole is arranged on the power supply main body and is positioned on different sides of the power supply main body with the contact pin;
the at least two point power modules comprise a first point power module and a second point power module, the first point power module and the second point power module are arranged on the circuit board side by side, and the first point power module and the second point power module are respectively connected with the circuit board through the spherical welding points; the first point power supply module and the second point power supply module are connected through a contact pin and a plug hole or through a spherical welding spot.
2. The point power supply assembly of claim 1, wherein said socket is located on a side of said power supply body facing away from said pin.
3. The point power supply assembly of claim 2, wherein said second side is a different side than said pin and said socket, and said third side is a side of said socket.
4. The point power supply assembly of claim 3, wherein said power supply body further comprises a heat sink disposed on a side of said power supply body other than said pin, said hole and said ball joint.
5. The point power supply component of claim 4, wherein the power supply body comprises a housing and a circuit substrate;
the spherical welding points are arranged on one surface, back to the inside of the power supply main body, of the circuit substrate, the plug holes comprise plug hole bodies and through holes formed in the centers of the plug hole bodies, the through holes penetrate through the circuit substrate, one ends of the contact pins are arranged on the plug hole bodies, and the other ends of the contact pins are exposed on one side, back to the circuit substrate, of the shell.
6. The point power supply assembly of claim 5, wherein said heat sink is threadably connected to said housing.
7. The point power supply component of claim 5, wherein the power supply body further comprises at least one of a BUCK circuit, a BOOST circuit, a BUCK-BOOST circuit, a unidirectional non-isolated type circuit, or a bidirectional non-isolated type circuit;
the at least one circuit is electrically connected with the circuit substrate.
8. The point power supply assembly of claim 5, wherein said pin, said ball pad and said socket are connected in parallel through said circuit substrate.
9. The point power supply assembly of claim 5, wherein said circuit substrate is a bent plate.
10. The point power module according to any of claims 1-9, wherein said at least two point power modules further comprise a third point power module, said third point power module being connected to a side of said first point power module facing away from said circuit board or a side of said second point power module facing away from said circuit board by said ball-shaped solder joint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022332051.8U CN214412565U (en) | 2020-10-19 | 2020-10-19 | Point power supply module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022332051.8U CN214412565U (en) | 2020-10-19 | 2020-10-19 | Point power supply module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214412565U true CN214412565U (en) | 2021-10-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022332051.8U Active CN214412565U (en) | 2020-10-19 | 2020-10-19 | Point power supply module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214412565U (en) |
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2020
- 2020-10-19 CN CN202022332051.8U patent/CN214412565U/en active Active
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