CN214410043U - Low-cost high temperature resistant non-anti metal RFID - Google Patents
Low-cost high temperature resistant non-anti metal RFID Download PDFInfo
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- CN214410043U CN214410043U CN202022785763.5U CN202022785763U CN214410043U CN 214410043 U CN214410043 U CN 214410043U CN 202022785763 U CN202022785763 U CN 202022785763U CN 214410043 U CN214410043 U CN 214410043U
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Abstract
The utility model discloses a low-cost high temperature resistant non-anti metal RFID, this kind of low-cost high temperature resistant non-anti metal RFID includes inlay hyperfrequency electronic tags antenna, organic polymer engineering material layer and insulating high temperature paper, inlay hyperfrequency electronic tags antenna is compound organic polymer engineering material layer from top to bottom, two-layer organic polymer engineering material layer and inlay hyperfrequency electronic tags antenna form sandwich structure, organic polymer engineering material layer is close to inlay hyperfrequency electronic tags antenna and connects the face and has the high temperature glue, two organic polymer engineering material layer lateral surfaces are all attached with insulating high temperature paper, two insulating high temperature paper are towards inlay hyperfrequency electronic tags antenna diffusion extension all around, the opposite face of two insulating high temperature papers is provided with the rectangular hole that is used for hanging, the rectangular hole both sides are provided with the circular port that is used for the location. In this way, the utility model discloses simple structure is compact, and is with low costs, and the delivery period is short, and the lapping supplies the material, and size precision is high, can use under 220 degrees centigrade high temperature environment.
Description
Technical Field
The utility model relates to a RFID label technical field especially relates to a low-cost high temperature resistant non-anti metal RFID.
Background
The RFID radio frequency identification is a non-contact automatic identification technology, which automatically identifies a target object and obtains related data through radio frequency signals, the identification work does not need manual intervention, the RFID technology can work in various severe environments, can identify high-speed moving objects and can identify a plurality of electronic tags at the same time, the operation is quick and convenient, the RFID radio frequency identification is frequently used in supermarkets, an Inlay ultrahigh frequency electronic tag antenna is a special term for the industry of intelligent cards, and is a pre-laminated product which is formed by laminating a plurality of layers of PVC sheets containing chips and coils, generally comprises two layers or three layers, does not have any printed patterns on the surface, is suitable for the early-stage mass production of various cards, and is formed by laminating materials which are covered with different printed patterns on the upper and lower parts of the Inlay ultrahigh frequency electronic tag antenna again to form a colorful non-contact card.
The existing flexible non-metal-resistant high-temperature-resistant RFID tag mostly adopts an SMT FPC inlay ultrahigh-frequency electronic tag antenna or a copper-etched PI substrate high-temperature-resistant inlay ultrahigh-frequency electronic tag antenna, so that the short-term high-temperature-resistant characteristic of the flexible tag is achieved, and the prior art has the following defects: the FPC inlay ultrahigh frequency electronic tag antenna can not be continuously coiled due to single feeding, and single die cutting production is needed when the RFID tag is produced, so that the production efficiency is low, and the manufacturing cost is high; the production positioning tolerance of a single FPC Inlay ultrahigh frequency electronic tag antenna is large, so that the position tolerance of the Inlay ultrahigh frequency electronic tag antenna on a finished product is large; the inlay ultrahigh frequency electronic tag antenna with the copper etched PI substrate has high raw material cost and long exchange period; copper is easy to oxidize, needs to be stored in vacuum, has high storage cost and short effective period, and needs to improve the prior art to design a low-cost high-temperature-resistant non-metal RFID based on the defects and the shortcomings.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the main technical problem who solves provides a low-cost high temperature resistant non-anti metal RFID, and simple structure is compact, and standard aluminium etching Inlay hyperfrequency electronic tags antenna is with low costs, and the delivery period is short, and the lapping supplies of material, and size precision is high, and convenient follow-up production improves production efficiency greatly and reduces product cost, can use under 220 degrees centigrade high temperature environment.
In order to solve the technical problem, the utility model discloses a technical scheme be: the low-cost high-temperature-resistant non-metal RFID comprises an Inlay ultrahigh-frequency electronic tag antenna, an organic polymer engineering material layer and insulating high-temperature paper, wherein the Inlay ultrahigh-frequency electronic tag antenna is formed by etching aluminum, the Inlay ultrahigh-frequency electronic tag antenna is compounded with the organic polymer engineering material layer from top to bottom, the two organic polymer engineering material layers and the Inlay ultrahigh-frequency electronic tag antenna form a sandwich structure, the Inlay ultrahigh-frequency electronic tag antenna is clamped in the middle, the common Inlay ultrahigh-frequency electronic tag antenna is well protected, the common Inlay ultrahigh-frequency electronic tag antenna can be used in a high-temperature environment at 220 ℃, the high-temperature glue is arranged on the part, close to the connection surface of the Inlay ultrahigh-frequency electronic tag antenna, the insulating high-temperature paper is attached to the outer side surfaces of the two organic polymer engineering material layers, and the two pieces of insulating high-temperature paper extend towards the periphery of the Inlay ultrahigh-frequency electronic tag antenna in a diffusion mode, the opposite face of two insulating high temperature paper is provided with the rectangular hole that is used for hanging, and the rectangular hole both sides are provided with the circular port that is used for the location.
Preferably, the organic polymer engineering material layer is made of a polyimide material, the high temperature resistance of the polyimide material is over 400 ℃, the long-term use temperature range is-200-300 ℃, part of the polyimide material has no obvious melting point and high insulating property, and the material is provided with high-temperature glue on one side.
Preferably, the single surface of the insulating high-temperature paper is provided with a high-temperature-resistant adhesive layer, the insulating high-temperature paper is attached to the organic polymer engineering material layers above and below the inlay ultrahigh-frequency electronic tag antenna, the effect of isolating the external temperature of the inlay ultrahigh-frequency electronic tag antenna is achieved, and information such as bar codes can be printed on the outer surface of the insulating high-temperature paper.
Compared with the prior art, the beneficial effects of the utility model are that:
the low-cost aluminum-etched Inlay ultrahigh-frequency electronic tag antenna is used for replacing a PI Inlay ultrahigh-frequency electronic tag antenna or a FPC Inlay ultrahigh-frequency electronic tag antenna, the aluminum-etched Inlay ultrahigh-frequency electronic tag antenna is continuously coiled, the Inlay ultrahigh-frequency electronic tag antenna is low in cost and high in production efficiency; the aluminum etched Inlay ultrahigh frequency electronic tag antenna is not easy to oxidize and easy to store, and the storage cost is reduced; the antenna of the aluminum etched Inlay ultrahigh frequency electronic tag has high precision and high position precision on the flexible tag;
two layers of organic polymer engineering material polyimide are respectively attached to the upper surface and the lower surface of an Inlay ultrahigh frequency electronic tag antenna to form a protection structure, and the protection structure can be used in a high-temperature environment at 220 ℃;
the aluminum etched Inlay ultrahigh frequency electronic tag antenna is continuously coiled, so that the Inlay ultrahigh frequency electronic tag antenna is low in cost and high in production efficiency; the aluminum etched Inlay ultrahigh frequency electronic tag antenna is easy to store, and the storage cost is reduced; the antenna of the aluminum etching Inlay ultrahigh frequency electronic tag has high precision and high position precision on the flexible tag.
Drawings
FIG. 1 is a schematic structural diagram of a low-cost high-temperature-resistant non-metal RFID.
Detailed Description
The following detailed description of the preferred embodiments of the present invention will be provided to enable those skilled in the art to more easily understand the advantages and features of the present invention, and to make clear and definite definitions of the protection scope of the present invention.
Referring to fig. 1, an embodiment of the present invention includes:
a low-cost high-temperature-resistant non-metal RFID comprises an Inlay ultrahigh-frequency electronic tag antenna 1, an organic polymer engineering material layer 2 and insulating high-temperature paper 3, wherein the Inlay ultrahigh-frequency electronic tag antenna 1 is formed by etching an Inlay ultrahigh-frequency electronic tag antenna 1 with aluminum, the Inlay ultrahigh-frequency electronic tag antenna 1 is compounded with the organic polymer engineering material layer 2 from top to bottom, the two organic polymer engineering material layers 2 and the Inlay ultrahigh-frequency electronic tag antenna 1 form a sandwich structure, the Inlay ultrahigh-frequency electronic tag antenna is sandwiched between the two organic polymer engineering material layers, the common Inlay ultrahigh-frequency electronic tag antenna 1 is well protected and can be used in a high-temperature environment at 220 ℃, the high-temperature adhesive is arranged on the connecting surface of the organic polymer engineering material layer 2 close to the Inlay ultrahigh-frequency electronic tag antenna 1, the insulating high-temperature paper 3 is attached to the outer side surfaces of the two organic polymer engineering material layers 2, two insulating high temperature paper 3 extend towards inlay hyperfrequency electronic tags antenna 1 diffusion all around, and the opposite face of two insulating high temperature paper 3 is provided with the rectangular hole 31 that is used for hanging, and rectangular hole 31 both sides are provided with the circular port 32 that is used for the location.
The organic polymer engineering material layer 2 is made of polyimide materials, the high temperature resistance of the material can reach more than 400 ℃, the long-term use temperature range is-200-300 ℃, the part has no obvious melting point and high insulating property, and the material is provided with high-temperature glue on one side.
The single face of the insulating high-temperature paper 3 is provided with a high-temperature-resistant adhesive layer, the insulating high-temperature paper 3 is attached to the organic polymer engineering material layer 2 above and below the inlay ultrahigh-frequency electronic tag antenna 1, the effect of isolating the external temperature of the inlay ultrahigh-frequency electronic tag antenna 1 is achieved, and information such as bar codes can be printed on the outer surface of the insulating high-temperature paper 3.
The utility model relates to a low-cost high temperature resistant non-anti metal RFID, simple structure is compact, and standard aluminium etching Inlay hyperfrequency electronic tags antenna is with low costs, and the delivery period is short, and the lapping supply of material, size precision is high, and convenient follow-up production improves production efficiency and reduction product cost greatly, can use under 220 degrees centigrade high temperature environment.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.
Claims (3)
1. A low-cost high temperature resistant non-metal RFID, its characterized in that: this kind of low-cost high temperature resistant non-anti metal RFID includes the hyperfrequency electronic tags antenna, organic polymer engineering material layer and insulating high temperature paper, the hyperfrequency electronic tags antenna adopts aluminium etching hyperfrequency electronic tags antenna, compound organic polymer engineering material layer about the hyperfrequency electronic tags antenna, two-layer organic polymer engineering material layer and hyperfrequency electronic tags antenna form sandwich structure, press from both sides the hyperfrequency electronic tags antenna in the middle of, organic polymer engineering material layer is close to hyperfrequency electronic tags antenna connection face and has the high temperature glue, two organic polymer engineering material layer lateral surfaces are all attached with insulating high temperature paper, two insulating high temperature paper are towards the diffusion extension all around the hyperfrequency electronic tags antenna, the opposite face of two insulating high temperature papers is provided with the rectangular hole that is used for hanging, the rectangular hole both sides are provided with the circular port that is used for the location.
2. The low-cost high-temperature-resistant non-metal-resistant RFID according to claim 1, wherein: the organic polymer engineering material layer is made of polyimide material, and the single surface of the material is provided with high-temperature glue.
3. The low-cost high-temperature-resistant non-metal-resistant RFID according to claim 1, wherein: the single side of the insulating high-temperature paper is provided with a high-temperature-resistant adhesive layer, the insulating high-temperature paper is attached to the organic polymer engineering material layers above and below the ultrahigh-frequency electronic tag antenna, and bar code information can be printed on the outer surface of the insulating high-temperature paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022785763.5U CN214410043U (en) | 2020-11-26 | 2020-11-26 | Low-cost high temperature resistant non-anti metal RFID |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022785763.5U CN214410043U (en) | 2020-11-26 | 2020-11-26 | Low-cost high temperature resistant non-anti metal RFID |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214410043U true CN214410043U (en) | 2021-10-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022785763.5U Active CN214410043U (en) | 2020-11-26 | 2020-11-26 | Low-cost high temperature resistant non-anti metal RFID |
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| CN (1) | CN214410043U (en) |
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- 2020-11-26 CN CN202022785763.5U patent/CN214410043U/en active Active
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