CN214407826U - Welding type pressure sensing module and electronic equipment - Google Patents
Welding type pressure sensing module and electronic equipment Download PDFInfo
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- CN214407826U CN214407826U CN202023229834.XU CN202023229834U CN214407826U CN 214407826 U CN214407826 U CN 214407826U CN 202023229834 U CN202023229834 U CN 202023229834U CN 214407826 U CN214407826 U CN 214407826U
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- control circuit
- circuit board
- pressure sensor
- groove
- stress
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Abstract
The utility model provides a welding formula forced induction module and electronic equipment belongs to forced induction technical field. Welded type forced induction module includes: the control circuit board is provided with at least one control circuit part, and the central area of the control circuit part is provided with at least one first stress concentration groove and at least one first bonding pad; the pressure sensor is arranged on one side of the control circuit board along the thickness direction of the control circuit board and corresponds to the control circuit part; the central area of one side of the pressure sensor, which is far away from the control circuit board, is provided with a pressure sensing area; and the edge area of one side, facing the control circuit board, of the pressure sensor is also provided with at least one second bonding pad, and the second bonding pad is electrically connected with the first bonding pad. The utility model discloses a set up the concentrated groove of first stress on control circuit board, make stress more effective, transmit pressure sensor more concentratedly on.
Description
Technical Field
The utility model belongs to the technical field of the forced induction, concretely relates to welding formula forced induction module and electronic equipment.
Background
With the technological progress and social development, the pressure sensing technology is widely applied in the consumer electronics industry (such as mobile phones, earphones, notebook computers, intelligent furniture and the like), and mainly applied to pressure switches or pressure function keys and the like through pressure sensors. At present, an existing pressure sensing module generally comprises a control circuit board and a pressure sensor, wherein the pressure sensor is packaged on the control circuit board, and then the pressure sensing module is directly attached to the back of a touch panel or a key panel to detect the change of force transmitted from the surface of the panel. However, in the structure of the existing pressure sensing module, the control circuit board is usually a PCB printed circuit board with a whole plane, which directly transmits the pressure on the panel to the pressure sensor of the pressure sensing module, and the control circuit board is not provided with a stress concentration structure for concentrating and transmitting the pressure, which results in the problem of non-concentrated stress transmission.
Therefore, based on the above technical problem, the utility model provides a new welding formula forced induction module and an electronic equipment.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least, provide a welding formula forced induction module and an electronic equipment.
An aspect of the utility model provides a welded type forced induction module, include:
the device comprises a control circuit board, a first stress concentration groove and a second stress concentration groove, wherein at least one control circuit part is arranged on the control circuit board, and at least one first bonding pad and at least one first stress concentration groove are arranged in the central area of the control circuit part;
at least one pressure sensor, the said pressure sensor is set up in one side of the said control circuit board along its thickness direction, and correspond to said control circuit part; wherein the content of the first and second substances,
a pressure sensing area is arranged in the central area of one side, away from the control circuit board, of the pressure sensor; and the number of the first and second groups,
the edge area of one side, facing the control circuit board, of the pressure sensor is further provided with at least one second bonding pad, and the second bonding pad is electrically connected with the first bonding pad.
Optionally, the first stress concentration groove penetrates through at least a part of the thickness of the control circuit board.
Optionally, the first stress concentration groove is in a long strip shape, and the length direction of the first stress concentration groove is parallel to the width direction of the control circuit board.
Optionally, the first stress concentration groove is shaped like a Chinese character 'gong', and the middle part of the Chinese character 'gong' is parallel to the width direction of the control circuit board.
Optionally, the pressure sensor is provided with at least one second stress concentration groove penetrating through the thickness of the pressure sensor, and the second stress concentration groove extends inwards from the end portion.
Optionally, the center of the second stress concentration groove is collinear with the center of the pressure sensing area; and/or the center of the second stress concentrating groove is collinear with the center of the first stress concentrating groove.
Optionally, the number of the second stress concentration grooves is two, and the two second stress concentration grooves are symmetrically arranged along the width direction of the pressure sensor.
Optionally, a plurality of first pads are arranged on the control circuit portion, and the plurality of first pads are symmetrically arranged on two sides of the first stress concentration groove; and the number of the first and second groups,
the pressure sensor is provided with a plurality of second bonding pads, the second bonding pads are symmetrically arranged on two sides of the second stress concentration groove, and each first bonding pad is electrically connected with each second bonding pad.
Optionally, the welding type pressure sensing module comprises a plurality of pressure sensors, and the control circuit board is provided with a plurality of control circuit parts; wherein the content of the first and second substances,
each of the pressure sensors corresponds to each of the control circuit sections.
The utility model discloses an on the other hand provides an electronic equipment, including pressing the panel, power equipment still includes the foretell record welded type forced induction module, the control circuit board laminating sets up pressing the regional department of pressing of panel.
The utility model provides a welding formula forced induction module, include: the control circuit board is provided with at least one control circuit part, and the central area of the control circuit part is provided with a first stress concentration groove and at least one first bonding pad; the pressure sensor is arranged on one side of the control circuit board along the thickness direction of the control circuit board and corresponds to the control circuit part; the central area of one side of the pressure sensor, which is far away from the control circuit board, is provided with a pressure sensing area, and the pressure sensing area corresponds to the first stress concentration groove; and the edge area of one side, facing the control circuit board, of the pressure sensor is also provided with at least one second bonding pad, and the second bonding pad is electrically connected with the first bonding pad. The utility model discloses a welded type forced induction module is through being provided with the concentrated groove of first stress on control circuit board, and this concentrated groove of first stress is corresponding with the forced induction region, makes on stress more effectively, transmits pressure sensor more concentratedly, and then improves pressure detection sensitivity.
Drawings
Fig. 1 is a schematic structural diagram of a welding type pressure sensing module according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a control circuit board according to an embodiment of the present invention;
fig. 3 is a front view of a pressure sensor according to an embodiment of the present invention;
fig. 4 is a rear view of a pressure sensor in accordance with an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a welding type pressure sensing module according to another embodiment of the present invention;
fig. 6 is a schematic structural diagram of a control circuit board according to another embodiment of the present invention;
fig. 7 is an assembly diagram of an electronic device according to another embodiment of the present invention;
fig. 8 is a schematic cross-sectional view of a first stress concentrating groove of an electronic device according to another embodiment of the present invention;
fig. 9 is a schematic cross-sectional view of another first stress concentrating groove of an electronic device according to another embodiment of the present invention.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. Based on the described embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Unless otherwise specifically stated, technical or scientific terms used herein shall have the ordinary meaning as understood by those of ordinary skill in the art to which the present invention belongs. As used in this application, the terms "comprises" or "comprising," or the like, do not specify the presence of stated shapes, numbers, steps, acts, operations, elements, components, and/or groups thereof, nor do they preclude the presence or addition of one or more other different shapes, numbers, steps, acts, operations, elements, components, and/or groups thereof. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number and order of the indicated features.
In some descriptions of the present invention, unless expressly stated or limited otherwise, the terms "mounted," "connected," or "fixed" and the like are not intended to be limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect through an intermediate medium, communication between two elements, or interaction between two elements. Also, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate an orientation or positional relationship based on that shown in the drawings, and are used only to indicate a relative positional relationship, which may also be changed accordingly when the absolute position of the object being described is changed.
As shown in fig. 1 to 6, an aspect of the present invention provides a welding type pressure sensing module 100, including: the pressure sensor comprises a control circuit board 110 and at least one pressure sensor 120, wherein at least one control circuit part is arranged on the control circuit board 110, and at least one first stress concentration groove 111 and at least one first bonding pad 112 are arranged in the central area of the control circuit part. The pressure sensor 120 is disposed at one side of the control circuit board 110 in the thickness direction thereof, and corresponds to the control circuit part; wherein, the central area of the side of the pressure sensor 120 facing away from the control circuit board 110 is provided with a pressure sensing area 121. And, the edge area of the side of the pressure sensor 120 facing the control circuit board 110 is further provided with at least one second pad 122, and the second pad 122 is electrically connected with the first pad 112.
This embodiment is through setting up first stress concentration groove on control circuit board, and this first stress concentration groove is corresponding with pressure sensor's pressure sensing area, makes stress more effective, transmit pressure sensor more concentratedly to improve the sensitivity that pressure sensor response panel pressed in the practical application. And, all set up the pad through on control circuit board and pressure sensor, formed the structure that can weld the module to realize the standardization of module, adapt to customer's different demands.
It should be noted that, the control circuit board is not specifically limited in this embodiment, and a user may design the PCB circuit board, that is, the control circuit board, according to design requirements.
It should be further noted that, in the present embodiment, the number of the control circuit portions on the control circuit board is not specifically limited, and one control circuit portion, two control circuit portions, three control circuit portions, or more control circuit boards may be disposed thereon, and it will be apparent to those skilled in the art that the specific arrangement may be performed according to actual needs.
For example, as shown in fig. 1 to 6, the welding type pressure sensing module 100 includes a plurality of pressure sensors 120, and a plurality of control circuit portions are disposed on the control circuit board 110. Wherein each pressure sensor 120 corresponds to each control circuit section.
It should be noted that, in this embodiment, the shape and the slotting depth of the first stress concentration slot are not specifically limited, for example, the first stress concentration slot may penetrate through a part of the thickness of the control circuit board or may penetrate through the entire thickness of the control circuit board, i.e., the full through slot structure. And the first stress concentration groove can be arranged in a long strip shape, an I shape or other shapes convenient for stress concentration.
Specifically, as shown in fig. 1 and 2, in some embodiments, the first stress concentration groove 111 is in a shape of a long bar, and the length direction of the first stress concentration groove 111 is parallel to the width direction of the control circuit board 110. That is, the first stress concentration grooves are arranged along the width direction of the control circuit board.
Further, as shown in fig. 5 and 6, in other embodiments, the first stress concentration groove 111 has an "i" shape, and a middle portion of the "i" shape of the first stress concentration groove 111 is parallel to the width direction of the control circuit board.
Further, as shown in fig. 8 and 9, it can be seen from the cross-sectional view of the package structure of the electronic device 200 along the a-a direction that the first stress concentration groove 111 penetrates at least a part of the thickness of the control circuit board 110. Referring to fig. 8, the first stress concentration groove 111 is a full through groove structure, and referring to fig. 9, the first stress concentration groove 111 is a half groove structure, and of course, the first stress concentration groove may be set to a first stress concentration groove with other depths.
Alternatively, as shown in fig. 3, the pressure sensor 120 of the present embodiment is provided with at least one second stress concentration groove 123 penetrating the thickness thereof, and the second stress concentration groove 123 extends inward from the end portion. Of course, in some embodiments, the number of the second stress concentration grooves may be two, and two second stress concentration grooves 123 are symmetrically arranged in the width direction of the pressure sensor 120. That is to say, the ends of the pressure sensor along the width direction are respectively provided with a second stress concentration groove symmetrically.
To further transmit the stress concentration, as shown in fig. 1 and 5, the center of the second stress concentration groove 123 of the present embodiment is collinear with the center of the pressure-sensitive area 121. Of course, since the second stress concentration groove corresponds to the pressure sensing region, the center of the second stress concentration groove 123 is collinear with the center of the first stress concentration groove 111. That is, the centers of the first stress concentration groove and the second stress concentration groove are collinear, and both correspond to the pressure sensing area, so that the stress concentration is transferred.
In the present embodiment, the type of the pressure sensor is not particularly limited, and for example, a piezoresistive pressure sensor may be selected, or a piezoelectric pressure sensor or a pressure plate type pressure sensor may be selected. Of course, the pressure sensor of the present embodiment may be a PCB sensor or an FPC sensor.
It should be noted that, in the embodiment, the number and the shape of the first bonding pad and the second bonding pad are not particularly limited, as long as the control circuit board can be electrically connected to the pressure sensor. For example, the first pad and the second pad may be rectangular, circular, or other shapes that facilitate stress concentration.
Illustratively, as shown in fig. 2 and 6, a plurality of first pads 112 are disposed on each control circuit portion, and the plurality of first pads 112 are symmetrically disposed on both sides of the first stress concentration groove 111. For example, two first pads 112, that is, four first pads 112 in total, are symmetrically disposed on both sides of the first stress concentrating groove 111. Correspondingly, referring to fig. 4, each pressure sensor 120 is provided with a plurality of second pads 122, the plurality of second pads 122 are symmetrically disposed on two sides of the second stress concentration groove 123, for example, the second pads 122 are symmetrically disposed on two sides of two second stress concentration grooves 123, which is also equivalent to that the second pads 122 are disposed on four corners of the pressure sensor 120, that is, four second pads 122 are totally disposed, and each first pad 112 is electrically connected to each second pad 122. That is, each first bonding pad corresponds to each second bonding pad, and the pressure sensor is fixed and electrically connected with the circuit on the control circuit board through welding, and outputs the pressure signal sensed by the pressure sensing area.
As shown in fig. 7 to 9, another aspect of the present invention provides an electronic device 200, which includes a pressing panel 210 and the welding type pressure sensing module 100 described above. The control circuit board 110 of the soldering pressure sensing module 100 is attached to the pressing area of the pressing panel 210. That is to say, directly laminate the back that presses the panel to press the region with the forced induction module, like this, transmit control circuit board with stress and deformation through pressing the panel, through the concentrated groove of stress on the control circuit board again, make stress concentrate transmit pressure sensor on, pressure sensor passes through detection circuitry and receives pressure signal, then output electric signal to control circuit board.
It should be noted that, in this embodiment, the bonding manner between the control circuit board and the pressing panel is not particularly limited, and a double-sided adhesive layer, an acrylic foam adhesive layer, an AB adhesive layer, an epoxy adhesive layer, a silicone adhesive layer, or other similar adhesive layers may be used for bonding.
The utility model provides a welding formula forced induction module and electronic equipment compares with prior art and has following beneficial effect: the utility model discloses a be provided with the concentrated groove of first stress on control circuit board, make and press down the stress on pressing down the panel and transmit pressure sensor more effectively, concentrate to improve the sensitivity that pressure sensor response panel pressed down among the practical application. In addition, at least one first bonding pad is arranged on the control circuit board, at least one second bonding pad is further arranged on the edge area of one side, facing the control circuit board, of the pressure sensor, and the second bonding pad is electrically connected with the first bonding pad to form a weldable structure, so that standardization of the module is achieved, and different requirements of customers are met.
It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. The utility model provides a welded type forced induction module which characterized in that includes:
the device comprises a control circuit board, a first stress concentration groove and a second stress concentration groove, wherein at least one control circuit part is arranged on the control circuit board, and at least one first bonding pad and at least one first stress concentration groove are arranged in the central area of the control circuit part;
at least one pressure sensor, the said pressure sensor is set up in one side of the said control circuit board along its thickness direction, and correspond to said control circuit part; wherein the content of the first and second substances,
a pressure sensing area is arranged in the central area of one side, away from the control circuit board, of the pressure sensor; and the number of the first and second groups,
the edge area of one side, facing the control circuit board, of the pressure sensor is further provided with at least one second bonding pad, and the second bonding pad is electrically connected with the first bonding pad.
2. The soldered pressure sensing module of claim 1, wherein the first stress concentrating slot extends through at least a portion of the thickness of the control circuit board.
3. The welding type pressure induction module set forth in claim 1, wherein said first stress concentrating groove is elongated, and the length direction of said first stress concentrating groove is parallel to the width direction of said control circuit board.
4. The soldered pressure sensing module of claim 1 wherein the first stress concentrating slot is "i" shaped with a middle portion parallel to the width of the control circuit board.
5. The welded pressure sensing module of any one of claims 1 to 4, wherein the pressure sensor is provided with at least one second stress concentrating groove through its thickness, the second stress concentrating groove extending inwardly from an end.
6. The welded pressure sensing module of claim 5, wherein a center of the second stress concentrating channel is collinear with a center of the pressure sensing region; and/or the center of the second stress concentrating groove is collinear with the center of the first stress concentrating groove.
7. The welded pressure induction module set forth in claim 6 wherein said second stress concentrating slots are two in number, and wherein said two second stress concentrating slots are symmetrically disposed along the width of said pressure sensor.
8. The welding type pressure induction module set forth in claim 5, wherein a plurality of first bonding pads are disposed on the control circuit portion, and the first bonding pads are symmetrically disposed on two sides of the first stress concentration groove; and the number of the first and second groups,
the pressure sensor is provided with a plurality of second bonding pads, the second bonding pads are symmetrically arranged on two sides of the second stress concentration groove, and each first bonding pad is electrically connected with each second bonding pad.
9. The welding type pressure sensing module according to any one of claims 1 to 4, wherein the welding type pressure sensing module comprises a plurality of pressure sensors, and a plurality of control circuit parts are arranged on the control circuit board; wherein the content of the first and second substances,
each of the pressure sensors corresponds to each of the control circuit sections.
10. An electronic device comprising a pressing panel, wherein the electronic device further comprises the welding type pressure sensing module set according to any one of claims 1 to 9, and the control circuit board is attached to the pressing area of the pressing panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023229834.XU CN214407826U (en) | 2020-12-28 | 2020-12-28 | Welding type pressure sensing module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023229834.XU CN214407826U (en) | 2020-12-28 | 2020-12-28 | Welding type pressure sensing module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214407826U true CN214407826U (en) | 2021-10-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023229834.XU Active CN214407826U (en) | 2020-12-28 | 2020-12-28 | Welding type pressure sensing module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214407826U (en) |
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2020
- 2020-12-28 CN CN202023229834.XU patent/CN214407826U/en active Active
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