CN214404030U - High temperature control heat dissipation fan structure - Google Patents
High temperature control heat dissipation fan structure Download PDFInfo
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- CN214404030U CN214404030U CN202022455930.XU CN202022455930U CN214404030U CN 214404030 U CN214404030 U CN 214404030U CN 202022455930 U CN202022455930 U CN 202022455930U CN 214404030 U CN214404030 U CN 214404030U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 71
- 230000005540 biological transmission Effects 0.000 claims abstract description 29
- 238000012544 monitoring process Methods 0.000 claims abstract description 15
- 230000003321 amplification Effects 0.000 claims abstract description 4
- 238000003199 nucleic acid amplification method Methods 0.000 claims abstract description 4
- 239000003990 capacitor Substances 0.000 claims description 27
- 230000000007 visual effect Effects 0.000 claims description 7
- 238000001816 cooling Methods 0.000 description 11
- 238000012360 testing method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 230000002159 abnormal effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005034 decoration Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
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Abstract
The utility model belongs to the technical field of high temperature monitoring, and relates to a high temperature monitoring heat dissipation fan structure, which comprises a motor shaft, wherein a photoelectric encoder is arranged on the motor shaft, the tail end of the motor shaft is connected with a stepping motor, and the stepping motor is connected with an MCU fan controller; the MCU fan controller comprises a microprocessor, the microprocessor is connected with an acousto-optic alarm circuit, a wireless transparent transmission module and a power circuit, and the wireless transparent transmission module is connected with an infrared temperature sensor module; the infrared temperature sensor module comprises an infrared temperature sensor and a signal amplifying circuit connected with the infrared temperature sensor; the signal amplification circuit amplifies signals of the infrared temperature sensor and outputs amplified signals, and the amplified signals transmit detected temperature data to the microprocessor through the wireless transparent transmission module; the microprocessor is also connected with an acousto-optic alarm circuit. The utility model discloses can improve the radiating efficiency through changing heat dissipation fan angle, to heat dissipation fan operating condition control simultaneously.
Description
Technical Field
The utility model belongs to the technical field of the high temperature control, concretely relates to high temperature control heat dissipation fan.
Background
At the beginning of the design, a heat dissipation system is arranged in a case, a server and a matched board card of the server can effectively dissipate heat, but in the single board test process, the board card needs to be moved out of the case, so that the problem of heat dissipation of the board card becomes a potential safety hazard.
The existing solution is to place the heat dissipation fan on the top of the heat dissipation plate for local heat dissipation, and the placement position of the heat dissipation fan causes the inconsistency of the air channels between the heat dissipation fan and the heat dissipation plate, and the heat dissipation effect is poor and the heat dissipation area is small. The problem that the heat dissipation fan stops rotating after long-time operation is found in the testing process, the heat dissipation fan loses the heat dissipation function, and meanwhile fire hazards can be brought due to quality problems. Therefore, the cooling is only carried out through the cooling fan, so that great potential safety hazards do not exist in the state monitoring of the cooling fan, and the defect of the prior art is overcome.
In view of this, the utility model provides a high temperature control heat dissipation fan structure to solve the defect that exists among the prior art, it is very necessary.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a design high temperature control heat dissipation fan structure to the radiating effect that the heat dissipation fan that exists leads to with the fin wind channel nonconformity is poor, and the heat dissipation area is little to and the operating condition of heat dissipation fan is not monitored, and the heat dissipation fan stall brings the defect of the potential safety hazard of conflagration, in order to solve above-mentioned technical problem.
A high-temperature monitoring radiating fan structure comprises a motor shaft, wherein a photoelectric encoder is arranged on the motor shaft, the top end of the motor shaft is connected with fan blades, a fan cover is arranged outside the fan blades, the tail end of the motor shaft is connected with a fan motor, and the fan motor is connected with an MCU fan controller;
the MCU fan controller comprises a microprocessor, the microprocessor is connected with an acousto-optic alarm circuit, a wireless transparent transmission module and a power circuit, and the wireless transparent transmission module is connected with an infrared temperature sensor module;
the infrared temperature sensor module comprises an infrared temperature sensor and a signal amplifying circuit connected with the infrared temperature sensor; the signal amplification circuit amplifies signals of the infrared temperature sensor and outputs amplified signals, and the amplified signals transmit detected temperature data to the microprocessor through the wireless transparent transmission module; the microprocessor is also connected with an acousto-optic alarm circuit.
Preferably, the inverting input end of the operational amplifier is connected with one end of a resistor R2 and a first end of a resistor R1, a second end of the resistor R2 is grounded, a second end of the resistor R1 is connected with a voltage 5V, the inverting input end of the operational amplifier is connected with a first end of a resistor R3, a second end of a resistor R3 is connected with a first end of a resistor R4 and a capacitor C2, a second end of the resistor R4 is connected with a first end of a capacitor C3 and a 3 port of a comparator LM35, a 1 port of the LM35 is connected with VCC, and second ends of the capacitor C2, the capacitor C3 and the capacitor C4 are grounded.
Preferably, the audible and visual alarm circuit comprises an LED1 anode connected with a first end of a resistor R6, a resistor R6 second end connected with a voltage 5V and a buzzer 1 end, an LED1 cathode connected with an upper pin of a triode Q1, an upper pin of a triode Q1 connected with a buzzer 2 end, a lower pin of a triode Q1 grounded, a resistor R5 first end connected with a microprocessor, and a second end connected with a triode Q1.
Preferably, the wireless transparent transmission module adopts low-power-consumption Bluetooth transmission or WiFi transmission, and in the data transmission process, the length and the content of data of a sender and a receiver are completely consistent, so that the transmission quality is ensured, and meanwhile, the transmitted data is not processed.
Preferably, the power supply circuit comprises a first pin of the hall current sensor FD-SIP2 grounded, a second pin of the hall current sensor FD-SIP2 grounded, a first end of a resistor R7 and an anode of a diode D1, a cathode of the diode D1 connected to a power VCC, first ends of a capacitor C5 and a capacitor C6 both connected to the power VCC, second ends of a capacitor C5 and a capacitor C6 both grounded, a second end of a resistor R7 connected to a first end of a resistor R8, and a second end of a resistor R8 grounded.
Preferably, a high temperature control radiator fan system includes, infrared temperature sensor sets up at upper test bench, and heat dissipation support fixed mounting is at lower floor's test bench, is provided with a plurality of heat dissipation fan with adjustable angle on the heat dissipation support, and heat dissipation fan wind channel direction sets up the fin, and the fin setting is on the veneer.
Preferably, the photoelectric encoder detects the rotating speed of the cooling fan, and is provided with a low-power Hall current sensor for detecting the power of the cooling fan; when any one of the rotating speed and the power of the heat dissipation fan is abnormal, the standby heat dissipation fan is switched in time, and the heat dissipation fan is abnormal, so that the heat dissipation fan is directly cut off and the power supply of the single board is tested to reduce the safety risk.
Preferably, the microprocessor is STM32, and has low power consumption, small size, high reliability, high operation speed and high function.
The beneficial effects of the utility model reside in that, a high temperature control heat dissipation fan structure has been designed, has increased heat dissipation fan running state control, veneer ambient temperature and has detected, unusual alarming function for the laboratory bench veneer heat dissipation can effectively reduce safe risk. The utility model discloses the invention can be 24 hours unmanned under the condition operation of guard, can effectively shorten veneer test time, improves research and development efficiency. Furthermore, the utility model relates to a principle is reliable, and simple structure has very extensive application prospect.
Therefore, compared with the prior art, the utility model has the substantive characteristics and the progress, and the beneficial effects of the implementation are also obvious.
Drawings
FIG. 1 is a schematic diagram of an MCU fan controller.
Fig. 2 is a schematic structural view of a high-temperature monitoring heat dissipation fan.
Fig. 3 is a schematic diagram of an operational amplifier circuit of the temperature sensor.
Fig. 4 is a schematic diagram of an audible and visual alarm circuit.
Fig. 5 is a schematic diagram of a power supply circuit.
FIG. 6 is a schematic diagram of a high temperature monitoring system.
100-a microprocessor; 101-an audible and visual alarm circuit; 102-a wireless transparent transmission module; 103-an infrared sensor module; 104-a power supply circuit; 1-upper experiment table; 2-an infrared temperature sensor; 3-a heat sink; 4-single board; 5-lower layer experiment table; 6-a heat dissipation bracket; 7-a first heat dissipation fan; 8-a second heat dissipation fan; 9-a fan cover; 10-a fan blade; 11-motor shaft; 12-a photoelectric encoder; 13-a fan motor; 14-MCU fan controller; 15-step motor.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings by way of specific examples, which are illustrative of the present invention and are not limited to the following embodiments.
Example 1:
as shown in fig. 1, the MCU fan controller 14 includes a microprocessor 100, the microprocessor 100 is connected to an audible and visual alarm circuit 101, a wireless transparent transmission module 102 and a power circuit 104, and the wireless transparent transmission module 102 is connected to an infrared temperature sensor module 103;
the infrared temperature sensor module 103 comprises an infrared temperature sensor and a signal amplifying circuit connected with the infrared temperature sensor; the signal amplification circuit amplifies the infrared temperature sensor signal and outputs an amplified signal, and the amplified signal transmits the detected temperature data to the microprocessor 100 through the wireless transparent transmission module; the microprocessor is also connected with an audible and visual alarm circuit 101.
Example 2:
a high-temperature monitoring radiating fan structure comprises a motor shaft 11, wherein a photoelectric encoder 12 is arranged on the motor shaft 11, the top end of the motor shaft 11 is connected with a fan blade 10, a fan cover 9 is arranged outside the fan blade 10, the tail end of the motor shaft is connected with a fan motor 13, and the fan motor is connected with an MCU fan controller 14; the fan motor 13 is a stepping motor 15.
As shown in fig. 3, the amplifying circuit includes an inverting input terminal of the operational amplifier connected to one end of a resistor R2 and a first end of a resistor R1, a second end of a resistor R2 is grounded, a second end of a resistor R1 is connected to a voltage 5V, a same-direction input terminal of the operational amplifier is connected to a first end of a resistor R3, a second end of a resistor R3 is connected to a first end of a resistor R4 and a capacitor C2, a second end of the resistor R4 is connected to a first end of a capacitor C3 and a 3 port of a comparator LM35, a 1 port of the LM35 is connected to VCC, and second ends of the capacitor C2, the capacitor C3 and the capacitor C4 are grounded.
As shown in fig. 4, the sound and light alarm circuit 101 includes a positive electrode of an LED1 connected to a first end of a resistor R6, a second end of the resistor R6 connected to a voltage 5V and a buzzer 1, a negative electrode of the LED1 connected to an upper pin of a transistor Q1, an upper pin of a transistor Q1 connected to a buzzer 2, a lower pin of a transistor Q1 grounded, a first end of the resistor R5 connected to a microprocessor, and a second end connected to a transistor Q1.
The wireless transparent transmission module 102 adopts low-power-consumption bluetooth transmission or WiFi transmission, and in the data transmission process, the length and content of the data of the sender and the receiver are completely consistent, so that the transmission quality is ensured, and meanwhile, the transmitted data is not processed.
As shown in fig. 5, the power circuit 104 includes a hall current sensor FD-SIP2 with a first pin grounded, a second pin grounded, a first end of a resistor R7 and an anode of a diode D1, a cathode of the diode D1 connected to the power VCC, a first end of a capacitor C5 and a first end of a capacitor C6 both connected to the power VCC, a second end of a capacitor C5 and a second end of a capacitor C6 both grounded, a second end of a resistor R7 connected to a first end of a resistor R8, and a second end of a resistor R8 grounded.
The utility model provides a high temperature control heat dissipation fan structural system includes, infrared temperature sensor sets up at upper test bench 1, and 6 fixed mounting of heat dissipation support are at lower floor's test bench 5, are provided with the first 7 and the second 8 of heat dissipation fan with adjustable angle on the heat dissipation support 6, and heat dissipation fan wind channel direction sets up the fin, and fin 3 sets up on veneer 4.
The photoelectric encoder 12 detects the rotating speed of the cooling fan, and is provided with a low-power Hall current sensor for detecting the power of the cooling fan; when any one of the rotating speed and the power of the heat dissipation fan is abnormal, the standby heat dissipation fan is switched in time, and the heat dissipation fan and the power supply of the test single board 4 are directly cut off when the heat dissipation fan is abnormal so as to reduce the safety risk.
The microprocessor model is STM32, and low power consumption, small size, high reliability, fast operation speed and strong function.
Example 3:
as shown in fig. 6, in the high-temperature monitoring heat dissipation fan structure, external temperature sensors are distributed and installed on the top end of a laboratory bench and used for detecting the temperature of a single plate 4, the heat dissipation fan is installed at an upper air inlet and a lower air inlet of the single plate 4 and used for cooling the single plate 4, the laboratory bench is divided into an upper layer and a lower layer, the bottom surface of the upper layer can be used for installing 2-4 infrared temperature sensors, collected temperature data are sent to a microprocessor through a wireless transmission module 102, the microprocessor checks whether the temperature is in a safe temperature range, if the temperature is in the safe temperature range, the current state of the heat dissipation fan is maintained, and if the temperature is too high, the inclination angle of the heat dissipation fan or the rotation speed of the heat dissipation fan is properly adjusted according to the position of an overheating area.
Firstly, distinguishing main radiating points on the single board, and installing the infrared temperature sensor right above the radiating points. The microprocessor is compatible with UART, IIC and SPI mainstream wireless transparent transmission module 102 interfaces, and the infrared temperature sensor sends detected temperature data to the microprocessor 100 through the wireless transparent transmission module 102. Then, the microprocessor 100 judges whether the temperature is in a safety area according to a set threshold value, and if the temperature is in the safety area, the heat dissipation fan keeps the current state; if the temperature data exceeds the threshold, the microprocessor 100 adjusts the inclination angle by the stepping motor of the heat dissipation fan to improve the heat dissipation effect. If the tilt angle of the cooling fan is adjusted to the optimum value and still the desired cooling effect cannot be achieved, the microprocessor 100 can increase the rotation speed of the cooling fan by adjusting the PWM duty ratio. If the temperature still cannot be reduced below the threshold, the microprocessor 100 gives an audible and visual alarm and sends an alarm message to a preset emergency contact.
The data of the photoelectric encoder is matched and compared by the microprocessor 100, and if the calculated rotating speed has larger deviation with a set value, a second path of standby heat dissipation fan is started and an error code is sent. The Hall current sensor is used for detecting the current of a power supply loop of the heat dissipation fan, if the power supply of the heat dissipation fan is abnormally increased, the power supply of the heat dissipation fan is cut off to start the standby heat dissipation fan, and if the current of the two heat dissipation fans is abnormally increased, the two heat dissipation fans and the tested single board power supply are cut off and problem codes are sent to wait for maintenance.
The above disclosure is only for the preferred embodiments of the present invention, but the present invention is not limited thereto, and any person skilled in the art can think of the inventive changes, and several improvements and decorations made without departing from the principle of the present invention should fall within the protection scope of the present invention.
Claims (7)
1. The utility model provides a high temperature control heat dissipation fan structure which characterized in that: the high-temperature monitoring radiating fan structure comprises a motor shaft, wherein a photoelectric encoder is arranged on the motor shaft, the top end of the motor shaft is connected with fan blades, a fan cover is arranged outside the fan blades, the tail end of the motor shaft is connected with a fan motor, and the fan motor is connected with an MCU fan controller;
the MCU fan controller comprises a microprocessor, the microprocessor is connected with an acousto-optic alarm circuit, a wireless transparent transmission module and a power circuit, and the wireless transparent transmission module is connected with an infrared temperature sensor module;
the infrared temperature sensor module comprises an infrared temperature sensor and a signal amplifying circuit connected with the infrared temperature sensor; the signal amplification circuit amplifies signals of the infrared temperature sensor and outputs amplified signals, and the amplified signals transmit detected temperature data to the microprocessor through the wireless transparent transmission module; the microprocessor is also connected with an acousto-optic alarm circuit.
2. The high-temperature monitoring heat dissipation fan structure of claim 1, wherein: the amplifying circuit comprises an operational amplifier, wherein the reverse input end of the operational amplifier is connected with one end of a resistor R2 and a first end of a resistor R1, the second end of the resistor R2 is grounded, the second end of the resistor R1 is connected with a voltage 5V, the equidirectional input end of the operational amplifier is connected with the first end of a resistor R3, the second end of the resistor R3 is connected with the first end of a resistor R4 and a capacitor C2, the second end of the resistor R4 is connected with the first end of a capacitor C3 and a 3 port of a comparator LM35, a port 1 of the LM35 is connected with a VCC, and the second ends of the capacitor C2, the capacitor C3 and the capacitor C4 are grounded.
3. The high-temperature monitoring heat dissipation fan structure of claim 2, wherein: the audible and visual alarm circuit comprises a positive electrode of an LED1, a first end of a resistor R6, a second end of a resistor R6 is connected with a voltage 5V end and a buzzer 1 end, a negative electrode of the LED1 is connected with an upper pin of a triode Q1, an upper pin of a triode Q1 is connected with a buzzer 2 end, a lower pin of a triode Q1 is grounded, a first end of a resistor R5 is connected with a microprocessor, and a second end of the resistor R5 is connected with a triode Q1.
4. The high-temperature monitoring heat dissipation fan structure of claim 3, wherein: the wireless transparent transmission module adopts low-power-consumption Bluetooth transmission or WiFi transmission.
5. The high-temperature monitoring heat dissipation fan structure of claim 4, wherein: the power supply circuit comprises a first pin of a Hall current sensor FD-SIP2 which is grounded, a second pin is connected with a first end of a resistor R7 and the anode of a diode D1, the cathode of the diode D1 is connected with a power supply VCC, the first ends of a capacitor C5 and a capacitor C6 are both connected with the power supply VCC, the second ends of a capacitor C5 and a capacitor C6 are both grounded, the second end of a resistor R7 is connected with the first end of a resistor R8, and the second end of the resistor R8 is grounded.
6. The high-temperature monitoring heat dissipation fan structure of claim 5, wherein: the microprocessor is a model STM32 microprocessor.
7. The structure of claim 6, wherein the structure of the high temperature monitoring heat dissipation fan comprises: the fan motor adopts a stepping motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022455930.XU CN214404030U (en) | 2020-10-29 | 2020-10-29 | High temperature control heat dissipation fan structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022455930.XU CN214404030U (en) | 2020-10-29 | 2020-10-29 | High temperature control heat dissipation fan structure |
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| Publication Number | Publication Date |
|---|---|
| CN214404030U true CN214404030U (en) | 2021-10-15 |
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|---|---|---|---|
| CN202022455930.XU Active CN214404030U (en) | 2020-10-29 | 2020-10-29 | High temperature control heat dissipation fan structure |
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| CN (1) | CN214404030U (en) |
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- 2020-10-29 CN CN202022455930.XU patent/CN214404030U/en active Active
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