CN214384752U

CN214384752U - Heat dissipation packaging structure of constant current driving chip

Info

Publication number: CN214384752U
Application number: CN202023222434.6U
Authority: CN
Inventors: 吴晓荣; 徐志华
Original assignee: Jiangyin Sunny Orient Technology Co ltd
Current assignee: Jiangyin Sunny Orient Technology Co ltd
Priority date: 2020-12-29
Filing date: 2020-12-29
Publication date: 2021-10-12
Anticipated expiration: 2030-12-29

Abstract

The utility model discloses a constant current driver chip's heat dissipation packaging structure belongs to LED equipment technical field. A heat dissipation packaging structure of a constant current driving chip comprises a packaging assembly, wherein a mounting groove is formed in the packaging assembly, a strip-shaped groove is formed in the bottom of the packaging assembly, a heat dissipation assembly is arranged in the strip-shaped groove, grooves are formed in two sides of the bottom of the packaging assembly, and an isolation net rack is clamped at the top of the heat dissipation assembly; the utility model discloses an keep apart rack and radiator unit's setting, because the bottom is provided with inhales formula flabellum, can accelerate the circulation of the inside air of mounting groove after making its operation, and then improve the radiating effect to the chip, impurity in the air can stop on first isolation net, the staff can pull out its one side from the recess and can clear up its impurity on its surface, avoid influencing the radiating effect, not only whole operation flow is simple convenient, time saving and labor saving, and need not to dismantle the chip and can take out it.

Description

Heat dissipation packaging structure of constant current driving chip

Technical Field

The utility model relates to a heat dissipation packaging structure especially relates to a be applied to heat dissipation packaging structure on constant current drive chip, belongs to the packaging technology field.

Background

At present, high-power devices such as LED devices and IGBT need special heat dissipation structure superposed fans for special cooling. Especially, the requirement of the high-power LED device on the driving power supply is nearly strict, the high-power LED device needs to be driven by a special lighting driving circuit, the rated power of a linear constant current driving chip often cannot meet the use requirement, and a plurality of linear constant current driving chips are often required to be connected in parallel to form a multi-chip parallel LED lighting circuit to expand the power.

However, present conventional constant current driver chip often can be installed in packaging structure, in order to improve the radiating effect to constant current driver chip, often can integrated encapsulation fan improve the radiating effect in its packaging structure, but under long-time the use, have in a large amount of dusts get into radiator unit, do not clear up then can influence the radiating effect to it for a long time, when clearing up it, often need dismantle the chip, can take out its inside radiator unit, very big inconvenience has been brought for maintainer.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving among the prior art when clearing up the dust, often need dismantle the chip, can take out its inside radiator unit, brought very big inconvenient problem for maintainer, and the heat dissipation packaging structure of a constant current drive chip that provides.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a constant current drive chip's heat dissipation packaging structure, includes the encapsulation subassembly, the mounting groove has been seted up to the inside of encapsulation subassembly, the bar groove has been seted up to the bottom of encapsulation subassembly, the inside in bar groove is provided with radiator unit, the both sides of encapsulation subassembly bottom all are seted up flutedly, radiator unit's top joint has the isolation rack, the inside of isolating the rack is provided with first isolation net, radiator unit's inside is provided with the driving shaft, the surface of driving shaft has cup jointed inhales the formula flabellum, the inside of mounting groove is provided with the spacing splint of translation, the inside of the spacing splint of translation is provided with second isolation net.

Preferably, the spout has all been seted up to the both sides of encapsulation subassembly, the inside sliding connection of spout has the slurcam.

Preferably, the cavity has all been seted up to the both sides at radiator unit top, the inside fixed mounting of cavity has the supporting external member, the one end swing joint of supporting external member has flexible bracing piece, the one end and the slurcam fixed connection of flexible bracing piece.

Preferably, one side of slurcam extends to the inside of recess and with limiting plate fixed connection, the inside of recess is provided with the handle, handle fixed mounting is in one side of keeping apart the rack.

Preferably, the four corners of the packaging assembly are provided with prismatic recesses, and locking bolts are inserted into the prismatic recesses.

Preferably, the both sides of encapsulation subassembly all are pegged graft and are had screw thread push rod, the one end of screw thread push rod extend to the inside of mounting groove and with translation limit splint swing joint, the upper surface of translation limit splint is provided with the chip body.

Compared with the prior art, the utility model provides a constant current driver chip's heat dissipation packaging structure possesses following beneficial effect:

the utility model discloses an keep apart rack and radiator unit's setting, because the chip body is installed in the mounting groove, the mounting groove is in penetrating state with the bar groove of bottom, make the heat that the chip distributed out can discharge fast, because the bottom is provided with inhales the formula flabellum, make its circulation that can accelerate the inside air of mounting groove after the operation, and then improve the radiating effect to the chip, impurity in its air can stop on first isolation net, the staff can pull out it from one side of recess and can clear up the impurity on its surface, avoid influencing the radiating effect, not only whole operation flow is simple convenient, time saving and labor saving, and need not to dismantle the chip and can take out it, very big facility has been brought for the staff. The utility model discloses a setting of screw thread propelling movement pole and the spacing splint of translation, the size that the chip can be installed as required to the staff moves screw thread propelling movement pole through twisting and can make the spacing splint of translation carry out the translation, and two spacing splint of translation mutually support, can carry out the centre gripping to it, and then make it fix in the encapsulation subassembly to make the device can be applicable to the chip of different models, very big improvement the device's practicality.

Drawings

Fig. 1 is a schematic top view of the structure of the present invention;

fig. 2 is a perspective view of the packaging assembly of the present invention;

fig. 3 is a schematic side view of the structure of the packaging assembly of the present invention;

fig. 4 is a schematic side view of the package assembly of the present invention.

In the figure: 1. a package assembly; 2. mounting grooves; 3. a strip-shaped groove; 4. a heat dissipating component; 5. a groove; 6. isolating the net rack; 7. a first isolation mesh; 8. a drive shaft; 9. a suction fan blade; 10. translating the limiting clamp plate; 11. a second isolation mesh; 12. a chute; 13. a push plate; 14. a cavity; 15. a support assembly; 16. a telescopic support rod; 17. a limiting plate; 18. a handle; 19. a prismatic recess; 20. locking the bolt; 21. a threaded push rod; 22. the chip body.

Detailed Description

Referring to fig. 1-4, the utility model relates to a heat dissipation packaging structure of constant current driving chip, which comprises a packaging assembly 1, wherein the packaging assembly 1 is internally provided with a mounting groove 2, the bottom of the packaging assembly 1 is provided with a strip groove 3, the inside of the strip groove 3 is provided with a heat dissipation assembly 4, two sides of the bottom of the packaging assembly 1 are respectively provided with a groove 5, the top of the heat dissipation assembly 4 is clamped with an isolation net rack 6, the inside of the isolation net rack 6 is provided with a first isolation net 7, a chip body 22 is mounted in the mounting groove 2, the mounting groove 2 and the strip groove 3 at the bottom are in a through state, so that the heat emitted by the chip can be rapidly discharged, because the bottom is provided with a suction type fan blade 9, the circulation of the air in the mounting groove 2 can be accelerated after the operation, and further the heat dissipation effect on the chip can be improved, the inside of the heat dissipation assembly 4 is provided with a driving shaft 8, the outer surface of the driving shaft 8 is sleeved with the suction type fan blade 9, impurities in the air can stay on the first isolation net 7, a worker can pull the first isolation net out of one side of the groove 5 to clean the impurities on the surface of the groove, the heat dissipation effect is prevented from being influenced, the whole operation process is simple, convenient, time-saving and labor-saving, the chip can be taken out without disassembling, great convenience is brought to the worker, the translation limiting clamp plate 10 is arranged inside the mounting groove 2, the second isolation net 11 is arranged inside the translation limiting clamp plate 10, the sliding grooves 12 are formed in the two sides of the packaging assembly 1, the pushing plate 13 is connected inside the sliding grooves 12 in a sliding mode, the worker can install the size of the chip according to needs, the translation limiting clamp plate 10 can translate by screwing the threaded pushing rod 21, the two translation limiting clamp plates 10 are matched with each other to clamp the chip, and further fix the chip in the packaging assembly 1, and therefore the device can be suitable for chips of different models, very big improvement the device's practicality, cavity 14 has all been seted up to the both sides at radiator unit 4 top, the inside fixed mounting of cavity 14 has supporting external member 15, supporting external member 15's one end swing joint has flexible bracing piece 16, the one end and the slurcam 13 fixed connection of flexible bracing piece 16, one side of slurcam 13 extend to recess 5 inside and with limiting plate 17 fixed connection, recess 5's inside is provided with handle 18, handle 18 fixed mounting is in one side of keeping apart rack 6, diamond-shaped sunken 19 has all been seted up to encapsulation subassembly 1's four corners department, the inside of diamond-shaped sunken 19 is pegged graft and is had locking bolt 20, all pegged graft threaded propelling movement pole 21 in encapsulation subassembly 1's both sides, the one end of threaded propelling movement pole 21 extend to mounting groove 2 inside and with translation limiting splint 10 swing joint, the upper surface of translation limiting splint 10 is provided with chip body 22.

In the utility model, through the arrangement of the isolation net rack 6 and the heat dissipation component 4, the chip body 22 is arranged in the mounting groove 2, the mounting groove 2 and the strip-shaped groove 3 at the bottom are in a permeable state, so that the heat emitted by the chip can be quickly discharged, because the suction type fan blades 9 are arranged at the bottom, the circulation of the air in the mounting groove 2 can be accelerated after the operation, and the heat dissipation effect on the chip is further improved, the impurities in the air can be stopped on the first isolation net 7, the worker can pull the chip out from one side of the groove 5 to clean the impurities on the surface of the chip, the heat dissipation effect is prevented from being influenced, the whole operation flow is simple, convenient, time-saving and labor-saving, the chip can be taken out without disassembling the chip, great convenience is brought to the worker, through the arrangement of the thread pushing rod 21 and the translational spacing splint 10, the worker can install the size of the chip according to needs, can make the spacing splint 10 of translation carry out the translation through twisting screw thread propelling movement pole 21, two spacing splint 10 of translation mutually support, can carry out the centre gripping to it, and then make it fix in encapsulation subassembly 1 to make the device can be applicable to the chip of different models, very big improvement the device's practicality.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A heat dissipation packaging structure of a constant current driving chip comprises a packaging component (1) and is characterized in that, the packaging component (1) is internally provided with a mounting groove (2), the bottom of the packaging component (1) is provided with a strip-shaped groove (3), a heat dissipation component (4) is arranged in the strip-shaped groove (3), grooves (5) are respectively arranged on two sides of the bottom of the packaging component (1), an isolation net rack (6) is clamped at the top of the heat dissipation assembly (4), a first isolation net (7) is arranged inside the isolation net rack (6), a driving shaft (8) is arranged inside the heat dissipation component (4), the outer surface of the driving shaft (8) is sleeved with a suction type fan blade (9), the installation groove is characterized in that a translation limiting clamping plate (10) is arranged inside the installation groove (2), and a second isolation net (11) is arranged inside the translation limiting clamping plate (10).

2. The heat dissipation package structure of a constant current driver chip as claimed in claim 1, wherein the package assembly (1) has two sides each having a sliding slot (12), and the sliding slots (12) are slidably connected to a pushing plate (13).

3. The heat dissipation package structure of a constant current driver chip as claimed in claim 2, wherein the top of the heat dissipation assembly (4) has a cavity (14) on both sides, a support sleeve (15) is fixedly mounted inside the cavity (14), one end of the support sleeve (15) is movably connected to a telescopic support rod (16), and one end of the telescopic support rod (16) is fixedly connected to the push plate (13).

4. The heat dissipation package structure of a constant current driver chip as claimed in claim 2, wherein one side of the pushing plate (13) extends to the inside of the recess (5) and is fixedly connected with the limiting plate (17), a handle (18) is disposed inside the recess (5), and the handle (18) is fixedly mounted on one side of the isolation grid (6).

5. The heat dissipation package structure of a constant current driver chip as claimed in claim 1, wherein the package assembly (1) has prismatic recesses (19) at four corners, and the prismatic recesses (19) are inserted with locking bolts (20).

6. The heat dissipation package structure of a constant current driver chip as claimed in claim 1, wherein a threaded push rod (21) is inserted into each of two sides of the package assembly (1), one end of the threaded push rod (21) extends into the mounting groove (2) and is movably connected to the translation limiting clamp plate (10), and a chip body (22) is disposed on an upper surface of the translation limiting clamp plate (10).