CN214381932U

CN214381932U - High-power water-cooling machine case cooling system

Info

Publication number: CN214381932U
Application number: CN202023276565.2U
Authority: CN
Inventors: 朱骏
Original assignee: Beijing Huaqing Ruida Technology Co ltd
Current assignee: Beijing Huaqing Ruida Technology Co ltd
Priority date: 2020-12-29
Filing date: 2020-12-29
Publication date: 2021-10-08
Anticipated expiration: 2030-12-29

Abstract

The utility model provides a high-power water-cooled case heat dissipation system, which comprises a case enclosing frame, wherein the case enclosing frame consists of four enclosing walls, and a plug panel and a case rear panel are respectively arranged at the two ends of the case enclosing frame; one end of the case enclosing frame is provided with a plugging panel which can be opened and closed and is assembled on the case enclosing frame, a case handle is arranged on the outer side of the plugging panel, and a debugging door is also arranged on one side of the plugging panel of the case enclosing frame; the other end of the enclosure frame of the case is provided with a rear panel of the case, and the rear panel of the case is provided with two liquid cooling connectors; the cold liquid runner is arranged on the inner side of the enclosing wall of the enclosure frame of the case and comprises a cold liquid inlet and a cold liquid outlet, the cold liquid inlet and the cold liquid outlet are respectively connected with a liquid cooling connector on the rear panel of the case, and the liquid cooling connector is connected with an external cold liquid circulating system. The utility model discloses beneficial effect: the optimized cold liquid flow channel arrangement mode can further improve the heat dissipation capacity of the case, and is suitable for a high-power communication system with high power consumption and high heat generation.

Description

High-power water-cooling machine case cooling system

Technical Field

The utility model belongs to the technical field of the water-cooling machine case equipment technique and specifically relates to a high-power water-cooling machine case cooling system is related to.

Background

In the communication tooling equipment, a large amount of heat is generated during the normal operation of the high-power communication equipment, and a large amount of heat dissipation structure design needs to be carried out on the enclosure frame of the case so as to avoid the abnormal condition or equipment loss caused by the overheating of a communication system. The existing heat dissipation structure of the enclosure frame of the chassis needs to occupy larger equipment volume and has poor heat dissipation effect, and cannot meet the use requirements of a high-power communication system with high power consumption and high heat generation, so that the prior art has defects and needs to be further improved and perfected.

Disclosure of Invention

The utility model aims at providing a high-power water-cooling machine case cooling system to alleviate the not enough technical problem of current quick-witted case heat dispersion.

In order to achieve the above purpose, the technical scheme of the utility model is realized like this:

a high-power water-cooling machine case cooling system comprises:

the chassis enclosure frame is composed of four enclosure walls, and a plug panel and a chassis rear panel are arranged at two ends of the chassis enclosure frame respectively.

The quick-witted case encloses frame one end and is equipped with the plug panel, but plug panel switch assembly is on quick-witted case encloses the frame, just the plug panel outside is provided with quick-witted case handle, quick-witted case encloses the frame and still is provided with the debugging door in plug panel one side.

The other end of the enclosure frame of the case is provided with a case rear panel, and the case rear panel is provided with two liquid cooling connectors.

The cooling liquid flow channel is arranged on the inner side of the enclosing wall of the enclosure frame of the case and comprises a cooling liquid inlet and a cooling liquid outlet, the cooling liquid inlet and the cooling liquid outlet are respectively connected with a liquid cooling connector on a rear panel of the case, and the liquid cooling connector is connected with an external cooling liquid circulating system.

Furthermore, four surrounding walls of the enclosure frame of the case are integrally fixed and assembled.

Furthermore, a cabinet slide rail is further arranged at the bottom end of the outer side of the lateral enclosure wall of the cabinet enclosure frame.

Furthermore, two liquid cooling connectors are respectively arranged on two sides of the rear panel of the case.

Further, the cold liquid flow channel is arranged around the inner sides of the four surrounding walls of the enclosure frame of the case.

Furthermore, a board card slot is further arranged on the peripheral wall at the bottom of the enclosure frame of the case, and the clamping board is tightly attached to the enclosure frame of the case through the board card slot.

Furthermore, a plurality of case guide pins are arranged at the bottom of the rear panel of the case.

Furthermore, the cold liquid inlet and the cold liquid outlet are oppositely arranged on the inner sides of the two enclosure walls of the enclosure frame of the chassis.

Furthermore, the cold liquid inlet and the cold liquid outlet are welded on the surrounding wall.

Furthermore, the cold liquid flow channel is a copper pipe flow channel.

Compared with the prior art, high-power water-cooling machine case cooling system have following advantage: the water-cooled case uses an integral case enclosing frame, so that the structure is more stable, and case leakage caused by splicing a plurality of cases is avoided; the inner sides of the enclosing walls of the enclosure frame of the case are uniformly provided with cold liquid flow channels, the cold liquid flow channels are connected with an external cold liquid circulating system through cold liquid inlets, cold liquid outlets and liquid cooling connectors, water is used as a heat exchange medium, the heat dissipation capacity of the case can be further improved through an optimized arrangement mode of the cold liquid flow channels, and the case is suitable for a high-power communication system with high power consumption and high heating.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the invention without limitation. In the drawings:

fig. 1 is a schematic diagram of a forward structure of a heat dissipation system of a high-power water-cooled chassis according to an embodiment of the present invention;

fig. 2 is a schematic diagram of a back structure of a heat dissipation system of a high-power water-cooled chassis according to an embodiment of the present invention;

fig. 3 is a schematic view of an internal structure of a heat dissipation system of a high-power water-cooled chassis according to an embodiment of the present invention;

fig. 4 is a schematic diagram of a cold liquid flow channel arrangement mode of the heat dissipation system of the high-power water-cooling chassis according to the embodiment of the present invention.

Description of reference numerals:

1-enclosure frame of the case; 2-rear panel of the case; 3-liquid cooling joint; 4-a chassis slide rail; 5-case guide pins; 6-plugging the panel; 7-debugging a gate; 8-case handle; 9-cold liquid inlet; 10-board card slot; 11-cold liquid outlet; 12-upper wall of the case; 13-cold liquid flow channel.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without any creative effort belong to the protection scope of the present invention.

Examples

The technical problem to be solved in this embodiment is that the heat dissipation structure of the existing enclosure frame 1 needs to occupy a larger device volume and has a poor heat dissipation effect, and cannot meet the use requirements of a high-power communication system with high power consumption and high heat generation.

In order to solve the above technical problem, the present embodiment provides a high-power water-cooled enclosure heat dissipation system, including:

the chassis enclosure frame 1 comprises four enclosure walls, and a plug panel 6 and a chassis rear panel 2 are respectively arranged at two ends of the chassis enclosure frame 1. And the four surrounding walls of the case surrounding frame 1 are integrally fixed and assembled. And a case slide rail 4 is further arranged at the bottom end of the outer side of the lateral enclosing wall of the case enclosing frame 1.

As shown in fig. 1, the chassis encloses frame 1 one end and is equipped with plug panel 6, but plug panel 6 switch assembly encloses on frame 1 at the chassis, just the plug panel 6 outside is provided with quick-witted case handle 8, frame 1 still is provided with debugging door 7 in plug panel 6 one side to the chassis.

As shown in fig. 2, the other end of the enclosure frame 1 is equipped with a rear panel 2 of the enclosure, and the rear panel 2 of the enclosure is provided with two liquid cooling connectors 3. Two liquid cooling joints 3 are respectively arranged on two sides of the rear panel 2 of the chassis. The bottom of the case back panel 2 is also provided with a plurality of case guide pins 5.

As shown in fig. 3, a cold liquid flow channel 13 is arranged on the inner side of the surrounding wall of the enclosure frame 1 of the chassis, and the cold liquid flow channel 13 is a copper pipe flow channel. The cold liquid flow channel 13 comprises a cold liquid inlet 9 and a cold liquid outlet 11, and the cold liquid inlet 9 and the cold liquid outlet 11 are oppositely arranged on the inner sides of the two enclosure walls of the enclosure frame 1 of the chassis. The cold liquid inlet 9 and the cold liquid outlet 11 are welded on the surrounding wall. The cold liquid inlet 9 and the cold liquid outlet 11 are respectively connected with the liquid cooling connector 3 on the rear panel 2 of the case, and the liquid cooling connector 3 is connected with an external cold liquid circulating system. The chassis encloses and still sets up integrated circuit board slot 10 on the leg of frame 1 bottom, and the cardboard passes through integrated circuit board slot 10 and encloses frame 1 closely laminating with the chassis.

As shown in fig. 4, the cold liquid flow channel 13 is arranged around the inside of four surrounding walls of the enclosure frame 1 of the chassis. The upper wall 12 of the enclosure frame 1 may also be provided with a heat dissipation window.

The water-cooled case provided by the embodiment uses the integral case enclosure frame 1, so that the structure is more stable, and the case leakage caused by splicing a plurality of cases is avoided; the inner side of the enclosing wall of the enclosure frame 1 is uniformly provided with cold liquid flow channels 13, the cold liquid flow channels 13 are connected with an external cold liquid circulating system through the cold liquid inlet 9, the cold liquid outlet 11 and the liquid cooling connector 3, water is used as a heat exchange medium, the heat dissipation capacity of the enclosure can be further improved through an optimized arrangement mode of the cold liquid flow channels 13, and the enclosure frame is suitable for a high-power communication system with high power consumption and high heat generation.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings, which are merely for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be construed as limiting the invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the invention, the meaning of "a plurality" is two or more unless otherwise specified.

In the description of the invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "connected" and "connected" are to be construed broadly, e.g. as being fixed or detachable or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the creation of the present invention can be understood by those of ordinary skill in the art through specific situations.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the invention, so that any modifications, equivalents, improvements and the like, which are within the spirit and principle of the present invention, should be included in the scope of the present invention.

Claims

1. The utility model provides a high-power water-cooling machine case cooling system which characterized in that includes:

the chassis enclosure frame consists of four enclosure walls, and a plug panel and a chassis rear panel are respectively arranged at two ends of the chassis enclosure frame;

one end of the case enclosing frame is provided with a plugging panel which can be assembled on the case enclosing frame in a switching way, a case handle is arranged on the outer side of the plugging panel, and a debugging door is also arranged on one side of the plugging panel of the case enclosing frame;

the other end of the enclosure frame of the case is provided with a rear panel of the case, and the rear panel of the case is provided with two liquid cooling connectors;

2. The high-power water-cooled chassis heat dissipation system of claim 1, wherein: and the four surrounding walls of the enclosure frame of the case are integrally fixed and assembled.

3. The high-power water-cooled chassis heat dissipation system of claim 1, wherein: and a case slide rail is further arranged at the bottom end of the outer side of the side enclosing wall of the case enclosing frame.

4. The high-power water-cooled chassis heat dissipation system of claim 1, wherein: two liquid cooling joints are respectively arranged on two sides of the rear panel of the chassis.

5. The high-power water-cooled chassis heat dissipation system of claim 1, wherein: the cold liquid flow channel is arranged on the inner sides of the four surrounding walls of the enclosure frame of the case in a surrounding mode.

6. The high-power water-cooled case heat dissipation system of claim 5, wherein: the chassis encloses and still sets up the integrated circuit board slot on the leg of frame bottom, and the cardboard encloses the frame through integrated circuit board slot and chassis and closely laminates.

7. The high-power water-cooled chassis heat dissipation system of claim 1, wherein: a plurality of case guide pins are further arranged at the bottom of the case rear panel.

8. The high-power water-cooled chassis heat dissipation system of claim 1, wherein: the cold liquid inlet and the cold liquid outlet are oppositely arranged on the inner sides of the two enclosure walls of the enclosure frame of the case.

9. The high-power water-cooled chassis heat dissipation system of claim 8, wherein: and the cold liquid inlet and the cold liquid outlet are welded on the enclosure wall.

10. The high-power water-cooled chassis heat dissipation system of claim 1, wherein: the cold liquid flow passage is a copper pipe flow passage.