CN214381847U

CN214381847U - Waterproof assembly structure of circuit board

Info

Publication number: CN214381847U
Application number: CN202023340457.7U
Authority: CN
Inventors: 马仁军
Original assignee: Sichuan Changhong Electronic Parts Co ltd
Current assignee: Sichuan Changhong Electronic Parts Co ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-10-08
Anticipated expiration: 2030-12-31

Abstract

The utility model discloses a waterproof assembly structure of a circuit board, which comprises an upper cover, a circuit board, a lower cover, a button layer and a waterproof silica gel layer; the waterproof silica gel layer is connected with the button layer in a buckling mode and clamps the circuit board, and the upper cover and the lower cover are connected in a buckling mode to form a cavity for accommodating the waterproof silica gel layer and the button layer. The utility model discloses improve the assembly structure of circuit board in the electronic apparatus, carry out duplicate protection to the circuit board through the assembly structure of button layer and waterproof silica gel layer and the assembly structure of upper cover and lower cover, can effectively protect the circuit board, improve the waterproof effect of whole assembly structure; the utility model discloses the mode that the assembly connection of well each part adopted the buckle to connect more, and the manual assembly degree of difficulty is lower, need not consume a large amount of human costs, can realize the big mass assembly of circuit board, effectively improves assembly efficiency.

Description

Waterproof assembly structure of circuit board

Technical Field

The utility model belongs to the technical field of the electronic equipment assembly technique and specifically relates to a waterproof assembly structure of circuit board.

Background

In the present controller or remote controller of electronic apparatus, generally adopt one or more sealing washer to carry out water repellent to the circuit board, perhaps link together the flexible glue seal structure through the mode of secondary injection moulding, this kind of assembly structure has following shortcoming: 1. the production cost of parts is increased, a large amount of labor is consumed for assembly, and the manual assembly cost is high; 2. the assembly is troublesome, the mass assembly is not facilitated, and the assembly efficiency is low; 3. during assembly, the sealing ring is not easy to be arranged in a corresponding structure, so that the production efficiency is influenced; 4. when a plurality of parts are assembled, the risk of sealing failure is large.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the circuit board waterproof assembly structure is high in assembly efficiency and good in protection performance of the circuit board.

For solving the technical problem the utility model discloses the technical scheme who adopts is: the waterproof assembly structure of the circuit board comprises an upper cover, the circuit board, a lower cover, a key layer and a waterproof silica gel layer; the waterproof silica gel layer is connected with the button layer in a buckling mode and clamps the circuit board, and the upper cover and the lower cover are connected in a buckling mode to form a cavity for accommodating the waterproof silica gel layer and the button layer.

Further, the method comprises the following steps: a circle of sealing rings perpendicular to the key layer are arranged around the key layer, a plurality of clamping grooves are formed in the sealing rings, and clamping teeth matched with the clamping grooves are arranged at the edge of the waterproof silica gel layer; when the waterproof silica gel layer is connected with the key layer, the latch is clamped into the corresponding clamping groove.

Further, the method comprises the following steps: the bottom surface on button layer is fixed with at least one buckle post, buckle post passes behind circuit board and the waterproof silica gel layer in proper order the buckle on the surface on waterproof silica gel layer.

Further, the method comprises the following steps: the end of the buckling column is a cone end.

Further, the method comprises the following steps: the bottom surface on button layer is fixed with at least one reference column, the reference column passes circuit board and waterproof silica gel layer in proper order.

Further, the method comprises the following steps: a circle of surrounding edge is fixed on the periphery of the upper cover, a plurality of buckle bosses are fixed on the inner side surface of the surrounding edge, and buckle holes corresponding to the buckle bosses one by one are fixed on the outer side of the periphery of the lower cover; when the upper cover is connected with the lower cover, the buckle boss is inserted into the corresponding buckle hole.

Further, the method comprises the following steps: the lower end face of the buckle boss is an inclined plane, and an inclined plane step is fixed at the top of the buckle hole.

Further, the method comprises the following steps: a guide block is fixed on the inner side surface of the surrounding edge, and the section of the guide block is T-shaped; the periphery of the lower cover is provided with a guide groove matched with the guide block, and when the upper cover is connected with the lower cover, the guide block is inserted into the corresponding guide groove.

Further, the method comprises the following steps: the key layer is characterized in that at least one limiting boss protruding upwards is fixed on the top surface of the key layer, an inwards concave limiting groove is formed in the inner top surface of the upper cover, and the limiting boss is inserted into the corresponding limiting groove.

The utility model has the advantages that: the utility model discloses improve the assembly structure of circuit board in the electronic apparatus, carry out duplicate protection to the circuit board through the assembly structure of button layer and waterproof silica gel layer and the assembly structure of upper cover and lower cover, can effectively protect the circuit board, improve the waterproof effect of whole assembly structure; the utility model discloses the mode that the assembly connection of well each part adopted the buckle to connect more, and the manual assembly degree of difficulty is lower, need not consume a large amount of human costs, can realize the big mass assembly of circuit board, effectively improves assembly efficiency.

Drawings

FIG. 1 is an exploded view of the structure of the present invention;

FIG. 2 is an exploded view of the structure of the present invention;

FIG. 3 is an isometric view of the upper cover;

FIG. 4 is a front isometric view of a key layer;

FIG. 5 is a rear isometric view of a key layer;

FIG. 6 is an isometric view of the assembled key layer and waterproof silicone layer;

labeled as: 100-upper cover, 110-surrounding edge, 120-buckling lug boss, 130-limiting groove, 140-guiding block, 200-lower cover, 210-buckling hole, 220-inclined plane step, 300-circuit board, 400-key layer, 410-sealing ring, 420-buckling groove, 430-buckling column, 440-positioning column, 450-limiting lug boss, 500-waterproof silica gel layer and 510-clamping tooth.

Detailed Description

In order to facilitate understanding of the present invention, the following description is further provided with reference to the accompanying drawings.

As shown in fig. 1 and fig. 2, the utility model discloses a waterproof assembly structure of circuit board comprises upper cover 100, lower cover 200, circuit board 300, button layer 400 and waterproof silica gel layer 500, circuit board 300 sets up between button layer 400 and waterproof silica gel layer 500, button layer 400 and waterproof silica gel layer 500 connect the assembly and constitute the cavity that includes circuit board 300 inclusion, the assembly structure after button layer 400 and waterproof silica gel layer 500 connect sets up between upper cover 100 and lower cover 200, upper cover 100 and lower cover 200 connect the assembly and constitute the cavity that holds button layer 400 and waterproof silica gel layer 500; the utility model discloses an assembly structure of button layer 400 and waterproof silica gel layer 500 and assembly structure of upper cover 100 and lower cover 200 carry out duplicate protection to circuit board 300 to effectively improve circuit board 300's protection effect, improve whole assembly structure's water-proof effects.

The utility model discloses well button layer 400 is silica gel button layer, as shown in fig. 1, fig. 2 and fig. 5, is equipped with round sealing washer 410 at button layer 400's periphery, sealing washer 410 and the integrative injection moulding of button layer 400, and sealing washer 410 forms the round flange at button layer 400's periphery along the peripheral perpendicular setting of button layer 400. A plurality of clamping grooves 420 are formed in the sealing ring 410, the clamping grooves 420 are formed by bending the sealing ring 410, and clamping teeth 510 matched with the clamping grooves 420 are arranged on the edge of the waterproof silica gel layer 500; the utility model discloses well draw-in groove 420 is the rectangle draw-in groove, and is corresponding, and latch 510 sets up to the rectangle latch. The key layer 400 and the waterproof silica gel layer 500 are matched with each other through the clamping grooves 420 and the clamping teeth 510 to realize assembly connection, the circuit board 300 is clamped between the key layer 400 and the waterproof silica gel layer 500, and the first layer of the circuit board 300 is protected through the matching of the key layer 400 and the waterproof silica gel layer 500 to achieve a waterproof effect. In addition, in the utility model, the limit in the horizontal direction is mainly realized through the cooperation of the clamping groove 420 and the latch 510, in order to improve the stability of the connection of the key layer 400 and the waterproof silica gel layer 500, the utility model discloses in still having set up the buckle post 430 and having carried out the connection of the key layer 400 and the waterproof silica gel layer 500, as shown in fig. 2, fig. 5 and fig. 6, be fixed with the buckle post 430 of vertical setting on the bottom surface of the key layer 400, set up the through-hole in the position corresponding to the buckle post 430 on the circuit board 300 and the waterproof silica gel layer 500, the end diameter of the buckle post 430 should be greater than the aperture of the through-hole, make the buckle post 430 can pass through the circuit board 300 and the waterproof silica gel layer 500 in proper order and buckle on the surface of the waterproof silica gel layer 500, thereby realize the integral connection of the assembly structure of the key layer 400 and the waterproof silica gel layer 500 fast; the quantity of buckle post 430 is set for according to actual need, the utility model discloses in adopted two buckle posts 430. In order to facilitate the assembly of workers, the end of the buckling column 430 is a cone end, so that the buckling column 430 can easily pass through the through hole, the buckling column 430 is silica gel with the same material as the key layer 400, the buckling column 430 has enough elasticity, and the buckling column 430 and the key layer 400 are integrally molded by injection during production. As shown in fig. 2, 5 and 6, in order to facilitate the worker to quickly position the button layer 400 and the waterproof silicone layer 500 during the assembly, the bottom surface of the button layer 400 is further provided with a positioning column 440, the positioning column 440 is vertically fixed on the bottom surface of the button layer 400, a through hole for the positioning column 440 to pass through is formed at the corresponding position of the circuit board 300 and the waterproof silicone layer 500, and when the button layer 400 and the waterproof silicone layer 500 are assembled, the positioning column 440 sequentially passes through the through holes on the button layer 400 and the waterproof silicone layer 500 to realize quick positioning; the quantity of reference column 440 is set for according to actual need, the utility model discloses in adopted two reference columns 440, reference column 440 adopts the same silica gel of material and button layer 400 equally, reference column 440 also with the integrative injection moulding of button layer 400 during production.

As shown in fig. 1 to 5, the upper cover 100 and the lower cover 200 of the present invention are assembled by the same snap connection, a circle of surrounding edge 110 is fixed on the periphery of the upper cover 100, the upper cover 100 forms a rectangular groove by setting the periphery 110, a plurality of snap bosses 120 are fixed on the inner side of the periphery 110, snap holes 210 corresponding to the snap bosses 120 one by one and engaged with the snap are provided on the periphery outside of the lower cover 200, when the upper cover 100 is connected with the lower cover 200, the snap bosses 120 are inserted into the corresponding snap holes 210, and the periphery of the lower cover 200 is connected and fixed with the surrounding edge 100 of the upper cover 100. In order to reduce the assembly degree of difficulty of upper cover 100 and lower cover 200, the utility model discloses set up the lower terminal surface of buckle boss 120 into the inclined plane to at the fixed inclined plane step 220 in the top of buckle hole 210, when making upper cover 100 and lower cover 200 assemble, buckle boss 120 and buckle hole 210's contact surface is the inclined plane that parallels, and buckle boss 120 can insert in the corresponding buckle hole 210 more easily. After the upper cover 100 and the lower cover 200 are connected by a snap fit, the upper cover 100 and the lower cover 200 are fixed by screws. The utility model discloses in, in order to realize the quick, accurate location of upper cover 100 and lower cover 200, the guide block 140 has been set up on the medial surface of the surrounding edge 110 of upper cover 100, the cross-section of guide block 140 is "T" shape, be equipped with simultaneously on the periphery of lower cover 200 with guide block 140 matched with guiding groove, when upper cover 100 is connected with lower cover 200, aim at corresponding guiding groove with guide block 140, make guide block 140 insert can realize the quick location of upper cover 100 with the assembly of lower cover 200 in the corresponding guiding groove.

As shown in fig. 3 and 4, at least one limiting boss 450 protruding upwards is fixed on the top surface of the key layer 400, an inward concave limiting groove 130 is formed on the inner top surface of the upper cover 100, the limiting boss 450 is inserted into the corresponding limiting groove 130, and the key layer 400 is positioned in the upper cover 100 by the cooperation of the limiting boss 450 and the limiting groove 130, so that the keys on the key layer 400 can correspond to the key holes on the upper cover 100.

Claims

1. Waterproof assembly structure of circuit board, its characterized in that: comprises an upper cover (100), a lower cover (200), a circuit board (300), a key layer (400) and a waterproof silica gel layer (500); waterproof silica gel layer (500) is connected and with button layer (400) buckle and press from both sides circuit board (300) inclusion, upper cover (100) and lower cover (200) buckle are connected and are constituteed the cavity that holds waterproof silica gel layer (500) and button layer (400).

2. The waterproof assembly structure of a circuit board according to claim 1, wherein: a circle of sealing rings (410) perpendicular to the key layer (400) are arranged around the key layer (400), a plurality of clamping grooves (420) are formed in the sealing rings (410), and clamping teeth (510) matched with the clamping grooves (420) are arranged at the edge of the waterproof silica gel layer (500); when the waterproof silica gel layer (500) is connected with the key layer (400), the latch (510) is clamped into the corresponding clamping groove (420).

3. The waterproof assembly structure of a circuit board according to claim 1, wherein: at least one buckle column (430) is fixed on the bottom surface of the key layer (400), and the buckle column (430) penetrates through the circuit board (300) and the waterproof silica gel layer (500) in sequence and then is buckled on the surface of the waterproof silica gel layer (500).

4. The waterproof assembly structure of a circuit board according to claim 3, wherein: the end of the buckling column (430) is a cone end.

5. The waterproof assembly structure of a circuit board according to claim 1, wherein: the bottom surface of button layer (400) is fixed with at least one reference column (440), reference column (440) pass circuit board (300) and waterproof silica gel layer (500) in proper order.

6. The waterproof assembly structure of a circuit board according to claim 1, wherein: a circle of surrounding edge (110) is fixed on the periphery of the upper cover (100), a plurality of buckle bosses (120) are fixed on the inner side surface of the surrounding edge (110), and buckle holes (210) which are in one-to-one correspondence with the buckle bosses (120) are fixed on the outer side of the periphery of the lower cover (200); when the upper cover (100) is connected with the lower cover (200), the buckling bosses (120) are inserted into the corresponding buckling holes (210).

7. The waterproof assembly structure of a circuit board according to claim 6, wherein: the lower end face of the buckle boss (120) is an inclined plane, and an inclined plane step (220) is fixed at the top of the buckle hole (210).

8. The waterproof assembly structure of a circuit board according to claim 6, wherein: a guide block (140) is fixed on the inner side surface of the surrounding edge (110), and the section of the guide block (140) is T-shaped; the periphery of the lower cover (200) is provided with guide grooves matched with the guide blocks (140), and when the upper cover (100) is connected with the lower cover (200), the guide blocks (140) are inserted into the corresponding guide grooves.

9. The waterproof assembly structure of a circuit board according to claim 1, wherein: the key layer (400) is characterized in that at least one limiting boss (450) protruding upwards is fixed on the top surface of the key layer, an inwards concave limiting groove (130) is formed in the inner top surface of the upper cover (100), and the limiting boss (450) is inserted into the corresponding limiting groove (130).