CN214376093U - Heat dissipation type foot pad assembly for notebook computer - Google Patents
Heat dissipation type foot pad assembly for notebook computer Download PDFInfo
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- CN214376093U CN214376093U CN202023072152.2U CN202023072152U CN214376093U CN 214376093 U CN214376093 U CN 214376093U CN 202023072152 U CN202023072152 U CN 202023072152U CN 214376093 U CN214376093 U CN 214376093U
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Abstract
The utility model discloses a heat dissipation type callus on sole subassembly for notebook computer, through temperature sensor and computer casing fixed connection, heat dissipation insulating piece and computer casing fixed connection, computer casing has the thermovent, radiator unit and computer casing fixed connection, four inner tubes respectively with computer casing fixed connection, four cylinders respectively with computer casing fixed connection, four piston rods respectively with four cylinder output end fixed connection, four connecting plates respectively with four piston rod opposite side fixed connection, four stoppers respectively with four inner tube fixed connection, four urceolus respectively with four inner tube sliding connection, the problem that heat dissipation type callus on the sole subassembly height singleness leads to the computer radiating effect is obscure has been solved.
Description
Technical Field
The utility model relates to a callus on the sole subassembly technical field especially relates to a heat dissipation type callus on the sole subassembly for notebook computer.
Background
Because the air inlet hole for heat dissipation of the notebook computer is also arranged at the bottom of the system end, when the temperature of the system end rises, a large amount of air is required to enter the system end through the air inlet hole so as to facilitate heat dissipation of the system end, therefore, the foot pad component is required to be used, the distance between the notebook computer and the supporting surface is increased, the existing foot pad component only provides the height of the heat dissipation foot pad component for the notebook computer generally, and the heat dissipation effect of the computer is not obvious.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat dissipation type callus on sole subassembly for notebook computer aims at solving the high singleness of heat dissipation type callus on the sole subassembly and leads to the obscure problem of computer radiating effect.
In order to achieve the above purpose, the utility model provides a heat dissipation foot pad component for a notebook computer,
the computer comprises a computer shell, a temperature sensor, a foot pad component, a heat dissipation insulating sheet and a heat dissipation component, wherein the temperature sensor is fixedly connected with the computer shell and is positioned inside the computer shell, the heat dissipation insulating sheet is fixedly connected with the computer shell and is positioned inside the computer shell, the computer shell is provided with a heat dissipation port, the heat dissipation component is fixedly connected with the computer shell and is positioned at the heat dissipation port, the foot pad component comprises four inner cylinders, four piston rods, four connecting plates, four limit blocks and four outer cylinders, the four inner cylinders are respectively fixedly connected with the computer shell and are positioned near the heat dissipation port, the four cylinders are respectively fixedly connected with the computer shell and are positioned inside the four inner cylinders, and the four piston rods are respectively fixedly connected with the four cylinder output ends, the four connecting plates are fixedly connected with the other sides of the four piston rods respectively, the four limiting blocks are fixedly connected with the four inner cylinders respectively and are all located on one side away from the computer shell, and the four outer cylinders are slidably connected with the four inner cylinders respectively and are all located on the periphery of the inner cylinders.
The foot pad component further comprises four springs, one sides of the four springs are fixedly connected with the outer barrel and located inside the outer barrel, and the other sides of the four springs are fixedly connected with the inner barrel and located inside the inner barrel.
The foot pad assembly further comprises a buffer pad, and the buffer pad is fixedly connected with the connecting plate and located on one side far away from the piston rod.
The foot pad assembly is characterized by further comprising four anti-slip pads, wherein the four anti-slip pads are fixedly connected with the four outer cylinders respectively and are located on one side far away from the inner cylinders.
The foot pad assembly further comprises four protection pads, and the four protection pads are respectively fixedly connected with the outer barrel and are located at one side close to the computer shell.
The heat dissipation type foot pad assembly for the notebook computer further comprises a protective cover, wherein the protective cover is fixedly connected with the computer shell and located around the heat dissipation assembly.
The utility model relates to a heat dissipation foot pad component for notebook computer, which is characterized in that a temperature sensor is fixedly connected with a computer shell and is positioned in the computer shell, a heat dissipation insulation sheet is fixedly connected with the computer shell and is positioned in the computer shell, the computer shell is provided with a heat dissipation port, the heat dissipation component is fixedly connected with the computer shell and is positioned at the heat dissipation port, the foot pad component comprises four inner cylinders, four air cylinders, four piston rods, four connecting plates, four stoppers and four outer cylinders, the four inner cylinders are respectively fixedly connected with the computer shell and are all positioned close to the heat dissipation port, the four air cylinders are respectively fixedly connected with the computer shell and are all positioned in the four inner cylinders, the four piston rods are respectively fixedly connected with the four air cylinder output ends, and the four connecting plates are respectively fixedly connected with the other sides of the four piston rods, four the stopper respectively with four inner tube fixed connection all is located keeps away from computer case's one side, four the urceolus respectively with four inner tube sliding connection all is located the inner tube is all around, has solved heat dissipation type callus on the sole subassembly height singleness and has leaded to the obscure problem of computer radiating effect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a cross-sectional view of a heat dissipating foot pad assembly for a notebook computer;
FIG. 2 is a schematic view of a heat dissipation foot pad assembly for a notebook computer;
FIG. 3 is a bottom view of a heat dissipating foot pad assembly for a notebook computer;
FIG. 4 is a cross-sectional view of the elevated condition of the foot pad assembly;
fig. 5 is a cross-sectional view of the foot pad assembly in a lowered state.
1-computer shell, 2-foot pad component, 3-heat dissipation insulating sheet, 4-heat dissipation port, 5-temperature sensor, 6-heat dissipation component, 7-protective cover, 20-cylinder, 21-piston rod, 22-connecting plate, 23-buffer pad, 24-inner cylinder, 25-limiting block, 26-outer cylinder, 27-spring, 28-non-slip pad and 29-protective pad.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "left", "right", "top", "bottom", "inner", "outer", and the like refer to the orientation or positional relationship as shown in the drawings, which is for convenience of description and simplicity of description, and does not indicate or imply that the referenced device or element must be constructed and operated in a particular orientation or orientation, and thus, is not to be construed as limiting the present invention. In addition, in the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1 to 5, the present invention provides a heat dissipation type foot pad assembly for a notebook computer, including a computer housing 1, a temperature sensor 5, a foot pad assembly 2, a heat dissipation insulation sheet 3 and a heat dissipation assembly 6, wherein the temperature sensor 5 is fixedly connected to the computer housing 1 and is located inside the computer housing 1, the heat dissipation insulation sheet 3 is fixedly connected to the computer housing 1 and is located inside the computer housing 1, the computer housing 1 has a heat dissipation opening 4, the heat dissipation assembly 6 is fixedly connected to the computer housing 1 and is located at the heat dissipation opening 4, the foot pad assembly 2 includes four inner cylinders 24, four air cylinders 20, four piston rods 21, four connecting plates 22, four stoppers 25 and four outer cylinders 26, the four inner cylinders 24 are respectively fixedly connected to the computer housing 1 and are located close to the heat dissipation opening 4, four the cylinder 20 respectively with computer housing 1 fixed connection all is located four inside the inner tube 24, four the piston rod 21 respectively with four cylinder 20 output end fixed connection, four the connecting plate 22 respectively with four piston rod 21 opposite side fixed connection, four stopper 25 respectively with four inner tube 24 fixed connection all is located keep away from one side of computer housing 1, four the urceolus 26 respectively with four inner tube 24 sliding connection all is located inner tube 24 is all around.
In this embodiment, the heat dissipating assembly 6 works following the working state of the computer, when the computer is in the power-on state, the heat dissipating assembly 6 on the computer housing 1 starts to work, the heat generated by the work of the computer absorbed by the heat dissipating insulating sheet 3 is discharged from the heat dissipating port 4, the temperature sensor 5 monitors the temperature inside the computer housing 1 in real time and transmits the temperature data to the computer, the data is displayed by the computer, when the inside of the computer housing 1 reaches a certain temperature, the computer controls the air cylinder 20 to drive the piston rod 21 to extend and drive the piston rod 21 to move, the distance between the inner cylinder 24 and the outer cylinder 26 is increased, so that the heat dissipating assembly 6 is increased to increase the distance between the heat dissipating assembly and the supporting surface until the inside of the computer reaches the optimal temperature, and the computer can control the working state of the air cylinder 20 according to the temperature data transmitted by the temperature sensor 5, thereby control the elevating condition of callus on the sole subassembly 2 reaches the best radiating effect of radiator unit 6, for avoiding piston rod 21 excessively extends and leads to inner tube 24 roll-off urceolus 26, so be provided with on the inner tube 24 stopper 25, the diameter of stopper 25 is greater than the bore of urceolus 26, has solved heat dissipation type callus on the sole subassembly 2 highly single and has leaded to the obscure problem of computer radiating effect.
Further, the foot pad assembly 2 further includes four springs 27, one side of each of the four springs 27 is fixedly connected to the four outer cylinders 26 and is located inside the outer cylinder 26, and the other side of each of the four springs 27 is fixedly connected to the four inner cylinders 24 and is located inside the inner cylinders 24.
In the present embodiment, in order to increase the stability of the floor mat assembly 2, the spring 27 is provided between the outer cylinder 26 and the inner cylinder 24, and the spring 27 absorbs the excessive pressure to have a cushioning effect.
Further, the foot pad assembly 2 further comprises a buffer pad 23, and the buffer pad 23 is fixedly connected with the connecting plate 22 and is located on a side away from the piston rod 21.
In the present embodiment, in order to further increase the stability of the floor mat unit 2, the cushion pad 23 is provided on the connecting plate 22, and when the connecting plate 22 applies a force to the outer tube 26 to lift the floor mat unit 2, the cushion pad 23 absorbs an excessive pressure to have a shock absorbing effect, and the cushion pad 23 also has an effect of protecting the outer tube 26.
Further, the foot pad assembly 2 further includes four anti-slip pads 28, and the four anti-slip pads 28 are respectively and fixedly connected to the four outer cylinders 26 and are all located on one side far away from the inner cylinder 24.
In the present embodiment, in order to avoid the stability of the computer during operation being affected by the external smoothness of the outer barrel 26 when the computer is in use, the anti-slip pads 28 are disposed at the bottom ends of the four outer barrels 26 to increase the friction force with the contact surface, thereby increasing the stability.
Further, the foot pad assembly 2 further comprises four protection pads 29, and the four protection pads 29 are respectively fixedly connected with the four outer cylinders 26 and are located at one side close to the computer casing 1.
In this embodiment, in order to prevent the computer case 1 from being damaged after the computer case 1 collides with the upper end of the outer cylinder 26 when the inner cylinder 24 slides into the outer cylinder 26, the protection pad 29 is disposed on the side of the outer cylinder 26 close to the computer case 1.
Further, notebook computer is with heat dissipation type callus on sole subassembly still includes safety cover 7, safety cover 7 with computer housing 1 fixed connection, and be located around heat dissipation subassembly 6.
In this embodiment, in order to prevent the heat dissipation assembly 6 from being stuck by other objects during operation and affecting the heat dissipation effect of the heat dissipation assembly 6, the protective cover 7 is disposed around the heat dissipation assembly 6 to protect the heat dissipation assembly 6.
The utility model discloses a heat dissipation type foot pad component for notebook computer, the heat dissipation component 6 follows the operating condition work of computer, when the computer is in the on state, the heat dissipation component 6 on the computer shell 1 just begins to work, discharges the heat that the computer work that the heat dissipation insulating sheet 3 absorbs produces from the thermovent 4, temperature sensor 5 monitors the temperature in the computer shell 1 in real time, and sends temperature data to the computer, and data is through the computer display, when the computer shell 1 inside reaches certain temperature, computer control the cylinder 20 drive the piston rod 21 is extended and is driven the piston rod 21 motion, draw the distance of inner tube 24 and urceolus 26 big, thereby the heat dissipation component 6 rises to increase the distance with the holding surface, until the computer inside reaches the optimum temperature, the computer can be according to the temperature sensor 5 the operating condition control of cylinder 20, thereby control the elevating condition of callus on the sole subassembly 2 reaches the best radiating effect of radiator unit 6, for avoiding piston rod 21 excessively extends and leads to inner tube 24 roll-off urceolus 26, so be provided with on the inner tube 24 stopper 25, the diameter of stopper 25 is greater than the bore of urceolus 26, has solved heat dissipation type callus on the sole subassembly 2 highly single and has leaded to the obscure problem of computer radiating effect.
The above disclosure is only a preferred embodiment of the heat dissipation foot pad assembly for notebook computer, and certainly, the scope of the present invention should not be limited thereto, and one skilled in the art can understand all or part of the processes for implementing the above embodiments, and the equivalent changes made according to the claims of the present invention still belong to the scope covered by the present invention.
Claims (6)
1. A heat dissipation type foot pad component for a notebook computer is characterized by comprising a computer shell, a temperature sensor, a foot pad component, a heat dissipation insulating sheet and a heat dissipation component, wherein the temperature sensor is fixedly connected with the computer shell and is positioned inside the computer shell, the heat dissipation insulating sheet is fixedly connected with the computer shell and is positioned inside the computer shell, the computer shell is provided with a heat dissipation opening, the heat dissipation component is fixedly connected with the computer shell and is positioned at the heat dissipation opening, the foot pad component comprises four inner cylinders, four air cylinders, four piston rods, four connecting plates, four limit blocks and four outer cylinders, the four inner cylinders are respectively fixedly connected with the computer shell and are positioned near the heat dissipation opening, and the four air cylinders are respectively fixedly connected with the computer shell, the four outer cylinders are respectively connected with the four inner cylinders in a sliding mode and are all located around the inner cylinders.
2. The heat dissipation foot pad assembly for a notebook computer as claimed in claim 1, wherein the foot pad assembly further comprises four springs, one side of each of the four springs is fixedly connected with the four outer cylinders and is located inside the outer cylinders, and the other side of each of the four springs is fixedly connected with the four inner cylinders and is located inside the inner cylinders.
3. The heat dissipation foot pad assembly for the notebook computer as claimed in claim 1, wherein the foot pad assembly further comprises a buffer pad fixedly connected to the connecting plate and located at a side away from the piston rod.
4. The heat dissipation foot pad assembly for the notebook computer as claimed in claim 1, wherein the foot pad assembly further comprises four non-slip pads, and the four non-slip pads are respectively fixedly connected with the four outer cylinders and are located at a side far away from the inner cylinder.
5. The heat dissipation foot pad assembly for the notebook computer as claimed in claim 1, wherein the foot pad assembly further comprises four protection pads, and the four protection pads are respectively fixedly connected with the four outer barrels and are located at one side close to the computer casing.
6. The heat dissipation foot pad assembly for the notebook computer as claimed in claim 1, further comprising a protective cover fixedly connected to the computer housing and located around the heat dissipation assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023072152.2U CN214376093U (en) | 2020-12-18 | 2020-12-18 | Heat dissipation type foot pad assembly for notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023072152.2U CN214376093U (en) | 2020-12-18 | 2020-12-18 | Heat dissipation type foot pad assembly for notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214376093U true CN214376093U (en) | 2021-10-08 |
Family
ID=77985915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023072152.2U Active CN214376093U (en) | 2020-12-18 | 2020-12-18 | Heat dissipation type foot pad assembly for notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214376093U (en) |
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2020
- 2020-12-18 CN CN202023072152.2U patent/CN214376093U/en active Active
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