CN2143744Y - Pyroelectric semiconductor air conditioner - Google Patents

Pyroelectric semiconductor air conditioner Download PDF

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Publication number
CN2143744Y
CN2143744Y CN 92242661 CN92242661U CN2143744Y CN 2143744 Y CN2143744 Y CN 2143744Y CN 92242661 CN92242661 CN 92242661 CN 92242661 U CN92242661 U CN 92242661U CN 2143744 Y CN2143744 Y CN 2143744Y
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CN
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Grant
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Prior art keywords
semiconductor
side
heat
module
thermoelectric
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CN 92242661
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Chinese (zh)
Inventor
王锦侠
徐之平
吴北林
郑海中
何定义
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上海机械学院
李凤鸣
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Abstract

The utility model relates to a thermoelectric type semiconductor air conditioner, which is composed of an outer casing, a power supply, a semiconductor refrigeration module and a blower fan. One side of the semiconductor refrigeration module is connected with a heat exchange fin, and the other side is connected with a water tank. During refrigeration procedure, the semiconductor refrigeration module is added to direct current (dc) voltage, one side absorbs heat to reduce the temperature of the heat exchange fin and cools down the air which is sent to the fin by the blower fan, and heat quantity which is produced by the other side is carried off by the flowing water stream of the water tank. During heating procedure, positive and negative electrodes of the power supply reverse, one side of the semiconductor refrigeration module releases heat by the fin to heat up the air, and the other side absorbs heat from the water stream. The utility model has advantages of simple structure, convenient installation and maintenance, no pollution, no noise, no vibration, no abrasion, small size and light weight.

Description

本实用新型涉及一种空气温度调节器,特别是一种利用半导体热电偶为能量转换装置,以流动液体传递热量的热电式半导体空调器。 The present invention relates to an air temperature regulator, in particular a thermocouple as energy converter using a semiconductor device, flow of the liquid to transfer heat to the air conditioner of the thermoelectric semiconductor.

随着人们生活水平的不断提高,利用空调器调节室内气温已越来越普及。 With the continuous improvement of living standards, the use of the air conditioner to adjust the indoor temperature has been more and more popular. 目前使用的空调器,均为压缩式空调系统,系统内充注氟利昂,由于氟利昂破坏地球大气臭氧层,直接影响人类健康,因此世界各国正减少并将禁止使用氟利昂。 Air conditioners currently in use, are compression-type air-conditioning system, the system charge freon, freon destruction of the Earth's atmospheric ozone layer due to the direct impact on human health, so the world will positively reduce banned freon. 而且现有技术中的空调器体积大,重量大,安装不方便,工作噪声大,有震动,易磨损,结构复杂,维修不方便。 The volume of the air conditioner in the prior art and a large, heavy, inconvenient installation, large operating noise, there is vibration, wear, complicated structure, convenient maintenance.

本实用新型的目的在于提供一种热电式半导体空调器,它克服了已有技术的缺点,取消了压缩机系统,不使用氟利昂,对大气臭氧层不会造成任何破坏,并且体积小,重量轻,结构简单,安装维修方便,无噪声,无震动,不磨损,冷暖两用,制热效率特别高。 The present invention aims to provide a thermoelectric semiconductor conditioner which overcomes the disadvantages of the prior art, to cancel the compressor system does not use freon, on the ozone layer will not cause any damage, and small size, light weight, simple structure, easy installation and maintenance, no noise, no vibration, no wear, and well-being of dual-use, heating efficiency is particularly high. 本实用新型在已有技术中尚未发现。 The present invention not found in the prior art.

本实用新型是这样实现的:一种热电式半导体空调器,由外壳、电源、半导体致冷模块和风机组成,半导体致冷模块的两侧分别有一个换热翅片和水箱,水箱位于半导体致冷模块的一侧,与半导体致冷模块紧密接触,换热翅片位于半导体致冷模块的另一侧,也与其通过良好导热材料紧密接触,换热水箱上连接有进、出水管,内部设有折流片,电源将交流电整流变压后送到半导体致冷模块的两个引线脚上,并与风机连接,电源、换热翅片、换热水箱、半导体致冷模块和风机均安装在外壳内部。 The present invention is implemented as follows: a thermoelectric semiconductor type air conditioner, a housing, power source, and a thermoelectric cooling module fans formed, respectively, on both sides of the semiconductor thermoelectric module has a heat exchanger fins and the tank, the tank of the semiconductor electroluminescent cold side of the module, in close contact with the Peltier module, on the other side of the heat exchanger fins of the Peltier module is also in close contact therewith through good thermal conductive material, the heat exchanger is connected to the water tank into the outlet pipe, disposed inside there baffle plate, the AC power to the rectifier transformer two lead feet of the Peltier module and connected to the fan, the power supply, heat exchanger fins, the heat exchanger tank, thermoelectric cooling module and the fan are mounted inside the housing. 本实用新型系根据半导体半导体致冷模块选用TECL-12704陶瓷平板式半导体致冷模块,基板选用铜质材料,模块共使用36块,电源采用低功耗电源。 The present invention is selected based semiconductor Peltier module TECL-12704 ceramic plate type semiconductor thermoelectric module, the choice of the substrate material of copper, using a total of 36 modules, power low power supply.

如图1所示,在外壳(1)内安装有电源(5)和风机(3),水箱(8)、换热翅片(2)和半导体致冷模块(9)均垂直安装在外壳(1)的底板上,进水管(10)与出水管(6)连接着水箱(8),并通到外壳(1)的外面,分别与进水源与出水通道相连。 , In the housing (1) is mounted with a power supply in FIG. 1 (5) and the fan (3), the tank (8), heat transfer fins (2) and the Peltier module (9) are mounted vertically in the housing ( 1 on the floor), the inlet pipe (10) and the outlet pipe (6) connected to the water tank (8), and through the outside of the housing (1), are connected with the water inlet and outlet channel. 36块半导体致冷模块(9)排列成板状,左侧通过硅胶与换热翅片(2)紧密连接,右侧通过硅胶与水箱左侧板紧密连接。 36 Peltier modules (9) are arranged in a plate, closely connected to the left by silica and heat transfer fins (2), the right side of the tank and left plate by silica tight connection. 换热翅片(2)由基板(4)和波浪形金属薄片以焊接方式连接,金属薄片为铜质薄片,加工成波浪形,并由七层这样的波浪形薄片叠合成纵剖面呈网状,薄片与薄片以焊接方式相连接。 Heating fins (2) are connected by welding to the substrate (4) and wavy metal sheet, a metal foil of copper sheet processed into a wavy, undulated sheet by seven overlapping synthetic longitudinal section of such a mesh , and the sheet is connected to the sheet by welding. 水箱(8)为长方体外型,由铜质材料制成,内部设有折流片(7)使进水管(10)和出水管(5)之间形成曲折通道,以增加水的紊流度。 Tank (8) is a rectangular parallelepiped shape, made of a copper material, is formed with an internal passage meandering baffle plate (7) of the intake pipe (10) and outlet (5) between, in order to increase water turbulence . 在换热翅片(2)的后方安装一台风机(3),电源(5)通过导线与风机(3)连接,同时电源(5)又以导线与半导体致冷模块(9)的各引线脚连接,在电路中,36块半导体致冷模块TE按并联方式联结。 Mounting a wind turbine (3), a power supply (5) behind the heat exchanger fins (2) are connected by wires to the fan (3), while the power supply (5) in turn lead to the semiconductor thermoelectric module (9) of the leads pin is connected, in the circuit 36 ​​by the Peltier module TE links in parallel. 在制冷过程中,电源(5)接通以后,半导体致冷模块(9)的左侧吸热,使换热翅片(2)的温度降低,风机(3)将空气送过换热翅片(2),空气温度即降低,而同时半导体致冷模块(9)右侧产生的热量传递到水箱(8)内,被水流带往室外。 In the cooling process, after the power supply (5) is turned on, the left side of the endothermic Peltier module (9) of the heat transfer fins (2) reduce the temperature, the fan (3) conveying the air through the heat exchanger fin (2), i.e. the air temperature decreases, while the heat of the Peltier module (9) is transferred to the right side of the water tank (8), is taken outside the water. 将电源正负极变换,即进入制热过程,半导体致冷模块(9)的左侧放热、右侧吸热,电能转化为热能,在左侧放出,使换热翅片(2)温度升高,风机(3)将空气送过换热翅片(2),即使空气温度升高,同时半导体致冷模块(9)的右侧吸热,水流将热量又传递给半导体致冷模块(9),温度降低后流出。 The positive and negative power conversion, that is, into the heating process, the left side of the Peltier heat block (9), right endotherm energy into heat, releasing the left, so that heat transfer fins (2) temperature increased, the fan (3) conveying the air through the heat exchanger fins (2), even if the air temperature rises, while the Peltier module (9) of the right heat absorption, water and heat transferred to the Peltier module ( 9), the temperature is lowered outflow.

制冷原理,即当N型半导体与P型半导体联结成电偶时,在该电路上接上直流电源,电偶上就发生能量转移,一个接头吸收热量,另一接头放出热量,当电源极性变换后,吸热、放热端也反向。 Refrigeration principle, i.e. when the N-type semiconductor to the P-type semiconductor galvanic coupling, connected to the DC power source on the circuit, the energy transfer occurs galvanic, a linker absorb heat, heat release other terminal, when the power supply polarity after conversion, endothermic, exothermic reverse side also. 本实用新型系利用已有技术中的半导体致冷模块,它是由若干组电偶按吸热、放热端方向组合而成的,在本装置中,制冷过程中,电源接通后,半导体致冷模块的换热翅片一侧开始吸热,温度降低,风机将空气送过换热翅片,即得到降温后的空气,半导体致冷模块的另一侧温度升高,产生大量热,传递到水箱中,水流由进水管进入水箱后吸收热量,从出水口流出,将热量带至室外散发,在水箱内设有折流板,构成曲折通道,以提高水的紊流度,增加水流与水箱和半导体致冷模块这一侧面的热交换能力。 The present invention prior art system using the Peltier module, which is formed by a combination of endothermic, exothermic terminal direction galvanic several groups, in the present apparatus, the cooling process, the power supply is turned on, the semiconductor side fin heat exchanger thermoelectric module endothermic start temperature drops, the blower air is fed through the heat exchanger fin, the cooling air that is obtained, the other side of the Peltier module temperature rises, a large amount of heat, transmitted to the water tank, the water flow from the inlet pipe into the tank to absorb heat, flows out from the outlet, for distributing heat to the outdoor zone, the tank has baffles at the site to form a tortuous path to increase the turbulence of the water, increased water the water tank and the heat exchange capacity of the Peltier module to the side surface. 当电源正负极变换以后,即进入制冷过程,半导体致冷模块的换热翅片一侧产生大量热能,传递到换热翅片中,风机将风送过换热翅片而吸收热量,即送出热风,而致冷模块另一侧温度降低,水流通过水箱时,致冷模块这一侧又从水流中吸收外界热量传递给换热翅片一侧。 When positive and negative polarity conversion, that is, into the cooling process, the heat exchanger fins of the semiconductor module side of the refrigeration to generate a lot of heat, to the heat transfer fins, the fan air fed through the heat exchanger fins absorbs heat, i.e., feeding hot air, while the other side of the thermoelectric module the temperature decreases, the water flow through the tank, a refrigeration heat exchanger module is transmitted to and from the side of the side fins in the water absorbing external heat.

本实用新型因为采用半导体致冷元件作为换能装置,完全避免了采用压缩机系统和氟利昂,因而不会破坏大气臭氧层,同时又使结构简单,重量减轻,安装维修简单,不磨损,无震动,无噪声。 Because the present invention uses the Peltier element as a transducer means, completely avoid the use of freon compressor system and therefore does not destroy the ozone layer, while enabling a simple structure, reduced weight, easy installation and maintenance, not to wear, no vibration, no noise.

图1是本实用新型的结构示意图。 FIG. 1 is a structural diagram of the present invention novel.

图2是本实用新型的电路示意图。 FIG 2 is a circuit diagram of the present invention novel.

其中1-外壳2-换热翅片3-风机4-基板5-电源6-出水管7-折流片8-水箱9-半导体致冷模块10-进水管在电路示意图中,TE表示半导体致冷模块,F表示风机。 1- fin heat exchanger wherein the housing 2- 3- 4- substrate blower outlet pipe 7- 6- 5- power BAFFLE Peltier module 8- 9- 10- tank inlet pipe in the schematic circuit, TE denotes a semiconductor electroluminescent cold module, F represents the fan.

以下结合附图和实施例,对本实用新型作进一步说明。 In conjunction with the accompanying drawings and the following embodiments, further explanation of the invention as. 在这个实施例中, In this embodiment,

Claims (3)

  1. 1.一种热电式半导体空调器,由外壳、电源、半导体致冷模块和风机组成,其特征在于:半导体致冷模块的一侧连接有换热翅片,半导体致冷模块与换热翅片紧密接触,半导体致冷模块的另一侧连接有水箱,半导体致冷模块与水箱紧密接触,半导体致冷模块、换热翅片、水箱和风机均固定在外壳内,水箱上有进水管和出水管,进水管和出水管的一端均穿出外壳。 A thermoelectric semiconductor conditioner, by the housing, the power semiconductor module and a refrigeration composition of the fan, wherein: one side of the Peltier module is connected with a heat exchanger fin, heat transfer fins of the semiconductor module and refrigeration close contact with the other side of the thermoelectric module is connected to the tank of a semiconductor, a semiconductor thermoelectric module in close contact with the tank, thermoelectric cooling module, the heat exchanger fins, water tanks and the fan are fixed in the housing, and the intake pipe on the tank water, inlet and outlet pipe are piercing end of the housing.
  2. 2.如权利要求1所述的一种热电式半导体空调器,其特征在于:换热翅片由金属基板和两层以上的纵剖面呈波浪形的金属薄板构成,金属基板与金属薄板之间固定连接。 2. An air conditioner according thermoelectric semiconductor according to claim 1, wherein: the heat exchanger fins from the above metal substrate and two layers of undulating longitudinal cross-sectional configuration of the sheet metal, between the metal substrate and the metal sheet fixed connection.
  3. 3.如权利要求1所述的一种热电式半导体空调器,其特征在于:水箱内部设有折流片。 A thermoelectric semiconductor-type air conditioner according to claim 1, wherein: the tank is provided with an internal baffle plate.
CN 92242661 1992-12-11 1992-12-11 Pyroelectric semiconductor air conditioner CN2143744Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 92242661 CN2143744Y (en) 1992-12-11 1992-12-11 Pyroelectric semiconductor air conditioner

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CN 92242661 CN2143744Y (en) 1992-12-11 1992-12-11 Pyroelectric semiconductor air conditioner

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CN2143744Y true CN2143744Y (en) 1993-10-13

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CN 92242661 CN2143744Y (en) 1992-12-11 1992-12-11 Pyroelectric semiconductor air conditioner

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009018741A1 (en) * 2007-08-03 2009-02-12 Zhiping Wang A kind of thermoelectric semiconductor air conditioning for refrigerating and heating
WO2009043221A1 (en) * 2007-10-06 2009-04-09 Yibo Tang A portable refrigerator
CN100489429C (en) 2006-09-29 2009-05-20 曹爱国 Heat-conducting water box for air conditioner and its making process
CN100520200C (en) 2006-03-07 2009-07-29 株式会社电装 Air-conditioning device
CN100532976C (en) 2006-09-29 2009-08-26 曹爱国 Thermoelectric air conditioning unit and thermoelectric air conditioner possessing same
CN101055110B (en) 2006-09-29 2010-05-26 曹爱国 Heat exchanger and indoor thermoelectric air conditioner possessing same
CN104776528A (en) * 2015-04-03 2015-07-15 林波荣 Intermittent dispersed type integrated semiconductor efficient air conditioning terminal

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100520200C (en) 2006-03-07 2009-07-29 株式会社电装 Air-conditioning device
CN100489429C (en) 2006-09-29 2009-05-20 曹爱国 Heat-conducting water box for air conditioner and its making process
CN100532976C (en) 2006-09-29 2009-08-26 曹爱国 Thermoelectric air conditioning unit and thermoelectric air conditioner possessing same
CN101055110B (en) 2006-09-29 2010-05-26 曹爱国 Heat exchanger and indoor thermoelectric air conditioner possessing same
WO2009018741A1 (en) * 2007-08-03 2009-02-12 Zhiping Wang A kind of thermoelectric semiconductor air conditioning for refrigerating and heating
WO2009043221A1 (en) * 2007-10-06 2009-04-09 Yibo Tang A portable refrigerator
CN104776528A (en) * 2015-04-03 2015-07-15 林波荣 Intermittent dispersed type integrated semiconductor efficient air conditioning terminal

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