CN214357318U

CN214357318U - Inorganic composite polyphenyl A-grade insulation board shaping clinker interlayer device

Info

Publication number: CN214357318U
Application number: CN202120327964.2U
Authority: CN
Inventors: 王刚
Original assignee: Shandong Ganglei Building Material Technology Co ltd
Current assignee: Shandong Ganglei Building Material Technology Co ltd
Priority date: 2021-02-05
Filing date: 2021-02-05
Publication date: 2021-10-08
Anticipated expiration: 2031-02-05

Abstract

The utility model relates to an heated board production facility technical field, specifically speaking relates to an inorganic compound polyphenyl A level heated board design grog interlayer device. Comprises a portal frame and a bottom support; two supporting frames are respectively fixed at two vertex angles of the portal frame, a roll shaft is installed between the two supporting frames, and interlayer paper is wound on the roll shaft; the bottom support comprises a top supporting plate and a plurality of load supports fixed at the bottom of the top supporting plate. The utility model discloses the inside thick liquids of inorganic compound polyphenyl A level heated board of having not only solved the rigid production do not solidify, the problem of dark indentation appears in softer face, the problem of damaged appears on the inorganic compound polyphenyl A level heated board surface that has still solved the indentation adhesion and has produced and press from both sides the poor problem of the plate face roughness that the inhomogeneity that separates square pipe or slat position produced, thereby it is good to have guaranteed inorganic compound polyphenyl A level heated board plate face roughness, use the installation to plaster the degree of consistency unanimous, the installation effect roughness is good, to follow-up technology, work all provides convenience.

Description

Inorganic composite polyphenyl A-grade insulation board shaping clinker interlayer device

Technical Field

The utility model relates to an heated board production facility technical field, specifically speaking relates to an inorganic compound polyphenyl A level heated board design grog interlayer device.

Background

The main index requirements of the inorganic composite polyphenyl A-grade insulation board in the inorganic composite polyphenyl A-grade insulation board industry standard JG/T536-2017 are as follows: the combustion performance grade is A2 grade, and the heat value is less than or equal to 3 MJ; thermal conductivity is divided into 050 levels (≦ 0.050W/(m × k)) and 060 levels (> 0.050W/(m × k) and ≦ 0.060W/(m × k)); ③ the tensile strength vertical to the plate surface direction: 050 ≧ 0.10MPa, 060 ≧ 0.12; compression strength: 050 ≧ 0.15MPa, 060 ≧ 0.2 MPa; volume water absorption is less than or equal to 10%, and plate surface flatness is less than or equal to 2 mm.

In the insulation board producer, when the inorganic composite polyphenyl A-grade insulation board for preventing just production is through self inherent health preserving solidification under the circumstances of inside thick liquids not solidification, take place the adhesion between the inorganic composite polyphenyl A-grade insulation board and lead to unable separation, use, the inorganic composite polyphenyl A-grade insulation board that need will produce puts adopts the mode that every layer presss from both sides at a distance from square pipe (20mm x 20mm) or slat, and this mode is the clamp that this trade used most separates the mode of putting.

Adopt the clamp that uses commonly used to separate square pipe or ordinary slat to press from both sides to separate inorganic compound polyphenyl A level heated board and put though solved the adhesion condition between the inorganic compound polyphenyl A level heated board, but can produce new adhesion, also be inorganic compound polyphenyl A level heated board and press from both sides the adhesion that produces between square pipe or the slat. Because the slurry inside the just-produced inorganic composite polyphenyl A-grade insulation board is relatively soft when not cured, the contact surface of the inorganic composite polyphenyl A-grade insulation board and a clamping square tube or a common batten can generate deep indentation due to the self weight of the inorganic composite polyphenyl A-grade insulation board. When removing the clamp after inorganic compound polyphenyl A level heated board solidification and separating square pipe or slat, because the adhesion that the dark indentation produced can make inorganic compound polyphenyl A level heated board face appear the impression of square pipe or slat, more the inorganic compound polyphenyl A level heated board around square pipe or the slat impression also is glued and is fallen one even, causes inorganic compound polyphenyl A level heated board face damaged.

In addition, the above-mentioned clip-spacing placing method has another problem that the clip-spacing support surface is only a narrow width surface line of the square tube or the slat, so that the force is not uniform, the square tube or the slat is hollow when approaching the edge of the plate, and the corner of the square tube or the slat is drooped when approaching the center.

To sum up, the mode that adopts clamp to separate square pipe or slat can cause the face to buckle to inorganic compound polyphenyl A level heated board during putting, the roughness is poor and square pipe or slat impression adhesion glue the face and cause the damaged condition of face, lead to the installation use difficulty, plaster thickness inhomogeneous, the whole roughness effect of installation poor.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's defect, provide an inorganic compound polyphenyl A level heated board design grog interlayer device to solve above-mentioned technical problem.

In order to achieve the above object, the utility model adopts the following technical scheme:

the utility model provides an inorganic compound polyphenyl A level heated board design grog interlayer device which characterized in that: comprises a portal frame and a bottom support; two supporting frames are respectively fixed at two vertex angles of the portal frame, a roll shaft is installed between the two supporting frames, and interlayer paper is wound on the roll shaft; the bottom support comprises a top supporting plate and a plurality of load supports fixed at the bottom of the top supporting plate.

Further, install two upper and lower roller between two support frames, wherein, be located the below be the main roll axle, be located the top be reserve roll axle, the both ends of two roller all assemble on the bearing frame of two support frames through detachable mode.

Still further, the top supporting plate is a concrete plate with the thickness of 10 mm; the weight support is a batten of 100mm multiplied by 100 mm.

Furthermore, the interlayer paper is plastic paper with the width of 1350mm and the thickness of 0.02 mm.

Has the advantages that: compared with the prior art, design grog interlayer device has replaced the mode that traditional clamp was used always and is separated square pipe or slat, the problem of the inside thick liquids of inorganic compound polyphenyl A level heated board that has not only solved just production uncured, deeper indentation appears in softer face, the poor problem of the plate face roughness that the non-uniformity that has still solved the inorganic compound polyphenyl A level heated board surface that the indentation adhesion produced appears damaged problem and clamp and separate square pipe or slat position produced, thereby it is good to have guaranteed that inorganic compound polyphenyl A level heated board plate face roughness, use the installation to plaster the degree of consistency unanimous, the installation effect roughness is good, all provide convenience to follow-up technology, work.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of the present invention;

fig. 2 is a schematic structural view of the bottom support of the present invention.

Detailed Description

The invention is further described with reference to the accompanying drawings and specific embodiments.

Example (b):

referring to fig. 1, the inorganic composite polyphenyl class a insulation board shaping clinker interlayer device in the embodiment includes a portal frame 1 and a bottom support 7. Two apex angle positions of portal frame 1 are fixed with support frame 4 respectively, install the roller between two support frames 4, install two upper and lower rollers, wherein, be located the below be main roll axle 3, be located the top be reserve roll axle 2, the both ends of two rollers all assemble on the bearing frame of two support frames 4 through the detachable mode. Interlayer paper 5 is wound on the two roll shafts, and the interlayer paper 5 is double-layer plastic paper with the width of 1350mm and the thickness of 0.02 mm. The bottom support 7 comprises a top support plate 71 and a plurality of load supports 72 fixed at the bottom of the top support plate 71. The top supporting plate 71 is a concrete plate with the thickness of 10 mm; the weight support 72 is a batten of 100mm x 100 mm.

The use method of the shaping clinker interlayer device in the embodiment is briefly described as follows:

firstly, flatly placing a bottom support 7 on the ground, and paving interlayer paper 5 on the top surface of a top support plate 71; then placing the uncured and relatively soft inorganic composite polyphenyl A-grade insulation board 6 which is just produced on interlayer paper 5, and carrying out comprehensive shaping protection support on the soft inorganic composite polyphenyl A-grade insulation board by using a smooth jacking plate 71; then, reversely pulling the interlayer paper 5 to lay on the top surface of the inorganic composite polyphenyl A-grade insulation board at the bottommost layer; placing a newly produced inorganic composite polyphenyl A-grade insulation board on the interlayer paper 5; then reversely pulling the interlayer paper 5 to lay on the top surface of the second layer of inorganic composite polyphenyl A-grade insulation board; the insulation boards are placed in a mode that double-layer plastic paper interlayers are placed between every two layers of inorganic composite polyphenyl A-grade insulation boards (the height of the insulation boards placed on each bottom support 7 is about 1.2 m).

Design grog interlayer device show the characteristics do:

1. the mode that has replaced the clamp that traditionally used and separated square pipe or slat, solved the face bending that inorganic compound polyphenyl A level heated board adhesion batten tray and clamp and separated that square pipe caused, the face leaves darker side's pipe or plank seal unevenness, influences the problem of panel face roughness, realized that the face apparent density is even, the roughness is good, plaster evenly when installing, provides good plane to the installation use.

2. Through the mode of pressing from both sides and separating plastics interlayer paper, solved the condition of gluing square pipe or slat of inorganic compound polyphenyl A level heated board, avoided because square pipe or slat cause damaged problem to inorganic compound polyphenyl A level heated board surface when demolising, realized that inorganic compound polyphenyl A level heated board is upper and lower intact not damaged.

3. Plastic interlayer paper is placed between every two layers of inorganic composite polyphenyl A-grade insulation boards to form a closed space, so that a closed space is provided for internal curing of the inorganic composite polyphenyl A-grade insulation boards, and the heat generated by self-heating of the honeycomb cement of the inorganic composite polyphenyl A-grade insulation boards forms steam to be attached to each layer of plastic paper; when the moisture attached to each layer of plastic paper is increased, the plastic paper moves into the space outside the inorganic composite polyphenyl A-grade insulation board, the health-preserving effect is achieved, the internal waterproof factor cannot be damaged when cement in the honeycomb shape of the inorganic composite polyphenyl A-grade insulation board is self-heated, the primary and middle-stage solidification effect cannot be achieved due to excessive water, and the normal health-preserving solidification in place is ensured.

4. The mode of clamping and separating the plastic interlayer saves the labor cost and time of turning the board for preventing the stick from being finally solidified in the curing process of the inorganic composite polyphenyl A-grade insulation board, and the cost is saved by about 10 yuan/m³. After the inorganic composite polyphenyl A-level insulation board is cured for 3 days, repackaging the inorganic composite polyphenyl A-level insulation board by using a common batten wooden support (repackaging each piece of the inorganic composite polyphenyl A-level insulation board with the length of 1.2 meters, the width of 1.2 meters and the height of 2.4 meters), winding the periphery of a plastic film, placing the packaged wooden support into a storehouse for 7 days for medium-term curing, delivering goods after the medium-term curing, and recycling the shaped wooden support.

The foregoing shows and describes the general principles, features and technical characteristics of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, and that various changes and modifications may be made without departing from the spirit and scope of the invention, and the scope of the invention is to be protected. The scope of the invention is defined by the claims and their equivalents.

Claims

1. The utility model provides an inorganic compound polyphenyl A level heated board design grog interlayer device which characterized in that: comprises a portal frame (1) and a bottom support (7); two supporting frames (4) are respectively fixed at two vertex angles of the portal frame (1), a roll shaft is installed between the two supporting frames (4), and interlayer paper (5) is wound on the roll shaft; the bottom support (7) comprises a top supporting plate (71) and a plurality of load supports (72) fixed at the bottom of the top supporting plate (71).

2. The inorganic composite polyphenyl A-grade insulation board shaping clinker interlayer device according to claim 1, characterized in that: install two upper and lower roller between two support frames (4), wherein, be located the below be main roll axle (3), be located the top be reserve roll axle (2), the both ends of two roller all assemble on the bearing frame of two support frames (4) through the detachable mode.

3. The inorganic composite polyphenyl A-grade insulation board shaping clinker interlayer device according to claim 2, characterized in that: the top supporting plate (71) is a concrete slab with the thickness of 10 mm; the weight support (72) is a batten of 100mm multiplied by 100 mm.

4. The inorganic composite polyphenyl A-grade insulation board shaping clinker interlayer device according to claim 3, characterized in that: the interlayer paper (5) is plastic paper with the width of 1350mm and the thickness of 0.02 mm.