CN214322790U

CN214322790U - Silicon wafer polishing equipment for new generation information technology

Info

Publication number: CN214322790U
Application number: CN202120428794.7U
Authority: CN
Inventors: 李淑贞
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-02-26
Filing date: 2021-02-26
Publication date: 2021-10-01
Anticipated expiration: 2031-02-26

Abstract

The utility model relates to a silicon chip polishing equipment especially relates to a silicon chip polishing equipment for new generation information technology. The silicon wafer polishing equipment for the new generation information technology is high in processing efficiency and capable of cleaning dust without manual grinding and polishing. The utility model provides a such a silicon chip polishing equipment for new generation information technology, including: base, support frame and place actuating mechanism, the base top is equipped with a plurality of support frames, and left support frame top is equipped with places actuating mechanism. Adopt the cooperation between polishing mechanism and the supplementary polishing mechanism of polishing, drive polishing mechanism through supplementary polishing mechanism and remove to stabilize the polishing sword at the in-process of polishing, conveniently carry out slight adjustment to polishing.

Description

Silicon wafer polishing equipment for new generation information technology

Technical Field

The utility model relates to a silicon chip polishing equipment especially relates to a silicon chip polishing equipment for new generation information technology.

Background

In a general polycrystalline silicon processing production process, degraded silicon wafers are usually polished to reach a certain product specification, so that the cost loss caused by the elimination of defective products is reduced, and people have higher requirements on a silicon wafer polishing process along with the continuous improvement of production requirements. In the implementation process of the existing silicon wafer polishing process, workers usually polish the silicon wafer to be processed by hands by utilizing auxiliary materials such as silicon carbide and the like, and although the existing silicon wafer polishing mode can meet the basic production and processing requirements, the existing silicon wafer polishing mode has low processing efficiency and high labor intensity, causes a great deal of adverse effects on the smooth implementation of related production procedures, can generate large-material dust in the polishing process, is not easy to clean, and can affect the health of the workers.

Therefore, it is necessary to design a silicon wafer polishing apparatus for a new generation of information technology, which does not require manual polishing, has high processing efficiency, and can clean dust, to solve the above problems.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects that manual grinding is low in processing efficiency, large material dust is generated in the grinding and polishing process, and the cleaning is not easy, the technical problem to be solved is as follows: the silicon wafer polishing equipment for the new generation information technology is free from manual grinding and polishing, high in processing efficiency and capable of cleaning dust.

The utility model provides a silicon chip polishing equipment for new generation information technology, includes base, support frame, places actuating mechanism and polishes the polishing mechanism, and the base top is equipped with a plurality of support frames, and left support frame top is equipped with places actuating mechanism, and the support frame top of right back side is equipped with polishes the polishing mechanism.

Further, the placing driving mechanism comprises a servo motor, a driving shaft, a placing disc and clamping jaws, the servo motor is arranged at the top of the supporting frame on the left side, the driving shaft is arranged at the output end of the servo motor, the placing disc is arranged on the driving shaft, and the four clamping jaws are arranged on the placing disc.

Further, the polishing mechanism comprises a first slide rail, a slide block, a first push rod, a support column, a connecting rod and a polishing knife, the first slide rail is arranged at the top of the support frame on the rear right side, the slide block is arranged in the first slide rail in a sliding mode, the first push rod is arranged on the front side of the slide block, the support column is arranged on the first push rod, the connecting rod is arranged in the support column in a sliding mode, and the polishing knife is arranged between the left sides of the connecting rods.

Further explaining, still including supplementary polishing mechanism, supplementary polishing mechanism is including the second push rod, first screw thread piece, the lead screw, bevel gear pair, the cover axle, the transmission shaft, the second slide rail, the supporting seat, the backup pad, runner and handle, the support frame top of right front side is equipped with the second slide rail, the rotary type is equipped with the lead screw in the second slide rail, second slide rail left side is equipped with the supporting seat, be equipped with the backup pad in the supporting seat, the rotary type is equipped with the transmission shaft in the backup pad, be equipped with the cover axle on the transmission shaft, be equipped with bevel gear pair on cover axle and the lead screw, the screw thread formula is equipped with first screw thread piece, first screw thread piece and second slide rail sliding type contact, be equipped with the second push rod on the first screw thread piece, the second push rod is connected with the support column, the cover axle front side is equipped with the runner, the rotary type is equipped with the handle on the runner.

Further explain, still including the water mill wiper mechanism, the water mill wiper mechanism is including the water tank, the filter, external water hose, go out the water piston, the baffle, the axis of rotation, the hatch door, handle and shutter plate, base top middle part is equipped with the water tank, the drive shaft is connected with the water tank rotary type, the water tank slidingtype is equipped with the filter, base top front side is equipped with external water hose, water tank front side lower part is equipped with out the water piston, the water tank top is equipped with the baffle, the rotatory formula of water tank left side rear side is equipped with the axis of rotation, be equipped with the hatch door in the axis of rotation, the hatch door rear side is equipped with the handle, the water tank rear side is equipped with shutter plate.

Further explaining, the device also comprises a clamping and positioning mechanism, wherein the clamping and positioning mechanism comprises supporting blocks, guide rods, springs and clamping claws, the four supporting blocks are uniformly arranged on the placing disc, the guide rods are arranged at the tops of the supporting blocks in a sliding mode, the clamping claws are arranged between the end parts of the guide rods, the springs are arranged between the clamping claws and the supporting blocks, and the springs are arranged on the guide rods.

Further explain, still including removable tool bit mechanism, removable tool bit mechanism is equipped with two card posts including second screw thread piece, bayonet lock, card post and shaking hands between support column and the connecting rod slidingtype, is equipped with between the card post rear end and shakes hands, and slidingtype is equipped with the bayonet lock between the card post front end, and bayonet lock left side screw thread formula is equipped with second screw thread piece.

Further, the volume of the water tank is 5 liters.

The utility model has the advantages that: 1. adopt the cooperation between polishing mechanism and the supplementary polishing mechanism of polishing, drive polishing mechanism through supplementary polishing mechanism and remove to stabilize the polishing sword at the in-process of polishing, conveniently carry out slight adjustment to polishing.

2. Adopt the polishing mechanism of polishing and the cooperation between the water mill wiper mechanism, spray water on polishing sword and silicon chip by external hose, prevent that the friction temperature is overheated, wash the powder that produces of polishing simultaneously to reach the effect of water mill, the water of washing passes through the drainage board and drips to the water tank in, the powder is then stayed the drainage board top.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a schematic view of the three-dimensional structure of the placing driving mechanism of the present invention.

Fig. 3 is the three-dimensional structure schematic diagram of the polishing mechanism of the utility model.

Fig. 4 is an exploded view of the auxiliary polishing mechanism of the present invention.

Fig. 5 is a schematic view of the three-dimensional structure of the water mill cleaning mechanism of the present invention.

Fig. 6 is a schematic view of the three-dimensional structure of the clamping and positioning mechanism of the present invention.

Fig. 7 is a schematic perspective view of the replaceable cutter head mechanism of the present invention.

Number designation in the figures: 1-a base, 2-a support frame, 3-a placement driving mechanism, 31-a servo motor, 32-a driving shaft, 33-a placement disc, 34-a clamping jaw, 4-a polishing mechanism, 41-a first sliding rail, 42-a sliding block, 43-a first push rod, 44-a support column, 45-a connecting rod, 46-a polishing knife, 5-an auxiliary polishing mechanism, 51-a second push rod, 52-a first thread block, 53-a screw rod, 54-a pair of bevel gears, 55-a sleeve shaft, 56-a transmission shaft, 57-a second sliding rail, 58-a support seat, 59-a support plate, 510-a rotating wheel, 511-a handle, 6-a water mill cleaning mechanism, 61-a water tank, 62-a filter plate, 63-an external water hose and 64-a water outlet piston, 65-baffle plate, 66-rotating shaft, 67-cabin door, 68-handle, 69-baffle plate, 7-clamping positioning mechanism, 71-supporting block, 72-guide rod, 73-spring, 74-clamping claw, 8-replaceable cutter head mechanism, 81-second thread block, 82-clamping pin, 83-clamping column and 84-handle.

Detailed Description

It is to be noted that, in the case of the different described embodiments, identical components are provided with the same reference numerals or the same component names, wherein the disclosure contained in the entire description can be transferred to identical components having the same reference numerals or the same component names in a meaningful manner. The positional references selected in the description, such as upper, lower, lateral, etc., refer also to the directly described and illustrated figures and are to be read into the new position in the sense of a change in position.

Example 1

A silicon wafer polishing device for a new generation information technology is shown in figures 1-7 and comprises a base 1, a plurality of support frames 2, a placing driving mechanism 3 and a polishing mechanism 4, wherein the plurality of support frames 2 are arranged on the top of the base 1, the placing driving mechanism 3 is arranged on the top of the left support frame 2, and the polishing mechanism 4 is arranged on the top of the right rear support frame 2.

The staff fixes the silicon chip and places actuating mechanism 3 in, then starts and places actuating mechanism 3 work, places actuating mechanism 3 and drives the silicon chip and rotate at a high speed, then the staff promotes polishing mechanism 4 left, makes polishing mechanism 4's the part of polishing polish the silicon chip, thereby makes the silicon chip polish completely, finishes polishing the back, closes and places actuating mechanism 3, and promotes polishing mechanism 4 and resets, at last will polish the silicon chip that finishes take out can.

Place actuating mechanism 3 including, servo motor 31, drive shaft 32, place dish 33 and jack catch 34, the left support frame 2 top is equipped with servo motor 31, and servo motor 31 output is equipped with drive shaft 32, is equipped with on the drive shaft 32 and places dish 33, places and is equipped with four jack catches 34 on the dish 33.

The polishing mechanism 4 comprises a first slide rail 41, a slide block 42, a first push rod 43, a support column 44, a connecting rod 45 and a polishing knife 46, the top of the support frame 2 on the right rear side is provided with the first slide rail 41, the slide block 42 is arranged in the first slide rail 41 in a sliding manner, the first push rod 43 is arranged on the front side of the slide block 42, the support column 44 is arranged on the first push rod 43, the connecting rod 45 is arranged in the support column 44 in a sliding manner, and the polishing knife 46 is arranged between the left sides of the connecting rod 45.

The staff moves the silicon chip to left pressure to placing on the dish 33, jack catch 34 is fixed the silicon chip, then start servo motor 31 work, servo motor 31 drives through drive shaft 32 and places the high-speed rotation of dish 33, the staff promotes slider 42 left, thereby it contacts with the silicon chip surface to drive burnishing knife 46 through first push rod 43 and support column 44 left movement, thereby polish the polishing to the silicon chip under the cooperation of placing dish 33, the back of finishing of polishing, close servo motor 31, and promote slider 42 right, thereby drive burnishing knife 46 and reset, it can to take off the silicon chip from between the jack catch 34 at last.

Also comprises an auxiliary polishing mechanism 5, the auxiliary polishing mechanism 5 comprises a second push rod 51, a first thread block 52, a screw 53, a pair of bevel gears 54 and a sleeve shaft 55, the top of the support frame 2 on the right front side is provided with a second slide rail 57, the second slide rail 57 is rotatably provided with a lead screw 53, the left side of the second slide rail 57 is provided with a support base 58, the support base 58 is internally provided with a support plate 59, the support plate 59 is rotatably provided with a transmission shaft 56, the transmission shaft 56 is provided with a sleeve shaft 55, the sleeve shaft 55 and the lead screw 53 are provided with a paired bevel gear 54, the lead screw 53 is threadedly provided with a first thread block 52, the first thread block 52 is in sliding contact with the second slide rail 57, the first thread block 52 is provided with a second push rod 51, the second push rod 51 is connected with the support column 44, the front side of the transmission shaft 56 is provided with a rotary wheel 510, and the rotary wheel 510 is rotatably provided with a handle 511.

The staff can rotate handle 511, drives transmission shaft 56 and sleeve 55 through runner 510 and rotates, and sleeve 55 drives lead screw 53 through bevel gear 54 in pairs and rotates, thereby lead screw 53 rotates and drives first screw block 52 and carry out the horizontal slip in second slide rail 57 to control through second push rod 51 drive support column 44, and then drive burnishing knife 46 and control, conveniently carry out slight adjustment to polishing.

Still including terrazzo wiper mechanism 6, terrazzo wiper mechanism 6 is including water tank 61, filter 62, external water hose 63, go out water piston 64, baffle 65, axis of rotation 66, hatch door 67, handle 68 and

shutter board

69, 1 top middle part of base is equipped with water tank 61, drive shaft 32 is connected with water tank 61 rotary type, water tank 61 internal sliding type is equipped with

filter

62, 1 top front side of base is equipped with external water hose 63, water tank 61 front side lower part is equipped with out water piston 64, water tank 61 top is equipped with baffle 65, the left rear side of water tank 61 is rotated and is equipped with axis of rotation 66, be equipped with hatch door 67 on the axis of rotation 66, hatch door 67 rear side is equipped with handle 68, water tank 61 rear side is equipped with shutter board 69.

Before starting the equipment, the hatch door 67 belongs to a closed state, firstly, the handle 68 is pulled towards the rear side, the hatch door 67 is driven to be opened through the rotating shaft 66, then, the silicon wafer is placed between the clamping jaws 34, the handle 68 is pulled again, the hatch door 67 is driven to be closed through the rotating shaft 66, then, polishing and polishing work is carried out, water is sprayed on the polishing blades 46 and the silicon wafer through the external water hose 63, the friction temperature is prevented from being overheated, meanwhile, dust generated by polishing is washed, the water grinding effect is achieved, the washed water drips into the water tank 61 through the filter plate 62, the dust is remained at the top of the filter plate 62, when the water tank 61 is about to overflow, the water outlet piston 64 can be pulled out, waste water is discharged, after polishing is finished, the handle 68 is pulled again to open the hatch door 67, and the silicon wafer is taken out.

The device is characterized by further comprising a clamping and positioning mechanism 7, wherein the clamping and positioning mechanism 7 comprises supporting blocks 71, guide rods 72, springs 73 and clamping claws 74, the four supporting blocks 71 are uniformly arranged on the placing disc 33, the guide rods 72 are arranged on the tops of the supporting blocks 71 in a sliding mode, the clamping claws 74 are arranged between the end portions of the guide rods 72, the springs 73 are arranged between the clamping claws 74 and the supporting blocks 71, and the springs 73 are arranged on the guide rods 72.

Before the silicon wafer is placed, the clamping claws 74 are pushed outwards, the springs 73 are compressed, when the silicon wafer is in contact with the placing disc 33, the clamping claws 74 are loosened, and under the reset action of the springs 73, the clamping claws 74 are driven to reset so as to abut against the silicon wafer and fix the silicon wafer.

Still including removable tool bit mechanism 8, removable tool bit mechanism 8 is equipped with two card posts 83 including second screw block 81, bayonet lock 82, card post 83 and handle 84 between support column 44 and the connecting rod 45 slidingtype, is equipped with handle 84 between the card post 83 rear end, and slidingtype is equipped with bayonet lock 82 between the card post 83 front end, and bayonet lock 82 left side screw thread formula is equipped with second screw block 81.

When the polishing knife 46 needs to be replaced, the second thread block 81 can be rotated firstly, the second thread block 81 is unscrewed, the bayonet 82 is pulled towards the right side, the bayonet 82 is pulled out, the handle 84 is pulled towards the rear side, the clamping column 83 is driven to slide backwards and no longer supports against the connecting rod 45, at the moment, a worker can pull out the polishing knife 46 and the connecting rod 45 leftwards, then a new polishing knife 46 is replaced, after the replacement is finished, the handle 84 is pushed forwards, the clamping column 83 supports against the connecting rod 45, then the bayonet 82 slides leftwards, the end part of the clamping column 83 is fixed by the bayonet 82, and finally the second thread block 81 is rotated to fix the bayonet 82.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims

1. The utility model provides a silicon chip polishing equipment for new generation information technology, is equipped with a plurality of support frames (2) including base (1), support frame (2) and place actuating mechanism (3) base (1) top, left support frame (2) top is equipped with places actuating mechanism (3), its characterized in that: the polishing machine is characterized by further comprising a polishing mechanism (4), wherein the polishing mechanism (4) is arranged at the top of the support frame (2) on the right rear side.

2. A silicon wafer polishing apparatus for new-generation information technology according to claim 1, characterized in that: place actuating mechanism (3) including, servo motor (31), drive shaft (32), place dish (33) and jack catch (34), left support frame (2) top is equipped with servo motor (31), and servo motor (31) output is equipped with drive shaft (32), is equipped with on drive shaft (32) and places dish (33), places and is equipped with four jack catches (34) on dish (33).

3. A silicon wafer polishing apparatus for new-generation information technology according to claim 2, characterized in that: polishing mechanism (4) is including first slide rail (41), slider (42), first push rod (43), support column (44), connecting rod (45) and polishing sword (46), the support frame (2) top of right back side is equipped with first slide rail (41), first slide rail (41) internal sliding formula is equipped with slider (42), slider (42) front side is equipped with first push rod (43), be equipped with support column (44) on first push rod (43), support column (44) internal sliding formula is equipped with connecting rod (45), be equipped with polishing sword (46) between connecting rod (45) left side.

4. A silicon wafer polishing apparatus for new-generation information technology according to claim 3, characterized in that: the polishing machine also comprises an auxiliary polishing mechanism (5), wherein the auxiliary polishing mechanism (5) comprises a second push rod (51), a first thread block (52), a screw rod (53), a paired bevel gear (54), a sleeve shaft (55), a transmission shaft (56), a second slide rail (57), a supporting seat (58), a supporting plate (59), a rotating wheel (510) and a handle (511), the second slide rail (57) is arranged at the top of the supporting frame (2) at the front right side, the screw rod (53) is arranged in the second slide rail (57) in a rotating mode, the supporting seat (58) is arranged at the left side of the second slide rail (57), the supporting plate (59) is arranged in the supporting seat (58), the transmission shaft (56) is arranged on the supporting plate (59) in a rotating mode, the sleeve shaft (55) is arranged on the transmission shaft (56), the paired bevel gear (54) is arranged on the sleeve shaft (55) and the screw rod (53), and the first thread block (52) is arranged on the screw rod (53) in a threaded mode, the first thread block (52) is in sliding contact with the second sliding rail (57), a second push rod (51) is arranged on the first thread block (52), the second push rod (51) is connected with the supporting column (44), a rotating wheel (510) is arranged on the front side of the sleeve shaft (55), and a handle (511) is rotatably arranged on the rotating wheel (510).

5. The silicon wafer polishing apparatus for new-generation information technology according to claim 4, characterized in that: also comprises a water mill cleaning mechanism (6), the water mill cleaning mechanism (6) comprises a water tank (61), a filter plate (62), an external water hose (63) and a water outlet piston (64), baffle (65), axis of rotation (66), hatch door (67), handle (68) and shutter board (69), base (1) top middle part is equipped with water tank (61), drive shaft (32) are connected with water tank (61) rotary type, water tank (61) sliding type is equipped with filter (62), base (1) top front side is equipped with outer water receiving hose (63), water tank (61) front side lower part is equipped with out water piston (64), water tank (61) top is equipped with baffle (65), water tank (61) left side rear side is changeed and is equipped with axis of rotation (66), be equipped with hatch door (67) on axis of rotation (66), hatch door (67) rear side is equipped with handle (68), water tank (61) rear side is equipped with shutter board (69).

6. A silicon wafer polishing apparatus for new-generation information technology according to claim 5, characterized in that: the clamping device is characterized by further comprising a clamping and positioning mechanism (7), wherein the clamping and positioning mechanism (7) comprises supporting blocks (71), guide rods (72), springs (73) and clamping claws (74), the four supporting blocks (71) are uniformly arranged on the placing disc (33), the guide rods (72) are arranged at the tops of the supporting blocks (71) in a sliding mode, the clamping claws (74) are arranged between the end portions of the guide rods (72), the springs (73) are arranged between the clamping claws (74) and the supporting blocks (71), and the springs (73) are arranged on the guide rods (72).

7. A silicon wafer polishing apparatus for new-generation information technology according to claim 6, characterized in that: still including removable tool bit mechanism (8), removable tool bit mechanism (8) are equipped with two card post (83) including second screw block (81), bayonet lock (82), card post (83) and holding hand (84) between support column (44) and connecting rod (45) slidingtype, are equipped with holding hand (84) between card post (83) rear end, slidingtype is equipped with bayonet lock (82) between card post (83) front end, bayonet lock (82) left side screw thread formula is equipped with second screw block (81).

8. A silicon wafer polishing apparatus for new-generation information technology according to claim 5, characterized in that: the volume of the water tank (61) was 5 liters.