CN214315648U - Graphene heating chip structure - Google Patents
Graphene heating chip structure Download PDFInfo
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- CN214315648U CN214315648U CN202120448813.2U CN202120448813U CN214315648U CN 214315648 U CN214315648 U CN 214315648U CN 202120448813 U CN202120448813 U CN 202120448813U CN 214315648 U CN214315648 U CN 214315648U
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- copper foil
- insulating sleeve
- foil wire
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Abstract
The utility model discloses a graphene heating chip structure, which comprises a three-layer structure pressed together, wherein the first layer structure comprises a first PP fiber board, the second layer structure comprises a second PP fiber board, the intermediate layer structure comprises a graphene heating film and a main circuit arranged on two sides of the graphene heating film, the main circuit comprises an anode copper foil wire and a cathode copper foil wire, the anode copper foil wire is sleeved with an anode insulating sleeve, the cathode copper foil wire is sleeved with a cathode insulating sleeve, the anode insulating sleeve and the cathode insulating sleeve are internally provided with an isolating bracket matched with the anode copper foil wire and the cathode copper foil wire, the anode insulating sleeve and the cathode insulating sleeve are respectively provided with a wire routing hole, the graphene heating plate is connected with two connecting wires, the two connecting wires respectively pass through the wire routing holes to be connected with the anode copper foil wire and the cathode copper foil wire, the utility model has the advantages of can prevent to be too close to between heating film and the main circuit and cause the short circuit.
Description
Technical Field
The utility model relates to a graphite alkene field, specifically speaking is a graphite alkene chip architecture that generates heat.
Background
The chip that generates heat extensively applies to the heating, cold-proof field, and prior art can play the effect of rapid heating through arranging heating copper foil circuit in the fibreboard, and the stone carbon fiber chip that generates heat can satisfy the heating and have functions such as energy-conservation, environmental protection, health, safety, waterproof, electricity heat conversion rate.
In the prior art, the heating chip needs three layers which are distributed from top to bottom in sequence, the first layer is a PP fiberboard, the second layer comprises a PP fiberboard and two copper foil tapes (main circuits) are pasted on the PP fiberboard, the third layer comprises a PP fiberboard and a heating film pasted on the PP fiberboard, copper foil wires are adhered at two ends of the heating film, after the first layer, the second layer and the third layer are pressed, the copper foil wires at two ends of the heating film are opened, welded and connected with the copper foil tapes of the second layer through penetrating through the PP fiberboard of the second layer, the second layer of PP fiberboard is separated between the heating film and the main circuits, and in the pressing and combining process, due to the fact that the hot-pressing pressure is large, insulating glue on the insulating plate flows away, short circuit is formed between the heating film and the column circuit, and potential safety hazards are caused, and the number of structural layers of the heating chip of the three-layer structure is high, and materials are wasted.
Disclosure of Invention
The purpose of the invention is as follows: the utility model discloses an aim at is not enough to prior art, provides a graphite alkene chip architecture that generates heat.
The technical scheme is as follows: the utility model relates to a graphene heating chip structure, which comprises a three-layer structure pressed together, wherein the three-layer structure sequentially comprises a first layer structure, a middle layer structure and a second layer structure, the first layer structure comprises a first PP fiber board, the second layer structure comprises a second PP fiber board, the middle layer structure comprises a graphene heating film and a main circuit arranged at two sides of the graphene heating film, the main circuit comprises an anode copper foil wire and a cathode copper foil wire, an anode insulating sleeve is sleeved on the anode copper foil wire, a cathode insulating sleeve is sleeved on the cathode copper foil wire, an isolating support matched with the anode copper foil wire and the cathode copper foil wire is arranged in the anode insulating sleeve and the cathode insulating sleeve, wiring holes are arranged in the anode insulating sleeve and the cathode insulating sleeve, two connecting wires are connected on the graphene heating plate, and the two connecting wires respectively penetrate through the wiring holes to be connected to the positive copper foil wire and the negative copper foil wire.
Preferably, the second PP fiberboard is provided with an anode mounting groove and a cathode mounting groove which are matched with the anode insulating sleeve and the cathode insulating sleeve respectively.
Preferably, heat exchange tubes communicated with the outside of the anode insulating sleeve and the outside of the cathode insulating sleeve are arranged in the anode insulating sleeve and the cathode insulating sleeve.
The utility model discloses compare and have following beneficial effect in prior art: graphite alkene heating film sets up between anodal copper foil area and negative pole copper foil area, and graphite alkene heating film and anodal copper foil area, keep apart through positive insulation support and negative insulation support between the negative pole copper foil area, so can prevent at the fashioned in-process of pressfitting chip, because the pressfitting strength is too big, first PP fibreboard and second PP fibreboard warp the back, graphite alkene heating film is close to each other with the main circuit, prevent between graphite alkene heating film and the main circuit too close to and cause the short circuit, compare in traditional scheme with anodal copper foil area and negative pole copper foil area directly impress second PP fibreboard its advantage lie in avoiding in pressfitting in-process anodal copper foil area and negative pole copper foil area take place deformation and lead to anodal copper foil area and negative pole copper foil area local serious heating to cause the chip to damage.
Drawings
Fig. 1 is the utility model relates to a graphite alkene chip structure that generates heat's vertical section structure sketch map.
In the figure: 1. a first PP fiberboard; 2. a second PP fiberboard; 3. a graphene heating film; 4. a positive copper foil wire; 5. a negative copper foil wire; 6. a positive electrode insulating sleeve; 7. a negative electrode insulating sleeve; 8. a wiring hole; 9. a connecting wire; 10. and (5) isolating the bracket.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like are used in the indicated orientations and positional relationships based on the drawings for convenience in describing and simplifying the description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
In the present invention, unless otherwise specifically stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; the connection can be mechanical connection, electrical connection or communication connection; either directly or indirectly through intervening media, either internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The technical solution of the present invention will be described in detail below with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.
A graphene heating chip structure comprises a three-layer structure which is pressed together, the three-layer structure sequentially comprises a first layer structure, intermediate level structure and second floor structure, first layer structure includes first PP fibreboard 1, second floor structure includes second PP fibreboard 2, intermediate level structure includes graphite alkene heating film 3 and sets up the main circuit in graphite alkene heating film 3 both sides, the main circuit includes anodal copper foil line 4 and negative pole copper foil line 5, the cover is equipped with anodal insulating sleeve 6 on anodal copper foil line 4, the cover is equipped with negative pole insulating sleeve 7 on negative pole copper foil line 5, all be equipped with the isolation support 10 of the anodal copper foil line 4 of cooperation and negative pole copper foil line 5 in anodal insulating sleeve 6 and the negative pole insulating sleeve 7, wire walking hole 8 has all been seted up on anodal insulating sleeve 6 and the negative pole insulating sleeve 7, be connected with two connecting wires 9 on the graphite alkene hot plate, two connecting wires 9 pass wire walking hole 8 respectively and connect on anodal copper foil line 4 and negative pole copper foil line 5. This technical scheme's advantage lies in that graphite alkene heating film 3 sets up between anodal copper foil area and negative pole copper foil area, and graphite alkene heating film 3 and anodal copper foil area, keep apart through anodal insulating sleeve 6 and negative pole insulating sleeve 7 between the negative pole copper foil area, so can prevent at the fashioned in-process of pressfitting chip, because the pressfitting strength is too big, after first PP fibreboard and the deformation of second PP fibreboard, graphite alkene heating film 3 is close to each other with the main circuit, prevent that too close to between graphite alkene heating film 3 and the main circuit and cause the short circuit, compare in traditional scheme with anodal copper foil area and the second PP fibreboard 2 of directly impressing of negative pole copper foil area its advantage lie in avoiding taking place deformation and leading to anodal copper foil area and negative pole copper foil area local serious heating to cause the chip to damage in pressfitting in-process anodal copper foil area and negative pole copper foil area.
And the second PP fiberboard 2 is respectively provided with an anode mounting groove and a cathode mounting groove which are matched with the anode insulating sleeve 6 and the cathode insulating sleeve 7. When the first layer structure, the middle layer structure and the second layer structure are pressed, the anode insulating sleeve 6 and the cathode insulating sleeve 7 are respectively embedded into the anode mounting groove and the cathode mounting groove, and the effects of pressure dispersion and stable assembly can be achieved.
The heat exchange tubes communicated to the outside of the anode insulating sleeve 6 and the outside of the cathode insulating sleeve 7 are arranged in the anode insulating sleeve 6 and the cathode insulating sleeve 7 respectively, so that heat can be discharged in time when the anode copper foil wire 4 and the cathode copper foil wire 5 are abnormal in heating, the structural damage caused by heat accumulation is avoided, and meanwhile, the abnormal heating of the heat exchange tubes can remind a user of the internal damage.
In the present invention, unless otherwise explicitly specified or limited, the first feature "on" or "under" the second feature may be directly contacting the first feature and the second feature or indirectly contacting the first feature and the second feature through an intermediate. Also, a first feature "on," "above," and "over" a second feature may mean that the first feature is directly above or obliquely above the second feature, or that only the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lower level than the second feature. In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example" or "some examples," or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example.
Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (3)
1. A graphite alkene chip architecture that generates heat which characterized in that: comprises three layers of structures which are pressed together, wherein the three layers of structures sequentially comprise a first layer of structure, a middle layer of structure and a second layer of structure, the first layer structure comprises a first PP fiberboard, the second layer structure comprises a second PP fiberboard, the intermediate layer structure comprises a graphene heating film and main circuits arranged on two sides of the graphene heating film, the main circuit comprises a positive copper foil wire and a negative copper foil wire, a positive insulating sleeve is sleeved on the positive copper foil wire, the negative copper foil wire is sleeved with a negative insulating sleeve, the positive insulating sleeve and the negative insulating sleeve are internally provided with an isolating bracket matched with the positive copper foil wire and the negative copper foil wire, the positive pole insulation support and the negative pole insulation support are all provided with wiring holes, the graphene heating plate is connected with two connecting wires, and the two connecting wires penetrate through the wiring holes respectively and are connected to the positive pole copper foil wire and the negative pole copper foil wire.
2. The graphene heating chip structure according to claim 1, wherein: and the second PP fiberboard is respectively provided with an anode mounting groove and a cathode mounting groove which are matched with the anode insulating sleeve and the cathode insulating sleeve.
3. The graphene heating chip structure according to claim 1, wherein: and heat exchange tubes communicated with the outside of the anode insulating sleeve and the cathode insulating sleeve are arranged in the anode insulating sleeve and the cathode insulating sleeve.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202120448813.2U CN214315648U (en) | 2021-03-02 | 2021-03-02 | Graphene heating chip structure |
Applications Claiming Priority (1)
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CN202120448813.2U CN214315648U (en) | 2021-03-02 | 2021-03-02 | Graphene heating chip structure |
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CN214315648U true CN214315648U (en) | 2021-09-28 |
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CN202120448813.2U Active CN214315648U (en) | 2021-03-02 | 2021-03-02 | Graphene heating chip structure |
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2021
- 2021-03-02 CN CN202120448813.2U patent/CN214315648U/en active Active
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