CN214300322U - Evaporation plating device - Google Patents
Evaporation plating device Download PDFInfo
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- CN214300322U CN214300322U CN202120041576.8U CN202120041576U CN214300322U CN 214300322 U CN214300322 U CN 214300322U CN 202120041576 U CN202120041576 U CN 202120041576U CN 214300322 U CN214300322 U CN 214300322U
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Abstract
The utility model provides an evaporation device, include: a cavity; the evaporation source is positioned in the cavity; the sample support plate is positioned in the cavity and is suitable for bearing the edge area of the substrate to be evaporated; the temperature adjusting plate is arranged on one side, deviating from the evaporation source, of the sample support plate, a heating pipeline and a cooling pipeline are arranged at intervals in the temperature adjusting plate, and heating elements are arranged in the heating pipeline. The temperature-regulating plate can ensure that the functional thin film with lower optimal film-forming temperature and higher optimal film-forming temperature can be deposited at the optimal film-forming temperature, thereby improving the film quality of the functional thin film and further improving the performance of the semiconductor device.
Description
Technical Field
The utility model relates to an evaporation equipment technical field, concretely relates to evaporation device.
Background
In the process of manufacturing a semiconductor device, an evaporation process is generally used to form a functional thin film, that is, a material to be evaporated is heated to sublimate and then deposited on a substrate by heating. The film forming temperature affects the crystallinity, density, grain size, crystal structure, flatness, etc. of the crystals in the functional film, thereby affecting the film performance and even the performance of the semiconductor device. In the evaporation process, functional layer films of different materials have different optimal film forming temperatures, which are related to the properties of the film materials.
However, the conventional vapor deposition apparatus cannot perform vapor deposition of functional thin films having different properties at an optimum film formation temperature.
SUMMERY OF THE UTILITY MODEL
Therefore, the to-be-solved technical problem of the utility model lies in overcoming the defect that current evaporation plating equipment can't make the functional film that has different properties carry out the coating by vaporization with optimum film forming temperature to an evaporation plating device is provided.
The utility model provides an evaporation device, include: a cavity; the evaporation source is positioned in the cavity; the sample support plate is positioned in the cavity and is suitable for bearing the edge area of the substrate to be evaporated; be located the temperature regulating plate in the cavity, the temperature regulating plate set up in the sample support plate deviates from one side in coating by vaporization source, heating tube and cooling tube that have the interval in the temperature regulating plate, the inside heating member that is provided with of heating tube.
Optionally, the heating element includes a resistance wire, and the cooling pipeline is suitable for introducing a cooling liquid.
Optionally, the heating duct and the cooling duct are adjacent and arranged side by side.
Optionally, the heating pipeline and the cooling pipeline are serpentine in shape, or the heating pipeline and the cooling pipeline are spiral in shape.
Optionally, the distance between the temperature-adjusting plate and the sample support plate is less than or equal to 5 mm.
Optionally, the distance from the heating pipe to the sample support plate is equal to the distance from the cooling pipe to the sample support plate; or the distance from the heating pipeline to the sample carrier plate is not equal to the distance from the cooling pipeline to the sample carrier plate, and the projection of the heating pipeline on the bottom surface of the cavity is staggered or superposed with the projection of the cooling pipeline on the bottom surface of the cavity.
Optionally, the evaporation apparatus further includes: a power supply disposed outside the cavity, the power supply being electrically connected to the heating element; the cooling source comprises a circulating water tank, a cooling liquid input pipeline and a cooling liquid output pipeline which are communicated with the circulating water tank, and the circulating water tank is arranged outside the cavity; the cooling pipeline is provided with a liquid inlet and a liquid outlet; the cooling liquid input pipeline is communicated with the liquid inlet, and the cooling liquid output pipeline is communicated with the liquid outlet.
Optionally, the outer side wall of the sample support plate is provided with a plurality of teeth; the vapor deposition device further includes: the servo motor is arranged on the outer side of the cavity; the transmission rod penetrates through the cavity, the servo motor is connected with one end of the transmission rod to drive the transmission rod to rotate around a central shaft of the transmission rod, a transmission gear is arranged at the other end of the transmission rod, and the transmission gear is meshed with teeth of the sample support plate.
Optionally, the sample support plate is circular.
Optionally, the sample support plate includes a bottom plate and a side plate connected to a side of the bottom plate, the side plate is perpendicular to the bottom plate, a first through hole is formed in the bottom plate, and the size of the first through hole is larger than an evaporation area for carrying a substrate to be evaporated.
Optionally, a second groove is formed in one side, away from the temperature adjusting plate, of the bottom plate;
the vapor deposition device further includes: the baffle is abutted against the inner wall of the cavity, a second through hole is formed in the baffle, and the size of the second through hole is larger than that of an evaporation area for carrying a substrate to be evaporated; the fixing plate is perpendicular to the baffle plate and comprises a first section area and a second section area which are communicated, the first section area is connected with the inner side edge of the baffle plate, and the second section area extends into the second groove and is in contact with one side, away from the temperature adjusting plate, of the bottom plate; the rotating piece is arranged on one side, facing the second groove, of the second section area, and the rotating piece is in contact with the inner wall of the second groove.
The utility model discloses technical scheme has following advantage:
1. the utility model provides an evaporation device, which comprises a cavity; the evaporation source is positioned in the cavity; the sample support plate is positioned in the cavity and is suitable for bearing the edge area of the substrate to be evaporated; be located the temperature regulating plate in the cavity, the temperature regulating plate set up in the sample support plate deviates from one side in coating by vaporization source, heating tube and cooling tube that have the interval in the temperature regulating plate, the inside heating member that is provided with of heating tube. The cooling pipeline is suitable for cooling the sample support plate to accelerate the heat dissipation of the functional film, and is suitable for the functional film with lower optimal film forming temperature; the heating pipeline is suitable for heating the sample support plate and is suitable for a functional film with higher optimal film forming temperature; namely, the temperature-adjusting plate can enable the functional thin film with lower optimal film-forming temperature and higher optimal film-forming temperature to be deposited at the optimal film-forming temperature, thereby improving the film quality of the functional thin film and improving the performance of the semiconductor device.
2. The utility model provides an evaporation device, through control the heating line with cooling tube's shape is snakelike, or the heating line with cooling tube's shape is the vortex shape, has guaranteed to be located temperature regulating plate one side the different regions homoenergetic of treating the evaporation plating base plate in the sample carrier can carry out the heating or the cooling of the same degree, has guaranteed the homogeneity of treating evaporation plating base plate temperature to guaranteed that the functional film of treating on the evaporation plating base plate has the same film quality, avoided because the film quality that the temperature of treating certain region of evaporation plating base plate is lower or higher leads to this regional functional film is not good, then improved semiconductor device's performance.
3. The utility model provides an evaporation plating device, through injecing the temperature regulation board with interval between the sample support plate is for being less than or equal to 5mm, has controlled the heating rate and the cooling rate of temperature regulation board make the temperature regulation board has higher temperature regulation efficiency, is favorable to improving the film quality of function film to be favorable to improving semiconductor device's performance.
4. The utility model provides an evaporation device still includes servo motor, transfer line and transmission gear, servo motor set up in the cavity outside, the transfer line runs through the cavity, servo motor is connected with the one end of transfer line, the other end of transfer line is provided with the transmission gear, the transmission gear with the mutual interlock of tooth of sample support plate. The servo motor can drive the transmission rod to rotate around the central shaft of the transmission rod, the transmission rod drives the transmission gear to rotate, and the transmission gear drives the sample support plate to rotate around the central shaft of the sample support plate, so that the substrate to be evaporated rotates in the evaporation process, and the thickness uniformity of functional films in different areas on the substrate to be evaporated is improved.
5. The utility model provides an evaporation device, the sample support plate include the bottom plate and with the curb plate that the side of bottom plate is connected, the curb plate perpendicular to the bottom plate, be provided with first through-hole in the bottom plate, the size of first through-hole is greater than carries the evaporation coating region who treats the evaporation coating base plate, treat that the evaporation coating base plate is arranged in on the bottom plate, be located the evaporation coating material of treating of evaporation coating source sublime and evaporate through first through-hole and plate in the evaporation coating region of treating the evaporation coating base plate to form required functional film.
6. The evaporation device provided by the utility model is characterized in that a second groove is arranged on one side of the bottom plate deviating from the temperature adjusting plate, and the baffle abutted against the inner wall of the cavity is arranged, the fixed plate comprises a first section area and a second section area which are communicated, so that the first section area is connected with the inner side edge of the baffle, and the second section area extends into the second groove and is contacted with one side of the bottom plate deviating from the temperature adjusting plate, so that the sample support plate can be stably fixed in the cavity; meanwhile, the first through holes are formed in the baffle, and the size of the second through holes is larger than that of an evaporation area for carrying a substrate to be evaporated, so that on one hand, a substance to be evaporated, which is positioned in an evaporation source, is sublimated and is evaporated in the evaporation area of the substrate to be evaporated through the first through holes, on the other hand, the sublimated substance to be evaporated is prevented from being deposited in the area, which is positioned above the baffle, in the cavity, and therefore, the adverse effect of the substance to be evaporated on the evaporation device is avoided; in addition, a rotating part is arranged on one side, facing the second groove, of the second section area, and the rotating part is in contact with the inner wall of the second groove, so that the fixing plate can move relative to the bottom plate, and the sample support plate can rotate around the central shaft of the sample support plate when the transmission rod drives the transmission gear to rotate.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a side sectional view of an evaporation device of the present invention;
FIG. 2 is a cross-sectional view of an S-shaped cooling and heating conduit;
FIG. 3 is a cross-sectional view of a cooling duct and a heating duct in the form of a volute;
FIG. 4 is a side cross-sectional view of a first configuration of the thermal plate of FIG. 1;
FIG. 5 is a side cross-sectional view of a second construction of the thermal plate shown in FIG. 1;
fig. 6 is a top view of the sample support plate shown in fig. 1;
description of reference numerals:
1-a cavity; 2-evaporation source; 3-sample support plate; 31-a base plate; 32-side plate; 33-tooth; 4-temperature adjusting plate; 41-heating the pipeline; 42-a cooling pipe; 5-a power line; 6-cooling liquid input pipeline; 7-coolant output line; 8-a servo motor; 9-a transmission rod; 91-a transmission gear; 10-a heating part; 11-a baffle plate; 12-rotating member.
Detailed Description
As described in the background art, functional layer films of different materials have different optimum film-forming temperatures, which are related to the properties of the functional film. For example: aluminum is one of materials commonly used for producing thin film electrodes in semiconductor devices such as TFT-LCD or OLED, if heat generated in the evaporation process of Al cannot be discharged in time, the Al layer expands under the influence of heat, so that the thin film vertically grows from a crystal boundary to form hillocks, and the performance of the device is affected, namely the optimal film forming temperature of the Al layer is low. Some functional films have higher optimal film forming temperature, namely heating is needed in the film forming process, so that the crystallinity, the density or the grain size of the functional films are improved, and the performance of devices is improved.
However, the conventional evaporation apparatus can only perform heating or cooling, and thus functional thin films having different properties cannot be evaporated at an optimal film formation temperature.
On this basis, the utility model provides an evaporation device, include: a cavity; the evaporation source is positioned in the cavity; the sample support plate is positioned in the cavity and is suitable for bearing the edge area of the substrate to be evaporated; be located the temperature regulating plate in the cavity, the temperature regulating plate set up in the sample support plate deviates from one side in coating by vaporization source, heating tube and cooling tube that have the interval in the temperature regulating plate, the inside heating member that is provided with of heating tube. The temperature adjusting plate can enable the functional thin film with lower optimal film forming temperature and higher optimal film forming temperature to be deposited at the optimal film forming temperature, and the film quality of the functional thin film is improved, so that the performance of a semiconductor device is improved.
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which are only for convenience of description and simplification of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1, the present embodiment provides an evaporation apparatus, including: a cavity 1; the evaporation source 2 is positioned in the cavity 1; the sample support plate 3 is positioned in the cavity 1, and the sample support plate 3 is suitable for bearing the edge area of a substrate to be evaporated; be located thermoregulation board 4 in the cavity 1, thermoregulation board 4 set up in sample support plate 3 deviates from one side of coating by vaporization source 2, have spaced heating tube 41 and cooling tube 42 in the thermoregulation board 4, heating tube 41 is inside to be provided with the heating member.
In the evaporation device, the cooling pipeline 42 is suitable for cooling the sample support plate 3 to accelerate the heat dissipation of the functional film, and is suitable for the functional film with a lower optimal film forming temperature; the heating pipeline 41 is suitable for heating the sample support plate 3 and is suitable for a functional film with higher optimal film forming temperature; that is, the temperature-adjusting plate 4 enables the functional thin film having a lower optimal film-forming temperature and a higher optimal film-forming temperature to be deposited at the optimal film-forming temperature, and improves the film quality of the functional thin film, thereby improving the performance of the semiconductor device.
In this embodiment, the evaporation source 2 includes, but is not limited to, a boat or a crucible, the boat is made of tungsten, and the evaporation source 2 is suitable for holding a material to be evaporated. The evaporation device further comprises a heating assembly, the heating assembly comprises a heating part 10 arranged below the evaporation source 2, and the heating part 10 is suitable for heating the substance to be evaporated, so that the substance to be evaporated is sublimated to be deposited on the substrate to be evaporated.
In the present embodiment, the heating element includes a resistance wire, and the cooling conduit 42 is adapted to be filled with a cooling fluid. Specifically, the evaporation device further comprises a power supply (not shown in the figure), the power supply is arranged outside the cavity 1, and the power supply is electrically connected with the heating element, that is, a power line 5 of the power supply is electrically connected with the heating element; evaporation device still includes the cooling source, the cooling source include circulation tank (not shown in the figure) and with coolant liquid input pipeline 6 and the coolant liquid output pipeline 7 of circulation tank intercommunication, circulation tank set up in outside cavity 1, cooling tube 42 has inlet and liquid outlet, coolant liquid input pipeline 6 with the inlet intercommunication, coolant liquid output pipeline 7 with the liquid outlet intercommunication, the coolant liquid that comes from circulation tank gets into cooling tube 42 is right treat that the evaporation plating base plate cools down, and the coolant liquid after the cooling flows out and enters from cooling tube 42 circulation tank.
Further, referring to fig. 1, the cavity 1 is provided with power line inlets, power lines 5 are connected with the heating member through the power line inlets, and the number of the power line inlets is two; the cavity 1 is provided with a cooling liquid input pipe orifice and a cooling liquid output pipe orifice, the cooling liquid input pipeline 6 is communicated with the liquid inlet through the cooling liquid input pipe orifice, and the cooling liquid output pipeline 7 is communicated with the liquid outlet through the cooling liquid output pipe orifice. It should be understood that the number of the power line inlets may also be 1, and the cooling liquid input pipe orifice and the cooling liquid output pipe orifice may also be combined into one; as an alternative embodiment, the power supply line can be connected to the heating element via the coolant inlet and/or coolant outlet nozzle.
In this embodiment, referring to fig. 2, the heating duct 41 and the cooling duct 42 are serpentine in shape, referring to fig. 3, or the heating duct 41 and the cooling duct 42 are spiral in shape. Through inciting somebody to action heating tube 41 with cooling tube 42 sets up to above-mentioned shape, has guaranteed to be located temperature regulation plate 4 one side treat in the sample carrier that the different zone homoenergetic of coating by vaporization base plate can carry out the heating or the cooling of the same degree, guaranteed to treat the homogeneity of coating by vaporization base plate temperature to guaranteed to treat that the functional film on the coating by vaporization base plate has the same film quality, avoided because the film quality that treats that the temperature of certain region of coating by vaporization base plate is lower or higher leads to the functional film in this region is not good, then improved semiconductor device's performance.
It is to be understood that the shapes of the heating duct and the cooling duct include, but are not limited to, the above-described shapes.
In this embodiment, the distance between the temperature-regulating plate 4 and the sample support plate 3 is less than or equal to 5 mm. The distance between the temperature adjusting plate 4 and the sample carrier plate 3 is limited to be less than or equal to 5mm, so that the heating rate and the cooling rate of the temperature adjusting plate 4 are controlled, the temperature adjusting plate 4 has high temperature adjusting efficiency, the film quality of a functional film is improved, and the performance of a semiconductor device is improved.
In the present embodiment, the heating duct 41 and the cooling duct 42 are disposed adjacent to each other and side by side.
As an alternative embodiment, referring to fig. 4, the distance from the heating channel 41 to the sample support plate 3 is equal to the distance from the cooling channel 42 to the sample support plate 3.
As another alternative, referring to fig. 5, the distance from the heating conduit 41 to the sample support plate 3 is not equal to the distance from the cooling conduit 42 to the sample support plate 3, and the projection of the heating conduit 41 on the bottom surface of the cavity 1 is offset from or coincides with the projection of the cooling conduit 42 on the bottom surface of the cavity 1.
In this embodiment, referring to fig. 6, the outer side wall of the sample support plate 3 has a plurality of teeth 33; referring to fig. 1, the evaporation apparatus further includes: the servo motor 8, the said servo motor 8 is set up in the outside of the said cavity 1; the transmission rod 9 penetrates through the cavity 1, the servo motor 8 is connected with one end of the transmission rod to drive the transmission rod 9 to rotate around the central shaft of the transmission rod 9, the other end of the transmission rod is provided with a transmission gear 91, and the transmission gear 91 is meshed with the teeth 33 of the sample support plate 3. The servo motor 8 can drive the transmission rod 9 to rotate around the central shaft of the transmission rod 9, the transmission rod 9 drives the transmission gear 91 to rotate, and the transmission gear 91 drives the sample support plate 3 to rotate around the central shaft of the sample support plate, so that the substrate to be evaporated rotates in the evaporation process, and the thickness uniformity of functional films in different areas on the substrate to be evaporated is improved. The sample support plate 3 is circular.
In the present embodiment, referring to fig. 6, the sample support plate 3 includes a bottom plate 31 and a side plate 32 connected to a side of the bottom plate 31, the side plate 32 is perpendicular to the bottom plate 31, and a first through hole is provided in the bottom plate 31, and the size of the first through hole is larger than the evaporation area for carrying the substrate to be evaporated. The bottom plate 31 with the curb plate 32 encloses into a first recess, treat that the coating by vaporization base plate arranges in first recess on the bottom plate 31, be located the coating by vaporization source 2 treat that the coating by vaporization material sublimates and evaporate through first through-hole and plate in treating the coating by vaporization region of coating by vaporization base plate to form required functional film.
Further, the evaporation device is still including arranging in first recess the mask plate on the bottom plate 31, the mask plate includes a plurality of fretwork region, at the evaporation process, the mask plate is located bottom plate 31 with treat between the evaporation substrate in order to form the functional film of different shapes on treating the evaporation substrate.
Further, the bottom surface size of first recess is the same with the size of treating the evaporation substrate and the mask plate, has avoided among the evaporation process treat that evaporation substrate and mask plate take place relative movement and lead to the functional film of required different shapes the precision is lower or even can't obtain the functional film of required different shapes to functional film's evaporation coating precision has been guaranteed.
In this embodiment, referring to fig. 1, a second groove is disposed on a side of the bottom plate facing away from the temperature adjustment plate; the vapor deposition device further includes: the vapor deposition device comprises a baffle 11, a fixed plate and a rotating piece 12, wherein the baffle 11 is abutted against the inner wall of the cavity, a second through hole is formed in the baffle 11, and the size of the second through hole is larger than that of a vapor deposition area for carrying a substrate to be vapor deposited; the fixing plate is perpendicular to the baffle 11 and comprises a first section area and a second section area which are communicated, the first section area is connected with the inner side edge of the baffle 11, and the second section area extends into the second groove and is in contact with one side of the bottom plate, which is far away from the temperature adjusting plate; the rotating part 12 is arranged on one side of the second section area facing the second groove, and the rotating part 12 is in contact with the inner wall of the second groove.
In the evaporation device, the second groove is formed in one side of the bottom plate, which is far away from the temperature adjusting plate, and the baffle plate 11 is arranged and abutted against the inner wall of the cavity; meanwhile, the first through holes are formed in the baffle plate 11, and the size of the second through holes is larger than that of an evaporation area for carrying a substrate to be evaporated, so that on one hand, a substance to be evaporated, which is positioned in an evaporation source, is sublimated and is evaporated in the evaporation area of the substrate to be evaporated through the first through holes, on the other hand, the sublimated substance to be evaporated is prevented from being deposited in the area, which is positioned above the baffle plate 11, in the cavity, and therefore, the adverse effect of the substance to be evaporated on an evaporation device is avoided; in addition, the rotating part 12 is arranged on one side of the second section area facing the second groove, and the rotating part 12 is in contact with the inner wall of the second groove, so that the fixing plate can move relative to the bottom plate, and the sample support plate can rotate around the central shaft of the sample support plate when the transmission rod drives the transmission gear to rotate.
Specifically, the fixing plate is annular.
As an optional implementation manner, the rotating element 12 may be a bearing, the bearing includes an inner ring, an outer ring, and a plurality of rolling elements disposed between the inner ring and the outer ring, the inner ring is sleeved on the outer side of the second section area of the fixing plate, the outer ring is connected to the inner wall of the second groove, and when the transmission rod drives the transmission gear to rotate, the rolling elements rotate, so that the fixing plate and the bottom plate can move relatively, and finally the sample support plate rotates around the central axis of the sample support plate. Specifically, the rolling bodies may be steel balls.
As another alternative, the rotary member 12 may be a rolling body. And a third groove is formed in one side, facing the second groove, of the second section area, and the rolling body is embedded into the third groove and is in contact with the inner wall of the second groove. When the transmission rod drives the transmission gear to rotate, the rolling body rotates, so that the fixing plate and the bottom plate can move relatively, and finally the sample support plate rotates around the central shaft of the sample support plate. Specifically, the third groove may be disposed on a side of the second segment region departing from the first segment region, or may be disposed on a side wall of the second segment region, and the rolling element may be a steel ball.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (10)
1. An evaporation apparatus, comprising:
a cavity;
the evaporation source is positioned in the cavity;
the sample support plate is positioned in the cavity and is suitable for bearing the edge area of the substrate to be evaporated;
be located the temperature regulating plate in the cavity, the temperature regulating plate set up in the sample support plate deviates from one side in coating by vaporization source, heating tube and cooling tube that have the interval in the temperature regulating plate, the inside heating member that is provided with of heating tube.
2. The evaporation device according to claim 1, wherein the heating element comprises a resistance wire, and the cooling pipe is adapted to be filled with a cooling liquid.
3. The vapor deposition apparatus according to claim 1, wherein the heating tube is disposed adjacent to and side by side with the cooling tube.
4. The vapor deposition apparatus according to any one of claims 1 to 3, wherein the heating channel and the cooling channel have a serpentine shape, or the heating channel and the cooling channel have a spiral shape.
5. The vapor deposition apparatus according to claim 1, wherein a distance between the temperature control plate and the sample support plate is 5mm or less.
6. The evaporation apparatus according to claim 1, wherein the distance from the heating conduit to the sample support plate is equal to the distance from the cooling conduit to the sample support plate;
or the distance from the heating pipeline to the sample carrier plate is not equal to the distance from the cooling pipeline to the sample carrier plate, and the projection of the heating pipeline on the bottom surface of the cavity is staggered or superposed with the projection of the cooling pipeline on the bottom surface of the cavity.
7. The vapor deposition device according to claim 1, further comprising:
a power supply disposed outside the cavity, the power supply being electrically connected to the heating element;
the cooling source comprises a circulating water tank, a cooling liquid input pipeline and a cooling liquid output pipeline which are communicated with the circulating water tank, and the circulating water tank is arranged outside the cavity; the cooling pipeline is provided with a liquid inlet and a liquid outlet; the cooling liquid input pipeline is communicated with the liquid inlet, and the cooling liquid output pipeline is communicated with the liquid outlet.
8. The evaporation device according to claim 1, wherein the outer side wall of the sample support plate has a plurality of teeth;
the vapor deposition device further includes:
the servo motor is arranged on the outer side of the cavity;
the transmission rod penetrates through the cavity, the servo motor is connected with one end of the transmission rod to drive the transmission rod to rotate around a central shaft of the transmission rod, a transmission gear is arranged at the other end of the transmission rod, and the transmission gear is meshed with teeth of the sample support plate.
9. The evaporation device according to claim 1, wherein the sample support plate comprises a bottom plate and a side plate connected to a side of the bottom plate, the side plate is perpendicular to the bottom plate, a first through hole is provided in the bottom plate, and the size of the first through hole is larger than an evaporation area for carrying a substrate to be evaporated.
10. The vapor deposition device according to claim 9, wherein a second groove is provided on a side of the bottom plate facing away from the temperature-adjusting plate;
the vapor deposition device further includes:
the baffle is abutted against the inner wall of the cavity, a second through hole is formed in the baffle, and the size of the second through hole is larger than that of an evaporation area for carrying a substrate to be evaporated;
the fixing plate is perpendicular to the baffle plate and comprises a first section area and a second section area which are communicated, the first section area is connected with the inner side edge of the baffle plate, and the second section area extends into the second groove and is in contact with one side, away from the temperature adjusting plate, of the bottom plate;
the rotating piece is arranged on one side, facing the second groove, of the second section area, and the rotating piece is in contact with the inner wall of the second groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120041576.8U CN214300322U (en) | 2021-01-07 | 2021-01-07 | Evaporation plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120041576.8U CN214300322U (en) | 2021-01-07 | 2021-01-07 | Evaporation plating device |
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| Publication Number | Publication Date |
|---|---|
| CN214300322U true CN214300322U (en) | 2021-09-28 |
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Family Applications (1)
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| CN202120041576.8U Active CN214300322U (en) | 2021-01-07 | 2021-01-07 | Evaporation plating device |
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| CN (1) | CN214300322U (en) |
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2021
- 2021-01-07 CN CN202120041576.8U patent/CN214300322U/en active Active
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