CN214291265U - Reflow soldering device - Google Patents
Reflow soldering device Download PDFInfo
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- CN214291265U CN214291265U CN202120148627.7U CN202120148627U CN214291265U CN 214291265 U CN214291265 U CN 214291265U CN 202120148627 U CN202120148627 U CN 202120148627U CN 214291265 U CN214291265 U CN 214291265U
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Abstract
The utility model discloses a reflow soldering device, which comprises a laser light source mechanism used for emitting laser beams to a substrate; a vacuum cooling mechanism for cooling a first target region of the substrate in contact therewith; and the preheating mechanism is used for preheating a second target area of the substrate contacted with the preheating mechanism. The application provides a reflow soldering device, simple structure is reasonable, can be so that adopt laser to carry out the large tracts of land reflow soldering in-process, and temperature distribution on the base plate is even. The edge area can be subjected to temperature compensation through the preheating mechanism, the laser irradiation time is shortened, and the damage to the substrate caused by overlong irradiation time is prevented. In the welding process, the laser emission time and the energy intensity can be controlled in real time, and the optimal welding effect is ensured to be obtained. Is worthy of large-area popularization and application.
Description
Technical Field
The utility model relates to a PCB board preparation technical field especially relates to a reflow soldering device.
Background
The reflow soldering technology is that air or nitrogen is heated to a high enough temperature and then blown to a circuit board with a mounted component, so that solder on two sides of the component is melted and then bonded with a mainboard. The process has the advantages of easy temperature control, no oxidation during welding and easy control of the manufacturing cost.
The laser heating reflow soldering is characterized in that the laser beam is focused in a small area through an optical system by utilizing the characteristics of good directivity and high power density of the laser beam, and a local heating area is formed at the heated position in a short time. The heating of the laser heating reflow soldering has the characteristic of high localization, does not generate thermal stress, has small thermal shock, and is not easy to damage thermosensitive components.
However, in such a laser reflow soldering process, there is a disadvantage that the process cannot be used over a large processing area due to the limitation of the beam pattern of the laser beam.
SUMMERY OF THE UTILITY MODEL
The utility model provides a reflow soldering device.
The utility model provides a following scheme:
a reflow soldering apparatus, comprising:
a laser light source mechanism for emitting a laser beam to the substrate;
a vacuum cooling mechanism for cooling a first target region of the substrate in contact therewith;
a preheating mechanism for preheating a second target region of the substrate in contact therewith;
wherein the laser beam has a Gaussian pattern with intensity decreasing from a center portion to an edge portion, the first target area is located at a center portion where the substrate receives the laser beam, and the second target area is located at an edge portion where the substrate receives the laser beam.
Preferably: the vacuum cooling mechanism comprises a porous plate and a suction part, the upper surface of the porous plate is used for being abutted to the lower surface of the first target area of the substrate, and the suction part is used for generating negative pressure to enable the substrate to be connected with the porous plate.
Preferably: the suction part comprises a vacuum chamber and a negative pressure pump connected with the vacuum chamber.
Preferably: the lower surface of the porous plate is connected with a radiating fin assembly, and the radiating fin assembly is located in the vacuum chamber.
Preferably: the preheating mechanism comprises a heating base body, the upper surface of the heating base body is used for being abutted against the lower surface of the second target area of the substrate, and a heater and a thermocouple are arranged in the heating base body.
Preferably: the upper surface of the heating substrate is flush with the upper surface of the porous plate.
Preferably: the laser light source device also comprises a temperature detection mechanism and a control mechanism, wherein the temperature detection mechanism and the laser light source mechanism are respectively and electrically connected with the control mechanism; the temperature detection mechanism is used for acquiring the temperature of the substrate processing area.
Preferably: the temperature detection mechanism includes a thermal imaging camera.
According to the utility model provides a concrete embodiment, the utility model discloses a following technological effect:
through the utility model, a reflow soldering device can be realized, and in one realization mode, the device can comprise a laser light source mechanism for emitting laser beams to a substrate; a vacuum cooling mechanism for cooling a first target region of the substrate in contact therewith; a preheating mechanism for preheating a second target region of the substrate in contact therewith; wherein the laser beam has a Gaussian pattern with intensity decreasing from a center portion to an edge portion, the first target area is located at a center portion where the substrate receives the laser beam, and the second target area is located at an edge portion where the substrate receives the laser beam. The application provides a reflow soldering device, simple structure is reasonable, can be so that adopt laser to carry out the large tracts of land reflow soldering in-process, and temperature distribution on the base plate is even. The edge area can be subjected to temperature compensation through the preheating mechanism, the laser irradiation time is shortened, and the damage to the substrate caused by overlong irradiation time is prevented. In the welding process, the laser emission time and the energy intensity can be controlled in real time, and the optimal welding effect is ensured to be obtained. Is worthy of large-area popularization and application.
Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a reflow soldering apparatus according to an embodiment of the present invention.
In the figure: the laser light source mechanism 1, the vacuum cooling mechanism 2, the porous plate 21, the vacuum chamber 22, the negative pressure pump 23, the heat radiation fin assembly 24, the preheating mechanism 3, the heating base 31, the heater 32, the thermocouple 33, the temperature detection mechanism 4, the control mechanism 5, the substrate 6, the semiconductor element 7, and the solder 8.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art all belong to the protection scope of the present invention.
Examples
Referring to fig. 1, in order to provide a reflow soldering apparatus according to an embodiment of the present invention, as shown in fig. 1, the apparatus may include:
a laser light source mechanism 1 for emitting a laser beam to the substrate 6; the laser source may be any laser source that can be used in the prior art for implementing reflow soldering, such as a fiber laser source capable of generating a laser beam having a wavelength of 915 nm, but is not limited thereto. The substrate can be a PCB, a flexible circuit board and the like.
A vacuum cooling mechanism 2 for cooling a first target region of the substrate 6 in contact therewith;
a preheating mechanism 3 for preheating a second target region of the substrate 6 in contact therewith;
wherein the laser beam has a Gaussian pattern with intensity decreasing from a center portion to an edge portion, the first target area is located at a center portion where the substrate receives the laser beam, and the second target area is located at an edge portion where the substrate receives the laser beam.
Since the laser beam emitted from the laser light source has a gaussian mode, irradiation with the laser beam in the substrate post-processing region cannot form a uniform temperature distribution. That is, the temperature is relatively high at the central portion of the processing region of the substrate irradiated with the laser beam, and the temperature is relatively low at the edge portion. In this way, since a uniform temperature distribution cannot be formed in all the process areas on the substrate onto which the laser beam is irradiated, soldering quality may be deteriorated, and there is a problem in that the reflow soldering process cannot be simultaneously performed over a large process area. The vacuum cooling mechanism that this application embodiment provided can cool down laser irradiation's central part (first target area), adopts preheating mechanism to carry out temperature compensation to laser irradiation's marginal part (second target area) simultaneously for the base plate is even at the whole temperature of receiving laser irradiation back. Meanwhile, as the basic temperature of the edge part is compensated, the substrate can transfer the temperature to the solder, so that the temperature of the solder is increased, the laser irradiation time can be shortened, and the purpose of rapid welding can be achieved. The solder may be disposed in a spherical manner at a predetermined position on the substrate. The solder is used for bonding with a semiconductor device provided thereon after being irradiated with laser light, and may include, for example, lead or tin, or the like.
In practical applications, the vacuum cooling mechanism 2 includes a porous plate 21, an upper surface of the porous plate 21 is configured to abut against a lower surface of the first target region of the substrate 6, and a suction portion configured to generate a negative pressure to connect the substrate 6 to the porous plate 21. The vacuum cooling mechanism can not only cool the first target area, but also utilize the negative pressure generated by the suction part to make the substrate tightly absorbed, thereby preventing the basic displacement in the welding process. Specifically, the suction section includes a vacuum chamber 22 and a negative pressure pump 23 connected to the vacuum chamber 22. In order to achieve a better heat dissipation effect, a heat dissipation fin assembly 24 is attached to the lower surface of the porous plate 21, and the heat dissipation fin assembly 24 is located inside the vacuum chamber 22. This perforated plate can adopt the metal material preparation that the thermal conductivity is excellent, and the fin can in time give off the driven heat of perforated plate to absorption through the negative pressure pump is taken away along with the flow of air, reaches rapid cooling's purpose.
Further, the preheating mechanism 3 includes a heating base 31, an upper surface of the heating base 31 is configured to contact a lower surface of the second target region of the substrate 6, and a heater 32 and a thermocouple 33 are disposed inside the heating base 31. The mode that the heater is matched with the thermocouple is adopted, the temperature of the heating base body can be monitored in real time, and the most appropriate heating temperature can be provided for the second target area of the substrate. In order to ensure that the first target area and the second target area can be brought into contact with the vacuum cooling mechanism and the preheating mechanism, respectively, the upper surface of the heating base is flush with the upper surface of the porous plate.
In order to monitor the temperature of the substrate in real time during the welding process, a temperature detection mechanism 4 and a control mechanism 5 may also be provided in the embodiment of the present application, wherein the temperature detection mechanism 4 and the laser light source mechanism 1 are electrically connected to the control mechanism 5 respectively; the temperature detection mechanism 4 is configured to acquire a temperature of a processing area of the substrate 6. The temperature detection mechanism may measure the temperature of the processing region of the substrate in real time while the laser beam is irradiated to the processing region of the substrate during the soldering process. The temperature detection mechanism may include, for example, a thermal imaging camera. However, it is not limited thereto.
The control mechanism may be configured to control the laser light source mechanism based on the temperature measured by the temperature detection mechanism during the welding process. Specifically, the temperature detection mechanism measures in real time the temperature of the processing region of the substrate to which the laser beam is irradiated, and then transmits the measured temperature to the control mechanism. Then, the control mechanism controls the output of the laser light source mechanism in accordance with the temperature measured in the processing region of the substrate. Likewise, the control mechanism may control the temperature by controlling the energy of the output laser of the laser source mechanism over time during the welding process to ensure uniform distribution.
In a word, the reflow soldering device that this application provided, simple structure is reasonable, can be so that adopt laser to carry out the large tracts of land reflow soldering in-process, and the temperature distribution on the base plate is even. The edge area can be subjected to temperature compensation through the preheating mechanism, the laser irradiation time is shortened, and the damage to the substrate caused by overlong irradiation time is prevented. In the welding process, the laser emission time and the energy intensity can be controlled in real time, and the optimal welding effect is ensured to be obtained. Is worthy of large-area popularization and application.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (8)
1. A reflow soldering apparatus, comprising:
a laser light source mechanism for emitting a laser beam to the substrate;
a vacuum cooling mechanism for cooling a first target region of the substrate in contact therewith;
a preheating mechanism for preheating a second target region of the substrate in contact therewith;
wherein the laser beam has a Gaussian pattern with intensity decreasing from a center portion to an edge portion, the first target area is located at a center portion where the substrate receives the laser beam, and the second target area is located at an edge portion where the substrate receives the laser beam.
2. Reflow soldering apparatus in accordance with claim 1, wherein the vacuum cooling mechanism comprises a porous plate having an upper surface for abutting against a lower surface of the first target area of the substrate and a suction portion for generating a negative pressure to connect the substrate to the porous plate.
3. Reflow soldering apparatus in accordance with claim 2, wherein the suction portion comprises a vacuum chamber and a negative pressure pump connected to the vacuum chamber.
4. Reflow soldering apparatus in accordance with claim 3, wherein a heat sink fin assembly is attached to a lower surface of the porous plate, the heat sink fin assembly being located within the vacuum chamber.
5. Reflow soldering apparatus in accordance with claim 2, wherein the pre-heating mechanism comprises a heating base, an upper surface of the heating base being adapted to abut a lower surface of the second target area of the substrate, a heater and a thermocouple being arranged inside the heating base.
6. Reflow soldering apparatus in accordance with claim 5, wherein the upper surface of the heating base is flush with the upper surface of the porous plate.
7. The reflow soldering apparatus according to claim 1, further comprising a temperature detection mechanism and a control mechanism, wherein the temperature detection mechanism and the laser light source mechanism are electrically connected to the control mechanism, respectively; the temperature detection mechanism is used for acquiring the temperature of the substrate processing area.
8. Reflow soldering apparatus in accordance with claim 7, wherein the temperature detection means comprises a thermal imaging camera.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120148627.7U CN214291265U (en) | 2021-01-20 | 2021-01-20 | Reflow soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120148627.7U CN214291265U (en) | 2021-01-20 | 2021-01-20 | Reflow soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214291265U true CN214291265U (en) | 2021-09-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120148627.7U Active CN214291265U (en) | 2021-01-20 | 2021-01-20 | Reflow soldering device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214291265U (en) |
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2021
- 2021-01-20 CN CN202120148627.7U patent/CN214291265U/en active Active
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