CN214281727U - Linear array camera system mainboard - Google Patents
Linear array camera system mainboard Download PDFInfo
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- CN214281727U CN214281727U CN202023046759.3U CN202023046759U CN214281727U CN 214281727 U CN214281727 U CN 214281727U CN 202023046759 U CN202023046759 U CN 202023046759U CN 214281727 U CN214281727 U CN 214281727U
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- Prior art keywords
- mainboard
- heat dissipation
- main board
- heat
- memory card
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 46
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 239000010949 copper Substances 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 23
- 229920001296 polysiloxane Polymers 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 13
- 239000004519 grease Substances 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- -1 graphite alkene Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
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Abstract
The utility model belongs to the technical field of camera system mainboard, especially a linear array camera system mainboard, including the mainboard, the upper surface of mainboard is provided with the camera cassette, the upper surface of mainboard is provided with the chip, the upper surface of mainboard is provided with memory card cassette; the memory card seat is provided with a waterproof device which prevents water from entering the memory card seat to damage a reading function; the mainboard is provided with a mainboard heat dissipation device, and the heat dissipation device conducts and dissipates heat of the heat generated by the mainboard. This linear array camera system mainboard, through setting up watertight fittings, rotate by servo motor and drive the lead screw and rotate, rotate by the lead screw again and drive the slider and advance and retreat, the advancing and retreat of driving the waterproof board by the slider again, through pegging graft of waterproof board and water blocking groove, realize that RAM card draw-in groove and external sealed isolated waterproof, effectively solved because the exposure of RAM card draw-in groove, the problem of the mainboard or the draw-in groove damage of intaking that causes.
Description
Technical Field
The utility model relates to a camera system mainboard technical field especially relates to a linear array camera system mainboard.
Background
Along with the continuous improvement of people's living standard, the camera has become the indispensable electronic product that people's life amusement was exchanged, camera mainboard in the camera has integrated the various chips of camera function control, can carry out wholeness operation management to the camera, the performance of camera is also constantly promoting in the continuous development of electronic technology, the working property of camera mainboard is bigger and bigger, the integration procedure is higher, can realize various work amusement audio-visual functions, along with the continuous development of camera, its function also constantly increases, especially the realization of video function, brought huge change for the camera, people's life has been enriched.
When the existing camera main board is used, two problems mainly face, one is a heating problem and the other is a waterproof problem. The main heating source of the camera comes from the chip, and when the camera is used for a long time or runs software with a large memory, the camera chip easily emits a large amount of heat and can not rapidly lead the heat out, so that the service life of an electronic element on a camera mainboard can be influenced. In addition, the service life of the commonly used flat camera mainboard is short, the working performance is gradually reduced along with the increase of time, and the service life of the mainboard is seriously reduced because the memory card clamping groove is exposed and the waterproof capability is poor.
SUMMERY OF THE UTILITY MODEL
Poor and the poor technical problem who seriously influences mainboard life of waterproof ability of heat dissipation based on current linear array camera mainboard, the utility model provides a linear array camera system mainboard.
The utility model provides a linear array camera system mainboard, including the mainboard, the upper surface of mainboard is provided with the camera cassette, the upper surface of mainboard is provided with the chip, the upper surface of mainboard is provided with memory card cassette;
the memory card seat is provided with a waterproof device which prevents water from entering the memory card seat to damage a reading function;
the mainboard is provided with a mainboard heat dissipation device which conducts and dissipates heat generated by the mainboard;
the upper surface of chip is provided with chip heat abstractor, chip heat abstractor will the heat of chip is conducted the cell-phone shell fast, realizes dispelling the heat fast.
Preferably, the upper surface of the camera card holder is clamped with the bottom of the line camera, a memory card slot is arranged inside the memory card holder, and a memory card is clamped in the memory card slot.
Through above-mentioned technical scheme, RAM card cassette parcel lives the RAM card draw-in groove, realizes mainboard and external isolated waterproof.
Preferably, watertight fittings includes servo motor, servo motor fixed mounting be in the upper surface of mainboard, the fixed cover in surface of servo motor's output shaft has connect the lead screw, the fixed surface of mainboard installs the guide rail, the lead screw runs through the guide rail, the surface threaded connection of lead screw has the slider, the slider upper surface passes through the side surface fixed connection of connecting block and waterproof board.
Through above-mentioned technical scheme, rotate by servo motor and drive the lead screw and rotate, rotate by the lead screw again and drive the slider and advance and retreat, drive advancing and retreating of waterproof board by the slider again, realize that RAM card draw-in groove and external isolated waterproof.
Preferably, a water blocking groove is fixedly installed on the upper surface of the main board, and the water blocking groove is inserted with the waterproof board in a sliding mode.
Through above-mentioned technical scheme, after the waterproof board slides and pegs graft and hinders the basin, realize the better sealed effect of waterproof board, reinforcing water-proof effects.
Preferably, the surface of the main board is coated with a nano waterproof coating.
Through the technical scheme, the mainboard is coated with the nano waterproof coating, so that a transparent colorless molecular water-resistant film chain is formed between the mainboard and water, water cannot contact the mainboard, and the water resistance of the mainboard is realized.
Preferably, the mainboard heat dissipation device comprises aluminum heat dissipation fins, the aluminum heat dissipation fins are arranged on the periphery of the mainboard, and the upper surface of the nanometer waterproof coating is covered with the graphene heat dissipation paste.
Through above-mentioned technical scheme, aluminium fin and graphite alkene heat dissipation paste conduct the heat dissipation to the mainboard.
Preferably, the chip heat dissipation device comprises a heat conduction silicone grease layer, the heat conduction silicone grease layer is coated on the upper surface of the chip, the upper surface of the heat conduction silicone grease layer is connected with a heat dissipation copper plate, and heat dissipation copper pipes are arranged around the heat dissipation copper plate.
Through above-mentioned technical scheme, the heat that the chip produced is conducted for the heat dissipation copper by heat conduction silicone grease, and the heat dissipation copper is again with the heat through heat dissipation copper pipe conduction for the cell-phone shell dispel the heat.
The utility model provides a beneficial effect does:
1. through setting up watertight fittings, rotate by servo motor and drive the lead screw and rotate, rotate by the lead screw again and drive the slider and advance and retreat, drive advancing and retreating of waterproof board by the slider again, through pegging graft of waterproof board and water-blocking groove, realize that RAM card draw-in groove and external sealed isolated waterproof, effective, effectively solved because the exposure of RAM card draw-in groove, the problem of the mainboard or the draw-in groove damage of intaking that causes.
2. Through setting up chip heat abstractor, the heat that the chip produced is conducted for the heat dissipation copper by heat conduction silicone grease, and the heat dissipation copper is conducted the heat for the cell-phone shell through the heat dissipation copper pipe again, realizes the heat conveying conduction heat dissipation that produces the chip, thereby has effectively solved because the chip produces the problem of too much heat harm mainboard.
3. Through setting up nanometer waterproof coating, coated one deck nanometer waterproof coating on the mainboard, made to form between mainboard and the water and belong to transparent colourless molecule water-resistant film chain, made the unable contact mainboard of water, realized the water-proof effects of mainboard, effectively avoided the problem that the mainboard damaged of intaking.
Drawings
Fig. 1 is a schematic diagram of a main board of a line-scan camera system according to the present invention;
fig. 2 is a cross-sectional view of a motherboard structure of a motherboard of a line-scan camera system according to the present invention;
fig. 3 is an enlarged view of a position a in fig. 1 of the main board of the line-scan camera system provided by the present invention.
In the figure: 1. a main board; 11. a camera card holder; 12. a chip; 13. a memory card socket; 2. a line camera; 21. a memory card slot; 22. a memory card; 3. a servo motor; 31. a screw rod; 32. a guide rail; 33. a slider; 34. connecting blocks; 35. a waterproof sheet; 4. a water blocking tank; 5. a nano waterproof coating; 6. an aluminum heat sink; 61. a graphene heat dissipation patch; 7. a thermally conductive silicone layer; 71. a heat-dissipating copper plate; 72. a heat dissipation copper pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-3, a main board of a line-scan camera system includes a main board 1, a camera card holder 11 is disposed on an upper surface of the main board 1, a chip 12 is disposed on the upper surface of the main board 1, and a memory card holder 13 is disposed on the upper surface of the main board 1;
the memory card holder 13 is provided with a waterproof device which prevents water from entering the memory card holder 13 to damage the reading function;
further, watertight fittings includes servo motor 3, and servo motor 3 fixed mounting has cup jointed lead screw 31 at the upper surface of mainboard 1, and the fixed surface of the output shaft of servo motor 3 has installed guide rail 32, and lead screw 31 runs through guide rail 32, and the surperficial threaded connection of lead screw 31 has slider 33, and the slider 33 upper surface passes through the side surface fixed connection of connecting block 34 with waterproof board 35.
The servo motor rotates to drive the screw rod to rotate, the screw rod rotates to drive the sliding block to move forward and retreat, and the sliding block drives the waterproof board to move forward and retreat, so that the memory card clamping groove is isolated and waterproof from the outside.
Furthermore, a water blocking groove 4 is fixedly arranged on the upper surface of the main board 1, and a waterproof board 35 is inserted in the water blocking groove 4 in a sliding mode.
After the waterproof board is slidably inserted into the water blocking groove, the waterproof board can achieve a better sealing effect, and the waterproof effect is enhanced.
Further, the surface of the main board 1 is coated with a nano waterproof coating 5.
Through setting up nanometer waterproof coating, coated one deck nanometer waterproof coating on the mainboard, made to form between mainboard and the water and belong to transparent colourless molecule water-resistant film chain, made the unable contact mainboard of water, realized the water-proof effects of mainboard, effectively avoided the problem that the mainboard damaged of intaking.
The mainboard is coated with the waterproof coating of nanometer, makes to form a transparent colourless molecule water-resistant film chain between mainboard and the water, makes water unable contact mainboard, realizes the waterproof of mainboard.
Through setting up watertight fittings, rotate by servo motor and drive the lead screw and rotate, rotate by the lead screw again and drive the slider and advance and retreat, drive advancing and retreating of waterproof board by the slider again, through pegging graft of waterproof board and water-blocking groove, realize that RAM card draw-in groove and external sealed isolated waterproof, effective, effectively solved because the exposure of RAM card draw-in groove, the problem of the mainboard or the draw-in groove damage of intaking that causes.
The mainboard 1 is provided with a mainboard heat dissipation device which conducts and dissipates heat generated by the mainboard 1;
further, mainboard heat abstractor includes aluminium fin 6, and aluminium fin 6 sets up around mainboard 1, and the upper surface of nanometer waterproof coating 5 covers has graphite alkene heat dissipation subsides 61.
The aluminum radiating fins and the graphene radiating paste conduct and radiate heat of the mainboard.
The upper surface of chip 12 is provided with chip heat abstractor, and chip heat abstractor conducts the cell-phone shell with the heat of chip 12 fast, realizes dispelling the heat fast.
Further, the chip heat dissipation device comprises a heat conduction silicone grease layer 7, the heat conduction silicone grease layer 7 is coated on the upper surface of the chip 12, the upper surface of the heat conduction silicone grease layer 7 is connected with a heat dissipation copper plate 71, and heat dissipation copper pipes 72 are arranged around the heat dissipation copper plate 71.
The heat that the chip produced is conducted for the heat dissipation copper by heat conduction silicone grease, and the heat dissipation copper is again with the heat through heat dissipation copper pipe conduction for the cell-phone shell dispel the heat.
Through setting up chip heat abstractor, the heat that the chip produced is conducted for the heat dissipation copper by heat conduction silicone grease, and the heat dissipation copper is conducted the heat for the cell-phone shell through the heat dissipation copper pipe again, realizes the heat conveying conduction heat dissipation that produces the chip, thereby has effectively solved because the chip produces the problem of too much heat harm mainboard.
Further, the upper surface of the camera card holder 11 is clamped to the bottom of the line camera 2, a memory card slot 21 is arranged inside the memory card holder 13, and a memory card 22 is clamped to the memory card slot 21.
The memory card clamping groove is wrapped by the memory card clamping seat, and isolation and water prevention of the mainboard and the outside are achieved.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (7)
1. A linear array camera system motherboard, includes mainboard (1), its characterized in that: a camera card seat (11) is arranged on the upper surface of the main board (1), a chip (12) is arranged on the upper surface of the main board (1), and a memory card seat (13) is arranged on the upper surface of the main board (1);
the memory card holder (13) is provided with a waterproof device which prevents water from entering the memory card holder (13) to damage a reading function;
the mainboard (1) is provided with a mainboard heat dissipation device, and the heat dissipation device conducts and dissipates heat generated by the mainboard (1);
the upper surface of chip (12) is provided with chip heat abstractor, chip heat abstractor will the heat of chip (12) is conducted the cell-phone shell fast, realizes dispelling the heat fast.
2. The main board of a line-array camera system as claimed in claim 1, wherein: the upper surface of the camera card holder (11) is clamped with the bottom of the linear array camera (2), a memory card clamping groove (21) is formed in the memory card holder (13), and a memory card (22) is clamped in the memory card clamping groove (21).
3. The main board of a line-array camera system as claimed in claim 1, wherein: the waterproof device comprises a servo motor (3), wherein the servo motor (3) is fixedly installed on the upper surface of the main board (1), a screw rod (31) is sleeved on the surface of an output shaft of the servo motor (3), a guide rail (32) is installed on the surface of the main board (1), the screw rod (31) penetrates through the guide rail (32), a sliding block (33) is connected to the surface of the screw rod (31) in a threaded manner, and the upper surface of the sliding block (33) is fixedly connected with the side surface of the waterproof board (35) through a connecting block (34).
4. A main board of a line-array camera system as claimed in claim 3, wherein: the upper surface fixed mounting of mainboard (1) has water-blocking groove (4), water-blocking groove (4) slide and peg graft and have waterproof board (35).
5. The main board of a line-array camera system as claimed in claim 1, wherein: the surface of the main board (1) is coated with a nano waterproof coating (5).
6. The main board of a line-array camera system as claimed in claim 5, wherein: the mainboard heat dissipation device comprises aluminum heat dissipation fins (6), wherein the aluminum heat dissipation fins (6) are arranged on the periphery of the mainboard (1), and the upper surface of the nanometer waterproof coating (5) is covered with a graphene heat dissipation paste (61).
7. The main board of a line-array camera system as claimed in claim 1, wherein: the chip heat dissipation device comprises a heat conduction silicone grease layer (7), wherein the heat conduction silicone grease layer (7) is coated on the upper surface of the chip (12), the upper surface of the heat conduction silicone grease layer (7) is connected with a heat dissipation copper plate (71), and heat dissipation copper pipes (72) are arranged on the periphery of the heat dissipation copper plate (71).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023046759.3U CN214281727U (en) | 2020-12-17 | 2020-12-17 | Linear array camera system mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023046759.3U CN214281727U (en) | 2020-12-17 | 2020-12-17 | Linear array camera system mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214281727U true CN214281727U (en) | 2021-09-24 |
Family
ID=77799045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023046759.3U Active CN214281727U (en) | 2020-12-17 | 2020-12-17 | Linear array camera system mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214281727U (en) |
-
2020
- 2020-12-17 CN CN202023046759.3U patent/CN214281727U/en active Active
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