CN214277640U - Volatile organic compound gas enrichment device - Google Patents

Volatile organic compound gas enrichment device Download PDF

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Publication number
CN214277640U
CN214277640U CN202023100255.5U CN202023100255U CN214277640U CN 214277640 U CN214277640 U CN 214277640U CN 202023100255 U CN202023100255 U CN 202023100255U CN 214277640 U CN214277640 U CN 214277640U
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thermal
insulated
heat
heating
gas enrichment
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CN202023100255.5U
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黄源远
戴敏
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Youtai (Hunan) Environmental Protection Technology Co.,Ltd.
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Nutech Shenzhen Co ltd
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Abstract

The utility model discloses a gaseous enrichment device of volatile organic compound, including enrichment pipe, cooling body, thermal-insulated mechanism, heating mechanism and be used for controlling the pump body of coolant business turn over thermal-insulated mechanism, thermal-insulated mechanism sets up between cooling body and heating mechanism, set up the import and the export of cavity and with the cavity intercommunication in the thermal-insulated mechanism, the pump body and thermal-insulated mechanism intercommunication. The utility model has the advantages of simple structure, fail safe nature are high, the fault rate is low, can effectively improve the gas concentration that is surveyed, improve the precision of testing result etc.

Description

Volatile organic compound gas enrichment device
Technical Field
The utility model relates to a gaseous detection technology field of volatile organic compound refers in particular to a gaseous enrichment device of volatile organic compound.
Background
In the VOC gas detection process, when the concentration of a detected sample is very low, the detected sample cannot be directly sent into a gas chromatograph with limited sensitivity for analysis, but the detected sample needs to be firstly introduced into an enrichment pipe of the gas chromatograph, then the enrichment pipe is used for carrying out enrichment treatment on the detected sample, and after the enrichment pipe is enriched to a certain concentration, the enrichment pipe is rapidly heated to enable the detected sample in the enrichment pipe to be rapidly desorbed and enter a chromatographic column of the gas chromatograph for separation. In the actual use process of the detection instrument, the enrichment pipe needs a process of circularly cooling enrichment and heating desorption. In the prior art, for the temperature reduction treatment of the enrichment pipe, the prior art often adopts a semiconductor refrigerator, a compressor and other refrigeration modes. But tend to suffer from the following disadvantages: by adopting a semiconductor refrigerator or other small-sized refrigeration equipment, the enrichment pipe is very easy to damage the refrigeration equipment when the heating temperature is too high, and part of sample gas is insufficiently desorbed when the temperature is too low, so that the detection result deviation is caused.
SUMMERY OF THE UTILITY MODEL
To the technical problem that prior art exists, the utility model provides a simple structure, fail safe nature height, fault rate are low, can effectively improve the volatile organic compound gas enrichment device of being surveyed gas concentration, improving the precision of testing result.
In order to solve the technical problem, the utility model discloses a following technical scheme:
the utility model provides a volatile organic compound gas enrichment device, includes enrichment pipe, cooling body, thermal-insulated mechanism, heating mechanism and is used for controlling the pump body of coolant business turn over thermal-insulated mechanism, thermal-insulated mechanism sets up between cooling body and heating mechanism, set up the cavity in the thermal-insulated mechanism and with the import and the export of cavity intercommunication, the pump body communicates with thermal-insulated mechanism.
As a further improvement of the utility model: the inlet and the outlet are designed integrally.
As a further improvement of the utility model: the inlet and the outlet are designed independently.
As a further improvement of the utility model: the heating mechanism comprises a heating rod, a heat conducting piece and a pressing block, the heating rod is arranged in the heat conducting piece, and the enrichment pipe is connected with the heat conducting piece through the pressing block.
As a further improvement of the utility model: the heat conducting piece is a metal piece.
As a further improvement of the utility model: and a temperature sensor is also arranged in the heating mechanism.
As a further improvement of the utility model: the heat insulation mechanism is of an annular structure, and the cooling mechanism is sleeved with the heat insulation mechanism.
As a further improvement of the utility model: the enrichment pipe, the heat insulation mechanism and the heating mechanism are arranged in the heat preservation box.
Compared with the prior art, the utility model has the advantages of:
the utility model discloses a volatile organic compound gas enrichment device, thermal-insulated mechanism sets up between cooling body and heating mechanism, be equipped with the cavity in the thermal-insulated mechanism and with the import and the export of cavity intercommunication, coolant can pass through pump body business turn over thermal-insulated mechanism, in the appearance gas enrichment stage, coolant pours into in the cavity of thermal-insulated mechanism into, cooling body work refrigeration, under low temperature environment, coolant solidifies, heat transfer mode mainly goes on with heat-conducting mode between enrichment pipe and the cooling mechanism, heat transfer efficiency has greatly been improved, the temperature of reduction enrichment pipe that can be quick, can fall enrichment pipe temperature to cooling body's cooling limit in short time. In the gas desorption stage, the cooling medium liquefaction is taken out the vacuole formation when rising the temperature, and heat transfer is gone on with the mode of thermal convection and heat radiation, and heat transfer efficiency is by greatly reduced, reduces heat transfer to cooling body to can reduce the influence of heating mechanism to cooling body, avoid cooling body to damage because of the high temperature.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a blasting diagram of the present invention.
Fig. 3 is a cross-sectional view of the present invention.
Illustration of the drawings:
1. an enrichment pipe; 2. a cooling mechanism; 3. a heat insulation mechanism; 4. a heating mechanism; 41. a heating rod; 42. a heat conductive member; 43. briquetting; 5. a pump body; 6. a temperature sensor; 7. a heat preservation box.
Detailed Description
The invention will be described in further detail with reference to the drawings and specific examples.
As shown in fig. 1 to 3, the present embodiment discloses a volatile organic compound gas enrichment device, including an enrichment tube 1, a cooling mechanism 2, a heat insulation mechanism 3, a heating mechanism 4, and a pump body 5 for controlling a cooling medium to enter and exit the heat insulation mechanism 3, wherein the heat insulation mechanism 3 is disposed between the cooling mechanism 2 and the heating mechanism 4, a cavity, an inlet and an outlet communicated with the cavity are disposed in the heat insulation mechanism 3, and the pump body 5 is communicated with the heat insulation mechanism 3.
The gaseous enrichment device of volatile organic compound of this embodiment, thermal-insulated mechanism 3 sets up between cooling body 2 and heating mechanism 4, be equipped with the cavity in the thermal-insulated mechanism 3 and with the import and the export of cavity intercommunication, coolant can pass through pump body 5 business turn over thermal-insulated mechanism 3, in the sample gas enrichment stage, coolant pours into in the cavity of thermal-insulated mechanism 3, cooling body 2 work refrigeration, under low temperature environment, coolant solidifies, heat transfer mode mainly goes on with heat-conduction's mode between enrichment pipe 1 and the cooling body 2, heat transfer efficiency has greatly been improved, can reduce the temperature of enrichment pipe 1 fast, can fall enrichment pipe 1 temperature to cooling body 2's cooling limit in short time. At gaseous desorption stage, the cooling medium liquefaction is taken out the vacuole formation during the intensification, and heat transfer is gone on with the mode of thermal convection and heat radiation, and heat transfer efficiency is by greatly reduced, reduces heat transfer to cooling body 2 to can reduce the influence of heating mechanism 4 to cooling body 2, avoid cooling body 2 to damage because of the high temperature.
In this embodiment, the inlet and the outlet are designed integrally, that is, the inlet and the outlet are the same inlet and outlet, the inlet and outlet are disposed at the bottom of the heat insulation mechanism 3, and the cooling medium enters and exits the heat insulation mechanism 3 through the pump body 5. Only one pump body 5 is needed to realize the injection and extraction of the cooling medium by arranging one inlet and outlet, thereby reducing the cost of the device. In other embodiments, the inlet and the outlet are designed independently, that is, the inlet and the outlet are separately provided at the bottom of the heat insulation mechanism 3, or the inlet is provided at the bottom of the heat insulation mechanism 3 and the outlet is provided at the top of the heat insulation mechanism 3.
In this embodiment, the heating mechanism 4 includes a heating rod 41, a heat conducting member 42, and a pressing block 43, the heating rod 41 is disposed in the heat conducting member 42, and the enrichment tube 1 is connected to the heat conducting member 42 through the pressing block 43. The heat conducting member 42 is made of metal with good heat conducting property, and after the heating rod 41 is started, the temperature of the enrichment pipe 1 can be rapidly increased to 230-300 ℃ through the heat conducting member 42 with good heat conducting property, so that the measured gas can be rapidly and completely desorbed. In the gas desorption stage, the cooling medium is liquefied when the temperature rises and is pumped out from the heat insulation mechanism 3 by the pump body 5, the heat insulation mechanism 3 is made of a non-metal material with a poor heat conductivity coefficient, heat loss can be reduced, heat transfer to the cooling mechanism 2 can be reduced, and damage to the cooling mechanism 2 is avoided.
In this embodiment, a temperature sensor 6 is further provided in the heating mechanism 4. The temperature of the enrichment pipe 1 can be accurately measured through the temperature sensor 6, and accurate control is realized.
In this embodiment, the heat insulation mechanism 3 is an annular structure, and the heat insulation mechanism 3 is sleeved on the cooling mechanism 2.
In the embodiment, the device further comprises a heat preservation box 7, and the enrichment pipe 1, the heat insulation mechanism 3 and the heating mechanism 4 are arranged in the heat preservation box 7. The heat preservation box 7 is made of a material with relatively poor heat conducting property, so that the interference of the external environment temperature can be reduced, the efficiency of heat transfer of internal heating and cooling is improved, the heating and cooling time is greatly reduced, and the heating and cooling temperature range is widened in the same time.
When the heat-insulating device is applied specifically, a cooling medium (such as water) is injected into a cavity of the heat-insulating mechanism 3, the cooling mechanism 2 is started, the temperature is reduced, the cooling medium is solidified, the heat-insulating mechanism 3 transmits the cold temperature to the heat-conducting piece 42, and the enrichment pipe 1 quickly reaches a preset low temperature (such as the temperature is reduced to minus 60 ℃ to minus 80 ℃); introducing sample gas, carrying out gas enrichment treatment on the enrichment pipe 1, and closing the cooling mechanism 2 after the enrichment treatment is finished; the heating rod 41 is started, heat is transferred to the enrichment pipe 1 through the heat conducting piece 42, the temperature of the enrichment pipe 1 is rapidly increased to 230-300 ℃, gas is desorbed, cooling medium is liquefied and pumped out of the heat insulation mechanism 3 by the pump body 5 during temperature increase, heat transfer to the cooling mechanism 2 is reduced, the cooling mechanism 2 can be kept for a long time at a lower temperature, desorbed gas can be lower than 50 ℃, and the desorbed enriched gas enters the detection unit for component analysis.
Above only the utility model discloses an it is preferred embodiment, the utility model discloses a scope of protection not only limits in above-mentioned embodiment, and the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, a plurality of modifications and decorations without departing from the principle of the present invention should be considered as the protection scope of the present invention.

Claims (8)

1. The utility model provides a volatile organic compound gas enrichment device, includes enrichment pipe (1), its characterized in that, including cooling body (2), thermal-insulated mechanism (3), heating mechanism (4) and be used for controlling pump body (5) of coolant business turn over thermal-insulated mechanism (3), thermal-insulated mechanism (3) set up between cooling body (2) and heating mechanism (4), set up the cavity and with the import and the export of cavity intercommunication in thermal-insulated mechanism (3), pump body (5) and thermal-insulated mechanism (3) intercommunication.
2. The voc gas enrichment device of claim 1, wherein the inlet and outlet are of a unitary design.
3. The voc gas enrichment device of claim 1, wherein the inlet and outlet are independently designed.
4. The voc gas enrichment apparatus according to claim 1, wherein the heating mechanism (4) comprises a heating rod (41), a heat conductive member (42), and a pressure block (43), the heating rod (41) is disposed inside the heat conductive member (42), and the enrichment tube (1) is connected with the heat conductive member (42) through the pressure block (43).
5. The voc gas enrichment device of claim 4, wherein the thermally conductive member (42) is a metal member.
6. The voc gas enrichment device according to claim 4, wherein a temperature sensor (6) is further disposed inside the heating mechanism (4).
7. The voc gas enrichment device according to claim 1, wherein the heat insulation mechanism (3) is an annular structure, and the heat insulation mechanism (3) is sleeved on the cooling mechanism (2).
8. The VOC gas enrichment device according to any one of claims 1 to 7, further comprising a heat preservation box (7), wherein the enrichment tube (1), the heat insulation mechanism (3) and the heating mechanism (4) are arranged in the heat preservation box (7).
CN202023100255.5U 2020-12-21 2020-12-21 Volatile organic compound gas enrichment device Active CN214277640U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202023100255.5U CN214277640U (en) 2020-12-21 2020-12-21 Volatile organic compound gas enrichment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202023100255.5U CN214277640U (en) 2020-12-21 2020-12-21 Volatile organic compound gas enrichment device

Publications (1)

Publication Number Publication Date
CN214277640U true CN214277640U (en) 2021-09-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202023100255.5U Active CN214277640U (en) 2020-12-21 2020-12-21 Volatile organic compound gas enrichment device

Country Status (1)

Country Link
CN (1) CN214277640U (en)

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Address after: 410221 floor 101-5, production building, No. 558, tongzipo West Road, Changsha high tech Development Zone, Changsha City, Hunan Province

Patentee after: Youtai (Hunan) Environmental Protection Technology Co.,Ltd.

Address before: 518067 d3-2b, TCL Science Park, No. 1001, Zhongshan Park Road, Xili street, Nanshan District, Shenzhen, Guangdong

Patentee before: NUTECH SHENZHEN Co.,Ltd.