CN214276211U

CN214276211U - Intelligent semiconductor refrigerating device for physics major

Info

Publication number: CN214276211U
Application number: CN202120339690.9U
Authority: CN
Inventors: 符小根
Original assignee: Jiangxi College of Engineering
Current assignee: Jiangxi College of Engineering
Priority date: 2021-02-03
Filing date: 2021-02-03
Publication date: 2021-09-24
Anticipated expiration: 2031-02-03

Abstract

The utility model discloses a physics specialty is with intelligent semiconductor refrigerating plant relates to the semiconductor refrigeration field. This intelligent semiconductor refrigerating plant is used in physics specialty, including the experimental box, the last fixed surface of experimental box inlays and has the supporting shoe, the standing groove has been seted up to the upper surface of supporting shoe, the inside joint of standing groove has the semiconductor refrigeration piece, the upper surface of semiconductor refrigeration piece is the refrigeration face, the bottom surface of semiconductor refrigeration piece is for heating the face, this intelligent semiconductor refrigerating plant is used in physics specialty, utilizes the coolant liquid of flowing through, realizes the cooling to the experimental box is inside, through the absorber plate and the heating panel that set up, can absorb the heat that the semiconductor refrigeration piece produced to through the cooperation with the hair-dryer, blow in the inside of experimental box with the absorbed heat, to heating of experimental box, and then realized the adjustment to the experimental box temperature, effectively keep the constant temperature of experimental box, the staff's of being convenient for experimental work.

Description

Intelligent semiconductor refrigerating device for physics major

Technical Field

The utility model relates to a semiconductor refrigeration technology field specifically is a physics specialty is with intelligent semiconductor refrigerating plant.

Background

The semiconductor refrigerating sheet, also called thermoelectric refrigerating sheet, is a heat pump, and its advantages are no sliding parts, limited application in some spaces, in the occasion of high reliability requirement and no refrigerant pollution, the Peltier effect of the semiconductor material is utilized, when direct current passes through a couple formed by connecting two different semiconductor materials in series, the two ends of the couple can respectively absorb heat and emit heat, the aim of refrigeration can be fulfilled, in the special experiment process of physics specialty, often need have accurate requirement to the inside temperature environment of experimental box, the experiment temperature of control experimental box that current experimental box can not be accurate makes the inside temperature environment of experimental box often appear changing and undulant, leads to the inaccuracy of experimental result easily, influences staff's experiment precision, for this reason we provide a physics specialty with intelligent semiconductor refrigerating plant solve above problem.

SUMMERY OF THE UTILITY MODEL

The utility model provides a not enough to prior art, the utility model provides a physics specialty is with intelligent semiconductor refrigerating plant has solved the special test in-process in the physics specialty, often needs to have accurate requirement to the temperature environment of experimental box inside, and the experimental temperature of control experimental box that current experimental box can not be accurate makes the temperature environment of experimental box inside change and undulant often appear, leads to the inaccuracy of experimental result easily, influences the problem that the staff experiment precision.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a physics specialty is with intelligent semiconductor refrigerating plant, includes the experimental box, the last fixed surface of experimental box inlays and has the supporting shoe, the standing groove has been seted up to the upper surface of supporting shoe, the inside joint of standing groove has the semiconductor refrigeration piece, the upper surface of semiconductor refrigeration piece is the refrigeration face, the bottom surface of semiconductor refrigeration piece is the face of heating, the opening has been seted up to the inner diapire of standing groove, the bottom surface fixedly connected with absorber plate of semiconductor refrigeration piece, the heating panel that the bottom surface fixedly connected with equidistance of absorber plate was arranged, every the louvre that the equidistance was arranged is all seted up to the right flank of heating panel, the inside wall fixed mosaic of opening has two hair-dryers.

The upper surface of the experimental box is fixedly connected with a water tank, the inner top wall of the water tank is fixedly connected with a water pump, the input end of the water pump is fixedly communicated with a water suction pipe, the inner wall of the experimental box is fixedly connected with a first coiled pipe and a second coiled pipe, one ends of the first coiled pipe and the second coiled pipe, which are close to each other, are jointly and fixedly communicated with a communicating pipe, the input end of the first coiled pipe sequentially penetrates through the experimental box and the water tank and is fixedly communicated with the output end of the water pump, the upper surface of the semiconductor refrigeration sheet is fixedly connected with a circular heat exchange pipe, the output end of the circular heat exchange pipe is fixedly communicated with a drain pipe, the bottom end of the drain pipe is fixedly communicated with the upper surface of the water tank, the output end of the second coiled pipe penetrates through the experimental box and is fixedly communicated with the input end of the circular heat exchange pipe, the front surface of the experimental box is fixedly connected with a single chip microcomputer and a temperature monitoring sensor, the front of the experiment box is fixedly hinged with a sealing door through a hinge, and the front of the experiment box is fixedly connected with a power switch.

Preferably, a nameplate is arranged in front of the experiment box, and the back surface of the nameplate is fixedly connected with the front surface of the experiment box.

Preferably, the front of the water tank is fixedly embedded with an observation frame, and the front of the observation frame is fixedly connected with a scale sticker.

Preferably, the outer fixed surface of water pump is connected with two fixed blocks, every the upper surface of fixed block all with the interior roof fixed connection of water tank.

Preferably, two groups of air deflectors are arranged inside the through opening, and the upper surface of each air deflector is fixedly connected with the bottom surface of the heat absorbing plate.

Preferably, two groups of supporting legs are arranged below the experiment box, and the top end of each supporting leg is fixedly connected with the bottom surface of the experiment box.

Has the advantages that:

(1) the intelligent semiconductor refrigeration device for the physics major can utilize the work of the semiconductor refrigeration piece to release heat and refrigerate, can conveniently absorb cold air on the semiconductor refrigeration piece through the arranged circular heat exchange tube to achieve the aim of reducing the temperature of the cooling liquid, can utilize the water pump to work to extract the cooling liquid in the water tank through the arranged water pump, then flows through the first serpentine tube and the second serpentine tube, utilizes the flowing cooling liquid to realize the cooling of the interior of the experimental box, can absorb the heat generated by the semiconductor refrigeration piece through the arranged heat absorption plate and the arranged heat dissipation plate, and blows the absorbed heat into the interior of the experimental box through the matching with a blower, heats the experimental box, further realizes the adjustment of the temperature of the experimental box, and effectively keeps the constant temperature of the experimental box, the experiment work of staff is convenient for.

(2) This physics specialty is with intelligent semiconductor refrigerating plant, through the temperature monitoring sensor who sets up, can monitor often to the inside temperature of experimental box, make the more clear understanding of staff inside the temperature of experimental box, the staff of being convenient for experiments, through singlechip and the temperature monitoring sensor who sets up, can effectually monitor the inside temperature of experimental box, and realize the self-control to inside cooling device of experimental box and firing equipment, effectively independently kept the inside constancy of temperature of experimental box, the staff's of being convenient for experiment has increased the rate of accuracy of experiment.

Drawings

Fig. 1 is a sectional view of the front view of the experimental box of the present invention;

fig. 2 is a front view of the experimental box of the present invention;

FIG. 3 is a top view of the circular heat exchange tube of the present invention;

fig. 4 is an enlarged schematic view of a structure shown in fig. 1 according to the present invention.

In the figure: 1. an experimental box; 2. a suction pipe; 3. a fixed block; 4. a water pump; 5. a water tank; 6. a drain pipe; 7. a heat absorbing plate; 8. a blower; 9. a circular heat exchange tube; 10. a port; 11. a semiconductor refrigeration sheet; 12. a communicating pipe; 13. a second serpentine tube; 14. supporting legs; 15. a first serpentine tube; 16. a support block; 17. a placement groove; 18. a power switch; 19. a nameplate; 20. a single chip microcomputer; 21. an observation frame; 22. a sealing door; 23. an air deflector; 24. a heat dissipation plate; 25. heat dissipation holes; 26. and a temperature monitoring sensor.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1-4, the utility model provides a technical solution: an intelligent semiconductor refrigerating device for physics major comprises an experimental box 1, a nameplate 19 is arranged in front of the experimental box 1, the back of the nameplate 19 is fixedly connected with the front of the experimental box 1, the operation flow of the experimental box 1 can be explained, and the control and experiment of workers on the experimental box 1 are convenient, a supporting block 16 is fixedly embedded on the upper surface of the experimental box 1, a placing groove 17 is arranged on the upper surface of the supporting block 16, a semiconductor refrigerating sheet 11 is clamped inside the placing groove 17, an opening 10 is arranged on the inner bottom wall of the placing groove 17, a heat absorbing plate 7 is fixedly connected with the bottom surface of the semiconductor refrigerating sheet 11, heat radiating plates 24 which are arranged at equal intervals are fixedly connected with the bottom surface of the heat absorbing plate 7, radiating holes 25 which are arranged at equal intervals are arranged on the right side surface of each heat radiating plate 24, two groups of air guide plates 23 are arranged inside the openings 10 which are fixedly embedded in the inner side wall of the opening 10, the upper surface of each air deflector 23 is fixedly connected with the bottom surface of the heat absorbing plate 7, and can guide the air flow blown by the blower 8, so that heat can more conveniently enter the inside of the experiment box 1, and the experiment box 1 is convenient to heat.

The semiconductor refrigerating pieces 11 are arranged in a double-group mode, the upper surfaces of the semiconductor refrigerating pieces 11 are refrigerating surfaces, and the bottom surfaces of the semiconductor refrigerating pieces 11 are heating surfaces (the principle is that the positive and negative electrodes are connected with power supplies in an exchange mode, the positive electrodes are connected with refrigeration, and the negative electrodes are connected with heating in an inverted mode).

The upper surface of the experiment box 1 is fixedly connected with a water tank 5, the front surface of the water tank 5 is fixedly embedded with an observation frame 21, the front surface of the observation frame 21 is fixedly connected with a scale sticker, the content of cooling liquid in the water tank 5 can be conveniently observed, the influence on the cooling effect of the experiment box 1 caused by too little cooling liquid content is avoided, the inner top wall of the water tank 5 is fixedly connected with a water pump 4, the outer surface of the water pump 4 is fixedly connected with two fixed blocks 3, the upper surface of each fixed block 3 is fixedly connected with the inner top wall of the water tank 5, the water pump 4 can be clamped and fixed, the stability of the water pump 4 is improved, the input end of the water pump 4 is fixedly communicated with a water suction pipe 2, the inner wall of the experiment box 1 is fixedly connected with a first coiled pipe 15 and a second coiled pipe 13, one ends, close to each other, of the first coiled pipe 15 and the second coiled pipe 13 are fixedly communicated with a communicating pipe 12, the input end of the first coiled pipe 15 sequentially penetrates through the experiment box 1 and the water tank 5 and is fixedly communicated with the output end of the water pump 4, semiconductor refrigeration piece 11's last fixed surface is connected with circular heat exchange tube 9, the fixed intercommunication of output of circular heat exchange tube 9 has drain pipe 6, the bottom of drain pipe 6 and the last fixed surface intercommunication of water tank 5, the output of second coiled pipe 13 run through experimental box 1 and with the fixed intercommunication of input of circular heat exchange tube 9, experimental box 1's positive fixedly connected with singlechip 20 and temperature monitoring sensor 26, experimental box 1's front is fixed to articulate through the hinge has sealing door 22, experimental box 1's positive fixedly connected with switch 18, experimental box 1's below is equipped with two sets of supporting legs 14, every supporting leg 14's top all with experimental box 1's bottom surface fixed connection, can support experimental box 1 fixedly, increase experimental box 1's steadiness, the staff's of being convenient for experimental work.

When the test box is used, firstly, a worker clicks the power switch 18 to supply power to the test box 1, so that the semiconductor refrigeration sheet 11 works, meanwhile, the singlechip 20 and the temperature monitoring sensor 26 are set and programmed according to test data, when the temperature monitoring sensor 26 monitors that the temperature of the test box 1 is overhigh, the singlechip 20 transmits an electric signal, so that the singlechip 20 controls the water pump 4, the cooling liquid in the water box 5 is extracted through the matching with the water suction pipe 2 and then is discharged into the first serpentine pipe 15 and the second serpentine pipe 13, the heat in the test box 1 is absorbed by the flowing cooling liquid, meanwhile, the cold air generated by the semiconductor refrigeration sheet 11 is absorbed by the round heat exchange pipe 9, the temperature of the cooling liquid is reduced, the rapid cooling of the test box 1 by the cooling liquid is realized, when the temperature of the test box 1 is lower, the heat generated by the semiconductor refrigeration sheet 11 is absorbed by the heat absorption plate 7 and the heat dissipation plate 24, simultaneously temperature monitoring sensor 26 work is to singlechip 20 transmission signal of telecommunication, makes singlechip 20 control to hair-dryer 8, through the cooperation with louvre 25 and aviation baffle 23, utilizes the inside that hair-dryer 8 blows in experimental box 1 with the heat above the heating panel 24, increases the inside temperature of experimental box 1, and then realizes the regulation to the inside temperature of experimental box 1, effectively keeps the inside stability of experimental box 1, increases staff's experiment accuracy.

Water pump, absorber plate, hair-dryer, semiconductor refrigeration piece, singlechip, temperature monitoring sensor all can purchase through the market and acquire, and specific line connection is prior art.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a physics specialty is with intelligent semiconductor refrigerating plant, includes experimental box (1), its characterized in that: the upper surface of the experiment box (1) is fixedly inlaid with a supporting block (16), the upper surface of the supporting block (16) is provided with a placing groove (17), the inside of the placing groove (17) is clamped with a semiconductor refrigeration sheet (11), the inner bottom wall of the placing groove (17) is provided with a through hole (10), the bottom surface of the semiconductor refrigeration sheet (11) is fixedly connected with a heat absorption plate (7), the bottom surface of the heat absorption plate (7) is fixedly connected with heat dissipation plates (24) which are arranged at equal intervals, the right side surface of each heat dissipation plate (24) is provided with heat dissipation holes (25) which are arranged at equal intervals, and the inner side wall of the through hole (10) is fixedly inlaid with two blowers (8);

the upper surface of the experiment box (1) is fixedly connected with a water tank (5), the inner top wall of the water tank (5) is fixedly connected with a water pump (4), the input end of the water pump (4) is fixedly communicated with a water suction pipe (2), the inner wall of the experiment box (1) is fixedly connected with a first coiled pipe (15) and a second coiled pipe (13), one ends of the first coiled pipe (15) and the second coiled pipe (13) which are close to each other are jointly and fixedly communicated with a communicating pipe (12), the input end of the first coiled pipe (15) sequentially penetrates through the experiment box (1) and the water tank (5) and is fixedly communicated with the output end of the water pump (4), the upper surface of the semiconductor refrigeration sheet (11) is fixedly connected with a circular heat exchange pipe (9), the output end of the circular heat exchange pipe (9) is fixedly communicated with a drain pipe (6), the bottom end of the drain pipe (6) is fixedly communicated with the upper surface of the water tank (5), the output end of the second coiled pipe (13) penetrates through the experiment box (1) and is fixedly communicated with the input end of the circular heat exchange pipe (9), the front face of the experiment box (1) is fixedly connected with the single chip microcomputer (20) and the temperature monitoring sensor (26), the front face of the experiment box (1) is fixedly hinged with the sealing door (22) through a hinge, and the front face of the experiment box (1) is fixedly connected with the power switch (18).

2. An intelligent semiconductor refrigeration device for physical expertise according to claim 1, wherein: a nameplate (19) is arranged in front of the experiment box (1), and the back surface of the nameplate (19) is fixedly connected with the front surface of the experiment box (1).

3. An intelligent semiconductor refrigeration device for physical expertise according to claim 1, wherein: the front of water tank (5) is fixed to be inlayed and is had observation frame (21), the front fixedly connected with scale subsides of observation frame (21).

4. An intelligent semiconductor refrigeration device for physical expertise according to claim 1, wherein: the outer fixed surface of water pump (4) is connected with two fixed blocks (3), every the upper surface of fixed block (3) all with the interior roof fixed connection of water tank (5).

5. An intelligent semiconductor refrigeration device for physical expertise according to claim 1, wherein: two groups of air deflectors (23) are arranged inside the through hole (10), and the upper surface of each air deflector (23) is fixedly connected with the bottom surface of the heat absorbing plate (7).

6. An intelligent semiconductor refrigeration device for physical expertise according to claim 1, wherein: two groups of supporting legs (14) are arranged below the experimental box (1), and the top end of each supporting leg (14) is fixedly connected with the bottom surface of the experimental box (1).