CN214275376U

CN214275376U - Heat-conducting plastic radiator with high flatness of attaching surface and LED lamp

Info

Publication number: CN214275376U
Application number: CN202120659272.8U
Authority: CN
Inventors: 沈博; 金慧星; 巩玉钊; 张振北; 张光辉
Original assignee: Hangzhou Bensong New Materials Technology Co ltd
Current assignee: Hangzhou Bensong New Materials Technology Co ltd
Priority date: 2021-03-31
Filing date: 2021-03-31
Publication date: 2021-09-24
Anticipated expiration: 2031-03-31

Abstract

The utility model discloses a heat-conducting plastic radiator with high flatness of a laminating surface and a LED lamp, which are of an integrated structure and are integrally formed by heat-conducting plastic materials; including being used for with the laminating of LED base plate and conducting the thermal binding face of LED base plate and being used for the heat dissipation main part that spreads the heat of binding face through heat-conduction or heat radiation mode, the heat dissipation main part includes first side and the opposite second side with first side, the binding face is located first side, the position department corresponding to the binding face on the second side is equipped with the depressed area, the direction that the depressed area was towards the binding face is sunken, including the limit for thickness district in the depressed area, limit for thickness district area is less than or equal to the depressed area, the second side at limit for thickness district place is less than or equal to 3mm to the cross-sectional thickness of binding face. The thickness of the cross section from the second side face where the limited thickness area is located to the binding face is limited to be less than or equal to 3mm, and the surface flatness of the binding face can be obviously controlled.

Description

Heat-conducting plastic radiator with high flatness of attaching surface and LED lamp

Technical Field

The utility model belongs to the technical field of the LED, concretely relates to thermal conductive plastic radiator and LED lamp that laminating face roughness is high.

Background

LED lamps are widely used in the automotive industry, but are limited by the heat dissipation of LEDs, and the heat dissipation effect of a heat sink needs to be improved to prolong the service life of the LED lamp. In the prior art, most of radiator materials are high-thermal-conductivity metal materials such as aluminum materials, however, the post-processing procedures of aluminum/metal radiator materials are complex (such as flash processing, grinding, powder spraying, paint spraying and the like), and the limitation of the forming process is more, and in practical application, the aluminum material is adopted in a structure with a small size, so that the processing cost is higher, the aluminum radiator usually adopts a thicker section thickness of an attaching surface in order to save the processing cost, and the target radiating effect can be achieved by utilizing the high thermal conductivity coefficient of the aluminum material.

The heat-conducting plastic has high specific strength, light weight and certain heat-conducting property, and can be used for replacing part of LED aluminum radiators with low heat dissipation requirements, however, although the heat-conducting plastic has high processing precision, the material of the heat-conducting plastic has certain water absorption, particularly the heat-conducting plastic adopting a polyamide resin matrix has the advantages that the water absorption enables the shrinkage rate of products during processing and molding to be large, and the shrinkage is not uniform in a small range, so that the surface flatness of the binding surface and the LED substrate cannot meet the requirements (for example, the surface flatness is less than or equal to 0.1mm, and a height meter/height gauge test is utilized). Furthermore, when the LED substrate is attached, the quantity of heat dissipation silicone grease required to be filled is large, the silicone grease layer is thick, and the distribution difference of the silicone grease dosage in different areas of the attachment surface is large, so that the area heat dissipation is not uniform.

The LED radiator mainly comprises a binding surface, a radiating main body and radiating fins, wherein one side of the binding surface is used for conducting heat of the LED substrate to the main body, and the heat is conducted to the radiating fins through the main body and is radiated and diffused. However, some LED radiators require sealing the LED substrate to achieve dustproof and moistureproof effects due to their use environment requirements, and sealing is usually performed from the attaching surface to the side surface of the heat dissipating body, for example, sealing is performed by filling the space on the side surface of the attaching surface with a sealing gasket or by providing a sealing glue groove and filling a sealing glue in the sealing glue groove, and in the above manner, the thickness of the cross section from the attaching surface to the root of the heat dissipating fin needs to be increased to accommodate the sealing structure. The thickness of the section from the binding surface to the root of the radiating fin is increased by the method, and for plastic materials, the thickness is further increased, so that the surface flatness processing shrinkage is not controllable, or the requirement of the surface flatness is difficult to meet.

Although the molding shrinkage rate can be reduced to a certain extent by adding a large amount of heat-conducting fillers into the existing heat-conducting plastic, the requirement of high flatness is still difficult to meet on the premise of ensuring the processing performance and mechanical performance of products. In view of this, it is not a reasonable and practical solution to reduce the molding shrinkage by adding a heat conductive filler to improve the surface flatness of the product.

Disclosure of Invention

In order to solve the problem of the surface smoothness that exists among the prior art, the utility model aims to provide a have that the material proportion is light, processing aftertreatment is simple, the design degree of freedom is high, the radiating effect is good, with the high LED thermal conductivity plastic radiator of laminating surface smoothness of LED base plate, specifically realize through following technical scheme:

a heat-conducting plastic radiator with high flatness of a joint surface is of an integrated structure and is integrally formed by heat-conducting plastic materials; including being used for with the laminating of LED base plate and conducting the thermal binding face of LED base plate and being used for the heat dissipation main part that spreads the heat of binding face through heat-conduction or heat radiation mode, the heat dissipation main part includes first side and the opposite second side with first side, the binding face is located first side, the position department corresponding to the binding face on the second side is equipped with the depressed area, the direction that the depressed area was towards the binding face is sunken, including the limit for thickness district in the depressed area, limit for thickness district area is less than or equal to the depressed area, the second side at limit for thickness district place is less than or equal to 3mm to the cross-sectional thickness of binding face.

Optionally, the area of the thickness limiting area is greater than or equal to the area of the attaching surface, and if the area of the thickness limiting area is smaller than the area of the attaching surface, the thickness of the section from the second side surface corresponding to the area of the attaching surface to the attaching surface is not uniform, and the surface flatness of the attaching surface is affected when the thickness of the part of the second side surface exceeds 3 mm.

Optionally, at least the second side surface of the heat dissipation main body is provided with a plurality of heat dissipation fins.

Optionally, the heat dissipation fin includes one or more of a cylinder, a cuboid, a cube, a cone, and a reinforcing rib or a reinforcing rib having a heat dissipation function.

Optionally, the first side surface and/or the second side surface is/are planar or curved.

Optionally, the curved surface shape includes one or more of a circular arc shape, a bent shape and a step shape.

Optionally, a plurality of positioning structures for limiting the mounting position of the LED substrate are disposed beside the attachment surface on the heat dissipation body.

Optionally, a sealing structure is arranged between the first side face and the binding face, and the LED substrate and the heat dissipation space are isolated, and the LED substrate is dustproof and moistureproof.

Optionally, the sealing structure is a sealing gasket or a sealing rubber groove.

Optionally, the heat dissipation main body is provided with a plurality of mounting structures for mounting the heat sink.

Optionally, the mounting structure comprises a mounting hole.

Optionally, the mounting structure further comprises a positioning hole or other positioning component for defining the mounting position of the heat dissipation body.

Optionally, the joint surface is provided with a heat-conducting metal sheet matched with the joint surface, and the heat-conducting metal sheet is integrally formed with the joint surface through an aluminum-plastic embedding process. The heat of the LED substrate is quickly guided to the radiator through the heat-conducting metal sheet, and the interface between the heat-conducting metal sheet and the binding face can be tightly combined through the plastic embedding aluminum process, so that the thermal resistance is reduced, and the heat transfer efficiency is improved.

Optionally, the matrix of the heat conductive plastic material is polyamide resin. The technical scheme of the application can overcome the flatness problem caused by the shrinkage rate of the resin matrix, and is more suitable for other resin matrixes with small shrinkage rates.

Optionally, the thermal conductivity of the thermally conductive plastic material is 3-50W/(m.k). The high heat dissipation efficiency of the heat-conducting plastic is ensured, and the actual heat-conducting performance and mechanical performance requirements are met.

The application also provides an LED lamp, which comprises the heat-conducting plastic radiator.

The heat-conducting plastic radiator in any technical scheme is applied to the industry of LED lamps, for example, the heat-conducting plastic radiator can be used for radiators of corner lamps, fog lamps, steering lamps, brake lamps, dipped headlight, high beam lamps and the like on automobile lamps, and can be used for radiators of handkerchief lamps, high shed lamps and the like in the aspect of indoor lighting.

The heat-conducting plastic radiator in any technical scheme is applied to the technical field of heat dissipation, such as a camera heat dissipation module and the like.

Compared with the prior art, the application also has the following beneficial effects:

this application adopts thermal-conductive plastic as the radiator material to adopt the integrated into one piece, compare the radiator of current aluminum product, have that the material proportion is light, processing aftertreatment is simple, the radiating effect is good, long service life's advantage.

This application is through injecing the second side at limit for thickness district place to the cross-sectional thickness of binding face and being less than or equal to 3mm, can obviously control binding face surface smoothness, guarantees that heat dissipation silicone grease quantity is even in production process, coating thickness is low, the different regional heat dissipation silicone grease quantity distribution disparity of binding face is little, and heat dissipation silicone grease quantity is few, with low costs, and automated production improves the product yields under the condition that reduces heat dissipation silicone grease quantity. In addition, compared with aluminum materials, the material thickness and the material consumption can be obviously reduced, and the advantage of greatly reducing the weight of the finished piece is achieved when the existing aluminum finished piece is replaced by combining the characteristic of light weight of the heat-conducting plastic; on the other hand, the reduction of the thickness of the section of the binding surface reduces the path of the heat source transmitted to the heat dissipation main body along the binding surface, reduces the weakness of the heat conductivity coefficient of the heat conduction plastic compared with the aluminum material, accelerates the heat conduction transfer to the heat dissipation process of the heat radiation, and improves the overall heat dissipation efficiency of the part.

The scheme can also avoid that the requirement on the flatness, the mechanical property and the insulating property of the binding surface can not be simultaneously met by adjusting the formula under the condition that the heat conductivity coefficient of the heat conduction plastic material is 3-50W/(m.K), and the formula adjustment research and development time is long and the research and development result is uncontrollable.

In the art, it is usually difficult to find the technical problems pointed out by the present application, generally by selecting a metal material to achieve a predetermined index, and without considering the problems of the amount and thickness of the heat-dissipating silicone rubber, the yield of the automatic production, and the like caused by flatness, and handing over to the plastic supplier to increase the thermal conductivity of the heat-conducting plastic from the improved material formulation, it is difficult to think of the solution of the present application.

Drawings

Fig. 1 is a schematic perspective view of a bonding surface side of an LED lamp heat sink according to embodiment 1;

fig. 2 is a schematic perspective view of a heat sink of the LED lamp according to embodiment 1;

FIG. 3 is a schematic partial cross-sectional view of the heat sink of the LED lamp according to embodiment 1;

fig. 4 is a schematic cross-sectional view of the heat sink of the LED lamp according to embodiment 1.

The reference numbers in the figures are: 1 binding face, 2 heat dissipation main parts, 3 radiating fin, 4 sealant groove, 5 thickness-limiting areas, 6 first side, 7 second side.

Detailed Description

The technical solutions of the present invention are further described below with reference to specific embodiments, and it should be noted that the specific embodiments of the present invention are not intended to limit the claims of the present invention. Particularly, the LED lamp heat radiator can be applied to other LED lamp heat radiators to control the flatness of the joint surface according to the idea of the invention, so that the effect of the technical scheme of the application is realized.

Example 1

The heat sink for LED lamps shown in fig. 1 to 4 is an integrated structure and is integrally formed by a polyamide plastic material with a thermal conductivity of 8W/(m.k); including be used for with the laminating of LED base plate and conduct the thermal binding face 1 of LED base plate and be used for the heat dissipation main part 2 that the heat of binding face 1 diffuses through heat-conduction or thermal radiation mode, heat dissipation main part 2 includes first side 6 and the second side 7 opposite with first side 6, binding face 1 is located first side 6, the position department corresponding to binding face 1 on the second side 7 is equipped with the depressed area, the depressed area is sunken towards the direction of binding face 1, including limit thickness district 5 in the depressed area, in this embodiment, limit thickness district 5 is the same with the depressed area, second side 7 to binding face 1's cross-sectional thickness h at limit thickness district place is 2 mm.

In this embodiment, the area of the thickness limiting region 5 is equal to the area of the attachment surface 1.

In this embodiment, a sealing structure is disposed between the first side surface 6 and the attaching surface 1, and the sealing structure is a sealant groove 4 in this embodiment.

In this embodiment, a plurality of rectangular parallelepiped-shaped heat dissipating fins 3 are disposed on the second side surface 7 of the heat dissipating main body 2.

The flatness of the attaching surface 1 in this example was tested by a height gauge to meet the requirement of 0.1mm or less.

The technical personnel in the field can also be according to this application thinking, be equipped with the heat conduction sheetmetal with binding face 1 assorted in binding face 1 department, the heat conduction sheetmetal inlays aluminium technology and binding face 1 integrated into one piece through moulding. The heat of the LED substrate is quickly guided to the heat-conducting plastic through the heat-conducting metal sheet, and the interface between the heat-conducting metal sheet and the binding surface 1 can be tightly combined through the plastic-aluminum embedding process, so that the thermal resistance is reduced, and the heat transfer efficiency is improved. The heat-conducting metal sheet can be made of metal with high heat conductivity coefficient such as aluminum, copper and the like.

The technical personnel in the field can also be according to this application thinking, with its application on other LED thermal conductive plastic radiators, like can be used to the control of 1 roughness of binding face of the LED lamp radiator of handkerchief lamp, high shed lamp, or at the control of 1 roughness of binding face of the LED lamp radiator of car light such as angle lamp, fog lamp, indicator, brake light, passing lamp, far-reaching headlamp.

On the basis of the technical scheme of the present application, a person skilled in the art may add structures such as a limiting structure and a mounting hole to further expand the specific embodiments, but all of them belong to the protection scope of the present application.

It should be noted that the above contents described in the present specification are only examples of the technical solution of the present invention. All according to the utility model discloses the patent design simple change or the equivalent change that do of characteristic and principle all be included in the utility model discloses a protection within range. Those skilled in the art can make various modifications or additions to the described embodiments or substitute them in a similar manner without departing from the technical idea of the present invention or exceeding the scope defined by the claims, which shall fall within the protection scope of the present invention.

Claims

1. The utility model provides a heat conduction plastic radiator that laminating face roughness is high which characterized in that: the heat-conducting plastic is of an integrated structure and is integrally formed by heat-conducting plastic materials; including being used for with the laminating of LED base plate and conducting the thermal binding face of LED base plate and being used for the heat dissipation main part that spreads the heat of binding face through heat-conduction or heat radiation mode, the heat dissipation main part includes first side and the opposite second side with first side, the binding face is located first side, the position department corresponding to the binding face on the second side is equipped with the depressed area, the direction that the depressed area was towards the binding face is sunken, including the limit for thickness district in the depressed area, limit for thickness district area is less than or equal to the depressed area, the second side at limit for thickness district place is less than or equal to 3mm to the cross-sectional thickness of binding face.

2. A thermally conductive plastic heat sink as claimed in claim 1, wherein the thickness-limiting region has an area greater than or equal to the area of the faying surface.

3. A thermally conductive plastic heat sink as claimed in claim 1, wherein at least the second side of said heat dissipating body is provided with a plurality of heat dissipating fins.

4. A thermally conductive plastic heat sink as claimed in claim 1, wherein a sealing structure is provided between said first side and said abutting surface, said sealing structure being a sealing gasket or a sealant groove.

5. A thermally conductive plastic heat sink as claimed in claim 1, wherein the first side and/or the second side is planar or curved in shape.

6. A thermally conductive plastic heat sink as claimed in claim 5, wherein said curved surface has a shape selected from one or more of a circular arc, a bent shape, and a step shape.

7. A thermally conductive plastic heat sink as claimed in claim 1, wherein the heat dissipating body is provided with a plurality of positioning structures adjacent to the attachment surface for defining the mounting positions of the LED substrate.

8. A thermally conductive plastic heat sink as claimed in claim 1, wherein said heat sink body is provided with mounting structures for mounting the heat sink.

9. A thermally conductive plastic heat sink as claimed in claim 1, wherein the attachment surface is provided with a thermally conductive metal sheet matching the attachment surface, and the thermally conductive metal sheet is integrally formed with the attachment surface by plastic-aluminum embedding.

10. An LED lamp, characterized in that it comprises a heat-conducting plastic heat sink as claimed in any one of claims 1 to 9.