CN214254409U - TO-252 packaging-based power device - Google Patents

Abstract

The utility model discloses a power device based on TO-252 encapsulation, which comprises a frame; the frame is symmetrically provided with a first loading part and a second loading part in a concave manner; a plurality of first core carrying plates are arranged on the first loading part at intervals; a plurality of second core carrying plates are arranged on the second loading part at intervals; chips are packaged on each first chip carrier plate and each second chip carrier plate; glue locking holes are formed between the first core carrying plates and between the second core carrying plates; the utility model discloses a set up first loading portion and second loading portion to increase the quantity of first carrier plate and second carrier plate, and then improved the bearing capacity of power device, thereby can adapt to the loading of more types of high-power chips, effectively improved work efficiency, effectively reduced manufacturing cost, have good economic benefits; the rigidity and the hardness of the frame are effectively improved by increasing the thickness of the frame, the phenomenon that the product is easy to deform abnormally in the operation process is reduced, and the yield of the product is further improved.

Description

TO-252 packaging-based power device

Technical Field

The utility model relates TO a chip package technical field, especially are a power device based on TO-252 encapsulation.

Background

The conventional TO-252 packaged power device can bear a chip with certain power, but when the chip with high power is faced, the conventional packaged power device has the problem of insufficient bearing capacity; meanwhile, the conventional TO-263 frame is small in thickness and insufficient in hardness, and is easy TO deform abnormally in the operation process, so that the yield of products is low; there is a need TO provide a new TO-252 framework TO overcome the deficiencies of the prior art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's defect, provide a simple structure, can bear more powerful chip, avoid the product to warp unusually at the operation process easily, the high novel framework encapsulation power device of product yields.

The utility model discloses a following technical scheme realizes:

a TO-252 package based power device includes a frame; wherein: the frame is symmetrically provided with a first loading part and a second loading part in a concave manner; a plurality of first core carrying plates are arranged on the first loading part at intervals; a plurality of second core carrying plates are arranged on the second loading part at intervals; chips are encapsulated on each first chip carrier board and each second chip carrier board.

Furthermore, rubber locking holes are formed between the first core carrying plates and between the second core carrying plates.

Further, a plurality of oblong holes are formed in the frame.

Further, V-shaped grooves are symmetrically formed in the top and the bottom of the frame.

Further, the thickness of the frame is 0.5 mm.

Furthermore, the frame is provided with a positioning hole.

Further, the frame has a length of 240mm and a width of 58 mm.

The utility model has the advantages that:

the utility model discloses a set up first loading portion and second loading portion to increase the quantity of first carrier plate and second carrier plate, and then improved the bearing capacity of power device, thereby can adapt to the loading of more types of high-power chips, effectively improved work efficiency, effectively reduced manufacturing cost, have good economic benefits; the rigidity and the hardness of the frame are effectively improved by increasing the thickness of the frame, the phenomenon that the product is easy to deform abnormally in the operation process is reduced, and the yield of the product is further improved.

Drawings

FIG. 1 is a schematic diagram of the overall structure of a TO-252 package-based power device according TO an embodiment of the present invention;

FIG. 2 is an enlarged schematic view of section A of FIG. 1;

fig. 3 is a schematic side view of a TO-252 package-based power device according TO an embodiment of the present invention.

In the drawings: 1-a frame; 2-a first loading section; 3-a second loading section; 4-locking glue holes; 11-oblong holes; 12-V-shaped grooves; 13-positioning holes; 21-a first carrier sheet; 31-second carrier plate.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings and specific embodiments, and the present invention will be described in detail with reference to the accompanying drawings and specific embodiments below according to the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front, back, upper end, lower end, top, bottom … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present application, unless expressly stated or limited otherwise, the term "connected" is to be construed broadly, e.g., "connected" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature; in addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

Referring TO fig. 1 TO 3, a TO-252 package based power device includes a frame 1; wherein: the frame 1 is symmetrically provided with a first loading part 2 and a second loading part 3 in a concave manner; a plurality of first carrier plates 21 are arranged on the first loading part 2 at intervals; a plurality of second core plates 31 are arranged on the second loading part 3 at intervals; a chip is encapsulated on each first carrier-chip board 21 and on each second carrier-chip board 31. It should be noted that, by providing the first loading portion 2 and the second loading portion 3, the number of the first carrier plates 21 and the number of the second carrier plates 31 are increased, and the carrying capacity of the power device is further improved, so that the power device can adapt to loading of more types of high-power chips, and the working efficiency is effectively improved.

Specifically, in this embodiment, the glue locking holes 4 are disposed between the first carrier core plates 21 and between the second carrier core plates 31. It should be noted that the glue locking holes 4 are arranged to recycle the excess glue in the process of bonding the chip to the first carrier core plate 21 and the second carrier core plate 31, so that the packaging quality of the chip is ensured, and the improvement of the yield of the product is facilitated.

Specifically, in this embodiment, the frame 1 is provided with a plurality of oblong holes 11.

Specifically, in the embodiment, V-shaped grooves 12 are symmetrically arranged at the top and the bottom of the frame 1.

Specifically, in this embodiment, the thickness of the frame 1 is 0.5 mm. The thickness of the frame 1 is 0.5 mm. It should be noted that the thickness of the frame 1 in the present embodiment is preferably 0.5mm, but is not limited to 0.5mm, and the thickness of the frame 1 may be set to other values according to actual production requirements. The thickness of the frame 1 is increased to be more than 0.5mm, the rigidity and the hardness of the frame 1 are effectively improved, the phenomenon that the product is easy to deform in the operation process is reduced, and the yield of the product is further improved.

Specifically, in the embodiment, the frame 1 is provided with a positioning hole 13. It should be noted that, the positioning hole 13 is arranged to facilitate the installation and positioning of the frame 1, thereby effectively improving the working efficiency.

Specifically, in the embodiment of the present invention, the length of the frame 1 is 240mm, and the width thereof is 58 mm.

The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the above embodiments are only applicable to help understand the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the description should not be construed as a limitation to the present invention.

Claims (7)

1. A TO-252 package based power device includes a frame; the method is characterized in that: the frame is symmetrically provided with a first loading part and a second loading part in a concave manner; a plurality of first core carrying plates are arranged on the first loading part at intervals; a plurality of second core carrying plates are arranged on the second loading part at intervals; chips are encapsulated on each first chip carrier board and each second chip carrier board.

2. A TO-252 package based power device as claimed in claim 1, wherein: and rubber locking holes are formed between the first core carrying plates and between the second core carrying plates.

3. A TO-252 package based power device as claimed in claim 1, wherein: the frame is provided with a plurality of oblong holes.

4. A TO-252 package based power device as claimed in claim 1, wherein: v-shaped grooves are symmetrically formed in the top and the bottom of the frame.

5. A TO-252 package based power device as claimed in claim 1, wherein: the thickness of the frame is 0.5 mm.

6. A TO-252 package based power device as claimed in claim 1, wherein: the frame is provided with a positioning hole.

7. A TO-252 package based power device as claimed in claim 1, wherein: the frame has a length of 240mm and a width of 58 mm.

Images