CN214223403U - Gas temperature regulating system - Google Patents

Gas temperature regulating system Download PDF

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Publication number
CN214223403U
CN214223403U CN202023072457.3U CN202023072457U CN214223403U CN 214223403 U CN214223403 U CN 214223403U CN 202023072457 U CN202023072457 U CN 202023072457U CN 214223403 U CN214223403 U CN 214223403U
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temperature
gas
flow
pipeline
gas flow
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郭银波
宋洋
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Beijing Softong Intelligent Technology Co ltd
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Beijing Softong Intelligent Technology Co ltd
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Abstract

The embodiment of the utility model discloses gas temperature governing system, this system includes: a central processor and at least two temperature adjustment devices in communication with the central processor; the at least two temperature adjusting devices are arranged in the gas temperature adjusting cavity; the cavity is formed by at least two airflow pipelines; the at least two temperature adjusting devices are respectively arranged in each gas flow pipeline and used for adjusting the temperature of the gas which finally flows out through the at least two gas flow pipelines to a target preset temperature. Through the technical scheme of the utility model, realized using the temperature regulation apparatus in each air current pipeline to carry out temperature regulation to the gas of flowing through to the gas temperature that makes the outflow cavity can accurately reach the effect that the temperature was preset to the target.

Description

Gas temperature regulating system
Technical Field
The embodiment of the utility model provides a relate to automatic control technical field, especially relate to a gas temperature governing system.
Background
In the field of gas concentration measurement or in the process of taking gas into industrial manufacturing and chemical experiments, the temperature of the gas has an important influence on the result, so that it is necessary to maintain the temperature of the gas at a certain temperature. To avoid this problem, the following approaches are generally used: the gas temperature is stabilized near the designated temperature value by using a constant temperature control mode, and optionally, a group of temperature controllers and temperature adjusting actuators arranged in the cavity are used for realizing the constant temperature control function.
However, in the above manner, when the temperature at the inlet of the chamber changes instantaneously, the temperature actuator does not yet adjust the temperature of the gas, and the gas is already output from the temperature adjustment chamber, which causes a problem that the output gas temperature is greatly different from an actually expected value. When the gas based on the output participates in industrial manufacturing or experiment, the problem of large error of the final result is caused.
SUMMERY OF THE UTILITY MODEL
The utility model provides a gas temperature governing system to the realization is adjusted the gas temperature of the gaseous temperature regulation cavity of will flowing through, makes the gas temperature of outflow can accurately reach the effect that the temperature was preset to the target.
In a first aspect, an embodiment of the present invention provides a gas temperature regulating system, including: a central processor and at least two temperature adjustment devices in communication with the central processor;
the at least two temperature adjusting devices are arranged in the gas temperature adjusting cavity;
the cavity is formed by at least two airflow pipelines;
the at least two temperature adjusting devices are respectively arranged in each gas flow pipeline and used for adjusting the temperature of the gas which finally flows out through the at least two gas flow pipelines to a target preset temperature.
In a second aspect, the embodiment of the present invention further provides a control method of a gas temperature adjustment system, where the gas temperature adjustment system includes a central processing unit and at least two temperature adjustment devices in communication with the central processing unit, the at least two temperature adjustment devices are disposed in a cavity for gas temperature adjustment, the cavity is composed of at least two gas flow pipelines, and each temperature adjustment device is disposed in each gas flow pipeline respectively, and is used for adjusting the temperature of the gas finally flowing out through the at least two gas flow pipelines to a target preset temperature;
the control method comprises the following steps:
the central processing unit is used for determining a temperature speed reduction curve according to the inlet gas temperature of the cavity, the target preset temperature and the flowing time of the gas flowing through the cavity; the temperature speed reduction curve comprises temperature information corresponding to each moment;
the central processing unit is used for determining the pipe flow temperature corresponding to each gas flow pipeline according to the temperature speed drop curve and the time information of gas flowing through each gas flow pipeline, and sending the pipe flow temperature to the corresponding temperature adjusting device;
the temperature adjusting device is used for receiving the pipe flow temperature sent by the central processing unit, and adjusting the gas temperature in the gas flow pipeline to reach the pipe flow temperature according to the pipe flow temperature and the temperature detected by the temperature sensor, so that the gas temperature output by the cavity reaches the target preset temperature.
In a third aspect, the embodiment of the present invention further provides an electronic device, where the electronic device includes:
one or more processors;
a storage device for storing one or more programs,
when the one or more programs are executed by the one or more processors, the one or more processors implement the control method of the gas temperature regulation system according to any one of the embodiments of the present invention.
In a fourth aspect, the present invention further provides a storage medium containing computer-executable instructions, which when executed by a computer processor, are used to execute the control method of the gas temperature regulating system according to any one of the embodiments of the present invention.
The technical scheme of the embodiment of the utility model, through central processing unit among the gas temperature governing system and two at least temperature regulation apparatus that communicate mutually with central processing unit, wherein, two at least temperature regulation apparatus set up in gas temperature regulation's cavity, and the cavity comprises two at least air current pipelines, and two at least temperature regulation apparatus set up respectively in every air current pipeline, are used for passing through the gas temperature regulation that two at least air current pipelines flow out at last is to the target temperature of predetermineeing, has solved the gas temperature of the cavity output of flowing through gas temperature regulation and the great problem of actual expected value difference, has realized using the temperature regulation apparatus in each air current pipeline to carry out temperature regulation to the gas of flowing through to the gas temperature that makes the outflow cavity can accurately reach the target effect of predetermineeing the temperature.
Drawings
In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, a brief description is given below of the drawings required for describing the embodiments. It should be clear that the described figures are only drawings of some of the embodiments of the invention to be described, not all, and that for a person skilled in the art, other figures can be derived from these figures without inventive effort.
Fig. 1 is a schematic structural diagram of a gas temperature regulating system according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a second gas temperature regulating system according to an embodiment of the present invention;
fig. 3 is a schematic control diagram of the cpu, the temperature controller, the temperature adjustment actuator, and the temperature sensor according to the first embodiment of the present invention;
fig. 4 is a schematic structural diagram of a third gas temperature regulating system according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a fourth gas temperature regulating system according to an embodiment of the present invention;
fig. 6 is a schematic flow chart illustrating a control method of a gas temperature adjustment system according to a second embodiment of the present invention;
fig. 7 is a schematic view of a temperature drop curve provided by the second embodiment of the present invention;
fig. 8 is a flowchart for solving a temperature drop curve according to a second embodiment of the present invention;
fig. 9 is a schematic structural diagram of an electronic device according to a third embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Example one
Fig. 1 is the embodiment of the present invention provides a schematic structural diagram of a gas temperature regulating system, and the gas temperature regulating system provided by this embodiment is applicable to the condition of adjusting the gas temperature by stages.
As shown in fig. 1, the gas temperature regulating system 10 includes a central processing unit 102 and at least two temperature regulating devices 101 in communication with the central processing unit 102.
At least two temperature adjusting devices 101 arranged in the gas temperature adjusting chamber; the cavity is formed by at least two airflow pipelines; and the at least two temperature adjusting devices 101 are respectively arranged in each gas flow pipeline and are used for adjusting the temperature of the gas finally flowing out through the at least two gas flow pipelines to a target preset temperature.
The cavity for regulating the gas temperature is a pipeline for wrapping gas so as to regulate the temperature of the gas flowing through the cavity. The gas flow line is a component that makes up the chamber, for example: the chamber may be divided into at least two sections uniformly in a direction perpendicular to the direction of gas movement, and each section may be used as a gas flow line. The temperature adjusting device 101 is disposed in the gas temperature adjusting cavity, and specifically, may be disposed in each gas flow line respectively, and is configured to adjust a temperature of the gas flowing through each gas flow line. The central processor 102 may be in electrical communication with the temperature regulating device 101 for controlling the temperature regulating device 101 to measure and regulate the temperature of the gas in each of the gas flow lines. The target preset temperature is a preset temperature value or temperature range of the gas that finally flows out of the cavity.
Optionally, each of the at least two temperature adjustment devices 102 is configured to adjust the temperature of the gas flowing through the corresponding gas flow pipeline to the pipe flow temperature corresponding to the gas flow pipeline, so that the temperature of the gas output through the cavity reaches the target preset temperature.
Wherein the tube flow temperature is a preset gas temperature value or temperature range within each gas flow line.
Specifically, the central processing unit 102 may determine the pipe flow temperature in each gas flow pipeline and send the pipe flow temperature to the corresponding temperature control device 101, so that the temperature control device 101 compares the measured gas temperature with the pipe flow temperature set in each gas flow pipeline after measuring the gas temperature in each gas flow pipeline. If the measured gas temperature does not match the pipe flow temperature, the temperature adjustment device 101 may adjust the gas temperature in the gas flow pipes to make the gas temperature in each gas flow pipe match the pipe flow temperature, and further make the temperature of the gas finally flowing out of the chamber reach the target preset temperature.
Fig. 2 is a schematic structural diagram of a second gas temperature adjustment system according to an embodiment of the present invention, as shown in fig. 2, and optionally, the temperature adjustment device 101 includes a temperature controller 1011, and a temperature adjustment actuator 1012 and at least one temperature sensor 1013 connected to the temperature controller 1011.
Optionally, the cpu 102 is configured to determine a pipe flow temperature of each of the airflow pipes; a temperature controller 1011, in communication with the cpu 102, is configured to receive the pipe flow temperature and generate a control signal to the temperature adjustment actuator 1012 based on the pipe flow temperature, such that the temperature adjustment actuator 1012 adjusts the temperature in the air flow line to the pipe flow temperature based on the control signal.
It should be noted that, the same manner is adopted for each temperature adjustment actuator 1012 to adjust the gas temperature in the pipeline, and for clarity of describing the technical solution of the present embodiment, the description will be given by taking the example of determining the gas temperature in the pipeline adjusted by one of the temperature adjustment actuators 1012.
The control schematic diagram among the cpu 102, the temperature controller 1011, the temperature adjustment actuator 1012 and the temperature sensor 1013 is shown in fig. 3.
Specifically, the cpu 102 may determine the pipe flow temperature of each air flow pipeline according to the target preset temperature, and the temperature controller 1011 establishes a communication connection with the cpu 102, and may receive the pipe flow temperature of the air flow pipeline corresponding to the temperature controller 1011 and sent by the cpu 102. Temperature controller 1011 can control temperature sensor 1013 and measure the gas temperature in the gas flow pipeline, if the gas temperature who measures does not conform with the pipe flow temperature, temperature controller 1011 can adjust the gas temperature in the gas flow pipeline to the gas temperature in the gas flow pipeline accords with pipe flow temperature, and then makes the temperature of the last gas that flows out the cavity reach the target and predetermine the temperature.
Optionally, the temperature adjustment actuator 1012 comprises a resistance wire and a compression refrigerator.
Specifically, if the gas temperature in the gas flow line is higher than the pipe flow temperature, the temperature controller 1011 may control the compression refrigerator in the temperature adjustment actuator 1012 to start up, so as to reduce the gas temperature in the gas flow line to match the pipe flow temperature; if the gas temperature in the gas flow line is lower than the pipe flow temperature, the resistance wire in the temperature adjustment actuator 1012 can be controlled by the temperature controller 1011 to be activated, so that the gas temperature in the gas flow line is increased to be consistent with the pipe flow temperature.
Fig. 4 is a schematic structural diagram of a third gas temperature regulating system according to an embodiment of the present invention. As shown in fig. 2 and 4, optionally, the at least one temperature sensor 1013 includes a first temperature sensor 10131. A first temperature sensor 10131 disposed at an inlet of each gas flow line, in communication with the temperature controller 1011, for detecting an inlet gas temperature at the inlet of the gas flow line and sending the inlet gas temperature to the temperature controller 1011, so that the temperature controller 1011 adjusts the gas temperature to a pipe flow temperature according to the inlet gas temperature and a pipe flow temperature; the central processing unit 102 is further configured to receive an inlet gas temperature sent by the temperature controller 1011 at the inlet of the cavity, and determine a pipe flow temperature of each gas flow pipeline according to the inlet gas temperature and a flow time of the gas flowing through the cavity, and according to the inlet gas temperature and the flow time; a temperature controller 1011, in communication with the cpu 102, for receiving the pipe flow temperature corresponding to the current gas flow pipe sent by the cpu 102, and generating a control signal sent to the temperature adjustment actuator 1012 according to the pipe flow temperature and the inlet gas temperature; and the temperature adjusting actuator 1012 is communicated with the temperature controller 1011 and is used for receiving the control signal sent by the temperature controller 1011 and adjusting the temperature of the gas flowing out of the gas flow pipeline to reach the pipe flow temperature according to the control signal.
Specifically, a first temperature sensor 10131 is provided at the inlet of each gas flow line for measuring the temperature of the gas at the inlet of each gas flow line and, in turn, the temperature in the gas flow line. The benefits of this are: if the temperature in the gas flow line does not match the pipe flow temperature, there is sufficient time to adjust the gas temperature in the gas flow line. The first temperature sensor 10131 at the inlet of the chamber measures the gas temperature at the inlet of the chamber and sends this temperature to the cpu 102 via the temperature controller 1011. The cpu 102 determines the pipe flow temperature of each gas flow pipeline according to the received gas temperature at the inlet of the cavity and the flowing time of the gas flowing through the cavity, and sends the pipe flow temperature of each gas flow pipeline to the temperature controller 1011 corresponding to the pipe flow temperature, so as to ensure that the temperature of the gas flowing through the cavity can match the target preset temperature. When the temperature controller 1011 receives the pipe flow temperature corresponding to the current gas flow pipeline, the inlet temperature of the current gas flow pipeline measured by the first temperature sensor 10131 of the current gas flow pipeline is obtained, if the inlet temperature of the current gas flow pipeline does not accord with the pipe flow temperature, a control signal is generated and sent to the temperature adjustment actuator 1012 to adjust the gas temperature in the current gas flow pipeline. When the temperature adjustment actuator 1012 receives the control signal, the temperature of the gas in the gas flow line is adjusted, which may be temperature rise adjustment or temperature drop adjustment.
Optionally, the cpu 102 is further configured to determine a pipe flow temperature of each gas flow pipeline according to the inlet gas temperature of the cavity, the target preset temperature, and the flowing time period for the gas to flow through the cavity, and send the pipe flow temperature to the temperature controller 1011 corresponding to each gas pipe flow.
Specifically, the cpu 102 may determine a temperature change to be completed when the gas flows through the cavity according to the inlet gas temperature of the cavity and the target preset temperature, and further determine the pipe flow temperature of each gas flow pipeline according to the flowing time period for the gas to flow through the cavity. In order for the temperature controller 1011 to complete the adjustment of the gas temperature in the gas flow line, the cpu 102 may send the pipe flow temperature of the gas flow line to the temperature controller 1011.
Fig. 5 is a schematic structural diagram of a fourth gas temperature adjustment system according to an embodiment of the present invention. As shown in fig. 2 and fig. 5, optionally, the at least one temperature sensor 1013 further includes a second temperature sensor 10132 disposed at the outlet of the current airflow pipeline, and configured to detect the temperature of the current airflow pipeline at the outlet and send the temperature of the current airflow pipeline to the temperature controller 1011.
Optionally, the temperature controller 1011 is further configured to receive the outlet temperature and feed back the outlet temperature to the cpu 102, so that the cpu 102 adjusts the pipe flow temperature of the other airflow pipelines according to the outlet temperature until the outlet temperature of the last airflow pipeline reaches the target preset temperature.
Specifically, the gas temperature at the outlet of the gas flow pipeline can be obtained by the second temperature sensor 10132 disposed at the outlet of the gas flow pipeline, and in order to make the gas temperature regulation more flexible, the gas temperature at the outlet of the gas flow pipeline can be sent to the temperature controller 1011 and then fed back to the cpu 102. The cpu 102 may adjust the pipe flow temperature of other gas flow pipelines according to the gas temperature at the outlet of the current gas flow pipeline, optionally in combination with the target preset temperature. The benefits of this are: if the adjusting effect of the temperature controller 1011 corresponding to a certain gas flow pipeline does not reach the pipe flow temperature, the pipe flow temperature of each subsequent gas flow pipeline can be adjusted in time, so that the temperature of the gas reaching the outlet of the cavity reaches the target preset temperature.
The technical scheme of this embodiment, through central processing unit among the gas temperature governing system and two at least temperature regulation apparatus that communicate mutually with central processing unit, wherein, two at least temperature regulation apparatus set up in the cavity of gas temperature regulation, and the cavity comprises two at least gas flow line way, and two at least temperature regulation apparatus set up respectively in every gas flow line way, are used for will passing through the gas temperature that two at least gas flow line way flowed out at last is adjusted to the target and is predetermines the temperature, has solved the gas temperature of the cavity output of gas temperature regulation and has been expected the great problem of value difference with the reality, has realized using the temperature regulation apparatus in each gas flow line way to carry out temperature regulation to the gas of flowing through to the effect that the gas temperature of messenger's outflow cavity can accurately reach the target and predetermine the temperature.
Example two
Fig. 6 is a schematic flow chart illustrating a control method of a gas temperature adjustment system according to a second embodiment of the present invention. The present embodiment is suitable for the case of adjusting the temperature of the gas flow flowing through the gas temperature adjustment cavity to the target preset temperature according to the technical solutions of the above embodiments, and the method may be executed by a gas temperature adjustment system, which may be implemented by software and/or hardware, and integrated in a device with a control function, such as a computer. Wherein explanations of the same or corresponding terms as those of the above-described embodiments are omitted.
Referring to fig. 6, the control method of the gas temperature adjustment system provided in this embodiment specifically includes the following steps:
s601, the central processing unit determines a temperature speed reduction curve according to the inlet gas temperature of the cavity, the target preset temperature and the flowing time of the gas flowing through the cavity.
The temperature rapid-decrease curve comprises temperature information corresponding to each moment and is used for representing the change situation of the temperature along with the time.
Specifically, a temperature decrease curve can be determined by using a solution of the steepest decrease line problem according to the inlet gas temperature of the cavity, the target preset temperature and the flowing time of the gas flowing through the cavity, so as to determine the temperature to which the gas in the cavity needs to reach at each moment.
The temperature speed drop curve can be obtained by solving the problem of the steepest drop line. The transformation of the solution problem according to the steepest descent problem in this embodiment may be: and carrying out dimensionless processing on the time T and the temperature difference delta T, and establishing a mapping relation with the steepest descent problem. And after the gas flows through at least two gas flow pipelines, the inlet gas temperature Tin of the cavity reaches the target preset temperature Tout at the fastest speed under the temperature control action of each gas flow pipeline. Wherein the temperature control may be to raise or lower the control temperature.
In general, a variational method may be used to solve the steepest descent problem, and in this embodiment, the solution method is not specifically limited. The temperature rate-drop curve obtained by the solution is shown in fig. 7, and the solution flow is shown in fig. 8.
Specifically, the inlet gas temperature Tin of the cavity and the target preset temperature Tout are obtained, the temperature difference Δ T is calculated, a steepest descent curve is calculated by taking Qin (0, Δ T) as a starting point and Qout (T, 0) as an end point, the steepest descent curve is segmented according to the flowing time of the gas in each gas flow pipeline along a time axis, the number of the segments is consistent with the number of the gas flow pipelines, and coordinates of right points of each segment are respectively calculated to be Q1(T1, dT1), Q2(T2, dT2), …, Qm (tm, dTm) and Qout (T, 0). And determining a value to be reached after the temperature regulation of the gas is controlled by the temperature regulation device in each gas flow pipeline through calculation, namely the pipe flow temperature, and finally enabling the temperature of the gas flowing out of the last gas flow pipeline to reach the target preset temperature Tout.
And S602, the central processing unit determines the pipe flow temperature corresponding to each air flow pipeline according to the temperature speed drop curve and the time information of the air flowing through each air flow pipeline, and sends the pipe flow temperature to the corresponding temperature adjusting device.
Specifically, the temperature information corresponding to each moment can be determined according to the temperature drop curve, and the pipe flow temperature corresponding to each gas flow pipeline can be determined by combining the time information of gas flowing through each gas flow pipeline. In order to enable the temperature regulation device to control the gas temperature regulation in the corresponding gas flow line, the pipe flow temperature is sent to the respective temperature regulation device.
S603, the temperature adjusting device receives the pipe flow temperature sent by the central processing unit, and adjusts the gas temperature in the gas flow pipeline to reach the pipe flow temperature according to the pipe flow temperature and the temperature detected by the temperature sensor, so that the gas temperature output by the cavity reaches the target preset temperature.
Specifically, the temperature adjusting device receives the pipe flow temperature sent by the central processing unit, and can adjust the gas temperature in the gas flow pipeline according to the received pipe flow temperature and the temperature value measured by the temperature sensor at the current moment, so that the temperature when the gas flow pipeline reaches the outlet of the gas flow pipeline can reach the pipe flow temperature. Optionally, when the gas temperature is higher than the pipe flow temperature, the gas temperature can be reduced by using compression refrigeration, and when the gas temperature is lower than the pipe flow temperature, the gas temperature can be increased by using a resistance wire. And then, the temperature of the gas output by the cavity reaches the target preset temperature.
Through using central controller, temperature controller and steepest speed reduction curve, can carry out quick accurate regulation to the gas temperature to make the gas temperature of cavity exit invariable predetermines the temperature at the target. The method has the advantages that: when the gas temperature at the inlet is changed frequently and obviously, the method still has the characteristics of strong robustness and quick response, and can accurately control the gas temperature at the outlet of the cavity to be at the target preset temperature.
According to the technical scheme of the embodiment, the temperature speed reduction curve is determined by the central processing unit according to the inlet gas temperature of the cavity, the target preset temperature and the flowing time of the gas flowing through the cavity, the pipe flow temperature corresponding to each gas flow pipeline is determined according to the temperature speed reduction curve and the time information of the gas flowing through each gas flow pipeline, and the pipe flow temperature is sent to the corresponding temperature adjusting device. The temperature adjusting device receives the pipe flow temperature sent by the central processing unit, and adjusts the gas temperature in the gas flow pipeline to reach the pipe flow temperature according to the pipe flow temperature and the temperature detected by the temperature sensor, so that the gas temperature output by the cavity reaches the target preset temperature. The problem of the gas temperature of the cavity output of gas temperature control of flowing through with the actual expected value difference great is solved, temperature adjusting device in each gas flow line is used to carry out temperature control to the gas of flowing through to the effect that the gas temperature of messenger's outflow cavity can accurately reach the target and predetermine the temperature has been realized.
EXAMPLE III
Fig. 9 is a schematic structural diagram of an electronic device according to a third embodiment of the present invention. Fig. 9 illustrates a block diagram of an exemplary electronic device 70 suitable for use in implementing embodiments of the present invention. The electronic device 70 shown in fig. 9 is only an example, and should not bring any limitation to the functions and the scope of use of the embodiment of the present invention.
As shown in fig. 9, the electronic device 70 is embodied in the form of a general purpose computing device. The components of the electronic device 70 may include, but are not limited to: one or more processors or processing units 701, a system memory 702, and a bus 703 that couples various system components including the system memory 702 and the processing unit 701.
Bus 703 represents one or more of any of several types of bus structures, including a memory bus or memory controller, a peripheral bus, an accelerated graphics port, a processor, or a local bus using any of a variety of bus architectures. By way of example, such architectures include, but are not limited to, Industry Standard Architecture (ISA) bus, micro-channel architecture (MAC) bus, enhanced ISA bus, Video Electronics Standards Association (VESA) local bus, and Peripheral Component Interconnect (PCI) bus.
Electronic device 70 typically includes a variety of computer system readable media. Such media may be any available media that is accessible by electronic device 70 and includes both volatile and nonvolatile media, removable and non-removable media.
The system memory 702 may include computer system readable media in the form of volatile memory, such as Random Access Memory (RAM)704 and/or cache memory 705. The electronic device 70 may further include other removable/non-removable, volatile/nonvolatile computer system storage media. By way of example only, the storage system 706 may be used to read from and write to non-removable, nonvolatile magnetic media (not shown in FIG. 9, and commonly referred to as a "hard drive"). Although not shown in FIG. 9, a magnetic disk drive for reading from and writing to a removable, nonvolatile magnetic disk (e.g., a "floppy disk") and an optical disk drive for reading from or writing to a removable, nonvolatile optical disk (e.g., a CD-ROM, DVD-ROM, or other optical media) may be provided. In these cases, each drive may be connected to bus 703 via one or more data media interfaces. Memory 702 may include at least one program product having a set (e.g., at least one) of program modules that are configured to carry out the functions of embodiments of the invention.
A program/utility 708 having a set (at least one) of program modules 707 may be stored, for example, in memory 702, such program modules 707 including, but not limited to, an operating system, one or more application programs, other program modules, and program data, each of which examples or some combination thereof may comprise an implementation of a network environment. The program modules 707 generally perform the functions and/or methods of the described embodiments of the invention.
The electronic device 70 may also communicate with one or more external devices 709 (e.g., keyboard, pointing device, display 710, etc.), with one or more devices that enable a user to interact with the electronic device 70, and/or with any devices (e.g., network card, modem, etc.) that enable the electronic device 70 to communicate with one or more other computing devices. Such communication may occur via an input/output (I/O) interface 711. Also, the electronic device 70 may communicate with one or more networks (e.g., a Local Area Network (LAN), a Wide Area Network (WAN), and/or a public network, such as the internet) via the network adapter 712. As shown, the network adapter 712 communicates with the other modules of the electronic device 70 over a bus 703. It should be appreciated that although not shown in FIG. 9, other hardware and/or software modules may be used in conjunction with electronic device 70, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems, among others.
The processing unit 701 executes various functional applications and data processing by running a program stored in the system memory 702, for example, to implement a control method of the gas temperature regulation system provided by the embodiment of the present invention.
Example four
The fourth embodiment of the present invention further provides a storage medium containing computer-executable instructions for executing a control method of a gas temperature control system when the computer-executable instructions are executed by a computer processor.
The method comprises the following steps:
the central processing unit determines a temperature speed reduction curve according to the inlet gas temperature of the cavity, the target preset temperature and the flowing time of the gas flowing through the cavity; the temperature speed reduction curve comprises temperature information corresponding to each moment;
the central processing unit determines the pipe flow temperature corresponding to each air flow pipeline according to the temperature rapid-drop curve and the time information of the gas flowing through each air flow pipeline, and sends the pipe flow temperature to the corresponding temperature adjusting device;
the temperature adjusting device receives the pipe flow temperature sent by the central processing unit, and adjusts the gas temperature in the gas flow pipeline to reach the pipe flow temperature according to the pipe flow temperature and the temperature detected by the temperature sensor, so that the gas temperature output by the cavity reaches the target preset temperature.
The computer storage media of embodiments of the present invention may take any combination of one or more computer-readable media. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the foregoing. More specific examples (a non-exhaustive list) of the computer readable storage medium would include the following: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.
A computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated data signal may take many forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.
Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.
Computer program code for carrying out operations for embodiments of the present invention may be written in any combination of one or more programming languages, including an object oriented programming language such as Java, Smalltalk, C + +, and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet service provider).
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims (9)

1. A gas temperature conditioning system, comprising: a central processor and at least two temperature adjustment devices in communication with the central processor;
the at least two temperature adjusting devices are arranged in the gas temperature adjusting cavity;
the cavity is formed by at least two airflow pipelines;
the at least two temperature adjusting devices are respectively arranged in each gas flow pipeline and used for adjusting the temperature of the gas which finally flows out through the at least two gas flow pipelines to a target preset temperature.
2. The system of claim 1, wherein each of the at least two temperature adjustment devices is configured to adjust the temperature of the gas flowing through the gas flow line to a temperature corresponding to the pipe flow temperature of the gas flow line, so that the temperature of the gas flowing through the chamber reaches the target preset temperature.
3. The system of claim 1, wherein the temperature regulating device comprises a temperature controller, and a temperature regulating actuator and at least one temperature sensor connected to the temperature controller.
4. The system of claim 3, wherein said central processing unit is configured to determine a tube flow temperature of each of said gas flow lines;
and the temperature controller is communicated with the central processing unit and is used for receiving the pipe flow temperature and generating a control signal sent to the temperature adjusting actuator according to the pipe flow temperature so that the temperature adjusting actuator adjusts the temperature in the air flow pipeline to reach the pipe flow temperature according to the control signal.
5. The system of claim 4, wherein the at least one temperature sensor comprises a first temperature sensor;
the first temperature sensor is arranged at the inlet of each gas flow pipeline, is communicated with the temperature controller, and is used for detecting the inlet gas temperature at the inlet of the gas flow pipeline and sending the inlet gas temperature to the temperature controller, so that the temperature controller adjusts the gas temperature to reach the pipe flow temperature according to the inlet gas temperature and the pipe flow temperature;
the central processing unit is further used for receiving the inlet gas temperature sent by the temperature controller at the inlet of the cavity, and determining the pipe flow temperature of each gas flow pipeline according to the inlet gas temperature and the flowing time of the gas flowing through the cavity;
the temperature controller is communicated with the central processing unit and is used for receiving the pipe flow temperature which is sent by the central processing unit and corresponds to the current gas flow pipeline, and generating a control signal which is sent to the temperature adjusting actuator according to the pipe flow temperature and the inlet gas temperature;
and the temperature adjusting actuator is communicated with the temperature controller and is used for receiving the control signal sent by the temperature controller and adjusting the temperature of the gas flowing out of the gas flow pipeline to reach the temperature of the pipe flow according to the control signal.
6. The system of claim 5, further comprising:
and the second temperature sensor is arranged at the outlet of the current airflow pipeline and used for detecting the temperature of the outlet of the current airflow pipeline at the outlet and sending the temperature of the outlet to the temperature controller.
7. The system of claim 6, wherein the temperature controller is further configured to receive the outlet temperature and feed the outlet temperature back to the central processor, such that the central processor adjusts the duct flow temperatures of the other gas flow lines based on the outlet temperature until the outlet temperature of the last gas flow line reaches the target predetermined temperature.
8. The system of claim 3, wherein the temperature regulating actuator comprises a resistive wire and a compression refrigerator.
9. The system of claim 5, wherein the cpu is configured to determine a tube flow temperature for each gas flow tube based on an inlet gas temperature for the chamber, a target preset temperature, and a length of time for gas to flow through the chamber, and to send the tube flow temperature to the temperature controller corresponding to each gas tube flow.
CN202023072457.3U 2020-12-18 2020-12-18 Gas temperature regulating system Active CN214223403U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112484302A (en) * 2020-12-18 2021-03-12 北京软通智慧城市科技有限公司 Gas temperature regulation system and control method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112484302A (en) * 2020-12-18 2021-03-12 北京软通智慧城市科技有限公司 Gas temperature regulation system and control method

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