CN214212616U - Accurate cutting device of semiconductor wafer - Google Patents
Accurate cutting device of semiconductor wafer Download PDFInfo
- Publication number
- CN214212616U CN214212616U CN202022442946.7U CN202022442946U CN214212616U CN 214212616 U CN214212616 U CN 214212616U CN 202022442946 U CN202022442946 U CN 202022442946U CN 214212616 U CN214212616 U CN 214212616U
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- Prior art keywords
- rod
- telescopic rod
- microscope
- cutting
- bolt
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- 238000005520 cutting process Methods 0.000 title claims abstract description 78
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 239000007788 liquid Substances 0.000 claims abstract description 48
- 230000001681 protective effect Effects 0.000 claims abstract description 22
- 238000003698 laser cutting Methods 0.000 claims abstract description 21
- 235000012431 wafers Nutrition 0.000 claims description 23
- 238000009434 installation Methods 0.000 claims description 22
- 239000011521 glass Substances 0.000 claims description 18
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims 2
- 239000000314 lubricant Substances 0.000 claims 1
- 239000002173 cutting fluid Substances 0.000 abstract description 19
- 239000000463 material Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000003974 emollient agent Substances 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model relates to the technical field of cutting devices, in particular to a semiconductor wafer precise cutting device, which comprises a supporting seat, a balance adjusting rod, a base, a horizontal bubble, a vertical rod cutting machine, a laser cutting machine, a microscope, a magnifier, a cutting fluid box, a liquid suction pump and a material placing table, wherein the balance adjusting rod is arranged at the top bottom of the bottom plate and penetrates through the bottom plate, the horizontal bubble is arranged at the top of the bottom plate and is connected with the balance adjusting rod, an adjusting nut is arranged on the balance adjusting rod, the supporting seat is arranged at the bottom of the balance adjusting rod, the cutting fluid box and a liquid suction pump are arranged on the base, the outer side of the liquid suction pump is provided with a protective shell which is connected with the cutting fluid box, the material placing table is arranged at the top of the cutting fluid box and the protective shell, the liquid suction pump is provided with a liquid suction pipe and a liquid outlet pipe, the liquid suction pipe penetrates through the protective shell and the cutting fluid box, stretch into cutting fluid bottom of the case portion, the drain pipe runs through the protective housing, extends to and is close to and puts thing platform position department.
Description
Technical Field
The utility model relates to a cutting device technical field specifically is an accurate cutting device of semiconductor wafer.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; as the demand for use of wafers is becoming greater and greater, the efficiency of wafer processing and production is increasing. In the prior art, most wafers are cut by laser, the method is pollution-free and high in efficiency, but in the aspect of energy saving, the energy consumption of laser cutting is relatively large, so that the efficiency is high, the energy consumption in the actual production process is also large, and the production cost of enterprises is greatly increased. The existing wafer cutting device can not position the cutting knife and can not cool the cutting part.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides an accurate cutting, semiconductor wafer accurate cutting device of fly-cutting.
(II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: the utility model discloses a semiconductor wafer accurate cutting device, including supporting seat, balance adjustment pole, base, horizontal bubble, montant cutting machine, laser cutting machine, microscope, magnifying glass, cutting fluid tank, drawing liquid pump and thing platform, balance adjustment pole sets up in base top bottom, and runs through the base, horizontal bubble sets up at the base top, and is connected with balance adjustment pole, be equipped with adjusting nut on the balance adjustment pole, the supporting seat is installed in balance adjustment pole bottom, cutting fluid tank and drawing night pump are installed on the base, the drawing liquid pump outside is equipped with the protective housing, the protective housing is connected with cutting fluid tank, it sets up at cutting fluid tank and protective housing top to put the thing platform, be equipped with pipette and drain pipe on the drawing liquid pump, the pipette runs through protective housing and cutting fluid tank, stretches into cutting fluid tank bottom, the liquid outlet pipe penetrates through the protective shell and extends to a position close to the object placing table, the vertical rods are arranged on two sides of the protective shell and the cutting liquid box, two vertical rods are arranged on each side, limiting holes and sliding grooves are formed in the vertical rods, an installation block is arranged between the magnifying glass, the cutting machine and the laser cutting machine and the vertical rods, an installation hole and a sliding block are arranged on the installation block, a bolt is arranged between the installation hole and the limiting holes and is connected with the limiting holes, the installation block is inserted into the sliding grooves through the sliding blocks and is installed on the vertical rods through the bolt in the installation hole and the limiting holes, a magnifying glass telescopic rod is arranged between the magnifying glass and the installation block and is connected with the installation block, a first telescopic rod and a second telescopic rod are arranged between the cutting machine and the installation block, a third telescopic rod and a fourth telescopic rod are arranged between the laser cutting machine and the installation block and are connected with the laser cutting machine and are positioned on the rear side of the magnifying glass, be equipped with the connecting hole on first telescopic link, second telescopic link, third telescopic link and the fourth telescopic link, connecting hole between first telescopic link and the second telescopic link is equipped with bolted connection, connecting hole between third telescopic link and the fourth telescopic link is equipped with bolted connection, the microscope is installed on the microscope telescopic link, be equipped with the mounting hole on the microscope telescopic link, be equipped with bolted connection between the mounting hole on microscope and the microscope telescopic link, the one end of microscope telescopic link is equipped with the connecting hole, be equipped with bolted connection between spacing hole on microscopical connecting hole and the montant, the microscope is located cutting machine and laser cutting machine front side.
In order to facilitate fixation, the object placing table is provided with a mounting groove, the mounting groove is a cross-shaped mounting groove, and the mounting groove is provided with a clamping block.
For increase of service life, montant, base, put thing platform, supporting seat, magnifying glass telescopic link, microscope telescopic link, first telescopic link, second telescopic link, third telescopic link and fourth telescopic link are the forged steel, scribble emollient between balance adjustment pole and the adjusting nut.
In order to improve the cutting performance, a shock pad is arranged between the cutting machine and the two telescopic rods.
In order to increase the fixed effect of montant, be equipped with first stopper and bolt mouth on the montant, be equipped with the shank of bolt on the first stopper, the bolt mouth is located the montant top, first stopper passes through the shank of bolt and the bolt mouth is installed on the montant.
In order to improve the fixed effect of microscope, be equipped with second stopper and fixed mouthful on the microscope telescopic link, just fixed mouthful and second stopper are located the one end that the connecting hole was kept away from to the microscope telescopic link, be equipped with the shank of bolt on the second stopper, the second stopper passes through shank of bolt and fixed mouthful and installs on the microscope telescopic link.
(III) advantageous effects
Compared with the prior art, the utility model provides an accurate cutting device of semiconductor wafer possesses following beneficial effect:
this accurate cutting device of semiconductor wafer is equipped with cutting fluid case and drawing liquid pump, and the drawing liquid pump passes through the pipette and absorbs cutting fluid, again by the drain pipe to cutting position spray cutting fluid, to cutting position cooling, clears away impurity, improves cutting effect, has improved the precision of cutting when cutting small-size wafer through magnifying glass, microscope and laser cutting machine, it is equipped with the mounting groove on the thing platform to put, the mounting groove is the cross mounting groove be equipped with the clamp splice on the mounting groove, make things convenient for fixed cutting article more when the cutting, be equipped with the antivrbration pad between cutting machine and two telescopic links, prevent that the cutting machine is the vibrations that produce at work, improve cutting effect.
Drawings
Fig. 1 is a schematic structural view of the cutting machine of the present invention;
FIG. 2 is a schematic view of a microscope according to the present invention;
FIG. 3 is a schematic top view of the cutting machine of the present invention;
FIG. 4 is a schematic top view of a microscope according to the present invention;
in the figure: 1. a base; 2. horizontal bubbles; 3. a balance adjusting rod; 4. a supporting seat; 5. a liquid pump; 6. a pipette; 7. a liquid outlet pipe; 8. a vertical rod; 9. mounting blocks; 10. a first stopper; 11. a first telescopic rod; 12. a second telescopic rod; 13. a bolt; 14. a cutter; 15. a cutting knife; 16. a laser cutting machine; 17. a third compressor; 18. a cutting fluid tank; 19. a fourth telescopic rod; 20. a magnifying lens telescopic rod; 21. a magnifying glass; 22. a placing table; 23. a clamping block; 24. a microscope telescopic rod; 25. a second limiting block; 26. a microscope; 27. mounting grooves; 28. adjusting the nut;
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention relates to a semiconductor wafer precision cutting device, which comprises a supporting seat 4, a balance adjusting rod 3, a base 1, a horizontal bubble 2, a vertical rod 8, a cutting machine 14, a laser cutting machine 16, a microscope 26, a magnifying glass 21, a cutting liquid box 18, a liquid pump 5 and a platform 22, wherein the balance adjusting rod 3 is disposed at the top and bottom of the base 1 and penetrates through the base 1, the horizontal bubble 2 is disposed at the top of the base 1 and is connected with the balance adjusting rod 3, the balance adjusting rod 3 is provided with an adjusting nut 28, the supporting seat 4 is mounted at the bottom of the balance adjusting rod 3, the cutting liquid box 18 and the liquid pump are mounted on the base 1, the liquid pump 5 is provided with a protective shell outside, the protective shell is connected with the cutting liquid box 18, the platform 22 is disposed at the top of the cutting liquid box 18 and the protective shell, the liquid pump 5 is provided with a liquid outlet 6 and a liquid outlet 7, the pipette 6 penetrates through the protective shell and the cutting liquid box 18 and extends into the bottom of the cutting liquid box 18, the drain pipe 7 penetrates through the protective shell and extends to a position close to the object placing table 22, the vertical rod 8 is arranged on two sides of the protective shell and the cutting liquid box 18, two vertical rods are arranged on each side, a limiting hole and a sliding groove are formed in each vertical rod 8, an installation block 9 is arranged between the magnifying glass, the cutting machine 14 and the laser cutting machine 16 and the vertical rod 8, an installation hole and a sliding block are arranged on the installation block 9, a bolt 13 is arranged between the installation hole and the limiting hole and connected with the installation block 9, the installation block 9 is installed on the vertical rod 8 by inserting the sliding block into the sliding groove and inserting the bolt 13 into the installation hole and the limiting hole, a telescopic rod 21 and a telescopic rod 20 are arranged between the magnifying glass 21 and the installation block 9 and connected with a, a third telescopic rod and a fourth telescopic rod 19 are arranged between the laser cutting machine 16 and the mounting block 9 for connection, the cutting machine 14 and the laser cutting machine 16 are positioned at the rear side of the magnifier 21, connecting holes are arranged on the first telescopic rod 11, the second telescopic rod 12, the third telescopic rod 17 and the fourth telescopic rod 19, a bolt 13 is arranged in the connecting hole between the first telescopic rod 11 and the second telescopic rod 12 for connection, a bolt 13 is arranged in the connecting hole between the third telescopic rod 17 and the fourth telescopic rod 19 for connection, the microscope 26 is mounted on the microscope telescopic rod 24, a mounting hole is arranged on the microscope telescopic rod 24, a bolt 13 is arranged between the microscope 26 and the mounting hole on the microscope telescopic rod 24 for connection, a connecting hole is arranged at one end of the microscope telescopic rod 24, and a bolt 13 is arranged between the connecting hole of the microscope 26 and the limiting, the microscope 26 is located on the front side of the cutter 14 and the laser cutter 16.
When the semiconductor wafer accurate cutting device of the utility model is used, the horizontal bubble 2 is adjusted to the water position through adjusting the adjusting nut 28 on the balance adjusting rod 3, thereby the vertical rod 8 on the base 1 and the base 1, the liquid drawing pump 5, the cutting liquid box 18 and the object placing table 22 are in the horizontal state, the cutting effect is improved, the vertical rod 8 passes through the magnifying glass 21 telescopic rod 20, the microscope telescopic rod 24, the first telescopic rod 11, the second telescopic rod 12, the third telescopic rod 17 and the fourth telescopic rod 19, the magnifying glass 21, the microscope 26, the cutting machine 14 and the laser cutting machine 16 are fixed, the mounting block 9 on the vertical rod 8 passes through the bolt 13, the sliding groove and the mounting hole on the mounting block 9, the limiting hole on the sliding block and the vertical rod 8 is mounted on the vertical rod 8, and the mounting block 9 is connected with the magnifying glass 21 telescopic rod 20, the first telescopic rod 11 and the third telescopic rod 17, the improvement is fixed to magnifying glass 21, cutting machine 14 and laser cutting machine 16, cutting fluid tank 18 and drawing liquid pump 5, and drawing liquid pump 5 absorbs the cutting fluid through pipette 6, sprays the cutting fluid to the cutting position by drain pipe 7 again, to the cooling of cutting position, clears away impurity, improves the cutting effect, has improved the precision of cutting when cutting the wafer of small-size through magnifying glass 21, microscope 26 and laser cutting machine 16.
In order to facilitate fixation, the object placing table 22 is provided with a mounting groove 27, the mounting groove 27 is a cross-shaped mounting groove, and the mounting groove 27 is provided with a clamping block 23.
For increase of service life, the material of montant 8, base 1, put thing platform 22, supporting seat 4, magnifying glass telescopic link 20, microscope telescopic link 24, first telescopic link 11, second telescopic link 12, third telescopic link 17 and fourth telescopic link 19 is the forged steel, scribble emollient between balance adjustment pole 3 and adjusting nut 28.
In order to improve the cutting performance, a shock-proof pad is arranged between the cutting machine 14 and the second telescopic rod 12.
In order to increase the fixed effect of montant 8, be equipped with first stopper 10 and bolt mouth on the montant 8, be equipped with the shank of bolt on the first stopper 10, the bolt mouth is located montant 8 top, first stopper 10 passes through the shank of bolt and the bolt mouth is installed on montant 8.
In order to improve the fixing effect of the microscope 26, a second limiting block 25 and a fixing opening are arranged on the microscope telescopic rod 24, the fixing opening and the second limiting block 25 are located at one end, far away from the connecting hole, of the microscope telescopic rod 24, a bolt rod is arranged on the second limiting block 25, and the second limiting block 25 is installed on the microscope 26 telescopic rod 24 through the bolt rod and the fixing opening.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The accurate cutting device for the semiconductor wafer is characterized by comprising a supporting seat (4), a balance adjusting rod (3), a base (1), a horizontal bubble (2), a vertical rod (8), a cutting machine (14), a laser cutting machine (16), a microscope (26), a magnifier (21), a cutting liquid box (18), a liquid pump (5) and a storage table (22), wherein the balance adjusting rod (3) is arranged at the top bottom of the base (1) and penetrates through the base (1), the horizontal bubble (2) is arranged at the top of the base (1) and is connected with the balance adjusting rod (3), an adjusting nut (28) is arranged on the balance adjusting rod (3), the supporting seat (4) is arranged at the bottom of the balance adjusting rod (3), the cutting liquid box (18) and the liquid pump are arranged on the base (1), and a protective shell is arranged outside the liquid pump (5), the protective housing is connected with the cutting liquid box (18), the object placing table (22) is arranged at the top of the cutting liquid box (18) and the protective housing, the liquid drawing pump (5) is provided with a liquid drawing pipe (6) and a liquid discharging pipe (7), the liquid drawing pipe (6) penetrates through the protective housing and the cutting liquid box (18) and extends into the bottom of the cutting liquid box (18), the liquid discharging pipe (7) penetrates through the protective housing and extends to a position close to the object placing table (22), the vertical rods (8) are arranged at two sides of the protective housing and the cutting liquid box (18), each side is provided with two, the vertical rods (8) are provided with limiting holes and sliding grooves, an installation block (9) is arranged between the magnifying glass, the cutting machine (14) and the laser cutting machine (16) and the vertical rods (8), the installation block (9) is provided with installation holes and sliding blocks, and a bolt (13) is arranged between the installation holes, the mounting block (9) is inserted into the sliding groove through the sliding block, the bolt (13) is inserted into the mounting hole and the limiting hole and is mounted on the vertical rod (8), a magnifier telescopic rod (20) is arranged between the magnifier (21) and the mounting block (9) to be connected, a first telescopic rod (11) and a second telescopic rod (12) are arranged between the cutting machine (14) and the mounting block (9) to be connected, a third telescopic rod and a fourth telescopic rod (19) are arranged between the laser cutting machine (16) and the mounting block (9) to be connected, the cutting machine (14) and the laser cutting machine (16) are positioned at the rear side of the magnifier (21), connecting holes are formed in the first telescopic rod (11), the second telescopic rod (12), the third telescopic rod (17) and the fourth telescopic rod (19), and the connecting hole between the first telescopic rod (11) and the second telescopic rod (12) is provided with the bolt (13) to be connected, connecting hole between third telescopic link (17) and fourth telescopic link (19) is equipped with bolt (13) and connects, install on microscope telescopic link (24) microscope (26), be equipped with the mounting hole on microscope telescopic link (24), be equipped with bolt (13) between the mounting hole on microscope (26) and microscope telescopic link (24) and be connected, the one end of microscope telescopic link (24) is equipped with the connecting hole, be equipped with bolt (13) between the connecting hole of microscope (26) and the spacing hole on montant (8) and be connected, microscope (26) are located cutting machine (14) and laser cutting machine (14) front side.
2. The accurate cutting device of a semiconductor wafer according to claim 1, characterized in that the object placing table (22) is provided with a mounting groove (27), the mounting groove (27) is a cross-shaped mounting groove, and the mounting groove (27) is provided with a clamping block (23).
3. The semiconductor wafer precise cutting device according to claim 1, wherein the vertical rod (8), the base (1), the object placing table (22), the supporting base (4), the magnifying lens telescopic rod (20), the microscope telescopic rod (24), the first telescopic rod (11), the second telescopic rod (12), the third telescopic rod (17) and the fourth telescopic rod (19) are all made of forged steel, and a lubricant is coated between the balance adjusting rod (3) and the adjusting nut (28).
4. The semiconductor wafer precision cutting device as claimed in claim 1, wherein a shock-proof pad is arranged between the cutting machine (14) and the second telescopic rod (12).
5. The accurate cutting device for the semiconductor wafers as claimed in any one of claims 1 to 4, wherein a first limit block (10) and a bolt opening are arranged on the vertical rod (8), a bolt rod is arranged on the first limit block (10), the bolt opening is located at the top of the vertical rod (8), and the first limit block (10) is installed on the vertical rod (8) through the bolt rod and the bolt opening.
6. The semiconductor wafer precision cutting device according to claim 5, wherein a second limit block (25) and a fixing opening are arranged on the microscope telescopic rod (24), the fixing opening and the second limit block (25) are located at one end of the microscope telescopic rod (24) far away from the connecting hole, a bolt rod is arranged on the second limit block (25), and the second limit block (25) is installed on the microscope telescopic rod (24) through the bolt rod and the fixing opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022442946.7U CN214212616U (en) | 2020-10-29 | 2020-10-29 | Accurate cutting device of semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022442946.7U CN214212616U (en) | 2020-10-29 | 2020-10-29 | Accurate cutting device of semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214212616U true CN214212616U (en) | 2021-09-17 |
Family
ID=77695623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022442946.7U Expired - Fee Related CN214212616U (en) | 2020-10-29 | 2020-10-29 | Accurate cutting device of semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214212616U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114211132A (en) * | 2021-11-11 | 2022-03-22 | 江苏富乐德石英科技有限公司 | Processing method of quartz wafer |
-
2020
- 2020-10-29 CN CN202022442946.7U patent/CN214212616U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114211132A (en) * | 2021-11-11 | 2022-03-22 | 江苏富乐德石英科技有限公司 | Processing method of quartz wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210917 |
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| CF01 | Termination of patent right due to non-payment of annual fee |