CN214212520U

CN214212520U - Reflow soldering device for SMT

Info

Publication number: CN214212520U
Application number: CN202022884828.1U
Authority: CN
Inventors: 张法松; 沈雅芬; 安宏远; 顾书强; 董克君
Original assignee: Zhejiang Lingjie Intelligent Control Technology Co ltd
Current assignee: Zhejiang Lingjie Intelligent Control Technology Co ltd
Priority date: 2020-12-05
Filing date: 2020-12-05
Publication date: 2021-09-17
Anticipated expiration: 2030-12-05

Abstract

The utility model discloses a reflow soldering device for SMT belongs to SMT production line technical field, which comprises a frame, the frame lateral wall rotates connects the hinge, the hinge lateral wall rotates connects the apron. When the circuit board goes wrong, pulling handle a rotates through the hinge and drives the apron and begin, the buckle of apron one side can leave the cavity from the spout in the baffle outside, then drive the connecting plate through rotating the axis of rotation and remove inside the recess and withstand the apron, drive the connecting plate through the axis of rotation after having changed and leave in the recess, close the apron after that, the buckle can remove inside the cavity along the spout of baffle one side, the buckle fixes the apron through baffle compression spring, it leaves inside the fixed slot to drive L type kelly earlier through rotating the rotation axis, after leaving inside the frame through handle b pulling heating pipe, after having maintained, it gets back to the normal position to pull handle b and drive the heating pipe, then it fixes the heating pipe inside entering the fixed slot through rotating the rotation axis and driving L type kelly.

Description

Reflow soldering device for SMT

Technical Field

The utility model relates to a SMT production line technical field especially relates to a reflow soldering device for SMT.

Background

The SMT production line, also called surface mount technology, is a new generation of electronic assembly technology developed from hybrid integrated circuit technology, and is characterized by adopting component surface mount technology and reflow soldering technology, and thus becomes a new generation of assembly technology in electronic product manufacturing. The SMT production line equipment comprises reflow soldering equipment. The reflow soldering device is internally provided with a heating circuit which heats air or nitrogen to a high enough temperature and blows the heated air or nitrogen to a circuit board on which the element is stuck, so that solder on two sides of the element is melted and then is bonded with the mainboard. General reflow soldering equipment if the circuit board goes wrong in circuit board entering equipment back, is inconvenient takes out the circuit board from equipment in, dismantles equipment and takes out circuit board and can waste a large amount of time, influences production efficiency.

Patent No. CN201922404929.1 discloses a reflow soldering device for in SMT production, including quick-witted case, baffle, frame and transmission shaft, set up flutedly in the middle of the quick-witted case upper surface, rotate through the pivot respectively on the quick-witted case at both ends around the recess and be connected with the both ends of transmission shaft, quick-witted case upper surface and frame bottom fixed connection, the frame openly rotates through hinge and baffle top to be connected, be fixed with second hasp and first hasp respectively in the frame at both ends about the baffle, the baffle is fixed with the frame through second hasp and first hasp respectively, the frame back has the connecting plate through the screw fixation, be fixed with the heating pipe on the connecting plate, and the heating pipe stretches into in the frame. The utility model has the advantages of the baffle that can open is set up on the equipment, is convenient for take out the circuit board that gets into in the equipment, raises the efficiency.

The reflow soldering device used in SMT production of the technology has the following disadvantages: 1. the device has a complex structure and high cost, and is not suitable for popularization; 2. the device is relatively extravagant physical power when dismantling the heating pipe, for this reason, we propose a reflow soldering device for SMT.

SUMMERY OF THE UTILITY MODEL

The utility model provides a reflow soldering device for SMT, when the circuit board in the equipment goes wrong, need to be changed, pulling handle a drives the apron through the hinge rotation and begins, the buckle of apron one side can leave the cavity from the spout outside the baffle, then drive the connecting plate through rotating the axis of rotation and move to the recess inside to withstand the apron, can conveniently change the circuit board, after changing, drive the connecting plate through the axis of rotation and leave in the recess, then close the apron, the buckle can move to the cavity inside along the spout of baffle one side, the buckle fixes the apron through baffle compression spring, such advantage is when needing to change the circuit board, be convenient for open and support the apron, it is convenient for maintenance personnel to change the apron, need not support the apron with the hand, save physical power, when needing to maintain or change the heating pipe, drive L type kelly through rotating the axis of rotation and leave the fixed slot inside first, inside leaving the frame through handle b pulling heating pipe after that, maintain or change the heating pipe, maintain good back, pull handle b and drive the heating pipe and get back to the normal position, drive L type kelly through rotating the rotation axis and enter into the fixed slot inside and fix the heating pipe after that, such benefit is not only convenient for fix also convenient to detach the heating pipe, can practice thrift maintenance time.

The utility model provides a specific technical scheme as follows:

the utility model provides a pair of reflow soldering device for SMT, which comprises a frame, the frame lateral wall rotates and connects the hinge, the hinge lateral wall rotates and connects the apron, apron one side fixed connection handle a, the inside cavity that is provided with of frame, cavity one side fixed connection spring, spring one end fixed connection baffle, the baffle lateral wall is provided with the spout, spout lateral wall sliding connection buckle, the axis of rotation is installed to apron one side, the axis of rotation lateral wall rotates the connection connecting plate, frame one side fixed connection bracing piece, bracing piece one end fixed connection fixing base, fixing base lateral wall through connection rotation axis, rotation axis lateral wall through connection L type kelly, frame one side fixed connection fixed block, fixed block one side fixed connection handle b.

Optionally, a fixing groove is formed at the joint of the L-shaped clamping rod and the fixing block.

Optionally, a groove is arranged at the joint of the cavity and the connecting plate.

Optionally, a heating pipe is placed inside the machine frame.

Optionally, a sliding groove is arranged at the joint of the heating pipe and the frame.

The utility model has the advantages as follows:

the embodiment of the utility model provides a reflow soldering device for SMT:

1. the utility model is composed of a hinge, a handle a, a spring, a baffle, a chute, a buckle, a rotating shaft, a connecting plate and a groove, when the circuit board in the equipment has problems and needs to be replaced, the handle a is pulled to rotate through the hinge to drive the cover plate, the buckle at one side of the cover plate can leave the cavity from the chute at the outer side of the baffle plate, then the rotating shaft is rotated to drive the connecting plate to move into the groove to prop against the cover plate, the circuit board can be conveniently replaced, after the replacement, the rotating shaft drives the connecting plate to leave the groove, then the cover plate is closed, the buckle can move into the cavity along the sliding groove at one side of the baffle plate, the buckle fixes the cover plate through the baffle plate compression spring, such benefit is to when needing to change the circuit board, is convenient for open and support the apron, makes things convenient for maintenance personal to change the apron, need not support the apron with the hand, saves physical power.

2. The utility model discloses a rotation axis, L type kelly, fixed slot and handle b, when needs maintain or change the heating pipe, it leaves inside the fixed slot to drive L type kelly earlier through rotating the rotation axis, inside leaving the frame through handle b pulling heating pipe after that, maintain or change the heating pipe, maintain good back, it gets back to the normal position to pull handle b and drive the heating pipe, it fixes the heating pipe to enter into the fixed slot inside through rotating the rotation axis after that, such benefit is the fixed also convenient to detach of heating pipe of both being convenient for, can practice thrift maintenance duration.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic overall structure diagram of a reflow soldering apparatus for SMT according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of the inside of a cavity of a reflow soldering apparatus for SMT according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a connection plate of a reflow soldering apparatus for SMT according to an embodiment of the present invention.

In the figure: 1. a frame; 2. a cover plate; 3. a hinge; 4. a handle a; 5. a cavity; 6. a spring; 7. a baffle plate; 8. a chute; 9. buckling; 10. a rotating shaft; 11. a connecting plate; 12. a groove; 13. a support bar; 14. a fixed seat; 15. a rotating shaft; 16. an L-shaped clamping rod; 17. a fixed block; 18. fixing grooves; 19. a handle b; 20. heating the tube.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

A reflow soldering apparatus for SMT according to an embodiment of the present invention will be described in detail with reference to fig. 1 to 3.

Referring to fig. 1 to 3, a reflow soldering apparatus for SMT provided by an embodiment of the present invention includes a frame 1, a hinge 3 is rotatably connected to the outer side wall of the frame 1, a cover plate 2 is rotatably connected to the outer side wall of the hinge 3, a handle a4 is fixedly connected to one side of the cover plate 2, a cavity 5 is provided inside the frame 1, a spring 6 is fixedly connected to one side of the cavity 5, one end of the spring 6 is fixedly connected to a baffle 7, the outer side wall of the baffle 7 is provided with a chute 8, a buckle 9 is slidably connected to the outer side wall of the chute 8, a rotating shaft 10 is installed on one side of the cover plate 2, the outer side wall of the rotating shaft 10 is rotatably connected to a connecting plate 11, a support rod 13 is fixedly connected to one side of the frame 1, a fixing seat 14 is fixedly connected to one end of the support rod 13, the outer side wall of the fixing seat 14 is connected to a rotating shaft 15, the outer side wall of the rotating shaft 15 is connected to an L-shaped clamping rod 16, one side of the frame 1 is fixedly connected with a fixed block 17, and one side of the fixed block 17 is fixedly connected with a handle b 19.

Illustratively, when a problem occurs in a circuit board inside the equipment, the circuit board needs to be replaced, the cover plate 2 is driven by pulling the handle a4 through the hinge 3, the buckle 9 on one side of the cover plate 2 leaves the cavity 5 from the chute 8 on the outer side of the baffle 7, then the connecting plate 11 is driven to move into the groove 12 through rotating the rotating shaft 10 to abut against the cover plate 2, the circuit board can be replaced conveniently, the connecting plate 11 is driven to leave the groove 12 through the rotating shaft 10 after replacement, then the cover plate 2 is closed, the buckle 9 moves into the cavity 5 along the chute 8 on one side of the baffle 7, the buckle 9 fixes the cover plate 2 through the baffle 7 compressing the spring 6, when the heating pipe 20 needs to be repaired or replaced, the L-shaped clamping rod 16 is driven to leave the fixing groove 18 through rotating the rotating shaft 15, then the heating pipe 20 is pulled to leave the rack 1 through the handle b19, the heating pipe 20 is repaired or replaced, after maintenance, the handle b19 is pulled to drive the heating pipe 20 to return to the original position, and then the rotating shaft 15 is rotated to drive the L-shaped clamping rod 16 to enter the fixing groove 18 to fix the heating pipe 20.

Referring to fig. 1, a fixing groove 18 is formed at a connection portion of the L-shaped clamping bar 16 and the fixing block 17.

Illustratively, the L-shaped clamping rod 16 is convenient to fix the heating tube 20.

Referring to fig. 3, a groove 12 is formed at the connection position of the cavity 5 and the connecting plate 11.

Illustratively, it is convenient to support the groove 12.

Referring to fig. 1, a heating pipe 20 is placed inside the housing 1.

Illustratively, heating of nitrogen or air is facilitated.

Referring to fig. 1, a sliding groove is formed at the connection position of the heating pipe 20 and the frame 1.

Illustratively, removal of the heating tube 20 is facilitated.

When the circuit board needs to be replaced when a problem occurs in the circuit board inside the equipment, the circuit board needs to be replaced, the cover plate 2 is driven by pulling the handle a4 to rotate through the hinge 3, the buckle 9 on one side of the cover plate 2 can leave the cavity 5 from the chute 8 on the outer side of the baffle 7, then the connecting plate 11 is driven to move into the groove 12 by rotating the rotating shaft 10 to prop against the cover plate 2, the circuit board can be conveniently replaced, after the circuit board needs to be replaced, the connecting plate 11 is driven to leave the groove 12 through the rotating shaft 10, then the cover plate 2 is closed, the buckle 9 can move into the cavity 5 along the chute 8 on one side of the baffle 7, the cover plate 2 is fixed by the buckle 9 through the baffle 7 and the compression spring 6, the advantage is that when the circuit board needs to be replaced, the cover plate 2 can be conveniently opened and supported, a maintenance worker can replace the cover plate without supporting the cover plate 2 by hands, the physical strength is saved, when the heating pipe 20 needs to be maintained or replaced, it leaves inside fixed slot 18 to drive L type kelly 16 through rotating rotation axis 15 earlier, it leaves inside frame 1 to pull heating pipe 20 through handle b19 after that, maintain or change heating pipe 20, after the maintenance is good, it drives heating pipe 20 and gets back to the normal position to drag handle b19, it fixes heating pipe 20 inside entering fixed slot 18 through rotating rotation axis 15 to drive L type kelly 16 after that, such benefit is both convenient for fix also convenient to detach heating pipe 20, maintenance time can be practiced thrift, heating pipe 20's model RQ.

It should be noted that the utility model relates to a reflow soldering device for SMT, which comprises a frame 1; 2. a cover plate; 3. a hinge; 4. a handle a; 5. a cavity; 6. a spring; 7. a baffle plate; 8. a chute; 9. buckling; 10. a rotating shaft; 11. a connecting plate; 12. a groove; 13. a support bar; 14. a fixed seat; 15. a rotating shaft; 16. an L-shaped clamping rod; 17. a fixed block; 18. fixing grooves; 19. a handle b; 20. the heating tube and the components are all standard parts or parts known to those skilled in the art, and the structure and principle of the heating tube and the components are known to those skilled in the art through technical manuals or through routine experiments.

It is apparent that those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Thus, if such modifications and variations of the embodiments of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. The reflow soldering device for the SMT comprises a rack (1) and is characterized in that a hinge (3) is rotatably connected to the outer side wall of the rack (1), a cover plate (2) is rotatably connected to the outer side wall of the hinge (3), a handle a (4) is fixedly connected to one side of the cover plate (2), a cavity (5) is arranged inside the rack (1), a spring (6) is fixedly connected to one side of the cavity (5), a baffle (7) is fixedly connected to one end of the spring (6), a sliding chute (8) is arranged on the outer side wall of the baffle (7), a buckle (9) is slidably connected to the outer side wall of the sliding chute (8), a rotating shaft (10) is installed on one side of the cover plate (2), a connecting plate (11) is rotatably connected to the outer side wall of the rotating shaft (10), a supporting rod (13) is fixedly connected to one side of the rack (1), and a fixing seat (14) is fixedly connected to one end of the supporting rod (13), fixing base (14) lateral wall through connection rotation axis (15), rotation axis (15) lateral wall through connection L type kelly (16), frame (1) one side fixed connection fixed block (17), fixed block (17) one side fixed connection handle b (19).

2. A reflow soldering apparatus for SMT according to claim 1, wherein a fixing groove (18) is disposed at a connection position of the L-shaped clamping bar (16) and the fixing block (17).

3. A reflow soldering apparatus for SMT according to claim 2, wherein a recess (12) is provided where the cavity (5) and the connection plate (11) are connected.

4. A reflow soldering apparatus for SMT according to claim 3, wherein a heating tube (20) is placed inside the frame (1).

5. Reflow soldering apparatus for SMT according to claim 4, wherein the heating tube (20) is provided with a sliding groove at its connection with the frame (1).