CN214210217U - Polishing solution preparation device - Google Patents
Polishing solution preparation device Download PDFInfo
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- CN214210217U CN214210217U CN202023186287.1U CN202023186287U CN214210217U CN 214210217 U CN214210217 U CN 214210217U CN 202023186287 U CN202023186287 U CN 202023186287U CN 214210217 U CN214210217 U CN 214210217U
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Abstract
The utility model provides a polishing solution configuration device, including operation platform and the agitator of setting on operation platform, be equipped with one-level puddler and second grade puddler in the agitator, one-level puddler and second grade puddler link to each other with the motor, the agitator below is equipped with gaseous release, and gaseous release links to each other with air compressor. According to the invention, a frame type stirrer, a linear stirrer and a spiral stirrer are combined, gas bubbling stirring is combined, the combination of the frame type stirrer and the linear stirrer can realize the rapid uniform mixing of a relatively viscous liquid, and the spiral stirrer can quickly bring a bottom grinding material to the middle part of a stirring barrel, so that axial exchange is enhanced, and up-and-down circulation is realized. The utility model discloses can realize the flash mixed even of different consistency polishing solutions, different thickness abrasive polishing solutions, avoid the canning solid content difference between the packaging unit to appear.
Description
Technical Field
The invention relates to the field of liquid preparation, in particular to a polishing solution preparation device.
Background
In recent years, rapid development of 5G technology has placed higher demands on polishing of semiconductor wafers. The polishing liquid, particularly the diamond grinding liquid and the alumina polishing liquid, is widely applied to polishing sapphire and silicon carbide wafers. One common problem with these polishing solutions is: the difference of the abrasive solid content among different packaging units is large, and particularly, the abrasive solid content of the packaging unit which is canned firstly is high, and the abrasive solid content of the later canned is low. If the viscosity of the polishing solution is low, the abrasive is thicker, and the solid content is high, so that the difference between packaging units is more obvious, the removal rate in the wafer polishing process is unstable, and the wafer polishing efficiency and the surface quality are influenced. Although there are some chinese patents: CN205613356U discloses an alumina polishing solution preparing apparatus, which can achieve dispersion, classification and filtration of alumina powder, but the above problems still exist, so that the polishing effect and removal rate of the wafer can be improved with half the effort starting from improving the homogenizing apparatus in the polishing solution preparing process.
Disclosure of Invention
The invention provides a polishing solution preparation device, which can realize the uniform preparation of polishing solutions with different viscosities and different thicknesses, realizes no difference in the solid content of abrasive materials among different packaging units, is simple and easy to realize, and has an effect superior to that of a common stirring device sold on the market.
The technical scheme for realizing the invention is as follows:
the utility model provides a polishing solution configuration device, includes operation platform and the agitator of setting on operation platform, be equipped with one-level puddler and second grade puddler in the agitator, one-level puddler and second grade puddler link to each other with the motor, the agitator below is equipped with gaseous release, and gaseous release links to each other with air compressor.
The material of the first-level stirring rod is stainless steel, polytetrafluoroethylene is sprayed on the surface of the first-level stirring rod, the first-level stirring rod is a combination of a frame type stirrer and a linear stirrer, and various polishing solutions with different viscosities and different thicknesses of grinding materials can be stirred. The material of second grade puddler be stainless steel, surface spraying polytetrafluoroethylene is spiral agitator, can lift the abrasive material that deposits in the bottom of the bucket fast, be convenient for the homogeneous mixing.
The stirring barrel is made of stainless steel, and polytetrafluoroethylene is sprayed inside the stirring barrel.
The motor is arranged above the stirring barrel, and a stirring rod rotating speed controller is arranged on the motor.
The upper end of the stirring barrel is provided with a feeding port, and the side surface and the bottom of the stirring barrel are provided with observation windows.
The air releasing device is internally provided with a cavity, the upper end of the air releasing device is provided with an air hole, the air hole is communicated with the cavity, the air releasing device is also provided with an air pipe connector, and the air pipe connector is connected with an air compressor through an air pipe.
The bottom of the stirring barrel is uniformly distributed with a gas releasing device, and the size of the gas holes uniformly distributed on the gas releasing device is 0.1-1.0 mm. The liquid outlet valve is a one-way valve, and only can flow out liquid but cannot flow in liquid; the liquid outlet valve is arranged on the pipe section at the bottom of the stirring barrel.
And a liquid receiving hose is arranged below the stirring barrel, and a liquid outlet valve is arranged on the liquid receiving hose.
And an air pressure regulating valve is arranged on the air pipe.
The invention has the beneficial effects that: according to the invention, a frame type stirrer, a linear stirrer and a spiral stirrer are combined, gas bubbling stirring is combined, the combination of the frame type stirrer and the linear stirrer can realize the rapid uniform mixing of a relatively viscous liquid, and the spiral stirrer can quickly bring a bottom grinding material to the middle part of a stirring barrel, so that axial exchange is enhanced, and up-and-down circulation is realized. The gas bubbling device is opened as required, the abrasive to be sunk or deposited can be blown, and the blowing strength is adjusted by the air pressure adjusting valve. The utility model discloses can realize the flash mixed even of different consistency polishing solutions, different thickness abrasive polishing solutions, avoid the canning solid content difference between the packaging unit to appear.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 and 3 are schematic structural views of the gas release device.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments of the present invention, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
As shown in fig. 1, a polishing solution configuration device, including operation platform 1 and agitator 2 of setting on operation platform 1, be equipped with one-level puddler 4 and second grade puddler 5 in agitator 2, one-level puddler 4 and second grade puddler 5 link to each other with motor 3, and motor 3 installs the lid central point at agitator 2 and puts, is equipped with puddler speed controller 14 on motor 3, agitator 2 below is equipped with gaseous release 13, and gaseous release 13 links to each other with air compressor 8, and pressure regulating valve 12 is located trachea 6, equipartition gas pocket 7 on the gaseous release 13 in agitator 2 bottom. The bubbling pressure is determined according to the thickness of the abrasive in the polishing liquid and the viscosity of the polishing liquid system.
The working principle of the utility model is as follows: opening a feeding port 15 arranged at the upper end of the stirring barrel 2, adding weighed water into the stirring barrel 2, opening the motor 3, adjusting the rotating speed of the stirring rod according to the particle size of the powder and the viscosity of the polishing solution system, adjusting a rotating speed controller 15 of the stirring rod, sequentially adding other components of the polishing solution, and adding powder abrasive materials (such as diamond, alumina, silicon carbide, boron carbide, iron oxide, cerium oxide, zirconium oxide and the like) after uniformly stirring. After stirring for a period of time, the air compressor 8 is opened, the air pressure regulating valve 12 on the air pipe 6 is regulated, as shown in fig. 2, a cavity 16 is arranged inside the gas releasing device 13, the upper end of the gas releasing device 13 is provided with an air hole 7, the air hole 7 is communicated with the cavity 16, the air pipe connector 17 is further arranged on the gas releasing device 13, and the air pipe connector 17 is connected with the air compressor 8 through the air pipe 6. The gas enters the cavity 16 and then is blown out from the air holes 7, bubbles begin to bubble on the surface of the gas releasing device 13, and the bubbling pressure and the stirring state of the polishing solution are observed through the observation window 11. After stirring for a period of time, the liquid outlet valve 9 is opened and canning is carried out through the liquid receiving hose 10.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (8)
1. The utility model provides a polishing solution configuration device, includes operation platform (1) and agitator (2) of setting on operation platform (1), its characterized in that: be equipped with one-level puddler (4) and second grade puddler (5) in agitator (2), one-level puddler (4) and second grade puddler (5) link to each other with motor (3), agitator (2) below is equipped with gas release device (13), and gas release device (13) link to each other with air compressor (8).
2. The polishing solution preparing apparatus according to claim 1, wherein: the motor (3) is arranged above the stirring barrel (2), and a stirring rod rotating speed controller (14) is arranged on the motor (3).
3. The polishing solution preparing apparatus according to claim 1, wherein: the upper end of the stirring barrel (2) is provided with a feeding port (15), and the side surface and the bottom are provided with observation windows (11).
4. The polishing solution preparing apparatus according to claim 1, wherein: the air compressor is characterized in that a cavity (16) is arranged inside the air release device (13), an air hole (7) is formed in the upper end of the air release device (13), the air hole (7) is communicated with the cavity (16), an air pipe connector (17) is further arranged on the air release device (13), and the air pipe connector (17) is connected with the air compressor (8) through an air pipe (6).
5. The polishing solution preparing apparatus according to claim 1, wherein: a liquid receiving hose (10) is arranged below the stirring barrel (2), and a liquid outlet valve (9) is arranged on the liquid receiving hose (10).
6. The polishing solution preparing apparatus according to claim 4, wherein: and an air pressure regulating valve (12) is arranged on the air pipe (6).
7. The polishing solution dispensing apparatus according to any one of claims 1 to 6, wherein: the primary stirring rod (4) is a combination of a frame type stirrer and a linear stirrer, and a polytetrafluoroethylene layer is arranged on the surface of the primary stirring rod.
8. The polishing solution preparing apparatus according to claim 7, wherein: the second-stage stirring rod (5) is a spiral stirrer, and a polytetrafluoroethylene layer is arranged on the surface of the second-stage stirring rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023186287.1U CN214210217U (en) | 2020-12-26 | 2020-12-26 | Polishing solution preparation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023186287.1U CN214210217U (en) | 2020-12-26 | 2020-12-26 | Polishing solution preparation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214210217U true CN214210217U (en) | 2021-09-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202023186287.1U Active CN214210217U (en) | 2020-12-26 | 2020-12-26 | Polishing solution preparation device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114515979A (en) * | 2022-02-28 | 2022-05-20 | 上海应用技术大学 | Magnetorheological polishing device for high-precision polishing |
| CN115448344A (en) * | 2022-09-02 | 2022-12-09 | 苏州博来纳润电子材料有限公司 | Composite nano-alumina and preparation method and application thereof |
-
2020
- 2020-12-26 CN CN202023186287.1U patent/CN214210217U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114515979A (en) * | 2022-02-28 | 2022-05-20 | 上海应用技术大学 | Magnetorheological polishing device for high-precision polishing |
| CN114515979B (en) * | 2022-02-28 | 2024-01-30 | 上海应用技术大学 | Magnetorheological polishing device for high-precision polishing |
| CN115448344A (en) * | 2022-09-02 | 2022-12-09 | 苏州博来纳润电子材料有限公司 | Composite nano-alumina and preparation method and application thereof |
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