CN214203727U

CN214203727U - Oven and LED wafer for visible light communication

Info

Publication number: CN214203727U
Application number: CN202120387996.1U
Authority: CN
Inventors: 马璐; 张振; 袁小松; 张森森
Original assignee: Focus Lightings Technology Suqian Co ltd
Current assignee: Focus Lightings Technology Suqian Co ltd
Priority date: 2021-02-20
Filing date: 2021-02-20
Publication date: 2021-09-14
Anticipated expiration: 2031-02-20

Abstract

The utility model provides an oven and visible light communication are with LED wafer, the oven includes: the device comprises a shell, a first fixing piece and a second fixing piece, wherein a cavity is arranged inside the shell; an ultraviolet light source disposed on at least one surface of the housing and within the chamber; the LED wafer for visible light communication is placed in the cavity, and the ultraviolet light source irradiates ultraviolet light to the surface of the LED wafer for visible light communication.

Description

Oven and LED wafer for visible light communication

Technical Field

The utility model relates to an industrial drying equipment, more specifically say, about an oven and LED wafer for visible light communication.

Background

Under the requirements of the high-efficiency energy-saving era and the emerging economy, the LED chip for visible light communication has the advantages of low energy consumption, small volume, long service life, environmental protection and the like, and can realize the function of visible light wireless communication while giving consideration to illumination. In the manufacturing and packaging process of the LED chip for visible light communication, a plurality of high-temperature drying processes are required, the high-temperature drying processes are mainly realized in an oven, and the purpose of removing water vapor or evaporating a solvent on the surface of the LED chip for visible light communication is achieved by generating a high-temperature environment through a fan and a heating element in the oven.

However, in the process of manufacturing the LED chip for visible light communication, organic substances usually remain on the surface of the wafer, and the remaining organic substances contaminate the LED chip for visible light communication on the wafer or cause other undesirable losses in the subsequent packaging and wire bonding.

SUMMERY OF THE UTILITY MODEL

The utility model provides a problem, current high temperature toasts the surface organic matter that the processing procedure can not get rid of the wafer, leads to remaining organic matter to pollute the LED chip for the communication of wafer visible light, perhaps brings the problem of other harmful losses to follow-up encapsulation routing.

In order to solve the above problem, the utility model provides an oven, the oven includes: the device comprises a shell, a first fixing piece and a second fixing piece, wherein a cavity is arranged inside the shell; an ultraviolet light source disposed on at least one surface of the housing and within the chamber; the LED wafer for visible light communication is placed in the cavity, and the ultraviolet light source irradiates ultraviolet light to the surface of the LED wafer for visible light communication.

As an optional technical scheme, the wavelength range of the ultraviolet light source is 100nm-350 nm.

As an optional technical solution, the housing is a polyhedral structure, and the ultraviolet light source is disposed on at least one surface of the polyhedral structure.

As an optional technical solution, the ultraviolet light source includes a plurality of ultraviolet lamps, and the plurality of ultraviolet lamps are uniformly distributed on at least one surface of the polyhedral structure.

As an optional technical solution, the ultraviolet light source includes a plurality of ultraviolet lamp beads, and the plurality of ultraviolet lamp beads are disposed on at least one surface of the polyhedral structure.

As an optional technical scheme, the ultraviolet light source further comprises a circuit board, and the plurality of ultraviolet lamp beads are electrically connected to the circuit board to form a planar light source.

As an optional technical scheme, the distribution density of the ultraviolet lamp beads on the circuit board is increased from the edge of the circuit board to the center of the circuit board.

As a selectable technical scheme, the air conditioner further comprises a fan and a heating device, the shell further comprises an air inlet and an air outlet, and the fan is arranged close to the air inlet.

As an optional technical solution, the ultraviolet light source includes a first ultraviolet light source and a second ultraviolet light source, and a wavelength of ultraviolet light provided by the first ultraviolet light source is different from a wavelength of ultraviolet light provided by the second ultraviolet light source.

The utility model also provides a LED wafer is used in the visible light communication, the LED wafer is used in the visible light communication is remaining organic matter on the surface is got rid of through foretell oven.

Compared with the prior art, the utility model provides an oven and LED wafer for visible light communication, including ultraviolet source, clear away the remaining organic matter in LED wafer surface for visible light communication by ultraviolet source, have following advantage at least: 1) the method adopts a non-cleaning reagent contact mode, can be carried out in the air and does not need to be dried after cleaning; 2) organic pollutants remained on the surface of the LED wafer for visible light communication can be thoroughly removed; 3) the problems of solvent volatilization and waste solvent treatment are solved; 4) the high reliability and the high yield of the processed LED wafer for visible light communication are ensured; 5) the uniformity of removing the organic matters remained on the surface of the LED wafer for visible light communication is consistent.

The present invention will be described in detail with reference to the accompanying drawings and specific embodiments, but the present invention is not limited thereto.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of an oven according to an embodiment of the present invention.

Fig. 2 is a schematic view of an oven according to another embodiment of the present invention.

Fig. 3 is a schematic view of an ultraviolet light source according to another embodiment of the present invention.

Fig. 4 is a schematic diagram of an ultraviolet light source according to another embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the following embodiments and accompanying drawings. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

As shown in fig. 1, in one embodiment of the present invention, an oven 100 is provided, which includes a housing 10 and an ultraviolet light source 20, wherein a cavity is disposed inside the housing 10; the ultraviolet light source 20 is disposed on at least one surface of the housing 10, and the ultraviolet light source 20 is located in the chamber; when the LED wafer for visible light communication is placed in the cavity, the ultraviolet light source 20 irradiates ultraviolet light onto the surface of the LED wafer for visible light communication.

The utility model discloses in, add ultraviolet source 20 in oven 100, utilize the ultraviolet ray that ultraviolet source 20 provided in order to remove the organic matter that remains on the LED wafer surface for visible light communication, especially remain the photosensitive organic matter on the LED wafer surface for visible light communication.

The ultraviolet light source 20 provides ultraviolet light in the wavelength range of 100nm to 350nm, preferably 185nm to 254 nm. When the wavelength of 100nm-350nm is irradiated to the surface of the LED wafer, the residual hydrocarbon organic compound on the surface of the LED wafer for visible light communication and oxygen in the air simultaneously absorb ultraviolet rays with the wavelength of 100nm-350nm, the residual organic matters adhered to the surface of the LED wafer for visible light communication are removed by utilizing the photosensitive oxidation effect of the organic compound, and the problem of residual organic matters on the surface of the LED wafer for visible light communication after high-temperature baking treatment can be effectively solved.

Specifically, the hydrocarbon organic compound remaining on the surface of the LED wafer for visible light communication readily absorbs energy emitted by ultraviolet rays having a wavelength of 185nm, and is decomposed into ions, free atoms, excited molecules, and neutrons. Meanwhile, oxygen molecules in the air generate ozone and atomic oxygen after absorbing ultraviolet rays with the wavelength of 254 nm. Ozone also has a strong absorption effect on ultraviolet rays with a wavelength of 254nm, and ozone is decomposed into atomic oxygen and oxygen. In the method, under the action of extremely active atomic oxygen, the decomposed substances of carbon and hydrocarbon on the surface of the LED wafer for visible light communication are further converted into volatile carbon dioxide, water and the like, and are escaped from the surface of the LED wafer for visible light communication, so that organic matters adhered to the surface of the LED wafer for visible light communication are thoroughly removed.

In a preferred embodiment of the present invention, the ultraviolet light source 20 includes a first ultraviolet light source 21 and a second ultraviolet light source 22, and the wavelength of the ultraviolet light provided by the first ultraviolet light source 21 is different from the wavelength of the ultraviolet light provided by the second ultraviolet light source 22. The first ultraviolet light source 21 and the second ultraviolet light source 22 are alternately arranged, and preferably, the wavelength of the ultraviolet light provided by the first ultraviolet light source 21 is about 185nm, and the wavelength of the ultraviolet light provided by the second ultraviolet light source 22 is about 254 nm.

By alternately arranging the ultraviolet light sources in different wavelength ranges, ultraviolet rays which are easily absorbed by organic matters and ultraviolet rays which are easily absorbed by oxygen in the air are simultaneously provided, the decomposition of the organic matters is accelerated, the concentration of active oxygen is improved, the removal efficiency of residual organic matters on the LED wafer for visible light communication is higher, and the removal effect is better.

In the present embodiment, the first ultraviolet light source 21 and the second ultraviolet light source 22 are respectively provided in plural numbers and are uniformly and alternately arranged along the long side direction of the top surface 11 of the housing 10. The first ultraviolet light source 21 and the second ultraviolet light source 22 are ultraviolet lamps, respectively. That is, when a plurality of ultraviolet lamps are employed as the ultraviolet light source, the plurality of ultraviolet lamps are uniformly distributed on at least one surface of the housing 10.

In other embodiments of the present invention, the first uv light source and the second uv light source may be arranged non-alternately, for example, may be arranged on two surfaces of the housing respectively, the two surfaces include two adjacent surfaces and two opposite surfaces; alternatively, the first ultraviolet light source is arranged first and then the second ultraviolet light source is arranged in the direction along the long side or the short side of one surface of the housing.

With continued reference to fig. 1, the housing 10 is generally of a hexahedral configuration, including opposing top and

bottom surfaces

11, 12, left and

right side surfaces

13, 14, and front and

rear side surfaces

15, 16; the front side surface 15 is close to the user, and therefore, an open opening (not shown) is often formed at the front side surface 15, and a door body (not shown) is provided at the front side of the open opening, and the door body can be opened or closed relative to the open opening.

The ultraviolet light source 20 is provided on the top surface 11, for example, and irradiates the surface of the LED wafer for visible light communication from above. It should be noted that the shape of the housing 10 of the oven 100 is not limited to a hexahedral structure, and may be any other polyhedral structure. However, the housing is designed to have a hexahedral structure, which has the advantages of easy manufacture and low manufacturing cost.

The rear side 16 of the housing 10 is provided with a fan 30 and a heating device 40, the fan 30 connects the chamber inside the housing 10 to the outside environment, the fan 30 is close to an air inlet (arranged) on the housing 10, and the air inlet is located on the rear side 16. The air outlet 50 is disposed on the rear side surface 16, and organic substances remaining on the surface of the LED wafer for visible light communication irradiated by the ultraviolet light source 20 are decomposed to form carbon dioxide and water, and are discharged from the air outlet 50 to the outside of the housing 10 under the combined action of the fan 30 and the heating device 40.

Wherein, the fan 30, the air inlet and the air outlet 50 are disposed on the rear side surface 16 together, so that the oven 100 has a more beautiful appearance. In this embodiment, the air outlet 50 is located in the area of the rear side surface 16 close to the top surface 11, mainly because the air flow circulates upward due to the high temperature environment in the chamber, so the air outlet 50 is arranged above.

As shown in fig. 2, in another embodiment of the present invention, an oven 200 is provided, which is different from the oven 100 in that an ultraviolet light source 201 and an ultraviolet light source 202 are respectively disposed on the left side 13 and the right side 14 of the housing 10 of the oven 200. That is, the ultraviolet light sources are disposed on the surfaces of the housing 10 to irradiate the surface of the LED wafer from multiple angles, thereby more effectively improving the efficiency of removing the organic substance residues on the surface of the wafer chip.

In a preferred embodiment, the wavelength of the uv light source 201 disposed on the left side 13 is different from the wavelength of the uv light source 202 disposed on the right side 14.

As shown in fig. 3, in another embodiment of the present invention, another ultraviolet light source 1000 is provided, which can replace the

ultraviolet light sources

20, 201, 202 shown in fig. 1 and 2. The ultraviolet light source 1000 includes, for example, a circuit board 1002 and a plurality of ultraviolet lamp beads 1001 disposed on the circuit board 1002, the circuit board 1002 and the plurality of ultraviolet lamp beads 1001 are electrically connected by welding or the like, wherein the circuit board 1002 and the plurality of ultraviolet lamp beads 1001 form a planar light source.

When the ultraviolet lamp tube is replaced by the planar light source, the LED lamp has the advantages of small occupied space and convenience in installation.

In a preferred embodiment of the present invention, the distribution density of the plurality of uv beads 1001 on the circuit board 1002 gradually increases from the edge of the circuit board 1002 toward the center of the circuit board 1002. Considering that the LED wafer is usually placed in the middle of the chamber, the ultraviolet intensity in the central area is controlled to be higher than that in the periphery, and the organic matter residue removal efficiency on the surface of the wafer chip can be effectively improved.

In addition, the plurality of ultraviolet lamp beads 1001 includes two or more kinds of ultraviolet lamp beads that provide ultraviolet rays of different wavelength ranges.

As shown in fig. 4, in another embodiment of the present invention, another uv light source 2000 is provided, which is different from the uv light source 1000 only in that a plurality of uv light beads 2001 in the uv light source 2000 are arranged in a uniform matrix on the circuit board 2002.

The uniformly arranged uv light sources 2000 may ensure consistent uniformity of removal of organic matter remaining on the surface of the LED wafer to a certain extent.

The utility model also provides a LED wafer is used in the visible light communication, and the remaining organic matter in LED wafer surface is got rid of through above-mentioned

oven

100, 200 in the visible light communication.

In this embodiment, the LED wafer refers to a wafer including a plurality of LED dies for visible light communication.

To sum up, the utility model provides an oven and LED wafer for visible light communication, including ultraviolet source, clear away the remaining organic matter in LED wafer surface for visible light communication by ultraviolet source, have following advantage at least: 1) the method adopts a non-cleaning reagent contact mode, can be carried out in the air and does not need to be dried after cleaning; 2) organic pollutants remained on the surface of the LED wafer for visible light communication can be thoroughly removed; 3) the problems of solvent volatilization and waste solvent treatment are solved; 4) the high reliability and the high yield of the processed LED wafer for visible light communication are ensured; 5) the uniformity of removing the organic matters remained on the surface of the LED wafer for visible light communication is consistent.

The present invention has been described in relation to the above embodiments, which are only examples for implementing the present invention. Furthermore, the technical features mentioned in the different embodiments of the present invention described above can be combined with each other as long as they do not conflict with each other. It should be noted that the present invention can be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. An oven, characterized in that the oven comprises:

the device comprises a shell, a first fixing piece and a second fixing piece, wherein a cavity is arranged inside the shell;

an ultraviolet light source disposed on at least one surface of the housing and within the chamber;

the LED wafer for visible light communication is placed in the cavity, and the ultraviolet light source irradiates ultraviolet light to the surface of the LED wafer for visible light communication.

2. The oven of claim 1, wherein the ultraviolet light source has a wavelength in the range of 100nm to 350 nm.

3. The oven of claim 1, wherein said housing is a polyhedral structure having said ultraviolet light source disposed on at least one surface thereof.

4. The oven of claim 3, wherein said ultraviolet light source comprises a plurality of ultraviolet light tubes, said plurality of ultraviolet light tubes being evenly distributed over at least one surface of said polyhedral structure.

5. The oven of claim 3, wherein the ultraviolet light source comprises a plurality of ultraviolet light beads disposed on at least one surface of the polyhedral structure.

6. The oven of claim 5, wherein the ultraviolet light source further comprises a circuit board, and the plurality of ultraviolet light beads are electrically connected to the circuit board to form a planar light source.

7. The oven of claim 6, wherein the distribution density of the plurality of ultraviolet light beads on the circuit board increases from the edge of the circuit board toward the center of the circuit board.

8. The oven of claim 1, further comprising a fan and a heating device, said housing further comprising an air inlet and an air outlet, said fan disposed proximate to said air inlet.

9. The oven of claim 1, wherein the ultraviolet light source comprises a first ultraviolet light source and a second ultraviolet light source, the first ultraviolet light source providing ultraviolet light at a wavelength different from the wavelength of the ultraviolet light provided by the second ultraviolet light source.

10. An LED wafer for visible light communication, characterized in that organic matter remaining on the surface of the LED wafer for visible light communication is removed by the oven according to any one of claims 1 to 9.