CN214203661U - Chip packaging structure - Google Patents
Chip packaging structure Download PDFInfo
- Publication number
- CN214203661U CN214203661U CN202120387341.4U CN202120387341U CN214203661U CN 214203661 U CN214203661 U CN 214203661U CN 202120387341 U CN202120387341 U CN 202120387341U CN 214203661 U CN214203661 U CN 214203661U
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- metal
- ceramic
- chip
- ceramic package
- package
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Abstract
The utility model provides a chip packaging structure, chip packaging structure includes metal covering plate, metal ball, metal connecting piece, ceramic package and ceramic antenna, metal covering plate is connected with ceramic package, forms inclosed cavity, the cavity is used for placing the chip, the ceramic package inside wall is equipped with the metal coating, the chip passes through the metal ball welding is in on ceramic package's the interior bottom surface, ceramic package's bottom is inlayed and is equipped with the connection the metal ball with locate the metal connecting piece of the ceramic antenna of the outer bottom surface of ceramic package. The utility model discloses a metal covering plate and metallic coating's shielding effect makes the chip normally work in strong electromagnetic interference's environment, and ceramic package makes the chip carry out normal signal transmission in high temperature environment simultaneously with ceramic antenna's setting.
Description
Technical Field
The utility model belongs to the technical field of the chip package technique and specifically relates to indicate a chip packaging structure.
Background
When the power equipment is patrolled and examined, if the power equipment is patrolled and examined manually according to the regular cycle of patrolling and examining, the amount of patrolling and examining and the record data volume are very huge, so that the temperature condition of each equipment during operation is generally known in real time by adopting a temperature sensor at present.
The traditional temperature sensor chip packaging structure generally has the defects of poor sealing reliability, large size, no anti-electromagnetic interference function, incapability of resisting high temperature and the like. For temperature detection of special key positions in some transformer substations, for example, when a high-voltage switch contact is in a high-voltage, high-temperature, strong magnetic field and extremely strong electromagnetic interference environment, the problem of adaptability of an electronic measuring device under the above severe environment condition needs to be solved to realize temperature measurement of the contact.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a chip packaging structure aims at solving current chip packaging structure can not high temperature resistant, high voltage and receive the problem that strong electromagnetic field disturbed easily.
In order to solve the technical problem, the utility model discloses a following technical scheme:
the utility model provides a chip packaging structure, includes metal covering plate, metal ball, metal connecting piece, ceramic package and ceramic antenna, metal covering plate is connected with ceramic package, forms inclosed cavity, the cavity is used for placing the chip, the ceramic package inside wall is equipped with the metallic coating, the chip passes through the metal ball welding is in on ceramic package's the interior bottom surface, ceramic package's bottom inlays and is equipped with the connection the metal ball with locate the ceramic antenna's of the outer bottom surface of ceramic package metal connecting piece.
And a welding ring for connecting the metal cover plate and the ceramic shell is also arranged between the metal cover plate and the ceramic shell.
And the bottom of the ceramic shell is provided with a through hole for the metal connecting piece to pass through.
The metal connecting piece comprises a metal pipe and a metal sheet, wherein the metal pipe is arranged in the through hole, one end of the metal pipe is connected with the metal ball, and the metal sheet is connected with the other end of the metal pipe and the ceramic antenna respectively.
The beneficial effects of the utility model reside in that:
the utility model provides a chip packaging structure, which comprises a metal cover plate, a metal ball, a metal connecting piece, a ceramic shell and a ceramic antenna, the metal cover plate is connected with the ceramic shell to form a closed cavity for placing a chip, the inner side wall of the ceramic shell is provided with a metal coating, the space formed by the metal coating and the metal cover plate has the function of blocking an external electric field and a magnetic field, the chip is prevented from being subjected to electromagnetic interference, the chip passes through the metal ball welding is in on the interior bottom surface of ceramic package, the bottom of ceramic package inlays and is equipped with the connection the metal ball with locate the metal connecting piece of the ceramic antenna of the outer bottom surface of ceramic package, ceramic package and ceramic antenna can be high temperature resistant, and the chip passes through metal ball, metal connecting piece and ceramic antenna and is connected transmission electromagnetic signal, guarantees the normal work of chip.
Drawings
The following detailed description of the specific structure of the present invention with reference to the accompanying drawings
Fig. 1 is a cross-sectional view of a chip package structure according to an embodiment of the present invention.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following description is given in conjunction with the embodiments and the accompanying drawings.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
Referring to fig. 1, fig. 1 is a cross-sectional view of a chip package structure according to an embodiment of the present invention. As shown in fig. 1, a chip package structure includes a metal cover plate 100, a metal ball 200, a metal connector 300, a ceramic case 400 and a ceramic antenna 500, wherein the metal cover plate 100 is connected to the ceramic case 400 to form a sealed cavity 600, the cavity 600 is used for placing a chip 700, a metal plating layer 800 is disposed on an inner side wall of the ceramic case 400, the chip 700 is welded to an inner bottom surface of the ceramic case 400 through the metal ball 200, and the metal connector 300 for connecting the metal ball 200 to the ceramic antenna 500 disposed on an outer bottom surface of the ceramic case 400 is embedded in a bottom of the ceramic case 400.
The beneficial effects of the utility model reside in that:
the utility model provides a chip packaging structure, including metal cover plate 100, metal ball 200, metal connecting piece 300, ceramic casing 400 and ceramic antenna 500, metal cover plate 100 is connected with ceramic casing 400, forms airtight cavity 600, cavity 600 is used for placing chip 700, ceramic casing 400 inside wall is equipped with metal coating 800, the space that metal coating 800 and metal cover plate 100 formed plays the effect of separation to external electric field, magnetic field, avoids chip 700 to receive electromagnetic interference, chip 700 passes through metal ball 200 welds on the interior bottom surface of ceramic casing 400, the bottom of ceramic casing 400 inlays and is equipped with the metal connecting piece 300 who connects metal ball 200 with ceramic antenna 500 of locating the outer bottom surface of ceramic casing 400, ceramic casing 400 and ceramic antenna 500 can be high temperature resistant, chip 700 is connected with ceramic antenna 500 through metal ball 200, metal connecting piece 300 and is transmitted electromagnetic signal, ensuring proper operation of chip 700.
Further, a welding ring 150 for connecting the metal cover plate 100 and the ceramic shell 400 is further disposed between the metal cover plate 100 and the ceramic shell 400, and the welding ring 150 is formed by partially melting the metal cover plate 100.
Further, the bottom of the ceramic housing 400 is opened with a through hole 410 for the metal connecting member 300 to pass through.
Further, the metal connector 300 includes a metal tube 310 disposed in the through hole 410 and having one end connected to the metal ball 200, and metal pieces 320 respectively connected to the other end of the metal tube 310 and the ceramic antenna 500.
Furthermore, there are a plurality of metal balls 200 and metal connectors 300, and one metal ball 200 is correspondingly connected to one metal connector 300.
Specifically, the metal sheet 320 may connect the plurality of metal tubes 310 and the plurality of metal balls 200, so as to achieve better electrical connection and signal transmission effects.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.
Claims (5)
1. The utility model provides a chip packaging structure, its characterized in that includes metal covering plate, metal ball, metal connecting piece, ceramic package and ceramic antenna, metal covering plate is connected with ceramic package, forms inclosed cavity, the cavity is used for placing the chip, the ceramic package inside wall is equipped with the metallic coating, the chip passes through the metal ball welding is in on ceramic package's the interior bottom surface, ceramic package's bottom inlays and is equipped with the connection the metal ball with locate the metal connecting piece of the ceramic antenna of the outer bottom surface of ceramic package.
2. The chip package structure according to claim 1, wherein a welding ring is further disposed between the metal cover plate and the ceramic housing for connecting the metal cover plate and the ceramic housing.
3. The chip package structure according to claim 1, wherein a through hole is formed at a bottom of the ceramic case for the metal connecting member to pass through.
4. The chip package structure according to claim 3, wherein the metal connecting member comprises a metal tube disposed in the through hole and having one end connected to the metal ball, and metal pieces respectively connected to the other end of the metal tube and the ceramic antenna.
5. The chip package structure according to claim 1, wherein there are a plurality of the metal balls and the metal connectors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120387341.4U CN214203661U (en) | 2021-02-20 | 2021-02-20 | Chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120387341.4U CN214203661U (en) | 2021-02-20 | 2021-02-20 | Chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214203661U true CN214203661U (en) | 2021-09-14 |
Family
ID=77639200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120387341.4U Active CN214203661U (en) | 2021-02-20 | 2021-02-20 | Chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214203661U (en) |
-
2021
- 2021-02-20 CN CN202120387341.4U patent/CN214203661U/en active Active
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