CN214176005U - Consumable chip, imaging box and imaging device - Google Patents
Consumable chip, imaging box and imaging device Download PDFInfo
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- CN214176005U CN214176005U CN202022956593.2U CN202022956593U CN214176005U CN 214176005 U CN214176005 U CN 214176005U CN 202022956593 U CN202022956593 U CN 202022956593U CN 214176005 U CN214176005 U CN 214176005U
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Abstract
The utility model discloses a consumptive material chip, formation of image box and imaging device, the consumptive material chip includes: the base plate, be equipped with chip mounting position on the base plate, chip mounting position includes first installation state and second installation state, wherein: in the first mounting state, the chip mounting position is used for mounting a first chip main body; in the second mounting state, the first chip main body is detached from the chip mounting position, and the chip mounting position is used for mounting a second chip main body; the first chip main body and the second chip main body respectively comprise a first side extending along a first direction and a second side extending along a second direction, and the length of the first side of the second chip main body is larger than or equal to that of the first side of the first chip main body. Compared with the prior art, the utility model discloses make first chip main part can be replaced, realize the recycle scheme.
Description
Technical Field
The utility model relates to a printer consumptive material technical field, especially a consumptive material chip, formation of image box and imaging device.
Background
When the waste printing consumable product is recycled, the substrate containing the old IC in the consumable can be used, and the old IC on the substrate is replaced by the new IC so as to realize recycling of the original consumable. However, with the development of original product technology, the product technology is made smaller and smaller, and the size of the original IC is also made smaller and smaller. Although the new IC size is gradually improved, it is still behind the original IC size, so that the size of many new ICs after optimized design is larger than the size of the old IC package, resulting in the new IC size after packaging not being consistent with the old IC package size, and thus the recycling scheme cannot be realized.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a consumptive material chip, formation of image box and imaging device to solve the technical problem among the prior art.
The utility model provides a consumable chip, include:
the base plate, be equipped with chip mounting position on the base plate, chip mounting position includes first installation state and second installation state, wherein:
in the first mounting state, the chip mounting position is used for mounting a first chip main body;
in the second mounting state, the first chip main body is detached from the chip mounting position, and the chip mounting position is used for mounting a second chip main body;
the first chip main body and the second chip main body respectively comprise a first side extending along a first direction and a second side extending along a second direction, and the length of the first side of the second chip main body is larger than or equal to that of the first side of the first chip main body.
A consumable chip as described above, wherein the second side length of the second chip body is preferably greater than the second side length of the first chip body.
As above a consumptive material chip, wherein, preferably, first chip main part includes a plurality of first pins, second chip main part includes a plurality of second pins, and is a plurality of first pin and a plurality of the second pin matches one by one, the second pin with pad on the base plate corresponds one by one, and is a plurality of first pin with a plurality of the second pin all is two and is listed as the setting, two are interval between the first pin and two are interval between the second pin equals.
The consumable chip as described above, preferably, the second chip main body includes a wafer and a casing for packaging the wafer and the second pins, and the second pins are disposed in a circumferential direction of the wafer.
The consumable chip as described above, wherein preferably, the first pins and the second pins have the same function, and the first pins and the second pins each include an SCL pin, an SDA pin, a first GND pin, a second GND pin, a first VCC pin, and a second VCC pin.
The consumable chip as described above, preferably, the SCL pin, the SDA pin and the first GND pin are proximate to one side the second side is disposed, and the first VCC pin, the second VCC pin and the second GND pin are proximate to the other side the second side is disposed.
The consumable chip comprises a first chip body and a second chip body, wherein the first chip body is provided with a plurality of conductive bonding pads, the second chip body is provided with a plurality of conductive bonding pads, the conductive bonding pads are arranged on the first chip body and are arranged on the same side, and the conductive bonding pads are arranged on the second side.
A consumable chip as described above, wherein preferably the substrate is provided with contacts on a side facing away from the chip mounting location.
The utility model also provides an imaging box, including the box body with as above the consumptive material chip, the consumptive material chip is located the inside of box body.
The utility model also provides an imaging device, including the probe and as above the formation of image box, the probe with the contact contacts.
Compared with the prior art, the utility model discloses a wafer packaging of second chip main part, the first side length design of the casing of the second chip main part after the encapsulation is for being more than or equal to the first side length of first chip main part, and the second side length of designing for being greater than first chip main part, the pin of first chip main part matches one by one with second chip main part encapsulation pin, second chip main part encapsulation pin with pad on the base plate corresponds one by one to make first chip main part can be replaced, realize the recycle scheme.
Drawings
Fig. 1 is a schematic structural diagram of a first chip body;
FIG. 2 is a schematic structural diagram of a wafer of a second chip body;
FIG. 3 is a schematic structural diagram of a second chip body;
fig. 4a is a schematic component side view of the substrate with the first chip body in mounted position on the substrate;
fig. 4b is a schematic non-component side view of the substrate with the first chip body in a mounted position on the substrate;
fig. 5a is a schematic component side view of the substrate with the second chip body in mounted position on the substrate;
fig. 5b is a schematic non-component side view of the substrate with the second chip body in place on the substrate.
Description of reference numerals: 1-substrate, 2-first chip body, 3-second chip body, 4-first side, 5-second side, 6-wafer, 7-second pin, 8-shell, 9-first pin, 10-SCL pin, 11-SDA pin, 12-first GND pin, 13-second GND pin, 14-first VCC pin, 15-second VCC pin, 16-conductive pad, 17-contact.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present invention, and should not be construed as limiting the present invention.
An embodiment of the utility model provides a consumable chip, include:
in a first mounting state, the chip mounting position is used for mounting the first chip main body 2, the first chip main body 2 is an original chip on the substrate 1, that is, a chip to be replaced, so as to achieve recycling, and the first mounting state described in this embodiment is a state before the original chip on the substrate 1 is replaced.
Under the second installation state, first chip main part 2 is detached chip mounted position, chip mounted position is used for installing second chip main part 3, and old former chip on base plate 1 will be replaced to second chip main part 3 to realize base plate 1's recycle, and the second installation state is exactly the state that former chip (first chip main part 2) on base plate 1 was replaced by second chip main part 3, and at this moment, former dress consumptive material has realized recycle.
The first chip main body 2 and the second chip main body 3 each include a first side 4 extending along a first direction and a second side 5 extending along a second direction, in this embodiment, the first direction is defined as a horizontal direction in the drawing, the second direction is defined as a vertical direction in the drawing, the length of the first side 4 of the second chip main body 3 is greater than or equal to the length of the first side 4 of the first chip main body 2, so as to match the second chip main body 3 with a chip mounting position on the substrate 1 in the horizontal direction, and the length of the second side 5 of the first chip main body 2 is smaller than the length of the second side 5 of the second chip main body 3. The bonding position on the actual substrate 1 has a large space in the horizontal direction and the vertical direction, and the first side 4 and the second side 5 of the second chip body 3 can be ensured to have any length.
The first chip body 2 is structured as shown in fig. 1, two rows of first pins 9 are provided outside the first chip body 2, each first pin 9 corresponds to a corresponding function, a fixed distance is provided between adjacent first pins 9, and each first pin 9 has a specific length. Referring to a specific model of the image forming apparatus, the first chip body 2 has a size of 2.00mm × 1.70mm, a side without the first pins 9 having a side length of 2mm, and a side with the first pins 9 having a side length of 1.7 mm.
The wafer 6 in the second chip body 3 has a rectangular structure as shown in fig. 2, the wafer 6 has two rows of pins, each pin corresponds to a corresponding function, and referring to a specific model of imaging equipment, the size of the wafer 6 is 1.117mm × 2.215mm, the side of the wafer 6 without pins has a side length of 1.117mm, and the side of the wafer with pins has a side length of 2.215 mm.
Compared with the old first chip body 2, when the wafer 6 of the new second chip body 3 is not packaged, the length of the side with the pins is longer than that of the first chip body 2 without the pins, and the second chip body 3 cannot be matched with the substrate 1. This requires packaging of the wafer 6 of the second chip body 3.
Specifically, the structure of the packaged second chip body 3 is as shown in fig. 3, the second chip body includes a wafer 6 and a housing 8 for packaging the wafer 6 and the second pins, and the second pins 7 are disposed in the circumferential direction of the wafer 6. The size of the casing 9 of the second chip main body 3 after packaging is 2.00mm × 3.00mm, the length of the first side 4 is 2.00mm, which is equal to the length of the first side 4 of the first chip main body 2, so as to realize that the second chip main body 3 is matched with the chip mounting position on the substrate 1 in the horizontal direction, the length of the second side 5 of the casing 8 of the second chip main body 3 is 3.00mm, which is larger than the length of the second side 5 of the first chip main body 2, the welding position on the actual substrate 1 has a large space in the vertical direction, and the second side 5 of the second chip main body 3 can be ensured to be any length.
The first chip main body comprises a plurality of first pins 9, the second chip main body comprises a plurality of second pins 7, the length of each first pin 9 is equal to that of each second pin 7, and the distance between every two adjacent first pins 9 is equal to that between every two adjacent second pins 7. The first pins 9 and the second pins 7 are arranged in two rows, and the distance between the two rows of the first pins 9 is equal to the distance between the two rows of the second pins 7, so that the second pins 7 are matched with the bonding pads on the substrate 1.
Further, a plurality of first pin 9 and a plurality of the function of second pin 7 is the same, and is a plurality of first pin 9 and a plurality of second pin 7 all includes SCL pin 10, SDA pin 11, first GND pin 12, second GND pin 13, first VCC pin 14 and second VCC pin 15. SCL pin 10, SDA pin 11 and one side is pressed close to first GND pin 12 second limit 5 sets up, first VCC pin 14, second VCC pin 15 and the opposite side is pressed close to second GND pin 13 second limit 5 sets up. Those skilled in the art will understand that the above pin functions are only illustrated by way of example, and the functions of the first pin 9 and the second pin 7 are matched, so that the second chip body 3 can replace the first chip body 2 to realize recycling, and those skilled in the art can add a new pin to ensure that the first chip body 2 and the second chip body 3 have the same function. When the first and second sides of the wafer 6 of the second chip body 3 are larger than the first and second sides of the second chip body 1, the pins may be provided on the back side of the second chip body 3.
Further, for the convenience of matching the second pins 7 with the bonding pads on the substrate 1, a plurality of conductive bonding pads 16 are arranged on the second chip body 3 on two symmetrical sides of the wafer 6, the second pins 8 are arranged on the conductive bonding pads 16, on the same side, the conductive bonding pads 16 are at least arranged in three, and the conductive bonding pads 16 are arranged close to the second edge 5. The position of the second pins 7 on the same side on the second side 5 is not limited to the middle position of the second side 5, and may also be near the upper side first side 4 and the lower side first side 4, as long as the second pins 7 are all arranged on the second side 5 of the housing 8.
Further, a plurality of contacts 17 are disposed on a side of the substrate 1 away from the chip mounting position. The plurality of contacts 17 are used to make contact with probes on the imaging device and transfer data stored in the second chip body 3 to the imaging device.
Fig. 4a and 4b show the mounting position of the first chip main body 2 on the substrate 1, where fig. 4a is the component surface of the substrate 1, the first pins 9 of the first chip main body 2 are matched with the pads on the substrate 1 and fixed on the substrate 1, and there is still a large space around the first chip main body 2. Fig. 4b shows the non-component side of the substrate 1, which includes a plurality of contacts 17 for electrical connection to the imaging device for transmitting data from the chip to the imaging device.
Fig. 5a and 5b show the mounting position of the second chip body 3 on the substrate 1, where fig. 5a shows that the second chip body 3 is mounted on the substrate 1, the position of the second chip body 3 on the substrate 1 in the horizontal direction is completely consistent with that of the first chip body 2, and the length of the second side 5 of the second chip body 3 in the vertical direction is greater than that of the second side 5 of the first chip body 2, but does not affect the mounting and implementation functions of the second chip body 3. Fig. 5b shows the non-component side of the substrate 1 after mounting the second chip body 3, which is the same as the non-component side shown in fig. 4b, and a plurality of contacts 17 for contacting probes on the printer for transferring data stored on the chip to the imaging device.
The embodiment also provides an imaging box (not shown), which comprises a box body and the consumable chip, wherein the consumable chip is arranged inside the box body. This enables the chip in the imaging cartridge to be stably electrically connected to the probe in the imaging device.
The present embodiment also provides an imaging apparatus (not shown) including the probe that comes into contact with the contact 17 and transmits data stored in the second chip body 3 to the imaging apparatus, and the imaging cartridge as described above.
The structure, features and effects of the present invention have been described in detail above according to the embodiment shown in the drawings, and the above description is only the preferred embodiment of the present invention, but the present invention is not limited to the implementation scope shown in the drawings, and all changes made according to the idea of the present invention or equivalent embodiments modified to the same changes should be considered within the protection scope of the present invention when not exceeding the spirit covered by the description and drawings.
Claims (10)
1. A consumable chip, comprising:
the base plate, be equipped with chip mounting position on the base plate, chip mounting position includes first installation state and second installation state, wherein:
in the first mounting state, the chip mounting position is used for mounting a first chip main body;
in the second mounting state, the first chip main body is detached from the chip mounting position, and the chip mounting position is used for mounting a second chip main body;
the first chip main body and the second chip main body respectively comprise a first side extending along a first direction and a second side extending along a second direction, and the length of the first side of the second chip main body is larger than or equal to that of the first side of the first chip main body.
2. The consumable chip of claim 1, wherein the second edge length of the second chip body is greater than the second edge length of the first chip body.
3. The consumable chip of claim 1, wherein the first chip body comprises a plurality of first pins, the second chip body comprises a plurality of second pins, the plurality of first pins are matched with the plurality of second pins one by one, the second pins correspond to the bonding pads on the substrate one by one, the plurality of first pins and the plurality of second pins are arranged in two rows, and the distance between the two rows of first pins is equal to the distance between the two rows of second pins.
4. The consumable chip of claim 3, wherein the second chip body comprises a wafer and a shell for packaging the wafer and the second pins, and the second pins are disposed on the periphery of the wafer.
5. The consumable chip of claim 4, wherein the plurality of first pins and the plurality of second pins have the same function, and each of the plurality of first pins and the plurality of second pins comprises an SCL pin, an SDA pin, a first GND pin, a second GND pin, a first VCC pin, and a second VCC pin.
6. The consumable chip of claim 5, wherein the SCL pin, the SDA pin and the first GND pin are arranged next to one side of the second edge, and the first VCC pin, the second VCC pin and the second GND pin are arranged next to the other side of the second edge.
7. The consumable chip of claim 4, wherein a plurality of conductive pads are disposed on the second chip body on two symmetrical sides of the wafer, the second pins are disposed on the conductive pads, at least three conductive pads are disposed on the same side, and the conductive pads are disposed close to the second side.
8. The consumable chip of claim 1, wherein a side of the substrate facing away from the chip mounting location is provided with contacts.
9. An imaging cartridge comprising a cartridge body and the consumable chip of claim 8, wherein the consumable chip is disposed inside the cartridge body.
10. An imaging apparatus comprising the imaging cartridge of claim 9 and a probe, the probe being in contact with the contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022956593.2U CN214176005U (en) | 2020-12-09 | 2020-12-09 | Consumable chip, imaging box and imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022956593.2U CN214176005U (en) | 2020-12-09 | 2020-12-09 | Consumable chip, imaging box and imaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214176005U true CN214176005U (en) | 2021-09-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022956593.2U Active CN214176005U (en) | 2020-12-09 | 2020-12-09 | Consumable chip, imaging box and imaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214176005U (en) |
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- 2020-12-09 CN CN202022956593.2U patent/CN214176005U/en active Active
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Address after: 519060 building 01, 83 Guangwan street, Xiangzhou District, Zhuhai City, Guangdong Province Patentee after: Jihai Microelectronics Co.,Ltd. Address before: 519060 building 01, 83 Guangwan street, Xiangzhou District, Zhuhai City, Guangdong Province Patentee before: APEX MICROELECTRONICS Co.,Ltd. |