CN214156482U

CN214156482U - Heat dissipation backpack for portable electronic device

Info

Publication number: CN214156482U
Application number: CN202022925027.5U
Authority: CN
Inventors: 陈剑雪; 刘烨
Original assignee: Shanghai University of Engineering Science
Current assignee: Shanghai University of Engineering Science
Priority date: 2020-12-09
Filing date: 2020-12-09
Publication date: 2021-09-10
Anticipated expiration: 2030-12-09

Abstract

The utility model relates to a heat dissipation knapsack for portable electronic device, including knapsack body (1), be fixed in baldric (2) and basepan (3) on knapsack body (1), baldric (2) are connected with basepan (3), still including intermediate layer (5) of locating knapsack body (1) back and encircle the door type metal heat dissipation area on knapsack body (1), the inside of intermediate layer (5) is equipped with walk line hole (6) that are used for drawing forth portable electronic device's direct current wire and radio frequency cable, walk line hole (6) and locate the surface of intermediate layer (5) is gone up and is run through intermediate layer (5), the inside of intermediate layer (5) is equipped with two sets of line punch combination, and every group walks the line punch combination and includes two parallel line hole (6) of walking of setting the same aperture. Compared with the prior art, the utility model has the advantages of strong heat dissipation, light in weight, be applicable to portable electron device.

Description

Heat dissipation backpack for portable electronic device

Technical Field

The utility model belongs to the technical field of the knapsack technique and specifically relates to a heat dissipation knapsack for portable electronic device is related to.

Background

At present, the backpack is an essential article for people to go out, and particularly when carrying articles, the backpack can provide larger assistance. However, for portable high-power electronic devices in a live working state, no backpack suitable for the device is available to meet the heat dissipation requirement. Portable high power electronic devices require a very high level of heat dissipation, especially when operating in a backpack in which the device is housed. Various air-permeable backpack structures on the market at present cannot meet the working heat dissipation requirements of electronic devices with power not exceeding 100 watts and the like.

SUMMERY OF THE UTILITY MODEL

The objective of the present invention is to provide a heat dissipation backpack for portable electronic device, which has high heat dissipation, good thermal conductivity and light weight, in order to overcome the drawbacks of the prior art.

The purpose of the utility model can be realized through the following technical scheme:

the utility model provides a heat dissipation knapsack for portable electronic device, includes the knapsack body, is fixed in baldric and the base band on the knapsack body, baldric and base band are connected, still including locating the intermediate layer at knapsack body back and encircle the door type metal heat dissipation area on the knapsack body, interbedded inside is equipped with the line hole of walking of direct current wire and radio frequency cable that is used for drawing forth portable electronic device, it locates to walk the line hole interbedded on the surface and run through the intermediate layer surface.

Preferably, two groups of routing hole groups are arranged in the interlayer, and each group of routing hole group comprises two parallel routing holes with the same aperture.

Preferably, the diameter of each wiring hole is 1.5 cm.

Preferably, the door-shaped metal heat dissipation belt comprises metal heat dissipation belts arranged on the side surface and the top surface of the backpack body, and metal heat dissipation meshes with different apertures and different arrangement densities are respectively arranged on each metal heat dissipation belt.

Preferably, the bottom of the side face of the backpack body is provided with three rows of metal heat dissipation meshes, and the top face of the backpack body is provided with two rows of metal heat dissipation meshes.

Preferably, the aperture of each metal heat dissipation mesh is 3-5 mm.

Preferably, each metal heat dissipation mesh is an aluminum alloy mesh.

Preferably, a supporting plate is arranged on one side of the interior of the interlayer.

Preferably, zippers are respectively arranged on the backpack body and the interlayer, a handle is arranged on the top surface of the backpack body, and damping cotton is arranged at the bottom of the backpack body.

Preferably, the shoulder straps are fixed to the top end of the back surface of the backpack body in a sewing manner, the bottom straps are fixed to the bottom end of the back surface of the backpack body in a sewing manner, and the shoulder straps and the bottom straps are connected through adjusting buckles.

Compared with the prior art, the utility model discloses following beneficial effect has:

1) the utility model discloses the knapsack body has designed door type and has surrounded the metal heat dissipation area, and has fully considered the wind channel characteristic of built-in portable electronic device, has the metal heat dissipation mesh that different apertures and density distribute on the metal heat dissipation area for heat radiating area maximize, optimization, can make full use of air water conservancy diversion effect make the thermal diffusivity strong, and whole knapsack body is more frivolous, is applicable to portable electronic device;

2) the interlayer is internally provided with a special wiring hole with a large aperture, so that an auxiliary wire of the built-in portable electronic device is attached and wired, the internal space allowance is further compressed, the internal device is attached to the backpack, and the hot air flowing efficiency is improved conveniently;

3) each metal heat dissipation mesh of knapsack body adopts the good and light aluminum alloy mesh of weight of heat conductivity, and aperture 3mm to 5mm varies, and the metal heat dissipation mesh of the bottom of the side of knapsack body is three rows of radiating hole designs, and the metal heat dissipation mesh at the middle part of the side of knapsack body and the top of knapsack body is double louvre design, can fully cooperate the fan position of the inside downward setting of built-in portable electronic device, makes the bottom satisfy stronger heat dissipation wind channel.

Drawings

FIG. 1 is a schematic diagram of a back side of a heat dissipation backpack for a portable electronic device according to an embodiment;

FIG. 2 is a schematic diagram of a metal heat sink strap of a heat sink backpack for a portable electronic device according to an embodiment;

FIG. 3 is a schematic diagram of an embodiment of an internal interlayer and wiring holes of a heat dissipation backpack for a portable electronic device;

FIG. 4 is a schematic front view of a heat dissipation backpack for a portable electronic device according to an embodiment;

FIG. 5 is a schematic side view of a heat dissipation backpack for a portable electronic device according to an embodiment;

the reference numbers in the figures indicate:

1. the backpack comprises a backpack body, 2, shoulder straps, 3, bottom straps, 4, adjusting buckles, 5, an interlayer, 6, wiring holes, 7, a metal radiating belt, 71 and metal radiating meshes.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall fall within the protection scope of the present invention.

Examples

As shown in fig. 1-5, the present invention relates to a heat dissipation backpack for portable electronic device, which comprises a backpack body 1, shoulder straps 2, a bottom strap 3, an adjusting buckle 4, an interlayer 5, a supporting plate, a wire-passing hole 6 and a metal heat dissipation belt 7.

The shoulder straps 2 are sewn to the top end of the back face of the backpack body 1. The bottom strap 3 is fixed at the bottom end of the back of the backpack body 1 in a sewing way, and the shoulder strap 2 and the bottom strap 3 are connected through the adjusting buckle 4. The backpack body 1 is provided with a main bag body which is provided with an accommodating inner cavity.

The back of the backpack body 1 is provided with an interlayer 5, and the inside of the interlayer 5 comprises a support plate (not shown in the figure) and a wiring hole 6 of the inside of a special large aperture. The inside one side of intermediate layer 5 is located to the backup pad, and the backup pad is preferred for resistant thermal plastic hole board, has still strengthened the laminating nature of inside electron device with the knapsack when playing the supporting role, and the inside wind channel heat dissipation that forms of being convenient for. The wiring hole 6 is arranged on the surface of the interlayer 5 and penetrates through the surface of the interlayer 5, and is used for leading out direct current wires and radio frequency cables of the electronic device. Preferably, two groups of wiring holes 6 are arranged in the interlayer 5, each group of wiring holes comprises two wiring holes 6 which are arranged in parallel and have the same aperture, and the diameter of each wiring hole 6 is preferably 1.5 CM.

The backpack body 1 is provided with door-shaped surrounding metal heat dissipation belts, and comprises metal heat dissipation belts 7 arranged on the side surface and the top surface of the backpack body 1, and the metal heat dissipation belts 7 form a door-shaped structure. The surface of each metal radiating strip 7 is respectively provided with metal radiating meshes 71 with different apertures and densities.

In the present embodiment, the metal heat dissipation mesh 71 on the surface of the metal heat dissipation strip 7 is made of aluminum alloy with good thermal conductivity and light weight, and the aperture is varied from 3MM to 5 MM. As a preferred scheme, the metal heat dissipation mesh holes 71 at the bottom of the side surfaces of the backpack body 1 are designed as three rows of heat dissipation holes, and the metal heat dissipation mesh holes 71 at the middle of the side surfaces of the backpack body 1 and at the top of the backpack body 1 are designed as two rows of heat dissipation holes, which takes into account that the position of the internal fan of the built-in electronic device is mostly inclined, so that a stronger heat dissipation air duct is needed at the bottom, the upper part of the backpack is not directly aligned to the fan, and the top and the middle of the side surfaces are designed as two rows of holes in consideration of the overall weight of the backpack.

Preferably, whole heat dissipation knapsack adopts the nylon infantees to sew up and forms, has better radiating effect, and the material is soft, wear-resisting firmness is good. Zippers are arranged on the main bag body and the interlayer 5 of the backpack body 1. The top of the backpack body 1 is also provided with a handle. The bottom of the backpack body 1 is provided with damping cotton for providing damping effect for the portable electronic device inside.

The utility model discloses a heat dissipation knapsack is when concrete implementation, portable electronic device to the exclusive that the knapsack held, if the portable electronic device of power of no more than 100 watts, because of device itself has built-in fan, can promote inside hot-air to flow after going up electricity, the intermediate layer of knapsack has guaranteed that equipment and knapsack are laminated, and to the device characteristics, different apertures and distribution density design have been done to the metal heat dissipation area, all designs all through inside wind channel simulation design, experimental result and sample actual measurement all show that the chip temperature with inside portable electronic device has effectively reduced about the degree centigrade 20, satisfy actual demand.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope of the present invention, and these modifications or replacements should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The utility model provides a heat dissipation knapsack for portable electronic device, includes knapsack body (1), is fixed in baldric (2) and the base band (3) on knapsack body (1), baldric (2) are connected with base band (3), its characterized in that, still including intermediate layer (5) of locating knapsack body (1) back and encircle the door type metal heat dissipation area on knapsack body (1), the inside of intermediate layer (5) is equipped with walk line hole (6) that are used for drawing forth portable electronic device's direct current wire and radio frequency cable, it locates to walk line hole (6) the intermediate layer (5) on the surface and run through intermediate layer (5) surface.

2. The heat dissipation backpack for portable electronic devices according to claim 1, wherein two sets of wire hole sets are disposed inside the interlayer (5), each set of wire hole sets comprises two wire holes (6) with the same aperture and disposed in parallel.

3. The heat-dissipating backpack for portable electronic devices according to claim 2, wherein the diameter of each of the wire holes (6) is 1.5 cm.

4. The heat dissipation backpack for portable electronic devices as claimed in claim 1, wherein the door-shaped metal heat dissipation strap comprises metal heat dissipation straps (7) disposed on the side and top surfaces of the backpack body (1), and metal heat dissipation mesh holes (71) with different apertures and densities are disposed on each metal heat dissipation strap (7).

5. The heat dissipation backpack for portable electronic devices according to claim 4, wherein the bottom of the side surface of the backpack body (1) is provided with three rows of metal heat dissipation mesh holes (71), and the top surface of the backpack body (1) is provided with two rows of metal heat dissipation mesh holes (71).

6. The heat dissipating backpack for portable electronic devices as claimed in claim 4, wherein the diameter of each of the metal heat dissipating meshes (71) is 3-5 mm.

7. The heat dissipating backpack for portable electronic devices as recited in claim 4, wherein each of the metal heat dissipating meshes (71) is an aluminum alloy mesh.

8. The heat dissipating backpack for a portable electronic device as set forth in claim 1, wherein a support plate is provided on an inner side of the sandwiching layer (5).

9. The heat dissipation backpack for the portable electronic device as claimed in claim 1, wherein the backpack body (1) and the interlayer (5) are respectively provided with a zipper, the top surface of the backpack body (1) is provided with a handle, and the bottom of the backpack body (1) is provided with a shock absorbing cotton.

10. The heat-dissipating backpack for a portable electronic device according to claim 1, wherein the shoulder straps (2) are fastened to the top end of the back surface of the backpack body (1) by sewing, the bottom strap (3) is fastened to the bottom end of the back surface of the backpack body (1) by sewing, and the shoulder straps (2) and the bottom strap (3) are connected by an adjusting buckle (4).