CN214108503U

CN214108503U - Stamping die is used in processing of high-accuracy hardware

Info

Publication number: CN214108503U
Application number: CN202022298188.6U
Authority: CN
Inventors: 徐宝华
Original assignee: Shenzhen Yinxin Alloy Technology Co ltd
Current assignee: Shenzhen Yinxin Alloy Technology Co ltd
Priority date: 2020-10-15
Filing date: 2020-10-15
Publication date: 2021-09-03
Anticipated expiration: 2030-10-15

Abstract

The utility model discloses a stamping die is used in processing of high-accuracy hardware, including base, lower mould and last mould, the equal vertical welding in base top opposition both sides has the spacing curb plate of second, two all the welding has same first spacing curb plate, two between the both ends at the spacing curb plate top of second the equal vertical fluting in middle part at the spacing curb plate facies top of second, be equipped with first buffer gear in the recess, the elastic plate is all installed to the bottom both sides of lower mould, two be equipped with second buffer gear between elastic plate and the base, the bottom middle part of lower mould rotates and is connected with the connecting rod, two be equipped with third buffer gear between connecting rod and the base. The utility model discloses guarantee to go up mould and lower mould and can't take place the skew at compound die stamping process to guarantee the accurate nature of punching press, reduce the defective percentage, the buffering mode is various, and the buffering effect is obvious, avoids causing the damage to the mould, extension mould life.

Description

Stamping die is used in processing of high-accuracy hardware

Technical Field

The utility model relates to the technical field of mold, especially, relate to a stamping die is used in processing of high-accuracy hardware.

Background

With the continuous development of the society, the mold processing industry of China is rapidly improved, in order to meet the market demand, the precision requirement on hardware is higher and higher, and a high-precision hardware stamping part is favored by users, so that the high-precision hardware stamping part mold is produced.

The existing high-precision hardware stamping part die is poor in shock resistance, the die is easily damaged when a stamping mechanism performs stamping, the service life of the die is shortened, and the die is inconvenient to use; the position of the upper die and the lower die of the existing high-precision hardware stamping part die is easy to shift when the dies are closed for stamping, so that hardware stamping failure is caused, and defective products are generated.

An effective solution to the problems in the related art has not been proposed yet.

Disclosure of Invention

The utility model aims at solving the shortcoming that exists among the prior art, and the stamping die for processing of a high-accuracy hardware that proposes.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a stamping die is used in processing of high-accuracy hardware, includes base, lower mould and last mould, the equal vertical welding in the opposite both sides in base top has the spacing curb plate of second, two all the welding has same first spacing curb plate, two between the both ends at the spacing curb plate top of second the equal vertical recess of having seted up in middle part at the spacing curb plate facies top of second, be equipped with first buffer gear in the recess, the stand has all been welded in base top four corners, four the top of stand all bonds and has the buffering cushion block, the elastic plate is all installed, two to the bottom both sides of lower mould be equipped with second buffer gear between elastic plate and the base, the bottom middle part of lower mould rotates and is connected with the connecting rod, the connecting rod is equipped with two, two be equipped with third buffer gear between connecting rod and the base.

Preferably, lower mould sliding connection is in two spacing curb plates of second and first spacing curb plate middle parts, go up the mould and be located the lower mould directly over, the lug, two have all been welded to the opposite both sides of lower mould the lug is inside two recesses sliding connection respectively.

Preferably, the second buffer gear includes first spring, first spout, two have been seted up to the equal level in another opposition both sides in base top the elastic plate bottom both ends all weld and have first slider and difference sliding connection inside two first spouts, first spring is equipped with two, two the both ends of first spring respectively with two first slider opposite side welding of two elastic plate bottoms with one side.

Preferably, the third buffer mechanism includes two second sliders and two moving blocks, the two second sliders are welded to the middle portions of the bottoms of the two elastic plates respectively, the two moving blocks are rotatably connected to the bottom ends of the two connecting rods respectively, and the two second sliders and the two moving blocks are slidably connected to the inside of the second sliding groove.

Preferably, the third buffer mechanism further includes a second spring and four third magnets, two ends of the second spring are respectively welded to the middle portions of the opposite side surfaces of the two moving blocks, two of the third magnets are respectively mounted on the opposite side surfaces of the two second sliders, and the other two third magnets are respectively mounted on the opposite side surfaces of the two moving blocks.

Preferably, the first buffer mechanism comprises two first magnets and two second magnets, the two first magnets are respectively installed at the tops of the two grooves, the four second magnets are respectively installed at the top ends of the two convex blocks, the other two second magnets are respectively installed at the bottoms of the two grooves, and the first magnets and the second magnets attract each other magnetically.

Preferably, the first buffer mechanism comprises a third spring and a fourth spring, the third spring and the fourth spring are respectively provided with two springs, the top ends of the two springs are respectively welded at the top of the two grooves, the bottom ends of the two springs are respectively welded at the top of the two bumps, the top ends of the two springs are respectively welded at the bottom of the two bumps, and the bottom ends of the two springs are respectively welded at the bottom of the two grooves.

The utility model has the advantages that:

1. when last mould and lower mould compound die stamping process, two first spacing curb plates and two spacing curb plates of second restrict the descending route of going up mould and lower mould to make last mould and lower mould can only go up and down at vertical face, thereby guarantee to go up mould and lower mould and can't take place the skew at the compound die stamping process, thereby guarantee the accurate nature of punching press, avoid hardware punching press failure, reduce the defective percentage.

2. In embodiment 1, during the process of closing and stamping the upper die and the lower die, the lower die moves downwards to drive the two bumps to move downwards in the groove, the first magnet at the top in the groove generates attraction force on the second magnet at the end of the bump, the second magnet at the bottom in the groove generates repulsion force on the second magnet at the end of the bump, the lower die is prevented from moving downwards, and then the impact force of closing the upper die and the lower die is primarily buffered.

3. In embodiment 2, in the process of performing die assembly and stamping on the upper die and the lower die, the lower die moves downwards to drive the two bumps to move downwards in the groove, the two third springs are driven to stretch downwards and compress the two fourth springs downwards, the two third springs and the fourth springs both generate upward rebound force to prevent the lower die from moving downwards, and then the impact force of die assembly of the upper die and the lower die is primarily buffered.

4. In the process of carrying out die assembly stamping on an upper die and a lower die, the lower die moves downwards to extrude two elastic plates, the two elastic plates generate upward elastic force, the bottoms of the two elastic plates move towards each other to drive a first sliding block to move towards each other to extrude two first springs, the two first springs generate reverse elastic force to prevent the lower die from moving downwards, impact force generated when the upper die and the lower die are assembled is buffered secondarily, the lower die moves downwards to drive the bottoms of two connecting rods to move towards each other simultaneously, namely, the two moving blocks are driven to move towards each other to stretch a second spring, the second spring generates reverse elastic force, and a repulsive force is generated between third magnets to prevent the lower die from moving downwards jointly, impact force generated when the upper die and the lower die are assembled is buffered for three times, the buffering mode is various, the buffering effect is obvious, damage to the die is avoided, and the service life of the die is prolonged.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment 1 of a stamping die for high-precision hardware processing according to the present invention;

fig. 2 is a first front sectional view of a stamping die for high-precision hardware processing according to embodiment 1 of the present invention;

fig. 3 is a front cross-sectional view of a stamping die for machining high-precision hardware according to embodiment 1 of the present invention;

fig. 4 is a front cross-sectional view of embodiment 2 of a stamping die for high-precision hardware processing according to the present invention.

In the figure: 1. an upper die; 2. a first magnet; 3. buffering cushion blocks; 4. an elastic plate; 5. a column; 6. a first limit side plate; 7. a lower die; 8. a second limit side plate; 9. a base; 10. a first chute; 11. a first spring; 12. a second chute; 13. a connecting rod; 14. a bump; 15. a second magnet; 16. a first slider; 17. a groove; 18. a second slider; 19. a third magnet; 20. a second spring; 21. a moving block; 22. a third spring; 23. and a fourth spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Example 1

Referring to fig. 1-3, a stamping die for high-precision hardware processing comprises a base 9, a lower die 7 and an upper die 1, wherein second limiting side plates 8 are vertically welded on two opposite sides of the top of the base 9, the same first limiting side plate 6 is welded between two ends of the top of each second limiting side plate 8, grooves 17 are vertically formed in the middle of the tops of opposite surfaces of the two second limiting side plates 8, first buffer mechanisms are arranged in the grooves 17, stand columns 5 are welded on four corners of the top of the base 9, buffer cushion blocks 3 are bonded on the top ends of the four stand columns 5, the buffer cushion blocks 3 buffer the lower die 7 when the lower die 7 descends to the upper side of the stand columns 5, elastic plates 4 are mounted on two sides of the bottom of the lower die 7, second buffer mechanisms are arranged between the two elastic plates 4 and the base 9, connecting rods 13 are rotatably connected to the middle of the bottom of the lower die 7, and the two connecting rods 13 are arranged, a third buffer mechanism is arranged between the two connecting rods 13 and the base 9.

In this embodiment, the lower die 7 is slidably connected to the middle portions of the two second limit side plates 8 and the first limit side plate 6, the upper die 1 is located right above the lower die 7, the two opposite sides of the lower die 7 are welded with the protruding blocks 14, the two protruding blocks 14 are respectively slidably connected to the inside of the two grooves 17, the second buffer mechanism includes two first springs 11, the other opposite sides of the top of the base 9 are horizontally provided with the first chutes 10, the two ends of the bottom of the two elastic plates 4 are welded with the first sliders 16 and are respectively slidably connected to the inside of the two first chutes 10, the two first springs 11 are provided, the two ends of the two first springs 11 are respectively welded to the opposite side surfaces of the two first sliders 16 on the same side of the bottom of the two elastic plates 4, the third buffer mechanism includes two second sliders 18 and two moving blocks 21, the two second sliders 18 and the moving block 21 are provided, the two second sliders 18 are respectively welded to the middle portions of the bottom of the two elastic plates 4, the two moving blocks 21 are respectively and rotatably connected to the bottom ends of the two connecting rods 13, the two second sliding blocks 18 and the moving blocks 21 are both connected inside the second sliding grooves 12 in a sliding manner, the third buffer mechanism further comprises second springs 20 and third magnets 19, two ends of each second spring 20 are respectively welded to the middle parts of the opposite side surfaces of the two moving blocks 21, four third magnets 19 are arranged, two third magnets 19 are respectively arranged on the opposite side surfaces of the two second sliding blocks 18, the other two third magnets 19 are respectively arranged on the opposite side surfaces of the two moving blocks 21, the first buffer mechanism comprises first magnets 2 and second magnets 15, two first magnets 2 are arranged, two first magnets 2 are respectively arranged at the top parts inside the two grooves 17, four second magnets 15 are arranged, two second magnets 15 are respectively arranged at the top ends of the two convex blocks 14, the other two second magnets 15 are respectively arranged at the bottom parts inside the two grooves 17, the first magnet 2 and the second magnet 15 are magnetically attracted to each other.

The working principle of the embodiment is as follows: when the upper die 1 and the lower die 7 are in die assembly and stamping processes, the two first limiting side plates 6 and the two second limiting side plates 8 limit descending routes of the upper die 1 and the lower die 7, so that the upper die 1 and the lower die 7 can only lift on a vertical surface, and the upper die 1 and the lower die 7 cannot deviate in the die assembly and stamping processes, so that the stamping accuracy is ensured, the hardware stamping failure is avoided, and the defective rate is reduced; in the process of closing and stamping the upper die 1 and the lower die 7, the lower die 7 moves downwards to drive the two lugs 14 to move downwards in the groove 17, the first magnet 2 at the top in the groove 17 generates attraction force on the second magnet 15 at the end part of the lug 14, the second magnet 15 at the bottom in the groove 17 generates repulsion force on the second magnet 15 at the end part of the lug 14, the lower die 7 is prevented from moving downwards, and the impact force of closing the upper die 1 and the lower die 7 is preliminarily buffered; in the process of carrying out die assembly and stamping on the upper die 1 and the lower die 7, the lower die 7 moves downwards to extrude the two elastic plates 4, the two elastic plates 4 generate upward elastic force, and the bottoms of the two elastic plates 4 move oppositely to drive the first sliding blocks 16 to move oppositely to extrude the two first springs 11, the two first springs 11 generate reverse elastic force to prevent the lower die 7 from moving downwards, the impact force of the matched die of the upper die 1 and the lower die 7 is buffered for the second time, simultaneously, the lower die 7 moves downwards to drive the bottoms of the two connecting rods 13 to move reversely, namely, the two moving blocks 21 are driven to move reversely to stretch the second spring 20, the second spring 20 generates reverse elastic force, and the repulsion force is generated between the third magnets 19, so as to prevent the lower die 7 from moving downwards together, the impact force of the matched molds of the upper mold 1 and the lower mold 7 is buffered for three times, the buffering mode is various, the buffering effect is obvious, the damage to the molds is avoided, and the service life of the molds is prolonged.

Example 2

Referring to fig. 4, the present embodiment differs from embodiment 1 only in that the first buffer mechanism includes two third springs 22 and two fourth springs 23, the top ends of the two third springs 22 are respectively welded to the top portions of the two grooves 17, the bottom ends of the two third springs 22 are respectively welded to the top portions of the two bumps 14, the top ends of the two fourth springs 23 are respectively welded to the bottom portions of the two bumps 14, and the bottom ends of the two fourth springs 23 are respectively welded to the bottom portions of the two grooves 17.

The working principle of the embodiment is as follows: in the process of carrying out die assembly stamping on the upper die 1 and the lower die 7, the lower die 7 moves downwards to drive the two lugs 14 to move downwards in the groove 17, the two third springs 22 are driven to stretch downwards, the two fourth springs 23 are driven to compress downwards, the two third springs 22 and the fourth springs 23 generate upward rebound force, the lower die 7 is prevented from moving downwards, and then the impact force of die assembly of the upper die 1 and the lower die 7 is primarily buffered.

Having shown and described the basic principles and essential features of the invention and advantages thereof, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof, and it is therefore intended that the embodiments be considered as exemplary and not limiting in any way, since the scope of the invention is defined by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein and are therefore not to be embraced therein by any reference numerals in the claims.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The stamping die for machining the high-precision hardware comprises a base (9), a lower die (7) and an upper die (1), and is characterized in that second limiting side plates (8) are vertically welded on opposite two sides of the top of the base (9), a same first limiting side plate (6) is welded between two ends of the top of each second limiting side plate (8), a groove (17) is vertically formed in the middle of the top of the opposite surface of each second limiting side plate (8), a first buffer mechanism is arranged in the groove (17), stand columns (5) are welded on four corners of the top of the base (9), buffer cushion blocks (3) are bonded on the top ends of the four stand columns (5), elastic plates (4) are mounted on two sides of the bottom of the lower die (7), a second buffer mechanism is arranged between each elastic plate (4) and the base (9), a connecting rod (13) is rotatably connected to the middle of the bottom of the lower die (7), the connecting rods (13) are two, and a third buffer mechanism is arranged between the connecting rods (13) and the base (9).

2. The stamping die for machining high-precision hardware parts as claimed in claim 1, wherein the lower die (7) is slidably connected to the middle of two second limiting side plates (8) and the first limiting side plate (6), the upper die (1) is located right above the lower die (7), the two opposite sides of the lower die (7) are welded with the protruding blocks (14), and the protruding blocks (14) are respectively slidably connected to the insides of the two grooves (17).

3. The stamping die for high-precision hardware processing according to claim 2, wherein the second buffer mechanism comprises first springs (11), first chutes (10) are horizontally formed in the other opposite two sides of the top of the base (9), two first sliding blocks (16) are welded at the two ends of the bottom of the elastic plate (4) and are respectively connected inside the two first chutes (10) in a sliding manner, two first springs (11) are arranged, and the two ends of each first spring (11) are respectively welded with the two first sliding blocks (16) on the same side of the bottom of the two elastic plates (4) in the opposite directions.

4. The stamping die for machining high-precision hardware as claimed in claim 3, wherein the third buffer mechanism comprises two second sliding blocks (18) and two moving blocks (21), the two second sliding blocks (18) and the two moving blocks (21) are respectively welded to the middle portions of the bottoms of the two elastic plates (4), the two moving blocks (21) are respectively rotatably connected to the bottom ends of the two connecting rods (13), and the two second sliding blocks (18) and the two moving blocks (21) are both slidably connected to the inside of the second sliding groove (12).

5. The stamping die for machining high-precision hardware parts as claimed in claim 4, wherein the third buffer mechanism further comprises a second spring (20) and four third magnets (19), two ends of the second spring (20) are welded to the middle of the opposite side faces of the two moving blocks (21), the number of the third magnets (19) is four, two of the three magnets (19) are mounted on the opposite side faces of the two second sliding blocks (18), and the other two third magnets (19) are mounted on the opposite side faces of the two moving blocks (21).

6. A stamping die for high-precision hardware processing according to claim 5, characterized in that, the first buffer gear includes first magnet (2) and second magnet (15), the first magnet (2) is provided with two, two first magnet (2) is installed respectively in two recesses (17) top, the second magnet (15) is provided with four, two of them second magnet (15) is installed respectively in the top of two lugs (14), the other two second magnet (15) is installed respectively in two recesses (17) bottom, first magnet (2) and second magnet (15) magnetism attract each other.

7. The stamping die for machining high-precision hardware as claimed in claim 5, wherein the first buffering mechanism comprises a third spring (22) and a fourth spring (23), the third spring (22) and the fourth spring (23) are respectively provided with two springs, the top end of the third spring (22) is welded to the top portions of the two grooves (17), the bottom end of the third spring (22) is welded to the top portions of the two convex blocks (14), the top end of the fourth spring (23) is welded to the bottom portions of the two convex blocks (14), and the bottom end of the fourth spring (23) is welded to the bottom portions of the two grooves (17).