CN214102142U - Computer room heat dissipation economizer system - Google Patents

Abstract

The utility model discloses a computer room heat dissipation economizer system, including computer lab and more than one cylinder, install first heat-conducting plate on the inside bottom surface of computer lab, the inside water cavity that forms of first heat-conducting plate, form the passageway of a frame type structure between first heat-conducting plate and the computer lab, the surface of first heat-conducting plate coats and is stamped the second heat-conducting plate, the second heat-conducting plate passes through cylinder drive, be equipped with the more than one through-hole with the water cavity intercommunication on the bottom surface of first heat-conducting plate, the heat pipe is all installed to the through-hole lower extreme, the heat pipe lower extreme all passes in the bottom plate of computer lab inserts the soil of lower extreme, be equipped with the more than one apopore on the outer wall of heat pipe lower extreme, all install the filter screen in the apopore, the inside water of all having annotated of heat pipe. The utility model discloses simple structure, the inside heat of absorption computer lab that low temperature through soil depths can be quick has reduced the operating power of air conditioner when reducing the computer lab temperature, plays energy-conserving effect.

Description

Computer room heat dissipation economizer system

Technical Field

The utility model relates to a computer technology field, concretely relates to computer room heat dissipation economizer system.

Background

Machine room: the old time is a general name of workplaces and production units of the manual and silk cotton weaving industry; now a computer study room; in the IT industry, a machine room generally refers to a place where a server is stored to provide IT services for users and employees, such as telecommunications, internet communications, mobile, two-wire, power, and government or enterprise.

At present, generally, the temperature is reduced through an air conditioner in the machine room, but along with the continuous rising of the price of electric power, the machine room faces the pressure of continuous expansion and the electric energy consumption of continuous growth to present domestic and foreign research data see that refrigeration is more power consumptive than the operation of server itself in the computer room, make the continuous rising of electric quantity index, cause the cost of electric quantity to constantly increase.

Disclosure of Invention

The utility model aims to solve the technical problem that a computer room heat dissipation economizer system is provided to solve the problem that proposes in the above-mentioned background art.

The utility model discloses a realize through following technical scheme: the utility model provides a computer lab heat dissipation economizer system, including computer lab and more than one cylinder, install first heat-conducting plate on the inside bottom surface of computer lab, the inside water cavity that forms of first heat-conducting plate, form the passageway of a frame type structure between first heat-conducting plate and the computer lab, the surperficial second heat-conducting plate that covers of first heat-conducting plate, the second heat-conducting plate passes through the cylinder drive, be equipped with the more than one through-hole with the water cavity intercommunication on the bottom surface of first heat-conducting plate, the heat pipe is all installed to the through-hole lower extreme, the heat pipe lower extreme all passes in the bottom plate of computer lab inserts the soil of lower extreme, be equipped with the more than one apopore on the outer wall of heat pipe lower extreme, all install the filter screen in the apopore, the inside water of all having annotated of heat pipe.

As preferred technical scheme, the length width of second heat-conducting plate is greater than the length width of first heat-conducting plate, and the outer lane of second heat-conducting plate extends to the passageway upper end, and the edge of second heat-conducting plate all touches with the internal face of computer lab, and cylinder evenly distributed is in the passageway, and the cylinder lower extreme is all installed on the bottom plate of computer lab, and the upper end is all installed on the bottom surface of second heat-conducting plate.

As preferred technical scheme, the more than one support column is installed perpendicularly to water cavity inside, and the surface of first heat-conducting plate is just all being equipped with first screw hole to support column department, and first screw hole lower extreme all extends to inside the support column, and the surface of second heat-conducting plate is just all being equipped with the second screw hole to first screw hole department, and equal threaded connection has fixing bolt in the second screw hole, and the equal threaded connection of fixing bolt lower extreme is in first screw hole.

As preferred technical scheme, install the filler pipe on the surface of first heat-conducting plate, the surface of second heat-conducting plate is just being equipped with the round hole to filler pipe department, and the filler pipe upper end passes the round hole setting, and threaded connection has the sealing plug in the opening of filler pipe upper end.

The utility model has the advantages that:

1. in summer, the temperature of the surface of the soil is far higher than the temperature of the deep part of the soil, so that the heat in the machine room can be transferred into the heat conduction pipes along the second heat conduction plate and the first heat conduction plate, the heat is transferred to the underground through the heat conduction pipes, and meanwhile, the heat conduction area and the heat conduction efficiency are greatly increased through water energy, so that the heat can be rapidly diffused to the deep part of the soil, the operating power of the air conditioner is greatly reduced, the energy is saved, and the cost is reduced;

2. in winter, because the heat of soil depths is higher than the heat on soil surface, consequently the second heat-conducting plate can be followed first heat-conducting plate and moved away, has avoided on the heat transfer in the soil reaches the equipment of second heat-conducting plate and second heat-conducting plate top, and can prop the centre of second heat-conducting plate through fixing bolt and live, has avoided the bending deformation in the middle of the second heat-conducting plate.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic structural view of the middle heat conduction pipe of the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected" and "disposed" are to be construed broadly, and may for example be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1 and 2, the utility model discloses a computer room heat dissipation economizer system, including computer lab 1 and more than one cylinder 4, install first heat-conducting plate 12 on the bottom surface of computer lab 1 inside, the inside water cavity 5 that forms of first heat-conducting plate 12, form the passageway of a frame type structure between first heat-conducting plate 12 and the computer lab 1, first heat-conducting plate 12 coats on the surface and is stamped second heat-conducting plate 11, second heat-conducting plate 11 passes through the cylinder 4 drive, be equipped with more than one on the bottom surface of first heat-conducting plate 12 and the through-hole 7 of water cavity intercommunication, heat pipe 8 is all installed to through-hole 7 lower extreme, 8 lower extremes of heat pipe all pass in the soil of computer lab 1's bottom plate insertion lower extreme, be equipped with more than one apopore on the outer wall of heat pipe 8 lower extreme, all install filter screen 10 in the apopore, 8 inside water of all pouring of heat pipe.

In this embodiment, the length and width of the second heat conduction plate 11 are greater than the length and width of the first heat conduction plate 12, the outer ring of the second heat conduction plate 11 extends to the upper end of the channel, the edge of the second heat conduction plate 11 contacts with the inner wall surface of the machine room 1, the cylinders 4 are uniformly distributed in the channel, the lower ends of the cylinders 4 are mounted on the bottom plate of the machine room 1, and the upper ends of the cylinders are mounted on the bottom surface of the second heat conduction plate 11.

In this embodiment, more than one support column 6 is vertically installed to water cavity 5 inside, and the surface of first heat-conducting plate 12 is just all being equipped with first screw hole to support column 6 department, and inside first screw hole lower extreme all extended to the support column, the surface of second heat-conducting plate 11 is just all being equipped with the second screw hole to first screw hole department, and equal threaded connection has fixing bolt 9 in the second screw hole, and equal threaded connection of fixing bolt 9 lower extreme is in first screw hole.

In this embodiment, the filler pipe 3 is installed on the surface of the first heat-conducting plate 12, the round hole is arranged on the surface of the second heat-conducting plate 11 opposite to the filler pipe, the round hole is arranged at the upper end of the filler pipe 3 in a penetrating manner, and the sealing plug 2 is connected to the opening at the upper end of the filler pipe 3 in a threaded manner.

In midsummer, the inflammation of burning sun, the heat is not tolerable, but the deep underground part is cool, refreshing and comfortable, and is abnormal. For example, the average air temperature in 7 months in Shanghai is 27.8 ℃, the average air temperature in 0.8 meter underground is 24.0 ℃, the average air temperature in 1.6 meter underground is 20.6 ℃, and the average air temperature in 3.2 meter underground is reduced to 16.9 ℃. So when the ground is hottest, the deep underground part is very cool. On the contrary, the average temperature in 1 month in Shanghai was 3.4 deg.C, 9.8 deg.C in the place of 0.8 meter underground, 13.1 deg.C in the place of 1.6 meter underground, and increased to 17.3 deg.C in the place of 3.2 meter underground.

After the water-cooling water heater is opened, water can enter water vapor along the water adding pipe and flow into different heat conduction pipes until the water flows out of the water outlet holes, the flowing water can be diffused in the deep part of the soil, so that the heat conduction area is increased, the heat conduction efficiency is also increased through the water, and the heat can be rapidly diffused in the deep part;

in summer, the first heat conduction plate and the second heat conduction plate are abutted, so that heat of equipment arranged on the second heat conduction plate can be quickly transferred to the heat conduction pipes along the second heat conduction plate and the first heat conduction plate, and can be transferred to soil through the heat conduction pipes and water energy, so that the temperature in the machine room is reduced, the running power of the air conditioner is reduced, and the energy-saving effect is achieved;

in winter, because the heat of soil depths is higher than the heat on soil surface, consequently, the second heat-conducting plate can be followed first heat-conducting plate and moved away, the heat transfer in the soil has been avoided on the equipment of second heat-conducting plate and second heat-conducting plate top, do not influence the normal use of equipment, before the second heat-conducting plate removes, need twist out fixing bolt, make the second heat-conducting plate lose the clamping force, consequently, play the back at the cylinder, can lift up the second heat-conducting plate, lift up the back, again with fixing bolt twist in first screw hole, can increase second heat-conducting plate middle holding power through fixing bolt, the bending deformation in the middle of the second heat-conducting plate has been avoided.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.

Claims (4)

1. The utility model provides a computer room heat dissipation economizer system which characterized in that: comprises a machine room (1) and more than one cylinder (4), a first heat-conducting plate (12) is installed on the bottom surface inside the machine room (1), a water cavity (5) is formed inside the first heat-conducting plate (12), a channel of a frame structure is formed between the first heat-conducting plate (12) and the machine room (1), a second heat-conducting plate (11) is covered on the surface of the first heat-conducting plate (12), the second heat-conducting plate (11) is driven by the cylinder (4), more than one through holes (7) communicated with the water cavity are arranged on the bottom surface of the first heat-conducting plate (12), heat-conducting pipes (8) are installed at the lower ends of the through holes (7), the lower ends of the heat-conducting pipes (8) penetrate through a bottom plate of the machine room (1) and are inserted into soil at the lower end, the outer wall surface of the lower end of the heat conduction pipe (8) is provided with more than one water outlet hole, the water outlet holes are all provided with filter screens (10), and water is injected into the heat conduction pipe (8).

2. The computer room heat dissipation and energy saving system of claim 1, wherein: the length and width of second heat-conducting plate (11) is greater than the length and width of first heat-conducting plate (12), and the outer lane of second heat-conducting plate (11) extends to the passageway upper end, and the edge of second heat-conducting plate (11) all touches with the internal face of computer lab (1), and cylinder (4) evenly distributed is in the passageway, and cylinder (4) lower extreme all is installed on the bottom plate of computer lab (1), and the upper end is all installed on the bottom surface of second heat-conducting plate (11).

3. The computer room heat dissipation and energy saving system of claim 1, wherein: more than one support column (6) are installed perpendicularly to water chamber (5) inside, and the surface of first heat-conducting plate (12) is just all being equipped with first screw hole to support column (6) department, and first screw hole lower extreme all extends to inside the support column, and the surface of second heat-conducting plate (11) is just all being equipped with the second screw hole to first screw hole department, and equal threaded connection has fixing bolt (9) in the second screw hole, and the equal threaded connection of fixing bolt (9) lower extreme is in first screw hole.

4. The computer room heat dissipation and energy saving system of claim 1, wherein: the water feeding pipe (3) is installed on the surface of the first heat conduction plate (12), a round hole is formed in the surface of the second heat conduction plate (11) and faces the water feeding pipe, the upper end of the water feeding pipe (3) penetrates through the round hole, and a sealing plug (2) is connected to the upper end of the water feeding pipe (3) through threads in an opening.

Images