CN214101696U - Bone conduction microphone - Google Patents
Bone conduction microphone Download PDFInfo
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- CN214101696U CN214101696U CN202022964209.3U CN202022964209U CN214101696U CN 214101696 U CN214101696 U CN 214101696U CN 202022964209 U CN202022964209 U CN 202022964209U CN 214101696 U CN214101696 U CN 214101696U
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- piezoelectric sensor
- bone conduction
- piezoelectric
- conduction microphone
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Abstract
The utility model discloses a bone conduction microphone. The bone conduction microphone includes: the device comprises a shell, a circuit board, a piezoelectric sensor and a vibration sensing contact; the circuit board is contained in the shell, the piezoelectric sensor is arranged on the circuit board, the vibration sensing contact is arranged on the shell, the vibration sensing contact is arranged above the piezoelectric sensor and is in contact with the central position of the piezoelectric sensor, a sound receiving hole is formed in one side, close to the piezoelectric sensor, of the vibration sensing contact, and the sound received by the sound receiving hole directly reaches the piezoelectric sensor. The utility model discloses a bone conduction microphone, through setting up the vibration contact, can receive and transmit the signal of bone vibration more effectively, sensitivity is high.
Description
Technical Field
The utility model belongs to the technical field of the electroacoustic, especially, relate to a bone conduction microphone.
Background
Bone conduction microphones have been known for a long time, but the existing bone conduction microphones have the disadvantages of low sensitivity and poor bass when acquiring a fine vibration signal, thereby limiting the wide application thereof.
Therefore, there is still a need for improvement and optimization of existing bone conduction microphones.
SUMMERY OF THE UTILITY MODEL
In order to solve the above technical problem, the present invention provides a bone conduction microphone capable of solving the problems of low sensitivity and lack of bass.
The utility model provides a pair of bone conduction microphone, include: the device comprises a shell, a circuit board, a piezoelectric sensor and a vibration sensing contact; the circuit board is contained in the shell, the piezoelectric sensor is arranged on the circuit board, the vibration sensing contact is arranged on the shell, and the vibration sensing contact is arranged above the piezoelectric sensor and is in contact with the central position of the piezoelectric sensor. And a sound receiving hole is formed in one side, adjacent to the piezoelectric sensor, of the vibration sensing contact, and the sound received by the sound receiving hole directly reaches the piezoelectric sensor.
In one embodiment, the housing comprises a first shell and a second shell matching the first shell; the first shell comprises a bottom wall and a side wall formed by extending from the edge of the bottom wall; the bottom wall and the side wall form an accommodating space for accommodating the circuit board and the piezoelectric sensor; the vibration sensing contact is arranged on the second shell.
In one embodiment, the vibration sensing contact is embedded in the center of the second shell of the shell, the sound receiving hole is formed in the center of the vibration sensing contact, and the sound received by the sound receiving hole directly reaches the center of the piezoelectric sensor.
In one embodiment, the vibration sensing contact is made of 45-degree silica gel; the size of the sound receiving hole is 0.5 mm.
In one embodiment, the bone conduction microphone further includes a plurality of protruding columns, the plurality of protruding columns are distributed in the housing at equal intervals, one ends of the plurality of protruding columns are arranged on the bottom wall of the first shell, and the other ends of the plurality of protruding columns are embedded in the second shell.
In one embodiment, the number of the plurality of convex columns is three.
In one embodiment, the piezoelectric sensor comprises a piezoelectric substrate and a piezoelectric sheet; the piezoelectric patches and the piezoelectric base layer are sequentially arranged on the circuit board from top to bottom.
In one embodiment, the shapes of the piezoelectric sheet, the piezoelectric base layer and the circuit board are all circular; the size of piezoelectric patch is not more than the size of piezoelectric substrate, the size of piezoelectric substrate is not more than the circuit board size.
In one embodiment, the circuit board includes components and leads; the element and the lead are both located on a side of the circuit board away from the piezoelectric sensor.
In one embodiment, the bone conduction microphone further comprises a voltage signal amplifier and a field effect transistor; the voltage signal amplifier is connected to the piezoelectric sensor; the field effect transistor is arranged between the piezoelectric sensor and the voltage signal amplifier.
In one embodiment, the bone conduction microphone further comprises two stages of high-frequency filter capacitors; one end of the two-stage high-frequency filter capacitor is respectively arranged at two ends of the voltage signal amplifier, and the other end of the two-stage high-frequency filter capacitor is respectively grounded.
The utility model discloses following beneficial effect has at least:
1. the vibration contact is arranged, so that the bone vibration signal can be received and transmitted more effectively, and the sensitivity is high; of course, the present invention provides a bone conduction microphone that can be used in a vibration sensor, but is not limited to receiving bone vibrations.
2. The boss fixing and ultrathin circuit board and the piezoelectric sensor form a low-frequency resonance vibration system, so that the amplitude of bass is improved;
3. a voltage signal amplifier is arranged, so that the sensitivity is high;
4. a field effect transistor is arranged, and high gain and low noise are achieved;
5. and the two-stage high-frequency filter capacitor is arranged, so that the anti-interference performance is better, and the sound of the bone conduction microphone is clearer.
Drawings
Fig. 1 is a cross-sectional view of a bone conduction microphone according to an embodiment of the present invention;
fig. 2 is a cross-sectional view of a bone conduction microphone according to an embodiment of the present invention, a plan view of the bone conduction microphone is shown in part b, and a side view of the bone conduction microphone is shown in part c;
fig. 3 is a top view of the circuit board, the piezoelectric substrate, and the piezoelectric plate of the bone conduction microphone in fig. 1 according to the present invention;
fig. 4 is a plan view of the circuit board, the piezoelectric substrate, and the piezoelectric plate of the bone conduction microphone in fig. 1 according to another embodiment of the present invention; and
fig. 5 is a circuit diagram of a bone conduction microphone according to an embodiment of the present invention.
Reference numbers in the figures:
the bone conduction microphone comprises a bone conduction microphone 100, a shell 1, a convex column 2, a circuit board 3, a piezoelectric sensor 5, a vibration sensing contact 6, a hollow sound conduction column 7, a sound receiving hole 8, a voltage signal amplifier 9, a field effect transistor 10, a first shell 11, a second shell 12, a bottom wall 13, a side wall 14, a high-frequency filter capacitor 15, a first resistor 16, a second resistor 17, a third resistor 18, an element 31, a lead 32, a piezoelectric substrate 51 and a piezoelectric sheet 52.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings.
The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Fig. 1 to 4 illustrate a bone conduction microphone 100 according to an embodiment of the present invention.
Referring to fig. 1 to 4, the bone conduction microphone 100 includes a housing 1, a circuit board 3, a piezoelectric transducer 5, and a vibration sensing contact 6. The circuit board 3 is accommodated in the housing 1. The piezoelectric sensor 5 is provided on the circuit board 3. The vibration sensing contact 6 is arranged on the shell 1, the vibration sensing contact 6 is arranged above the piezoelectric sensor 5 and is in contact with the central position of the piezoelectric sensor 5, a sound receiving hole 8 is formed in one side, adjacent to the piezoelectric sensor 5, of the vibration sensing contact 6, and the sound received by the sound receiving hole 8 directly reaches the piezoelectric sensor 5.
Further, the housing 1 includes a first case 11 and a second case 12 mated with the first case 11. The first housing 11 includes a bottom wall 13 and a side wall 14 formed to extend perpendicularly to an edge of the bottom wall 13. The bottom wall 13 and the side wall 14 form a housing space for housing the circuit board 3 and the piezoelectric sensor 5. The vibration sensing contact 6 is provided on the second housing 12.
Further, the piezoelectric sensor 5 includes a piezoelectric base layer 51 and a piezoelectric sheet 52. The piezoelectric sheet 52 and the piezoelectric substrate 51 are disposed on the circuit board 3 in this order from top to bottom.
Specifically, referring to fig. 3 again, the size of the piezoelectric sheet 52 is not larger than that of the piezoelectric substrate 51, and the size of the piezoelectric substrate 51 is not larger than that of the circuit board.
In the present embodiment, the piezoelectric sheet 52, the piezoelectric substrate 51, and the circuit board 3 are all circular in shape.
Referring again to fig. 4, the circuit board 3 includes a component 31 and a lead 32. Both the element 31 and the leads 32 are provided on the side of the circuit board 3 remote from the piezoelectric sensor 5. The element 31 is an amplifier chip.
Further, a hollow sound guide post 7 is arranged inside the vibration sensing contact 6. When the vibration sensing contact 6 senses vibration, the hollow sound guide column 7 of the vibration sensing contact 6 drives the gas in the vibration cavity to vibrate, and the gas vibration transmits a vibration signal to the piezoelectric sensor 5. Further, the vibration sensing contact 6 is embedded in the center of the second housing 12, a sound receiving hole 8 is formed in the center of the vibration sensing contact 6, the sound receiving hole 8 is formed in the center of the vibration sensing contact 6, and sound received in the sound receiving hole 8 directly reaches the center of the piezoelectric sensor 5. Thus, when the shell and/or the vibration sensing contact 6 feel external vibration, even fine vibration and sound signals can be transmitted to the piezoelectric sensor on the circuit board through the hollow sound guide column 7 and the sound receiving hole 8 of the vibration sensing contact 6, so that the vibration can be clearly collected.
Preferably, the vibration sensing contact 6 is made of 45-degree silica gel, and the size of the sound receiving hole 8 is 0.4 to 0.6 mm, preferably 0.5 mm. The sound received by the sound receiving hole 8 can directly reach the central part of the piezoelectric sensing piece, so that even if the sound signal is slight vibration, the vibration can be more clearly collected.
The bone conduction microphone 100 further includes a plurality of convex columns 2, and the plurality of convex columns 2 are distributed in the housing at equal intervals. Specifically, the one end of a plurality of projection 2 is established on the diapire 13 of first casing 11, and the other end of a plurality of projection 2 is inlayed in second casing 12, and a plurality of projection 2 can transmit the vibration that the shell was felt to piezoelectric sensor 5 through a plurality of projection 2 of equidistance distribution like this, and piezoelectric sensor 5 just can obtain the scope bigger, more even vibration signal of distribution like this.
Referring to fig. 2 again, in the present embodiment, the number of the plurality of protruding columns 2 is three, which are the vertical column a, the vertical column B, and the vertical column C. The three convex columns which are distributed equidistantly, namely the three convex columns, can transmit the vibration sensed by the shell to the piezoelectric sensor on the circuit board, so that the piezoelectric sensor can obtain vibration signals which are wider in range and more uniform in distribution.
Fig. 5 is a circuit diagram of a bone conduction microphone 100 according to an embodiment of the present invention.
Referring to fig. 5, the bone conduction microphone 100 further includes a voltage signal amplifier 9 and a field effect transistor 10. The voltage signal amplifier 9 is electrically connected to the piezoelectric sensor 5. A field effect transistor 10 is provided between the piezoelectric sensor 5 and the voltage signal amplifier 9. The voltage signal amplifier 9 can solve the disadvantages of low sensitivity and poor frequency response characteristic of the piezoelectric sensor. The voltage signal amplifier 9 may be, for example, a voltage signal amplifier of model BC847BW115, and the piezoelectric sensor 5 may be, for example, a piezoelectric sensor of model YD 06A.
In the present embodiment, in particular, the input of the field effect transistor 10 is connected to the piezoelectric sensor 5, and its high impedance input is matched exactly to the high impedance output of the piezoelectric sensor 5. The output of the field effect transistor 10 is connected to a voltage signal amplifier 9, the low impedance output of which matches just the low impedance input of the following voltage signal amplifier 9. According to the basic principle of the circuit, when the output impedance and the input impedance are matched, the circuit obtains the maximum gain.
Therefore, the utility model discloses a field effect transistor 10, and connect field effect transistor 10 between piezoelectric sensor and voltage signal amplifier 9, have high input impedance, low output impedance's characteristics, can obtain higher amplification gain, solved impedance match's problem effectively, the utility model discloses a voltage signal amplifier 9 gain can promote 7 dB (decibels), make the utility model provides a bone conduction microphone has higher sensitivity.
Further, the bone conduction microphone 100 further includes a two-stage high-frequency filter capacitor 15. The two ends of the voltage signal amplifier 9 are respectively arranged at one end of the two-stage high-frequency filter capacitor 15, and the other end of the two-stage high-frequency filter capacitor 15 is respectively grounded. Alternatively, the two-stage high-frequency filter capacitor 15 may be, for example, capacitors of 0.01 μ F (microfarad) and 33pF (picofarad), respectively.
Further, the bone conduction microphone 100 further includes three resistors, which are a first resistor 16, a second resistor 17 and a third resistor 18 in sequence. Specifically, the first resistor 16 is provided between the piezoelectric sensor 5 and the field effect transistor 10. The second resistor 17 is provided between the field effect transistor 10 and the voltage signal amplifier 9. The third resistor 18 is connected to the voltage signal amplifier 9.
Preferably, the first resistor 16 has a resistance of 10 megohms, the second resistor 17 has a resistance of 1 kilo-ohm, and the third resistor 18 has a resistance of 2 kilo-ohms.
The bone conduction microphone 100 uses the second case 12 of the housing 1 as a human body contact portion for obtaining bone conduction sound vibration during use.
The working principle of the application lies in that: when a person makes a sound, the vibration sensing contact 6 which is directly contacted with the body and arranged on the second shell 12 of the shell 1 receives the vibration of bones and generates follow vibration, then the hollow sound conducting column 7 of the vibration sensing contact 6 drives the gas vibration in the vibration cavity, the gas vibration transmits the vibration signal to the piezoelectric sensor 5, the vibration sound wave vibration signal enables the piezoelectric sheet 52 of the piezoelectric sensor 5 to be slightly deformed and converted into a tiny sound analog signal wave, the tiny sound analog signal wave is converted and amplified into an electric signal through the field effect transistor 10 and transmitted, the output signal is filtered by the resistors 17 and 18 respectively connected with the two-stage high-frequency filter capacitor 15, the rest signal is transmitted to the voltage signal amplifier 9 and processed into an audio electric signal, the audio electric signal is output to the electronic equipment connected with the bone conduction microphone 100, and the collection of the sound is completed.
The utility model discloses following beneficial effect has at least:
1. the vibration contact is arranged, so that the bone vibration signal can be received and transmitted more effectively, and the sensitivity is high; of course, the present invention provides a bone conduction microphone that can be used in a vibration sensor, but is not limited to receiving bone vibrations.
2. The boss fixing and ultrathin circuit board and the piezoelectric sensor form a low-frequency resonance vibration system, so that the amplitude of bass is improved;
3. a voltage signal amplifier is arranged, so that the sensitivity is high;
4. a field effect transistor is arranged, and high gain and low noise are achieved;
5. and the two-stage high-frequency filter capacitor is arranged, so that the anti-interference performance is better, and the sound of the bone conduction microphone is clearer.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A bone conduction microphone, comprising: the device comprises a shell, a circuit board, a piezoelectric sensor and a vibration sensing contact; the circuit board is contained in the shell, the piezoelectric sensor is arranged on the circuit board, the vibration sensing contact is arranged on the shell, the vibration sensing contact is arranged above the piezoelectric sensor and is in contact with the central position of the piezoelectric sensor, a sound receiving hole is formed in one side, close to the piezoelectric sensor, of the vibration sensing contact, and the sound received by the sound receiving hole directly reaches the piezoelectric sensor.
2. The bone conduction microphone of claim 1, wherein the housing comprises a first shell and a second shell mated with the first shell; the first shell comprises a bottom wall and a side wall formed by extending from the edge of the bottom wall; the bottom wall and the side wall form an accommodating space for accommodating the circuit board and the piezoelectric sensor; the vibration sensing contact is arranged on the second shell.
3. The bone conduction microphone according to claim 2, wherein the vibration sensing contact is embedded in a center of the second housing of the housing, the sound receiving hole is opened in the center of the vibration sensing contact, and the sound received by the sound receiving hole is directed to a central portion of the piezoelectric sensor.
4. The bone conduction microphone of claim 3, wherein the vibration sensing contact is made of 45-degree silica gel; the size of the sound receiving hole is 0.5 mm.
5. The bone conduction microphone of claim 2, further comprising a plurality of protruding columns, wherein the plurality of protruding columns are disposed in the housing in an equidistant manner, one end of the plurality of protruding columns is disposed on the bottom wall of the first casing, and the other end of the plurality of protruding columns is embedded in the second casing.
6. The bone conduction microphone of claim 5, wherein the number of posts is three.
7. The bone conduction microphone of claim 1, wherein the piezoelectric sensor comprises a piezoelectric substrate and a piezoelectric sheet; the piezoelectric patches and the piezoelectric base layer are sequentially arranged on the circuit board from top to bottom.
8. The bone conduction microphone according to claim 7, wherein the piezoelectric sheet, the piezoelectric substrate, and the circuit board are all circular in shape; the size of piezoelectric patch is not more than the size of piezoelectric substrate, the size of piezoelectric substrate is not more than the circuit board size.
9. The bone conduction microphone of claim 1, wherein the circuit board comprises elements and leads; the element and the lead are both located on a side of the circuit board away from the piezoelectric sensor.
10. The bone conduction microphone of claim 1, further comprising a voltage signal amplifier, a field effect transistor, and a two-stage high frequency filter capacitor; the voltage signal amplifier is connected to the piezoelectric sensor; the field effect transistor is arranged between the piezoelectric sensor and the voltage signal amplifier; one end of the two-stage high-frequency filter capacitor is respectively arranged at two ends of the voltage signal amplifier, and the other end of the two-stage high-frequency filter capacitor is respectively grounded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022964209.3U CN214101696U (en) | 2020-12-12 | 2020-12-12 | Bone conduction microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022964209.3U CN214101696U (en) | 2020-12-12 | 2020-12-12 | Bone conduction microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214101696U true CN214101696U (en) | 2021-08-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022964209.3U Active CN214101696U (en) | 2020-12-12 | 2020-12-12 | Bone conduction microphone |
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| Country | Link |
|---|---|
| CN (1) | CN214101696U (en) |
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2020
- 2020-12-12 CN CN202022964209.3U patent/CN214101696U/en active Active
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