CN214098377U

CN214098377U - Prefabricated sensor assembly, removable electronic device and electronic system

Info

Publication number: CN214098377U
Application number: CN202021803052.XU
Authority: CN
Inventors: 基肖尔·顺达拉-拉扬; 毛里西奥·E·古铁雷斯布拉沃; 伊万·波派列夫; 亚历杭德罗·考夫曼; 穆斯塔法·埃姆雷·卡拉戈兹勒
Original assignee: Google LLC
Current assignee: Google LLC
Priority date: 2019-08-26
Filing date: 2020-08-25
Publication date: 2021-08-31
Anticipated expiration: 2030-08-25
Also published as: DE202020104841U1

Abstract

The present disclosure relates to a prefabricated sensor assembly, a removable electronic device and an electronic system. A removable electronic device for a pre-fabricated sensor assembly for an interactive object is provided. The removable electronic device includes one or more processors, a first communication interface configured to communicatively couple with one or more remote computing devices, and a second communication interface configured to communicatively couple with a plurality of pre-manufactured sensor assemblies having touch sensors with different sensor layouts. In response to being physically coupled to the first pre-manufactured sensor assembly, the removable electronic device may analyze the first touch data to detect one or more predefined motions based on one or more first predefined parameters associated with the first touch sensor. In response to being physically coupled to the second pre-manufactured sensor assembly, the removable electronic device may analyze the second touch data to detect one or more predefined motions based on one or more second predefined parameters associated with the second touch sensor.

Description

Prefabricated sensor assembly, removable electronic device and electronic system

Technical Field

The present disclosure relates generally to electronic devices for interactive objects.

Background

The interactive object may include a sensor, such as a sense line, which may include a conductive line incorporated into the interactive object to form a sensor, such as a capacitive touch sensor configured to detect touch input. The interactive object may process the touch input to generate touch data that may be used to initiate functionality either locally at the interactive object or on various remote devices wirelessly coupled to the interactive object. The interactive object may include wires for other purposes, such as strain sensors for using conductive wires and visual interfaces for using line optics.

For example, the interactive object may be formed by forming a grid or array of conductive wires woven into the interactive textile. Each conductive wire may comprise a wire (e.g., copper wire) stranded, braided, or wrapped with one or more flexible wires (e.g., polyester or cotton). However, conventional sensor designs with such wires may be difficult to implement within an object.

SUMMERY OF THE UTILITY MODEL

Technical problem

Aspects and advantages of embodiments of the present disclosure will be set forth in part in the description which follows, or may be learned by practice of the embodiments.

One example aspect of the present disclosure is directed to a removable electronic device comprising one or more processors; a first communication interface configured to communicatively couple the removable electronic device to one or more remote computing devices; and a second communication interface configured to communicatively couple the removable electronic device to at least a first pre-manufactured sensor assembly including a first touch sensor having a first set of sensing elements and a second pre-manufactured sensor assembly including a second touch sensor having a second set of sensing elements. A first sensor layout of the first set of sensing elements is different from a second sensor layout of the second set of sensing elements. The removable electronic device includes one or more non-transitory computer-readable media collectively storing instructions that, when executed by one or more processors, cause the one or more processors to perform operations. The operations include, in response to the removable electronic device being physically coupled to the first pre-formed sensor assembly, analyzing first touch data associated with the first pre-formed sensor assembly to detect one or more predefined motions based on one or more first predefined parameters associated with the first touch sensor, and in response to the removable electronic device being physically coupled to the second pre-formed sensor assembly, analyzing second touch data associated with the second pre-formed sensor assembly to detect the one or more predefined motions based on one or more second predefined parameters associated with the second touch sensor.

Other example aspects of the disclosure are directed to systems, apparatuses, computer program products (such as tangible, non-transitory computer-readable media, but also such as software downloadable through a communication network without necessarily being stored in a non-transitory form), user interfaces, storage devices, and electronic devices for implementing and utilizing touch sensors, such as capacitive touch sensors.

These and other features, aspects, and advantages of various embodiments will become better understood with reference to the following description and appended claims. The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description, serve to explain the relevant principles.

Drawings

A detailed discussion of embodiments directed to one of ordinary skill in the art is set forth in the specification, which makes reference to the appended drawings, in which:

FIG. 1 depicts an example computing environment in which a prefabricated sensor assembly according to an example embodiment of the present disclosure may be implemented;

FIG. 2 depicts a block diagram of an example computing environment including interactive objects, according to an example embodiment of the present disclosure;

FIG. 3 depicts an example computing environment including a removable electronic device that may be removably coupled to a plurality of interactive objects, according to an example embodiment of the present disclosure;

fig. 4-7 are various perspective views depicting an example removable electronic device, according to example embodiments of the present disclosure;

8-9 are top and bottom views, respectively, depicting an example pre-fabricated sensor assembly according to an example embodiment of the present disclosure;

FIG. 10 depicts an example layout of a plurality of conductive lines of a capacitive touch sensor according to an example embodiment of the present disclosure;

11-13 are various perspective views depicting an example receptacle of a prefabricated sensor assembly according to an example embodiment of the present disclosure;

14A-14C are perspective views depicting an example socket and the insertion of a removable electronic module into the socket, according to an example embodiment of the present disclosure;

15-16 are top and bottom perspective views, respectively, depicting an example pre-fabricated sensor assembly according to an example embodiment of the present disclosure;

17-18 are front and side perspective views, respectively, depicting an example receptacle of a pre-manufactured sensor assembly according to an example embodiment of the present disclosure;

19A-19C are various perspective views depicting an example of inserting a removable electronic module into a receptacle of a pre-manufactured sensor assembly, according to an example embodiment of the present disclosure;

20A-20D are perspective views depicting an interactive insole and inserting a removable electronic module into a receptacle of the interactive insole according to an exemplary embodiment of the present disclosure;

FIG. 21 depicts a flowchart describing an example process of configuring a removable electronic module for a particular type of pre-manufactured sensor assembly, according to an example embodiment of the present disclosure;

22-23 are top and bottom perspective views depicting examples of prefabricated sensor assemblies according to example embodiments of the present disclosure;

FIG. 24 is an exploded perspective view of the example prefabricated sensor assembly depicted in FIGS. 22-23, according to an example embodiment of the present disclosure;

FIG. 25 is a detailed top view of a subset of the sense lines of the example prefabricated sensor assembly depicted in FIGS. 21-24, according to an example embodiment of the present disclosure;

FIG. 26 is a front perspective view depicting another example of a prefabricated sensor assembly according to an example embodiment of the present disclosure;

FIG. 27 is a detailed view of the example prefabricated sensor assembly depicted in FIG. 7, according to an example embodiment of the present disclosure;

FIG. 28 is a front perspective view depicting an example of a pre-formed sensor assembly including conductive wires implemented as a set of conductive wires for a capacitive touch sensor, according to an example embodiment of the present disclosure;

FIG. 29 is a detailed view of the example prefabricated sensor assembly depicted in FIG. 9, according to an example embodiment of the present disclosure;

FIG. 30 illustrates an example of an interactive object having a plurality of electronic modules, according to an example embodiment of the present disclosure;

FIG. 31 is a front perspective view depicting another example of a pre-formed sensor assembly including conductive wires implemented as a set of conductive wires for a capacitive touch sensor, according to an example embodiment of the present disclosure;

FIG. 32 is a front perspective view depicting an example of a prefabricated sensor assembly attached to a strap of an interactive garment accessory according to an example embodiment of the present disclosure;

FIG. 33 is a side perspective view depicting the example prefabricated sensor assembly and interactive garment accessory depicted in FIG. 13, according to an example embodiment of the present disclosure;

FIG. 34 is an illustration of a person wearing an interactive backpack including a pre-manufactured sensor assembly according to an example embodiment of the present disclosure;

FIG. 35 depicts a receptacle of a pre-manufactured sensor assembly, and illustrates a removable electronic module including a connector physically coupled to an interactive object via the receptacle, according to an example embodiment of the present disclosure;

FIG. 36 is an illustration of an interactive garment depicting insertion of a prefabricated sensor assembly into the interactive garment, according to an example embodiment of the present disclosure;

FIG. 37 is a block diagram depicting an example process for manufacturing an interactive object using pre-manufactured sensor assemblies, according to an example embodiment of the present disclosure; and

fig. 38 illustrates various components of an example computing system that can be implemented as any type of client, server, and/or computing device as described herein.

Detailed Description

Reference will now be made in detail to embodiments, one or more examples of which are illustrated in the drawings. Each example is provided by way of illustration of the embodiments and not limitation of the present disclosure. Indeed, it will be apparent to those skilled in the art that various modifications and variations can be made in the embodiments without departing from the scope or spirit of the disclosure. For instance, features illustrated or described as part of one embodiment, can be used with another embodiment to yield a still further embodiment. Accordingly, aspects of the present disclosure are intended to cover such modifications and variations.

In general, embodiments in accordance with the present disclosure are directed to methods and systems related to pre-manufactured sensor assemblies for interactive objects and removable electronic devices (also referred to as removable electronic modules) that are configured to interface with different types of pre-manufactured sensor assemblies, such as may be incorporated in different types of interactive objects. More specifically, removable electronic devices according to example embodiments of the disclosed technology may be configured to interface with various types of touch sensors that may be integrated within different pre-manufactured sensor assemblies. Additionally, the removable electronic device may be configured to interface with one or more sensors (such as an inertial measurement unit) integrated within the removable electronic device. The removable electronic device may be configured to physically and removably couple to sensor components having different form factors, as well as for communicating with touch sensors or the like having different sensor layouts of sensing elements. In this manner, a user may utilize a single removable electronic device that may automatically interface with different types of sensor assemblies to interact with various types of interactive objects.

For example, a removable electronic device according to an example embodiment may be configured to interface with a pre-manufactured sensor assembly having different types of sensors. For example, a first pre-manufactured sensor assembly may have a first type of capacitive touch sensor, such as may be integrated within a first type of interactive object (e.g., a jacket). The first type of capacitive touch sensor may include sensing elements having a first sensor layout. Sensor layout may refer to sensing element material (e.g., metal lines, conductive lines, etc.), multiple sensing elements of a touch sensor, a shape of a sensing element (e.g., lines, squares, circles, or other shapes), a size of a sensing element and/or spacing between sensing elements, etc. The removable electronic module may be further configured to interface with a second pre-fabricated sensor assembly having a second type of capacitive touch sensor, such as may be integrated in a second type of interactive object (e.g., a shoe). The second type of capacitive touch sensor may include sensing elements having a second sensor layout. In this manner, a single removable electronic device may be utilized with multiple interactive objects including different types of pre-fabricated sensor assemblies.

According to an example aspect, a removable electronic device according to an example embodiment may include one or more processors, a first communication interface configured to communicatively couple the removable electronic device to one or more computing devices, and a second communication interface configured to communicatively couple the removable electronic device to a plurality of pre-manufactured sensor assemblies. Each pre-fabricated sensor assembly may include a respective touch sensor having a plurality of sensing elements with different sensing layouts. For example, the removable electronic device can be configured to communicate with at least a first pre-manufactured sensor assembly including a first touch sensor having a first set of sensing elements and a second pre-manufactured sensor assembly including a second touch sensor having a second set of sensing elements having a different sensory layout. In response to the removable electronic device being physically coupled to the first pre-manufactured sensor assembly, the removable electronic module may analyze first touch data associated with the first pre-manufactured sensor assembly to detect one or more predefined motions based on one or more predefined parameters associated with the first touch sensor. In response to the removable electronic device being physically coupled to the second pre-manufactured sensor assembly, the removable electronic module may analyze second touch data associated with the second pre-manufactured sensor assembly to detect one or more predefined motions based on one or more second predefined parameters associated with the second touch sensor.

The removable electronic device may be removably inserted into a first pre-formed sensor assembly of the first interactive object and configured to detect one or more predefined motions associated with touch data generated in response to touch input by a first sensor (e.g., a capacitive touch sensor) of the first pre-formed sensor assembly. For example, when the removable electronic module is inserted into the first pre-manufactured sensor assembly, the removable electronic module may perform a motion (e.g., gesture) recognition process on one or more predefined motions using the first set of predefined detection parameters. In some examples, the removable electronic module may perform a gesture recognition process on one or more predefined motions using a machine learning model associated with the first pre-manufactured sensor assembly. The machine learning model associated with the first pre-manufactured sensor assembly may be specifically configured for the sensor of the first pre-manufactured sensor assembly. In some examples, the machine learning model associated with the first pre-manufactured sensor component may include a set of weights or other parameters associated with the sensors of the first pre-manufactured sensor component.

The removable electronic module may be removed from the first interactive object and inserted into a second pre-fabricated sensor assembly of a second interactive object. The removable electronic module may be reconfigured to detect one or more predefined motions associated with touch data generated in response to touch input by a second touch sensor (e.g., a resistive touch sensor) of the second pre-manufactured sensor assembly when the removable electronic module is inserted into the second pre-manufactured sensor assembly. For example, the removable electronic module may perform a motion recognition process on one or more predefined motions using a second set of predefined detection parameters. In some examples, the removable electronic module may perform a gesture recognition process on one or more predefined motions using a machine learning model associated with the second pre-manufactured sensor assembly. The machine learning model associated with the second pre-manufactured sensor assembly may be specifically configured for the sensor of the second pre-manufactured sensor assembly. In some examples, the machine learning model associated with the second pre-manufactured sensor component may include a set of weights or other parameters associated with the sensors of the second pre-manufactured sensor component. In some examples, the removable electronic module may perform a gesture recognition process on one or more predefined motions using a second machine learning model associated with a second preconfigured sensor component. In other examples, the removable electronic module may perform the gesture recognition process on one or more predefined motions using the same machine learning model as used for the first pre-manufactured sensor assembly, however a different set of weights may be used. In some examples, the removable electronic device may obtain the predefined parameter through a wireless network interface. For example, the removable electronic device may obtain the predefined parameters from one or more remote computing devices, such as a cloud computing service.

According to some aspects, a removable electronic device, such as a removable electronic module for a pre-fabricated sensor assembly, may analyze touch data from the first pre-configured sensor assembly to detect one or more predefined motions, such as gestures provided as touch inputs to a capacitive touch sensor of the first pre-fabricated sensor assembly. The removable electronic module may use one or more first predefined parameters associated with the first pre-manufactured sensor assembly, such as sensing, motion, or other detection parameters. The removable electronic device can analyze touch data from the second pre-manufactured sensor assembly to detect one or more predefined motions, such as gestures provided as touch inputs to a capacitive touch sensor of the second pre-manufactured sensor assembly. The removable electronic device may use one or more second predefined parameters associated with the second pre-manufactured sensor assembly.

According to some example embodiments, the removable electronic device may detect connection of the removable electronic device with the pre-manufactured sensor assembly. For example, the removable electronic device may detect that the removable electronic device is physically coupled to a first pre-manufactured sensor assembly that includes a first touch sensor having a first set of sensing elements that includes a first sensor layout. The removable electronic device can obtain a predefined parameter associated with the first touch sensor of the first pre-manufactured sensor assembly in response to detecting the connection. The removable electronic device may be configured to detect the predefined motion based on a predefined parameter obtained in response to detecting the connection. Subsequent to configuring the removable electronic device with predefined parameters associated with the first touch sensor of the first pre-manufactured sensor assembly, the removable electronic device may be removed from the first pre-manufactured sensor assembly and inserted into the second pre-manufactured sensor assembly. The removable electronic device can detect that the removable electronic device is physically coupled to a second pre-manufactured sensor assembly that includes a second touch sensor having a second set of sensing elements with a second sensor layout that is different from the first sensor layout. In response, the removable electronic module may obtain one or more second predefined parameters associated with the second pre-manufactured sensor assembly. The removable electronic device may be reconfigured to detect the one or more predefined motions based at least in part on the one or more second predefined parameters.

In some examples, the removable electronic device may utilize one or more machine learning models to detect the one or more predefined motions. The removable electronic device can configure one or more machine learning models for detecting predefined motions based on predefined parameters associated with particular pre-manufactured sensor assemblies. For example, one or more machine learning models may be configured with a first set of weights to detect a predefined motion associated with a first pre-manufactured sensor component. The one or more machine learning models may be reconfigured with the second set of weights to detect the predefined motion associated with the second pre-manufactured sensor component. In another example, one or more first machine learning models can be obtained to configure a removable electronic device to detect a predefined motion associated with a first pre-manufactured sensor assembly. One or more second machine learning models can be obtained to configure the removable electronic device to detect a predefined motion associated with the second pre-manufactured sensor assembly.

The removable electronic module may include a housing configured to removably couple the removable electronic module to different types of prefabricated sensor assemblies that may be integrated within various types of interactive objects. For example, the removable electronic module may include one or more retention elements configured to be removably coupled to one or more retention elements of different types of receptacles of different sensor assemblies. The removable electronic device may be connected to different types of sockets, such as may be used for different types of interactive objects. In some examples, the removable electronic module may include a single set of retention elements configured to interface with receptacles having different form factors. For example, the removable electronic module may include a retention element adapted to physically couple to a receptacle having a slot-based form factor and a corresponding retention element of a receptacle having a cartridge-based form factor. In other examples, the removable electronic module may include a plurality of sets of retention elements, with each set configured to interface with a particular receptacle having a particular type of form factor.

According to some aspects, a removable electronic device may include a processor, an inertial measurement unit, a first communication interface configured for data power communication with one or more remote computing devices, and a second communication interface configured for communication with a plurality of pre-fabricated sensor assemblies each including a capacitive touch sensor. Various components may be at least partially disposed within the housing of the removable electronic module. The second communication interface may be configured for communication with sensor assemblies having different sensor layouts, such as sensors having different numbers of sensing elements for capacitive touch sensors, sensing elements of different material types, sensing elements of different pitches and/or other sensor layouts, and so forth.

In some examples, the housing of the removable electronic module may include a first opening disposed along a first longitudinal face of the housing. The first communication interface may include a connector adjacent the first opening configured to physically and communicatively couple the removable electronic device to one or more remote computing devices. The removable electronic device may include a plurality of second openings disposed along a lower surface of the housing. The second communication interface may include a plurality of contacts configured to communicatively couple the removable electronic device to the pre-manufactured sensor assembly when the removable electronic device is inserted into the receptacle of the pre-manufactured sensor assembly. The contacts of the removable electronic device may be mated with sockets having different form factors to establish electrical connections.

According to some aspects, the removable electronic device may include a rechargeable power source, such as a rechargeable battery (e.g., a lithium ion battery). When the removable electronic modules are connected to the prefabricated sensor assemblies, the internal electronics of each prefabricated sensor assembly (also referred to as internal electronics module) may be powered by the power supply of the removable electronic module. For example, the internal electronics module of each pre-manufactured sensor assembly may include sensing circuitry configured to generate touch data in response to touch input detected at the respective capacitive touch sensor. The sensing circuitry may be powered by a power source of the removable electronic device when the removable electronic module is inserted into the corresponding pre-fabricated sensor assembly.

In accordance with some aspects of the disclosed technology, one or more of the contacts of the removable electronic module may be configured to provide power from a power source of the removable electronic module to the pre-manufactured sensor assembly when the removable electronic module is inserted into the pre-manufactured sensor assembly. Also, one or more other contacts of the removable electronic module may be configured to provide data from the removable electronic module to the pre-manufactured sensor assembly when the removable electronic device is inserted into the pre-manufactured sensor assembly.

Embodiments of the disclosed technology provide a number of technical effects and benefits, particularly in terms of interactive objects, touch sensors, computing technology, and integration of electronic devices with different types of touch sensors. In addition, one or more aspects of the disclosed technology may address problems that may arise when seeking to provide a practical system and method for incorporating sensor components into interactive objects and providing an electronic device that is capable of interfacing with different types of interactive sensor components. According to example embodiments of the disclosed technology, the removable electronic device may be configured to interface with different types of sensor assemblies, including sensor assemblies that may include different form factors as well as different types of touch sensors. The unique combination of a housing adapted to interface with different form factors and electronics preconfigured to interface with different types of capacitive touch sensors allows the sensor assembly to be widely incorporated in different types of interactive objects while providing a simple and cost-effective electronics for interfacing with various types of sensor assemblies once incorporated in different types of interactive objects.

In some examples, different types of pre-fabricated sensor assemblies may be provided to enable tight integration within the interactive object. In some examples, the pre-manufactured sensor assembly may include different types of sensors, such as different types of capacitive touch sensors. For example, different materials may be utilized to form the sensing elements of a capacitive touch sensor, different numbers of sensing elements may be used, different spacings between sensing elements may be utilized, and so forth. Such differences may enable various pre-manufactured sensor assemblies to be integrated into various interactive objects, including but not limited to interactive garments, interactive garment accessories, interactive garment containers, and other wearable devices, among others. A single removable electronic device can be configured to physically couple with different types of pre-fabricated sensor assembly devices and can be configured for communication with different types of capacitive touch sensors. In this way, a single removable electronic device may be adapted to multiple types of interactive objects to provide a cost-effective and efficient solution. In some examples, the removable electronic device may communicate with a remote computing device, such as a smartphone, tablet, laptop, cloud computing device, or the like, to provide interfacing between the interactive object and the remote computing device.

According to some aspects, a removable electronic device may include a housing having a set of retention elements configured to physically couple the removable electronic device to different types of receptacles having different form factors. The set of retaining elements may be adapted to physically couple with slot-based receptacles of some preconfigured sensor assemblies and cartridge-based receptacles of other preconfigured sensor assemblies. In this manner, a suitable receptacle may be integrated within the interactive object to facilitate universal form factor coupling with the removable electronic device. In this way, the removable electronic device can be seamlessly and efficiently docked with different types of interactive objects having different types of receptacles for receiving the removable electronic device.

According to some aspects, the removable electronic device may be configured to analyze touch data from different types of preconfigured sensor components. For example, the removable electronic device can be configured to analyze touch data from a first type of capacitive touch sensor (such as including a first number of sensing elements) and a second type of capacitive touch sensor (such as including a second number of sensing elements). The removable electronic device may be configured to analyze different types of touch data that may be provided for different types of pre-manufactured sensor assemblies in order to detect the same set of predefined motions, such as gestures. For example, the removable electronic device can apply different types of sensing or other detection parameters to analyze touch data from different types of capacitive touch sensors. In some cases, the removable electronic device can utilize different machine learning model configurations to analyze touch data from different types of touch sensors. Accordingly, the removable electronic device may provide seamless integration with different types of capacitive touch sensors, including automatic configuration for detecting gestures from different types of capacitive touch sensors.

According to example aspects of the disclosed technology, an electronic system may include a removable electronic module, a first interactive object, and a second interactive object. The removable electronic module may include one or more processors, an inertial measurement unit, a communication interface including a plurality of contacts configured to communicate with a plurality of pre-fabricated sensor assemblies, and a housing at least partially enclosing the processors, the inertial measurement unit, and the communication interface. The housing may include one or more retention elements configured to couple the removable electronic module to different types of receptacles having different form factors.

The first interactive object may include a first pre-manufactured sensor assembly. The first pre-formed sensor assembly may include a first capacitive touch sensor including a first plurality of flexible sensing elements. The first pre-fabricated sensor assembly may include first internal electronics including first sensing circuitry in electrical communication with the flexible sensing element of the capacitive touch sensor. The pre-manufactured sensor assembly may include a first receptacle having a first form factor including a first plurality of receiving elements. The first plurality of receiving elements may be configured to be removably coupled to one or more retaining elements of the removable electronic module to removably connect the removable electronic module to the first pre-fabricated sensor assembly. The first socket may include a first plurality of contact protrusions extending from a first plurality of openings in the first base member of the first socket to contact a plurality of contact pads of the removable electronic device when the removable electronic device is inserted into the first socket.

The second interactive object may include a second preconfigured sensor assembly including a second capacitive touch sensor including a second plurality of flexible sensing elements. The second interactive object may include second internal electronics including second sensing circuitry in electrical communication with the second plurality of flexible sensing elements. The second pre-manufactured sensor assembly may include a second receptacle having a second form factor that includes a second plurality of receiving elements configured to be removably coupled to one or more retaining elements of the removable electronic device to removably connect the removable electronic device with the second pre-manufactured sensor assembly. The second socket may include a second plurality of contact protrusions extending from a second plurality of openings in a second base member of the second socket. A first length of the first base member of the first socket in the longitudinal direction may be less than a second link of the second base member of the second socket in the longitudinal direction.

In some example aspects, the present disclosure relates to a pre-manufactured sensor assembly and related manufacturing process that may be applied to create an interactive object from an existing object substrate that has been at least partially fabricated or otherwise formed prior to application of the pre-manufactured sensor assembly. The pre-fabricated sensor assembly may include a touch sensor, such as a resistive or capacitive touch sensor, and sensing circuitry formed in a housing that can be tightly integrated with the interactive object, while also being adapted to be applied to the interactive object after the interactive object has been at least partially assembled. In this manner, the pre-fabricated sensor assembly may enable the touch sensor to be physically incorporated into the interactive object while also allowing traditional manufacturing processes to be used to form at least a portion of the interactive object.

According to some example embodiments, a pre-fabricated sensor assembly may include a touch sensor having a plurality of sensing elements coupled to sensing circuitry of a first electronic device (e.g., an internal electronic device). One or more communication interfaces, such as communication cables, may be coupled to the electronic module to facilitate communication with other electronic components local to the pre-fabricated sensor assembly and/or with other electronic components remote from the assembly, such as a smartphone or other computing device. The receptacle may be coupled to at least one of the communication cables to removably connect a second electronic module (e.g., a removable electronic device) to the pre-fabricated sensor assembly. One or more flexible retention layers may be used to define a housing for at least the touch sensor and optionally other components such as the first electronic module. In some examples, one or more retaining layers may also be used to attach the pre-fabricated sensor assembly to the substrate of the object. For example, more than one retaining layer may be heat pressed, stitched, glued, bonded, or otherwise attached to the base of an existing object in order to form an interactive object therefrom. The one or more retaining layers may be one or more encapsulating layers formed of polyurethane or other suitable flexible material. In this manner, at least a portion of the object can be formed utilizing conventional manufacturing processes prior to integrating the capacitive touch sensor. By way of example, an interactive garment including a pre-fabricated sensor assembly according to an example embodiment may be manufactured with minimal disruption to conventional manufacturing processes used to form garments and the like. The garment may be at least partially manufactured using a conventional textile manufacturing process and then the pre-fabricated sensor assembly attached to form the interactive garment.

The prefabricated sensor assembly for an interactive object according to an example embodiment may be contrasted with previous methods for forming interactive objects. For example, many prior art techniques seek to integrate sensing elements into a substrate, such as a textile fabric, prior to forming the object. For example, some prior art weaves conductive wires into fabrics to form capacitive touch sensors. In these methods, the fabric with conductive threads is subjected to any manufacturing process for forming the object, such as cutting, sewing, gluing, etc. However, many conventional manufacturing processes, such as conventional textile manufacturing processes, may not be able to or may not easily process substrates such as textile fabrics having conductive sensing lines integrated within the fabric. Thus, such techniques may require modifications to conventional textile machinery and processes in order to be able to accommodate the conductive thread. Thus, in many cases, it may not be desirable to form a sensing line within a textile substrate that forms a garment or other interactive object, or the like.

According to an example embodiment of the present disclosure, a pre-fabricated sensor assembly may include a touch sensor including a plurality of sensing elements adapted to be integrated within an object after at least a portion of the object has been formed. In this manner, conventional manufacturing processes may be used to form at least a portion of the object prior to integrating the capacitive touch sensor.

For example, the interactive object may be manufactured by receiving a manufactured object that includes an object base. The manufactured object may be of a shape suitable for its primary purpose, such as a garment suitable for wearing, a backpack or suitcase suitable for carrying items, or the like. The manufactured object may include sub-components of the object, such as tape or other objects intended to be applied to other materials to form a final product. However, the strap is suitable for its primary purpose of attaching and providing a load bearing mechanism. The manufactured object may include a receiving feature. The manufacturing process may include providing a pre-formed sensor assembly including one or more flexible retention layers, a capacitive touch sensor, a first electronic module, and a communication interface having a first end coupled to the first electronic module and a second end coupled to a receptacle configured to removably connect a second electronic module to the pre-formed sensor assembly. The capacitive touch sensor can include a plurality of flexible sense lines elongated in a first direction and coupled to a first electronic module. The first electronic module is capable of being powered by the power source of the second electronic module when the second electronic module is connected to the pre-fabricated sensor assembly. The manufacturing process may include attaching the pre-fabricated sensor assembly to the object substrate after receiving the manufactured object.

By way of example, the interactive object may comprise a "soft" object formed at least in part from a flexible substrate, such as a garment, garment accessory, or garment container. The flexible substrate may be formed of a soft material such as leather, natural fibers, synthetic fibers, or a network of such fibers. The flexible substrate may comprise a textile, such as a woven or non-woven fabric, or other materials such as flexible plastics, films, and the like. The material may be formed by weaving, knitting, crocheting, knotting, pressing textile threads together, or consolidating fibers or filaments together in a non-woven manner. The interactive objects may also include "hard" objects, such as may be made of non-flexible or semi-flexible materials such as plastic, metal, aluminum, and the like. By utilizing flexible sensing lines with flexible retention layer structures, pre-fabricated sensor assemblies according to embodiments of the present disclosure may be incorporated into or otherwise applied to at least partially formed soft and/or hard objects.

As a specific example, consider a garment that may be manufactured from a textile-based substrate, such as a shirt or jacket. In this case, the woven or non-woven fabric may be treated to form a garment using conventional textile manufacturing techniques, which may include sewing, gluing, and other fastening techniques. After at least a portion of the garment has been formed using these conventional manufacturing processes, the pre-fabricated sensor assembly may be attached to the garment.

To apply the pre-made sensor assembly according to example embodiments, one or more portions of the garment may remain accessible, such as by leaving an opening in the cuff of a jacket or shirt. One or more seams for forming the cuff portion of the jacket may, for example, be left open. The open cuff may include a receiving feature of the interactive object. The pre-fabricated sensor assembly may be inserted into an opening or otherwise attached to an existing textile substrate forming the interactive garment. The pre-manufactured sensor assembly may be sewn, glued, heat pressed or attached to the jacket in another suitable way. After attachment to the pre-formed sensor assembly, one or more seams may be stitched or otherwise closed to complete the manufacture of the interactive object's cuff. In this way, minimal disruption to the manufacturing process of the jacket itself can occur. In some cases, additional portions of the manufacturing process may be performed after attaching the pre-fabricated capacitive sensor assembly.

As another example, a pre-manufactured sensor assembly may be attached to the interior of a garment or other object without leaving an opening for insertion of the assembly. For example, a pre-formed sensor assembly may be affixed to an inner surface of the textile product using a heat and pressure application, a stitching application, or other mechanism to attach the pre-formed sensor assembly to the partially formed object.

According to some embodiments, a pre-manufactured sensor assembly may include one or more capacitive touch sensors and one or more electronic modules including sensing circuitry electrically coupled to the capacitive touch sensors. The one or more capacitive touch sensors can each include a plurality of flexible and conductive sense lines. The sense lines can be formed of various flexible materials and in various shapes to provide a capacitive touch sensor that can be flexibly integrated within various types of interactive objects.

Traditionally, the use of flexible sense lines as post-fabrication applications has been problematic due to the ability of the sense lines to move relative to each other. Movement of the sense lines relative to each other can affect the ability of the sensing circuitry and other components to properly detect inputs. In some cases, such movement may even cause the sense lines to short to each other.

According to an example embodiment, by applying one or more flexible retention layers, a flexible sensor assembly may be provided in post-fabrication applications while retaining a predefined arrangement of sensor elements. The flexible sensing wires can be positioned in a predefined arrangement, including dimensions and spacing of the prefabricated components relative to each other and/or other components prior to incorporation into the object. One or more retention layers may be utilized to secure the plurality of sense lines in a predetermined arrangement. The retention layer can provide structural stability to maintain the plurality of sense lines in a desired arrangement. Due to their flexibility, the one or more retaining layers may also allow the components to flex as the interactive object moves and flexes. In some examples, the flexible retention layer can provide physical separation of the flexible sensing line from the object substrate.

According to some embodiments, the plurality of sensing elements may be formed from a multilayer flexible film to facilitate application of the flexible sensing line to an existing object. For example, the multilayer film may include one or more flexible base layers, such as flexible textiles, plastics, or other flexible materials. One or more metal layers may extend over the flexible base layer. Optionally, one or more passivation layers may extend over the one or more flexible base layers and the one or more metal layers to promote adhesion between the metal layers and the base layers. According to some examples, a multi-layer sheet including one or more flexible base layers, one or more metal layers, and optionally one or more passivation layers may be formed and then cut, etched, or otherwise separated into individual sense lines. Each sensing line may comprise a line of one or more metal layers formed on a line of one or more flexible base layers. Optionally, the sensing lines may include lines of one or more passivation layers overlying one or more flexible base layers.

According to some embodiments, one or more adhesive layers can be applied to the plurality of sense lines to help maintain the sense lines in a predefined arrangement and/or to couple the sense lines to other layers. In some examples, one or more adhesive layers may be applied to the first surface of each sense line or a portion of each sense line. The adhesive layer may be a common adhesive layer extending over a surface of each of the sense lines.

In some examples, one or more shielding layers can be applied over at least a portion of one or more of the sense lines to selectively define a touch sensitive area of the capacitive touch sensor. By way of example, a plurality of sense lines for a capacitive touch sensor can extend in a first direction and a second direction different from the first direction. For example, the plurality of sensing lines may extend in a longitudinal direction and a transverse direction substantially orthogonal to the longitudinal direction. A longitudinal portion of each conductive sense line can be covered by one or more shield layers to selectively define a touch sensitive area of the capacitive touch sensor at portions of the sense line extending in a lateral direction. Alternatively, a lateral portion of each conductive sense line may be covered by one or more shield layers to selectively define a touch sensitive area at a portion of the sense line extending in the longitudinal direction. One or more adhesive layers may be applied on an upper surface of the one or more sense lines, and one or more shielding layers may be applied on an upper surface of the one or more adhesive layers. Other examples of selectively forming touch sensitive areas using one or more shielding layers may be used. In some examples, a single layer may provide electrical shielding as well as adhesive properties.

According to some embodiments, the plurality of sense lines may each include a first portion extending in a first direction, wherein the plurality of sense lines have a spacing therebetween in a second direction. The second direction may be substantially orthogonal to the first direction. The plurality of sensing lines may also extend in the second direction, with a spacing therebetween in the first direction. A first portion of each sense line can be connected to sensing circuitry and a second portion of each sense line can be used to form a touch sensitive area of the capacitive touch sensor. The spacing in the first direction may be less than the spacing in the second direction to enable a compact arrangement for attaching wires to the sensing circuitry. Also, in some examples, a larger spacing in the second direction may facilitate more robust detection of touch inputs. By spacing the sense lines appropriately, more efficient, accurate, and/or precise detection of touch input can be achieved.

According to some examples, the plurality of conductive lines may form a plurality of sense lines for a capacitive touch sensor of the pre-fabricated sensor assembly. At least a portion of each conductive thread may be connected to the flexible substrate, such as by weaving, embroidering, gluing, or otherwise attaching the conductive thread to the flexible substrate. In some examples, a conductive wire may be woven with a plurality of non-conductive wires to form a flexible substrate.

In some examples, each conductive line may include a first loose end that is not directly attached to the flexible substrate. Each conductive line may include a second loose end opposite the first loose end of the conductive line and also not directly attached to the flexible substrate. Between the loose ends, each conductive wire may include an attachment portion extending along and attached to the flexible substrate. The first loose end of each conductive wire may be attached to an internal electronics module of the pre-fabricated sensor assembly. The second loose end of each conductive wire may be removable with respect to the flexible substrate. In some examples, the second loose end of each conductive wire may extend beyond the outer periphery of the flexible substrate. In some examples, the extent to which each lead extends beyond the outer perimeter of the flexible substrate may serve as a touch sensitive area of the capacitive touch sensor.

In some embodiments, each conductive wire may include a longitudinal portion attached to the flexible substrate and a transverse portion that is released from the flexible substrate and optionally extends beyond the periphery of the flexible substrate. The lateral portion of each conductive line may extend in a direction substantially orthogonal to the longitudinal portion. The lateral portion of each conductive line may form a touch sensitive area of the capacitive touch sensor. The touch sensitive area formed by the lateral portion of the sense line can be configured to receive a touch input such as a swipe gesture provided in a longitudinal direction. Other gestures may be detected, such as a cold (cold), a swipe, and so forth.

According to some example embodiments, the conductive line may include a first portion attached to the flexible substrate of the pre-fabricated sensor assembly and a second portion attached to a different substrate. By way of example, a pre-fabricated sensor assembly may be affixed to a textile substrate to form an interactive garment. The first portion of each conductive wire may be attached to a flexible substrate, such as a first textile fabric, within the pre-fabricated sensor assembly. The second portion of each conductive thread may be attached to a core substrate of the interactive garment, such as a textile substrate from which the interactive garment itself is formed. Various techniques may be utilized to attach the second portion of each conductive thread to the interactive garment substrate. For example, the second portion of each conductive thread may be attached to the interactive garment using embroidery techniques, which may be particularly suitable for applying conductive threads to already fabricated objects. Other techniques such as gluing, bonding, etc. may be used.

In some implementations, one or more shield layers can be used to form the first and second capacitive touch sensors from the plurality of flexible sense lines. The first capacitive touch sensor can include a first subset of the plurality of flexible sense lines and the second capacitive touch sensor can include a second subset of the plurality of flexible sense lines. Each of the first subset of flexible sense lines can include a first portion that is elongated in a first direction and a second portion that is elongated in a second direction. Each of the second subset of flexible sense lines can include a first portion that is elongated in a first direction, and can also include a second portion. One or more shield layers can be formed on the first portion of each of the first subset of flexible sense lines. The one or more sensing circuits can be physically coupled to the first subset and the second subset of the plurality of flexible sensing lines. In this manner, the second portion of each of the first subset of flexible sense lines can form a touch sensitive area of the first capacitive touch sensor. Additionally, a second portion of each of the second subset of flexible sense lines can form a touch sensitive area of the second capacitive touch sensor. In some examples, the one or more shielding layers may cover a first portion of the flexible sensing lines of the second subset of the plurality of flexible sensing lines. The second portion of each of the second subset of flexible sense lines can be elongated in the second direction or the first direction.

Although much of the present disclosure is described with respect to capacitive touch sensors, it will be understood that any type of sensor may be included in a prefabricated sensor assembly as described. For example, a resistive touch sensor may be formed in a similar manner as the capacitive touch sensor described. Other types of sensors may be used, such as inertial measurement units, strain gauges, ultrasonic sensors, radar-based touch interfaces, image-based sensors, infrared sensors, and the like.

The pre-fabricated sensor assembly can include one or more flexible retention layers that define a housing for a plurality of sense lines that form a capacitive touch sensor. The housing may additionally house other components of the pre-fabricated sensor assembly, such as an internal electronics module. By including multiple sense lines within a housing created by one or more flexible retention layers, multiple sense lines for a capacitive touch sensor can be provided in a predefined sensor layout. Further, by utilizing a flexible layer, the capacitive touch sensor can remain flexible to enable subsequent integration within various interactive objects. In addition, the pre-fabricated sensor assembly may be integrated within a flexible object, such as an interactive garment, in a manner that enables the capacitive touch sensor to remain flexible with the interactive garment. In some examples, the flexible retaining layer may form a watertight housing. In some examples, the flexible retention layer may form a hermetically sealed housing.

According to some example embodiments, the interactive object may include an internal electronic module integrated within the interactive object. The plurality of sensing elements may be directly attached to the internal electronics module or may be attached to the internal electronics module via one or more connector components. The internal electronics module can provide power and/or control signals to the plurality of sense lines. In some embodiments, the internal electronics module may not include an on-board power supply. Alternatively, a removable electronic module removably coupled via a receptacle of the pre-fabricated sensor assembly may provide power to the internal electronic module.

In some examples, the internal electronics module can include sensing circuitry for a plurality of sense lines. The internal electronics module may include a first subset of electronic components, such as one or more drivers configured to provide control signals and/or power to the plurality of sense lines. In some examples, the internal electronics module includes a controller configured to generate control signals for the plurality of sense lines and detect a change in capacitance based on an object approaching or contacting the plurality of sense lines. In some examples, the internal electronics module includes a flexible Printed Circuit Board (PCB). The printed circuit board may include a set of contact pads and/or one or more ports for attachment to one or more communication cables. In some examples, the printed circuit board includes a microprocessor. A portion of a PCB (e.g., including a microprocessor) may be overmolded with the polymer composition.

In some embodiments, a removable electronic module comprising a second subset of electronic components (e.g., a microprocessor, a power supply, or a network interface) may be removably coupled to the interactive object via the communication interface. The communication interface enables communication between the internal electronic module and the removable electronic module when the removable electronic module is coupled to the interactive object. In an example embodiment, the removable electronic module may be removably mounted to a rigid member on the interactive object, such as a socket. The socket may include a connection device for physically and electrically coupling to the removable electronic module. The internal electronics module may communicate with the receptacle. The internal electronics module may be configured to communicate with the removable electronics module when connected to the receptacle. The controller of the removable electronic module may receive the information and send commands to the internal electronic module. The communication interface is configured to enable communication between the internal electronics module and the controller when the receptacle is coupled to the removable electronics module. For example, the communication interface may include a network interface integral with the removable electronic module. The removable electronic module may also include a rechargeable power supply. The removable electronic module may be removed from the interactive object to charge the power source. Once the power source is charged, the removable electronic module may be placed back into the interactive object and electrically coupled to the connector.

According to some embodiments, a touch sensor formed of one or more sets of sensing elements, such as conductive lines or lines formed of one or more conductive films, may be coupled to an internal electronics module integrated into the interactive object. The set of sensing elements may be directly attached to the internal electronics module, or may be attached to the internal electronics module via one or more connector components.

The internal electronics module may include electronic components, such as sensing circuitry configured to detect touch inputs to the wires. In some examples, the sensing circuit includes a controller configured to detect a touch input, for example, when user pressure is applied to the conductive line. The controller may also detect touch input when an object contacts or is proximate to the sense line. The controller may be configured to transmit the touch input data to the computing device. In some examples, the controller includes a flexible Printed Circuit Board (PCB). The printed circuit board may include a set of electrical contacts (such as contact pads for attaching to the sense lines).

Touch input provided via a resistive or capacitive touch sensor as described may include various applications and capabilities. By way of example, the touch sensor may be used as a button to detect a simple touch input at the location of the touch sensor. In some examples, a one-dimensional array of sense lines can be used to implement a touch sensor capable of detecting button-type inputs. The one-dimensional array of sense lines can also be used to detect one-dimensional sliding inputs (e.g., motion in a single direction corresponding to the spacing between the lines). In some examples, a two-dimensional array of sense lines can be used to implement a touch sensor capable of detecting trackpad inputs (including a particular location of a touch within a grid of conductive lines). Additionally, the two-dimensional array of sensing lines can be used to detect various gesture inputs, authentication inputs, predefined keystrokes, movements, user-specific natural behaviors, and the like. One or more machine learning models may be used to detect user input based on training the machine learning models using training data. Additionally, the touch sensor may be configured to detect analog and pseudo force inputs from changes in capacitance caused by finger distance.

According to some aspects, the pre-fabricated sensor component may be responsive to input received via an external computing device (e.g., a smartphone, a tablet, a laptop, etc.). The external computing device may be communicatively coupled to the interactive object using one or more wireless and/or wired interfaces. A gesture manager may be implemented on a computing device to store a mapping between gestures and functions of the computing device. A function mapped to a gesture may be initialized in response to detecting the gesture at the capacitive touch sensor. The interactive object may be responsive to a gesture detected by the internal electronics module, the removable electronics module, the remote computing device, or any combination thereof.

Embodiments of the disclosed technology provide a number of technical effects and benefits, particularly in terms of computing technology, capacitive touch sensors, and the integration of capacitive touch sensors including associated electronics with interactive objects such as clothing. In addition, one or more aspects of the disclosed technology may address problems that may arise when attempting to provide a practical system and method for incorporating an input device, such as a capacitive touch sensor, into an existing object, such as a garment or the like. In accordance with example embodiments of the disclosed technology, a pre-fabricated sensor assembly may uniquely provide a flexible architecture that may be utilized after processing at least a portion of a substrate of an object. In this manner, the sensing lines need not be incorporated directly into the subject substrate, but can be flexibly applied to the subject substrate after at least some processing of the substrate. The unique combination of the set of flexible sense lines housed in the one or more flexible retention layers enables the capacitive touch sensor to be tightly integrated within an object without the need to integrate the sense lines of the capacitive touch sensor with the substrate of the object. Further, the flexible retention layer enables post-processing attachment of the capacitive touch sensor, creating an interactive object from an existing structure. Further, the flexible retention layer can retain the plurality of sense lines in a predefined arrangement or sensor layout. This may enable the use of flexible sensing lines while also maintaining the sensing lines in a known and predefined arrangement to provide sufficient sensing capability.

In some examples, the set of conductive lines may include a multilayer film including a flexible base layer, one or more metal layers, and optionally one or more passivation layers. For example, an electromagnetic field shielding fabric may be used. These fabrics may be referred to as EMI fabrics. The metal layer includes at least one of a copper layer, a silver layer, or a gold layer. These leads may be formed within a housing defined by one or more flexible retaining layers. In some examples, the plurality of conductive lines may be formed on a common flexible substrate, which may include an adhesive layer in some cases. The multilayer structure may enable the provision of flexible metal cords adapted to be integrated within an interactive object such as a garment, garment accessory, garment container or the like.

In some examples, the set of wires may include a set of conductive wires. The set of conductive wires may be attached to the flexible substrate, such as by weaving at least a portion of each of the conductive wires with a plurality of non-conductive wires to form a flexible textile substrate. The set of conductive wires comprising the flexible substrate may be disposed within a housing created by the one or more retention layers to retain the set of conductive wires in a predefined arrangement. In some examples, the set of conductive wires may be selectively attached to the flexible substrate such that at least a portion of each conductive wire is released from the flexible substrate. This may enable a unique configuration and arrangement of capacitive touch sensors that include selectively defined touch sensitive areas to receive touch input.

These unique arrangements, including but not limited to flexible sensing wires and flexible retaining layers, provide a practical device that can be incorporated into existing manufacturing techniques and other processes. Such an approach may overcome the problems associated with the high cost and destructiveness of incorporating sense lines within the substrate of existing structures. For example, according to an example embodiment, existing textiles and other manufacturing processes may be used with the pre-fabricated sensor assembly.

Referring now to the drawings, example aspects of the disclosure will be discussed in more detail.

FIG. 1 is an illustration of an example environment 100 in which an interactive object having a plurality of electronic modules may be implemented. The environment 100 includes a touch sensor 102 (e.g., a capacitive or resistive touch sensor) or other sensor. The touch sensor 102 is shown as being integrated within various interactive objects 104. The touch sensor 102 can include one or more sensing elements, such as conductive lines or other sensing lines, configured to detect touch inputs. In some examples, the capacitive touch sensor may be formed from an interactive textile, which is a textile configured to sense multi-touch input. As described herein, a textile corresponds to any type of flexible knitted material consisting of a network of natural or artificial fibers, commonly referred to as textile threads or yarns. Textiles may be formed by weaving, knitting, crocheting, knotting textile threads, pressing textile threads together, or consolidating fibers or filaments together in a non-woven manner. The capacitive touch sensor may be formed from any suitable conductive material and in other ways, such as by using flexible conductive wires including metal wires, filaments, etc., attached to a non-woven substrate.

In environment 100, interactive objects 104 include "flexible" objects, such as shirts 104-1, hats 104-2, handbags 104-3, and shoes 104-6. However, it should be noted that the touch sensor 102 may be integrated in any type of flexible object made of fabric or similar flexible material, such as a garment or clothing, a garment accessory, a garment container, a blanket, a shower curtain, a towel, a bed sheet, a bed cover, or a fabric shell of furniture, to name a few. Examples of garment accessories may include sweat absorbing elastic bands worn around the head, wrist, or biceps. Other examples of garment accessories may be found in various wrist, arm, shoulder, knee, leg and hip braces (braches) or compression sleeves (compression sleeves). Headwear is another example of a garment accessory such as visor, hat, and insulated balaclava. Examples of garment containers may include waist or hip bags, backpacks, hand bags, satchels, suspension garment bags, and handbags. The garment container may be worn or carried by the user, as in the case of a backpack, or may hold its own weight, as in a roller box. The touch sensor 102 can be integrated within the flexible object 104 in a variety of different ways including weaving, stitching, gluing, and the like.

In this example, the objects 104 further include "hard" objects, such as a plastic cup 104-4 and a hard smartphone shell 104-5. However, it should be noted that hard object 104 may include any type of "hard" or "rigid" object made of a non-flexible or semi-flexible material, such as plastic, metal, aluminum, and the like. For example, hard object 104 may also include a plastic chair, a water bottle, a plastic ball, or an automobile part, to name a few. In another example, hard object 104 may also include clothing accessories, such as a chest plate, helmet, visor, shin guard, and elbow guard. Alternatively, the hard or semi-flexible garment accessory may be embodied by a shoe, cleat, boot, or sandal. The touch sensor 102 may be integrated within the hard object 104 using a variety of different manufacturing processes. In one or more embodiments, injection molding is used to integrate the touch sensor into the hard object 104.

The touch sensor 102 enables a user to control an object 104 integrated with the touch sensor 102 or to control various other computing devices 106 via a network 110. Computing device 106 is shown with various non-limiting example devices: a server 106-1, a smartphone 106-2, a laptop computer 106-3, computing glasses 106-4, a television 106-5, a camera 106-6, a tablet computer 106-7, a desktop computer 106-8, and a smart watch 106-9, although other devices may be used, such as home automation and control systems, sound or entertainment systems, home appliances, security systems, netbooks, and e-readers. Note that the computing device 106 may be wearable (e.g., computing glasses and smart watches), non-wearable but mobile (e.g., laptops and tablets), or relatively immobile (e.g., desktops and servers). The computing device 106 may be a local computing device, such as a computing device that may be accessed through a bluetooth connection, near field communication connection, or other local network connection. Computing device 106 may be a remote computing device, such as a computing device of a cloud computing system.

Network 110 includes one or more of many types of wireless or partially wireless communication networks, such as a Local Area Network (LAN), a Wireless Local Area Network (WLAN), a Personal Area Network (PAN), a Wide Area Network (WAN), an intranet, the internet, a peer-to-peer network, a mesh network, and so forth.

The touch sensor 102 can interact with the computing device 106 by transmitting touch data or other sensor data via the network 110. Additionally or alternatively, the touch sensor 102 may transmit gesture data, motion data, or other data derived from sensor data generated by the touch sensor. The computing device 106 may use the touch data to control the computing device 106 or an application on the computing device 106. As an example, consider that the touch sensor 102 integrated on the shirt 104-1 may be configured to control the user's smart phone 106-2 in the user's pocket, the user's television 106-5 in the user's home, the smart watch 106-9 on the user's wrist, or other various appliances in the user's house, such as a thermostat, lights, music, and so forth. For example, the user may be able to slide up or down on the touch sensor 102 integrated within the user's shirt 104-1 to raise or lower the volume on the television 106-5, raise or lower the temperature controlled by a thermostat in the user's house, or turn on and off lights in the user's house. Note that the touch sensor 102 may recognize any type of touch, tap, slide, hold, or stroke gesture.

In more detail, consider fig. 2 which illustrates an example system 190 that includes the interactive object 104, the removable electronic module 150, and the computing device 106. In the system 190, the touch sensor 102 is integrated in the object 104, which object 104 may be implemented as a flexible object (e.g., a shirt 104-1, hat 104-2, or handbag 104-3) or a hard object (e.g., a plastic cup 104-4 or smartphone housing 104-5).

The touch sensor 102 is configured to sense touch input from a user when one or more fingers of the user's hand touch or are in proximity to the touch sensor 102. The touch sensor 102 may be configured as a capacitive touch sensor or a resistive touch sensor to sense single touch, multi-touch, and/or full-hand touch input from a user. To enable detection of touch input, the touch sensor 102 includes a sensing element 108. The sensing element may include various shapes and geometries. In some examples, the sensing elements 108 may be formed as a grid, array, or parallel pattern of sensing lines such that touch inputs are detected. In some implementations, the sensing element 108 does not alter the flexibility of the touch sensor 102, which enables the touch sensor 102 to be easily integrated within the interactive object 104.

The interactive object 104 comprises an internal electronics module 124 (also referred to as internal electronics), which internal electronics module 124 is embedded within the interactive object 104 and directly coupled to the sensing element 108. The internal electronics module 124 may be communicatively coupled to the removable electronics module 150 (also referred to as a removable electronic device) via a communication interface 162. The internal electronics module 124 contains a first subset of electronic circuits or components for the interactive object 104 and the removable electronics module 150 contains a second, different subset of electronic circuits or components for the interactive object 104. As described herein, internal electronics module 124 may be physically and permanently embedded within interactive object 104, while removable electronics module 150 may be removably coupled to interactive object 104.

In the system 190, the electronic components contained within the internal electronics module 124 include sensing circuitry 126, the sensing circuitry 126 coupled to the sensing elements 108 forming the touch sensor 102. In some examples, the internal electronics module includes a flexible Printed Circuit Board (PCB). The printed circuit board may comprise a set of contact pads for attachment to the wires. In some examples, the printed circuit board includes a microprocessor. For example, wires from the conductive lines may be connected to the sensing circuitry 126 using a flexible PCB, crimping, gluing with conductive glue, soldering, and the like. In one embodiment, the sensing circuit 126 may be configured to detect a touch input of a user input on the conductive line that is preprogrammed to indicate a certain request. In one embodiment, when the conductive lines form a grid or other pattern, the sensing circuitry 126 can be configured to also detect the location of touch inputs on the sensing elements 108 and the motion of the touch inputs. For example, when an object, such as a user's finger, touches the sensing element 108, the location of the touch may be determined by the sensing circuitry 126 by detecting changes in capacitance on the grid or array of sensing elements 108. The touch input may then be used to generate touch data that may be used to control the computing device 106. For example, the touch input may be used to determine various gestures, such as single-finger touch (e.g., touch, tap, and hold), multi-finger touch (e.g., two-finger touch, two-finger tap, two-finger grip, and pinch), single-finger and multi-finger swipe (e.g., swipe up, swipe down, swipe left, swipe right), and full-hand interaction (e.g., touching a textile with the user's entire hand, covering the textile with the user's entire hand, pressing the textile with the user's entire hand, touching with the palm of the user's hand, and scrolling, twisting, or rotating the user's hand while touching the textile).

The internal electronics module 124 may include various types of electronic devices, such as sensing circuitry 126, sensors (e.g., capacitive touch sensors woven into the garment, microphones, or accelerometers), output devices (e.g., LEDs, speakers, or micro-displays), circuitry, and so forth. The removable electronic module 150 may include various electronic devices configured to connect and/or interface with the electronic devices of the internal electronic module 124. Generally, the electronics contained within the removable electronic module 150 are different than those contained within the internal electronics module 124 and may include, for example, a microprocessor 152, a power supply 154 (e.g., battery), memory 155, a network interface 156 (e.g., bluetooth, or WiFi, USB), sensors (e.g., accelerometer, heart rate monitor, pedometer, IMU), output devices (e.g., speaker, LED), and the like.

In some examples, the removable electronic module 150 is implemented as a band or label containing various electronic devices. For example, the band or label may be formed of a material such as rubber, nylon, plastic, metal, or any other type of fabric. It is noted, however, that removable electronic module 150 may take any type of shape. For example, the removable electronic module 150 may resemble a circular or square block of material (e.g., rubber or nylon) rather than a strap.

An Inertial Measurement Unit (IMU)158 may generate sensor data indicative of the position, velocity, and/or acceleration of the interactive object. The IMU 158 may generate one or more outputs that describe one or more three-dimensional motions of the interactive object 104. The IMU may be removably or non-removably secured to the internal electronics module 124, for example, with zero degrees of freedom, such that the inertial measurement unit translates and reorients as the interactive object 104 translates and reorients. In some embodiments, the inertial measurement unit 158 may include a gyroscope or accelerometer (e.g., a combination of a gyroscope and an accelerometer), such as a three-axis gyroscope or accelerometer configured to sense rotation and acceleration along and about three substantially orthogonal axes. In some embodiments, the inertial measurement unit may include a sensor configured to detect a change in velocity or a change in rotational velocity of the interactive object, and an integrator configured to integrate signals from the sensor such that a net motion may be calculated, e.g., by a processor of the inertial measurement unit, based on the integrated motion about or along each of the plurality of axes.

The communication interface 162 enables the transfer of power and data (e.g., touch inputs detected by the sensing circuitry 126) between the internal electronics module 124 and the removable electronics module 260. In some embodiments, the communication interface 162 may be implemented as a connector that includes a connector insert and a connector receptacle. The connector plug may be implemented at the removable electronic module 150 and configured to connect to a connector receptacle, which may be implemented at the interactive object 104. One or more communication interfaces may be included in some examples. For example, a first communication interface may physically couple the removable electronic module 150 to one or more computing devices 106, and a second communication interface may physically couple the removable electronic module 150 to the interactive object 104.

In system 190, removable electronic module 150 includes microprocessor 152, power supply 154, and network interface 156. The power supply 154 may be coupled to the sensing circuitry 126 via the communication interface 162 to provide power to the sensing circuitry 126 to enable detection of touch inputs, and may be implemented as a small battery. When the sensing circuitry 126 of the internal electronics module 124 detects a touch input, data representing the touch input may be communicated to the microprocessor 152 of the removable electronics module 150 via the communication interface 162. The microprocessor 152 can then analyze the touch input data to generate one or more control signals, which can be transmitted to the computing device 106 (e.g., smartphone, server, cloud computing infrastructure, etc.) via the network interface 156 to cause the computing device to initialize particular functions. In general, network interface 156 is configured to communicate data, such as touch data, to a computing device over a wired, wireless, or optical network. By way of example, and not limitation, network interface 156 may be through a Local Area Network (LAN), a Wireless Local Area Network (WLAN), a Personal Area Network (PAN) (e.g., Bluetooth)^TM) Wide Area Network (WAN), intranet, Internet, peer-to-peer network, networkMesh networks, and the like (e.g., through network 110 of fig. 1 and 2).

The object 104 may also include one or more output devices 127 configured to provide a haptic response, a tactile response, an audio response, a visual response, or some combination thereof. Similarly, the removable electronic module 150 may include one or more output devices 159, the one or more output devices 159 configured to provide a tactile response, and an audio response, a visual response, or some combination thereof. The output devices may include a visual output device such as one or more Light Emitting Diodes (LEDs), an audio output device such as one or more speakers, one or more tactile output devices, and/or one or more tactile output devices. In some examples, the one or more output devices are formed as part of a removable electronic module, although this is not required. In one example, the output device may include one or more LEDs configured to provide different types of output signals. For example, one or more LEDs may be configured to generate a circular pattern of light, such as by controlling the sequence and/or timing of individual LED activations. Other light and techniques may be used to generate the visual pattern including a circular pattern. In some examples, one or more LEDs may produce different colored lights to provide different types of visual indications. The output devices may include tactile or haptic output devices that provide different types of output signals in the form of different vibrations and/or vibration patterns. In yet another example, the output device may include a haptic output device, such as an interactive garment that may be tightened or loosened with respect to the user. For example, clips, buttons, cuffs, pleats, pleat actuators, bands (e.g., shrink bands), or other devices may be used to adjust the fit (e.g., tighten and/or loosen) of the garment on the user. In some examples, the interactive textile may be configured to tighten the garment, such as by actuating conductive wires within the touch sensor 102.

The motion manager 161 can interact with the computing device 106 and the application on the touch sensor 102 to effectively help control the application through touch input received by the touch sensor 102 in some cases. For example, the motion manager 161 may interact with an application. In fig. 2, the motion manager 161 is illustrated as being implemented at the removable electronic module 150. However, it will be understood that motion manager 161 may be implemented at internal electronics module 124, computing device 106 remote from the interactive object, or some combination thereof. In some embodiments, the motion manager may be implemented as a standalone application. In other embodiments, the motion manager may be integrated with one or more applications at the computing device.

A gesture or other predetermined action may be determined based on touch data detected by the touch sensor 102 and/or the inertial measurement unit 158 or other sensors. For example, motion manager 161 may determine gestures based on touch data, such as single finger touch gestures, double tap gestures, two finger touch gestures, swipe gestures, and so forth. As another example, the motion manager 161 may determine the pose based on motion data such as velocity, acceleration as may be determined by the inertial measurement unit 158.

The function associated with the gesture may be determined by the motion manager 161 and/or an application on the computing device. In some examples, it is determined whether the touch data corresponds to a request to perform a particular function. For example, the motion manager determines whether the touch data corresponds to a user input or gesture that maps to a particular function, such as initiating a vehicle service, triggering a text message or other notification related to a vehicle service, answering a phone call, creating a diary entry, and so forth. As described throughout, any type of user input or gesture may be used to trigger a function, such as sliding, tapping, or holding the touch sensor 102. In one or more embodiments, the motion manager enables an application developer or user to configure the type of user input or gestures that may be used to trigger gestures for a variety of different types of functions. For example, the sports manager may cause a particular function to be performed, such as by sending a text message or other communication, answering a call, creating a diary entry, increasing the volume of a television, turning on a light in the user's house, turning on an automated garage door at the user's house, and so forth.

While the internal electronics module 124 and the removable electronics module 150 are shown and described as including particular electronic components, it should be understood that these modules may be configured in a variety of different ways. For example, in some cases, the electronic components described as being contained within the internal electronic module 124 may be implemented at least in part at the removable electronic module 150, and vice versa. Further, the internal electronics module 124 and the removable electronics module 150 may include electronic components other than those shown in fig. 2, such as sensors, light sources (e.g., LEDs), displays, speakers, and the like.

Fig. 3 depicts an example of a computing environment including a plurality of interactive objects in which removable electronic module 150 may be removably inserted and removed. In FIG. 3, removable electronic module 150 may be removably inserted into interactive backpack 104-7, interactive shoe 104-6, interactive wand 104-8, and interactive cup 104-9 or a mug. It will be understood that the depicted interactive objects are provided by way of example only. Removable electronic module 150 may be removably inserted into any number and type of interactive objects. Interactive backpack 104-7 and interactive shoe 104-6 are examples of flexible interactive objects into which removable electronic module 150 may be removably inserted. The wand 104-8 and mug 104-9 are examples of hard interactive objects into which the removable electronic module 150 may be removably inserted. Each interactive object includes a receiving feature 105, such as a receptacle configured to removably receive a removable electronic module 150.

The receiving feature 105 at each interactive object may comprise a different form factor appropriate for the particular interactive object. In some examples, the receiving features 105 may include a receptacle having a slot-based form factor, wherein the removable electronic module 150 may be physically coupled to the receptacle by insertion in a single slot direction. In other examples, the receiving features 105 may include receptacles having a cartridge-based form factor, wherein the removable electronic module 150 may be physically coupled to the receptacles by insertion in a longitudinal and vertical direction. Other types of form factors may be used.

In some examples, the receiving feature 105 at the interactive object may include electrical contacts for establishing an electrical connection with the removable electronic module. For example, interactive object 104 may include one or more touch sensors and/or internal electronics modules coupled to the electrical contacts. For example, the interactive backpack 104-7 may include a receptacle receiving feature 105, the receptacle receiving feature 105 comprising a form factor configured to physically couple to the removable electronic module 150 when plugged in. Additionally, the socket receiving feature may include one or more contacts configured to provide an electrical connection between the removable electronic module 150 and one or more electronic components of the interactive object. For example, the receiving feature 105 may include a set of contact pads configured to contact a set of contact pads of the removable electronic module 150. In some examples, each receiving feature may include one or more retaining elements configured to couple with one or more retaining elements of the removable electronic module 150.

In some examples, the receiving feature 105 at the interactive object may include one or more retaining elements without including electrical contacts for establishing an electrical connection. For example, some interactive objects may not include a touch sensor or an internal electronic module to which a removable electronic module would be electrically connected when inserted. For example, the interactive shoe 104-6 may include receiving features 105, the receiving features 105 configured to securely receive the removable electronic module 150 when inserted into the shoe, but not include electrical contacts. The removable electronic module 150 may be used to generate motion data, such as from an inertial measurement unit of the removable electronic module 150. Additionally or alternatively, removable electronic module 150 may be configured to provide one or more outputs, such as audible, visual, and tactile outputs, in response to input from, for example, a remote computing device. In this case, the receiving feature 105 may not necessarily include an electrical contact.

Fig. 4-7 depict an example of a removable electronic module 150 according to an example embodiment of the present disclosure. Fig. 4 is a top perspective view of the removable electronic module, fig. 5 is a bottom perspective view of the removable electronic module, fig. 6 is a first side perspective view of the removable electronic module, and fig. 7 is a second side perspective view of the removable electronic module. The removable electronic module 150 may define a longitudinal axis 201, a lateral axis 203, and a transverse or vertical axis 205. The removable electronic module 150 includes a housing defining an upper surface 202, a lower surface 204, a first transverse surface 206, a first longitudinal surface 208, a second longitudinal surface 210, and a second transverse surface 212. In some examples, an input device 218, such as a button, is provided to receive user input. The housing may include one or more members defining a surface of the housing. For example, the housing may be a composite of the different components, or may be a non-composite structure. In some examples, the housing may include rounded edges to provide a device with enhanced ergonomics for the user and to facilitate ease of insertion and removal from the receptacle.

The removable electronic module 150 may include a first communication interface including a connector 242 configured to physically and communicatively couple the removable electronic device to a remote computing device. The first communication interface is an example of a wired communication interface 162. In an example embodiment, the first communication interface may be formed adjacent to an opening in the first longitudinal surface 208. In an example embodiment, a removable cable, such as a USB cable, may be inserted into connector 242 and attached to the remote computing device to establish a physical and communicative connection between the removable electronic module and the remote computing device. The connector 242 may physically couple the removable electronic module to a remote computing device (e.g., via a connecting cable) and may communicatively couple the removable electronic module to the remote computing device. In an example embodiment, the removable electronic module 150 may include a power source (e.g., power source 154) such as a battery, which may be charged via the connector 242 of the first communication interface. The removable electronic module 150 may establish a communication and power coupling to a remote computing device via the connector 242. In some examples, the connector 242 may be implemented at a USB type interface, a micro-USB type interface, or other type of interface.

Removable electronic module 150 may include a second communication interface configured to communicatively and/or physically couple the removable electronic device to various preconfigured sensor components of the interactive object. In some examples, the second communication interface is an example of a wired network interface 156. In an example embodiment, the second communication interface may include one or more contact pads 222. As shown in fig. 5, the lower surface 204 of the removable electronic module 150 may include a plurality of openings that expose a plurality of contact pads 222. In the example of fig. 5, the removable electronic module 150 includes 6 electrical contact pads 222-1, 222-2, 222-3, 222-4, 222-5, 222-6, however, any number of electrical contact pads may be used. In some examples, an upper surface of each electrical contact pad may be recessed relative to a lower surface 204 of the removable electronic module 150. For example, the lower surface 204 may include a plurality of openings such that the electrical contact pads 222 may be formed on the underside of the lower surface 204 where they are accessible via the openings of the lower surface 204. An upper surface of each of the plurality of contact pads may define a plane that is lower in a vertical direction than a plane defined by a bottom surface of the removable electronic device.

The removable electronic module 150 may include a plurality of retention elements 232. The plurality of retaining elements may be configured to removably couple the removable electronic device to a receptacle of a preconfigured sensor assembly of the interactive object. In some examples, the plurality of retaining elements may be configured to removably couple the removable electronic module 150 to different types of receptacles of different preconfigured sensor assemblies. For example, the plurality of retention elements may be configured to removably couple the removable electronic module 150 to a receptacle having a slot-based form factor, a receptacle having a bucket-or cartridge-based form factor, or a receptacle having other form factors.

The removable electronic module 150 includes a first retention element 232-1 disposed along the first longitudinal surface 208, a second retention element 232-2 disposed along the second longitudinal surface 210, and a third retention element 232-3 disposed along the first lateral surface 206. In an exemplary embodiment, the first, second, and third retaining elements 232-1, 232-2, 232-3 may be retracted retaining elements. For example, each retaining element may be recessed relative to the respective surface in which it is formed. In this manner, each retention element may be configured to receive a respective retention element, such as a detent retention element disposed on a respective surface of a socket or other receiving feature. In an example embodiment, the first and second retention elements 232-1 and 232-2 may have a circular cross-sectional shape, and in an example embodiment, the third retention element 232-3 may have an oval or rectangular cross-sectional shape. Note that more or less than three retaining elements may be used in example embodiments, and different shapes of retaining elements may be used.

Fig. 8-10 depict an example of a prefabricated sensor assembly 300 according to an example embodiment of the present disclosure. Fig. 8 and 9 depict a top perspective view and a bottom perspective view, respectively, of the sensor assembly 300. Fig. 10 depicts a top view showing additional details of the touch sensor 302. Sensor assembly 300 includes touch sensor 302, internal electronics module 124, receptacle 330, communication cable 320, and communication cable 322. In an example embodiment, the touch sensor 302 is one example of a touch sensor as illustrated in fig. 1 and 2, and may be configured as a capacitive touch sensor or a resistive touch sensor.

The pre-formed sensor assembly 300 includes a touch sensor 302 formed from a plurality of conductive lines 308-1 through 308-12. The conductive lines 308-1 to 308-12 are one example of the sensing element 108. The conductive lines 308-1 through 308-12 extend in a lateral direction parallel to a lateral axis 203 defined by the touch sensor 302. The conductive lines 308-1 to 308-12 include a curved section 351, the curved section 351 connecting a first lateral section 357 of each conductive line to a longitudinal section 353 of each conductive line extending in a direction parallel to the longitudinal axis 201. The first lateral segment 357 of each conductive line is attached to the substrate 332, while the second lateral segment 359 of each conductive line extends beyond the outer perimeter of the substrate 332 to form a relieved portion of each conductive line. The longitudinal section 353 may extend in a first direction (e.g., longitudinal) at a first portion of the pre-fabricated sensor assembly, and the transverse portion may extend in a second direction (e.g., transverse) at a second portion of the pre-fabricated sensor assembly. The first direction and the second direction may be substantially orthogonal. In some examples, conductive wires are coupled to the connection strip 314, which may be used to position the wires for connection to a plurality of electrical contact pads (not shown) of the internal electronics module 124. The plurality of conductive wires 308-1 to 308-12 may be collected and organized using tape at a pitch that matches a corresponding pitch of connection points of an electronic component, such as a component of internal electronics module 124.

The internal electronics module 124 may include sensing circuitry (not shown) in electrical communication with the plurality of conductive wires 308-1 through 308-12. The internal electronics module 124 may include one or more communication ports. In the example of fig. 8-10, the internal electronics module 124 includes a communication port 326 and a communication port 328. The communication port 326 is coupled to a first end of the communication cable 320. The communication cable 320 may form part of the communication interface 162, as shown in FIG. 2. The communication cable 320 includes a second end coupled to the receptacle 330. The receptacle 330 is configured to removably connect the removable electronic module 150 (not shown) to the pre-manufactured sensor assembly 300 via the communication cable 320. The receptacle 330 may be made of plastic, metal, polymer, or other suitable material. The receptacle 330 may include one or more electrical contact pads 382 for electrically coupling the removable electronic module to the pre-manufactured sensor assembly 300. The communication port 328 is coupled to a first end of the communication cable 322. The communication cable 322 may form part of the communication interface 162 as shown in fig. 2. The communication cable 322 includes a second end coupled to an output device 323. Output device 323 is one example of output device 127 depicted in fig. 2. Output device 323 may include an audible output device such as a speaker, a visual output device such as a light (e.g., an LED), or a tactile output device such as a haptic motor. Any suitable type of output device may be provided as output device 323.

The pre-fabricated sensor assembly 300 may include one or more flexible retaining layers 310. In some examples, the one or more flexible retaining layers 310 may include an upper flexible retaining layer and a lower flexible retaining layer. A set of conductive lines 308 may be formed between the flexible retention layers. In some examples, a portion of the internal electronics module 124 and/or the communications cable 320 may be formed between flexible retention layers. In some examples, a single flexible retention layer 310 may be utilized while still forming a housing for enclosing the touch sensor 302 and optionally other components such as the internal electronics module 124. For example, a single flexible retention layer 310 may be folded with the touch sensor 302 and the internal electronics module 124 formed therebetween.

In some examples, one or more flexible retention layers may at least partially surround the capacitive touch sensor. In other examples, the one or more flexible retention layers may at least partially surround the first electronics module and the plurality of conductive lines of the capacitive touch sensor. The communications cable may extend from within the housing of the one or more flexible retaining layers to outside the one or more flexible retaining layers. The socket extends at least partially outside the one or more flexible retention layers to enable removable connection of the second electronic module.

The set of conductive lines 308 and the internal electronics module 124 may be positioned in a predetermined arrangement or sensor layout. Vacuum sealing, heat, pressure, adhesive or other techniques may be utilized to adhere the top flexible retention layer to the bottom flexible retention layer to enclose the internal components within the housing formed by the flexible retention layers. More specifically, the set of conductive wires 308 and/or the internal electronics module 124 may be formed within a housing made of a flexible retention layer 310.

Similar prefabricated sensor assemblies may additionally or alternatively include other types of sensors. For example, a resistive touch sensor may be formed in a similar manner as the capacitive touch sensor described. Other types of sensors, such as inertial measurement units, strain gauges, ultrasonic sensors, radar-based touch interfaces, image-based sensors, infrared sensors, etc., may be integrated within the flexible retention layer as described.

The conductive lines 308-1 to 308-12 may be formed on or within the textile-based substrate 332. For example, the textile-based substrate 332 may be formed by weaving, embroidering, stitching, or otherwise integrating the sets of conductive threads 308-1 through 308-12 and non-conductive threads. In the example of fig. 8-10, each conductive line 308 includes a lateral segment 359 that can extend in a lateral direction to form an area designed to detect touch input of the touch sensor. In general, the lateral portion of each conductive line forms a touch sensitive area for touch sensor 302. As illustrated, the spacing between the conductive lines that connect the conductive lines to the internal electronics module may be less than the spacing between the conductive lines at the touch-sensitive area. Such a design may enable proper spacing and arrangement of the conductive lines at which the touch sensitive area is formed, while providing a tighter pitch to enable a compact arrangement in which the conductive lines are connected to the sensing circuitry.

Referring to FIG. 10, more details of the spacing and arrangement of the conductive lines 308 in the example of the prefabricated sensor assembly 300 are illustrated. A close-up view of the touch sensor is depicted showing a subset of the conductive lines including conductive lines 308-1 through 308-12. Each conductive line includes a first lateral section 357 and a second lateral section 359 extending in a direction parallel to lateral axis 203, and a longitudinal section 353 extending in a longitudinal direction parallel to longitudinal axis 201. The longitudinal section 353 is connected to the first transverse section 357 by a curved section 351.

The first transverse section 357 of each conductive wire may comprise a first portion that is woven or otherwise integrated within the textile-based substrate 332, and a second transverse section 359 that extends in a transverse direction beyond an outer perimeter of the textile-based substrate 332. The length of the lateral portion of each conductive line may be different from the length of the lateral portion of the other conductive lines.

The

lateral segments

357 and 359 of each conductive line 308 are separated from the lateral segments of adjacent lines by a distance 354. The longitudinal section 353 of each conductive line 308 is separated from the longitudinal section 353 of an adjacent conductive line by a distance 358. The distance 354 between the transverse sections is greater than the distance 358 between the longitudinal sections. Such a configuration may enable sufficient spacing to be utilized in the touch sensitive area to receive and distinguish touch inputs utilizing conductive lines. Moreover, such a configuration may allow for smaller spacings to be utilized at areas not intended for touch input, in order to save space and ultimately make a more compact device. In addition, the reduced spacing and width of the longitudinal sections may allow for tighter spacing to be utilized when connecting to the tape and ultimately to the sensing circuitry within the internal electronics module 124. In this way, tight or small spacing may be utilized to save space for making connections, but greater spacing may be utilized in other areas where it is desirable to detect touch inputs.

Fig. 11-13 depict an example of a receptacle 330 according to an example embodiment of the present disclosure. Fig. 11 depicts a front perspective view of the receptacle 330, fig. 12 depicts a first side perspective view of the receptacle 330, and fig. 13 depicts a second side perspective view of the receptacle 330.

The receptacle 330 includes a first longitudinal side wall 362, a second longitudinal side wall 364, a rear or transverse wall 366, and a base member 368. The receptacle 330 is one example of a bucket or cartridge based receptacle that includes one or more wall members that extend from the base member 368 to form an open cartridge for receiving the removable electronic module 150.

The first longitudinal sidewall 362 may include a first curved section 372 and the second longitudinal sidewall 364 may include a second curved section 374. The

curved sections

372 and 374 may extend along a back or second lateral surface of the removable electronic module 150 when inserted to provide additional support for the removable electronic module.

The lateral wall 366 includes a vertical portion 365 and a protruding portion 367. When the removable electronic module 150 is inserted into the receptacle 330, a portion of the upper surface 202 of the removable electronic module will be in contact with the hanging portion 367. In this manner, the hanging portion 367 may at least partially secure the removable electronic module 150 within the receptacle 330.

The receptacle 330 includes a plurality of retaining elements 392. Retaining elements 392-1 and 392-2 are disposed on the interior of vertical member 394. More specifically, the first longitudinal side wall 362 includes a first retaining element 392-1 disposed on an inner surface of the vertical member 394-1. The second longitudinal side wall 304 includes a second retaining member 392-2 formed on an inner surface of the vertical member 394-2. The vertical members 394-1 and 394-2 may provide flexibility such that the retaining elements 392-1 and 392-2 may bend when the removable electronic module 150 is inserted. In this manner, the retaining element 392-1 may receive the retaining element 232 located on the removable electronic module 150. The third retaining element 332-3 is formed on an inner surface of the vertical portion 365 of the transverse wall 366. In fig. 13, the retention elements 392-1, 392-2 and 392-3 are detents configured to engage a retraction of the retention element 232 comprising the removable electronic module 150. Retaining elements 392-1 and 392-2 may include a circular cross-section in an exemplary embodiment. In an example embodiment, the retaining element 392-3 may include an oval or rectangular cross-section.

The base member 368 may include a plurality of openings disposed along a portion of the base member 368 to provide access to a plurality of contact pads 382. In some examples, the plurality of contact pads 382 may extend perpendicularly from the inner surface of the base member 368 to form contact protrusions such that the plurality of contact protrusions may have an upper surface that defines a plane that is vertically separated from a plane defined by the inner surface of the base member 368.

The receptacle 330 includes an attachment member 370 that may be used to attach the receptacle 330 to an interactive object. The attachment member 370 may be affixed to the substrate of the existing object using an adhesive, one or more fasteners, heat pressing, or other suitable technique. In fig. 11-13, the attachment members 370 extend in the lateral and longitudinal directions with dimensions that exceed the corresponding dimensions of the socket box formed by the side walls of the box-based socket. In such embodiments, attachment member 370 may form a flange to enable receptacle 330 to be attached to the interactive object via attachment member 370 while exposing a box portion of receptacle 330 for a user to insert and remove removable electronic module 150. Attachment members 370 may extend in such directions to facilitate attachment of the receptacle to various types of interactive objects. In some examples, the receptacle 330 may be placed in a cuff or sleeve of a jacket of another type of wearable garment. In another example, the receptacle 330 may be attached to a portion of a backpack, purse, or other clothing accessory. In some embodiments, the receptacle 330 may be sewn to the base of the interactive object using the attachment member 370. In other examples, socket 330 may be attached to the base of the interactive object using glue or another adhesive.

Fig. 14A-14C depict an example of inserting the removable electronic module 150 into the receptacle 330, according to an example aspect of the present disclosure. A user may insert the removable electronic module 150 into the receptacle 330 by placing the first lateral surface 206 of the removable electronic module 150 in the receptacle 330 with a longitudinal force applied in a direction parallel to the longitudinal axis. At the same time, the user 377 may apply downward pressure in a vertical direction parallel to the vertical axis to cause the first lateral surface 206 to be inserted into the receptacle 330. The remainder of the lower surface 204 may be inserted by a vertical force until it contacts the base member 368 of the receptacle 330. With the removable electronic module 150 inserted, the set of contact pads 222 of the removable electronic module 150 may contact the set of contact pads of the receptacle 330. As illustrated in fig. 14C, a portion of the upper surface 202 of the removable electronic module 150 is in contact with the overhang portion 367 of the rear wall of the receptacle 330.

Fig. 15 and 16 illustrate another example of a prefabricated sensor assembly 300 according to an example embodiment of the present disclosure. Fig. 15 is a top view and fig. 16 is a bottom perspective view of a sensor assembly 400 including a touch sensor 402, an internal electronics module 124, and a receptacle 330. In an example embodiment, touch sensor 402 may be configured as a capacitive touch sensor or a resistive touch sensor. The touch sensor 402 is one example of the touch sensor 102 as illustrated in fig. 1 and 2.

The pre-manufactured sensor assembly 400 includes one or more flexible retention layers 310, the flexible retention layers 310 forming a housing that encloses the touch sensor 402 and the internal electronics module 124, as described earlier. More specifically, in this example, one or more flexible retention layers at least partially surround touch sensor 402 and internal electronics module 124 to provide stability and maintain a predetermined arrangement and positioning of conductive lines 308-1 through 308-10 forming touch sensor 402. In an example embodiment, touch sensor 402 may be configured as a capacitive touch sensor or a resistive touch sensor.

The conductive threads 308-1 through 308-10 are formed on or within the textile-based substrate 332. For example, the textile-based substrate 332 may be formed by weaving, embroidering, stitching, or otherwise integrating the conductive threads 308-1 through 308-10 and the set of non-conductive threads. In the example of fig. 15 and 16, each conductive line 308 includes a longitudinal portion extending in a longitudinal direction. The longitudinal portions of each conductive line collectively form a touch sensitive area for touch sensor 402. Each conductive thread may include a loose portion 411 that loosens from the textile-based substrate 332. The relieved portion of each conductive thread is formed by forming the textile-based substrate 332 without weaving, embroidering, or the like, with the non-conductive threads. The relieved portion may make the conductive wires more efficient and/or easier to connect to sensing circuitry within the internal electronics module 124. As illustrated, the spacing between conductive lines where the conductive lines are connected to the strips 314 and then to the internal electronics module may be less than the spacing between conductive lines at the touch sensitive area. Such a design may enable proper spacing and arrangement of the conductive lines where the touch sensitive area is formed, while providing a tighter pitch to enable a compact arrangement of the conductive lines connected to the sensing circuitry. In the particular example of fig. 15-16, a plurality of conductive wires 308 are collected and organized with a tape 314 at a pitch that matches a corresponding pitch of connection points of electronic components, such as the sensing circuitry of internal electronics module 124.

The internal electronics module 424 includes a communications port 328 coupled to a first portion of the communications cable 320. A second end of the communication cable 320 is coupled to the receptacle 330. In this example, the receptacle 330 includes or is otherwise attached to a flexible attachment member 470. The communication cable 320 includes a first end coupled to the communication port 328 of the internal electronics module 124 and a second end coupled to the receptacle 330.

Fig. 17-18 depict an example of a receptacle 430 according to an example aspect of the present disclosure. Fig. 17 depicts a front perspective view of receptacle 430, and fig. 18 depicts a side perspective view of receptacle 430.

The receptacle 430 includes a first longitudinal side wall 462, a second longitudinal side wall 464, a rear or transverse wall 466, a base member 468, and a top member 471. The receptacle 430 is one example of a slot-based receptacle that includes one or more wall members extending from the base member 468 to form a closed slot for receiving the removable electronic module 150. The receptacle 430 includes a top member 471 that provides a vertical force to retain the removable electronic module 150 when inserted. In an example embodiment, the top member 471 may extend beyond at least 25% of the length of the upper surface of the removable electronic module 150, such as at least 35% of the length of the upper surface, such as at least 45% of the length of the upper surface, such as at least 50% of the length of the upper surface. In other examples, the top member 471 may extend less than 25% or greater than 50% of the length of the upper surface.

The length of the base member 468 in the longitudinal direction is less than the length of the first and second

longitudinal sidewalls

462, 464 in the longitudinal direction. In this way, an opening may be provided to further facilitate removal and insertion of the removable electronic module.

The first longitudinal side wall 462 may include a first transverse arch 472 and the second longitudinal side wall 464 may include a second transverse arch 474. The lateral arch 472 may extend along at least a portion of an upper surface of the removable electronic module 150 when inserted to provide additional support for the removable electronic module. The transverse arch 474 may extend along at least a portion of the upper surface of the removable electronic module 150 when inserted to provide additional support for the removable electronic module.

The receptacle 430 includes a plurality of retaining elements 492. The first longitudinal side wall 462 includes a first retaining element 492-1 disposed on an inner surface of a horizontal member (not shown). The second longitudinal side wall 464 includes a second retaining element 492-2 formed on an inner surface of the horizontal member 494-2. Horizontal members, such as horizontal member 494-2, may provide flexibility such that retaining elements 492-1 and 492-2 may flex when removable electronic module 150 is inserted. In this manner, the retaining element 492 may receive the retaining element 232 located on the removable electronic module 150. The third retaining element 492-3 is formed on an inner surface of the transverse wall 466. In an example embodiment, the retaining elements 492-1, 492-2, and 492-3 may be detents configured to mate with a retraction of the retaining element 232 comprising the removable electronic module 150. In an example embodiment, the retaining elements 492-1 and 492-2 may comprise a circular cross-section. In an example embodiment, the retaining element 492-3 may comprise a rectangular cross-section.

The base member 468 may include a plurality of openings arranged along a portion of the base member 468 to provide access to a plurality of contact pads 482. In some examples, the plurality of contact pads 482 may extend perpendicularly from the inner surface of the base member 468 to form contact protrusions, such that the plurality of contact pads 482 may have an upper surface that defines a plane that is vertically separated from a plane defined by the inner surface of the base member 468.

The receptacle 430 includes an attachment member 470. In this example, the receptacle 230 includes or is attached to a flexible attachment member 470. In various embodiments, flexible attachment member 470 may comprise a textile or other flexible material. Flexible attachment member 470 may enable receptacle 430 to be attached to an interactive object. For example, flexible attachment member 470 may be stitched to a substrate used to form the interactive object, enabling receptacle 430 to be affixed to the interactive object. In this example, the attachment member 470 may include a flexible fabric or other material attached to at least a portion of one or more of the first longitudinal side wall 462, the second longitudinal side wall 464, the transverse wall 466, and/or the substrate 468. The particular arrangement of the receptacle 430 enables the removable electronic module 150 to be inserted into slots formed by various walls so that the removable electronic module may be securely attached to the receptacle 430, and thus to an interactive object that includes the pre-fabricated sensor assembly 400.

Fig. 19A-19C depict an example of inserting a removable electronic module 150 into a receptacle 430, according to an example aspect of the present disclosure. A user may insert the removable electronic module 150 into the receptacle 430 by placing the first lateral surface 206 of the removable electronic module 150 in the receptacle 430 with a longitudinal force applied in the longitudinal direction. A single longitudinal force may be used to insert the removable electronic module 150 within the slot formed by the receptacle 430. Upon insertion of the removable electronic module 150, the set of contact pads 222 (see fig. 5) of the removable electronic module 150 may contact the set of contact pads of the receptacle 430. As illustrated in fig. 14C, the top member 471 covers at least a portion of an upper surface of the removable electronic module 150. Additionally, a portion of the base member 468 contacts a lower surface of the removable electronic module 150. Further, the

lateral arches

472 and 474 extend in the lateral direction to provide additional support to the lower surface of the removable electronic module 150.

Fig. 20A depicts an example of an interactive insole 520 (also referred to as an interactive insole or interactive sock) including a socket 530, according to an example aspect of the present disclosure. Interactive insole 520 is an example of an interactive object that does not include a pre-fabricated sensor assembly. In contrast, interactive insole 520 includes a receptacle 530 configured to receive a removable electronic module via an opening 532. In this manner, the interactive insole 520 may be configured with a removable electronic module, for example, to capture data indicative of the user's movement using an inertial measurement unit of the removable electronic module. The removable electronic module may perform other functions when inserted into the interactive insole 520. For example, removable electronic module 150 may include one or more output devices, such as an LED output device, a haptic output device, or other output device. The removable electronic module may receive control signals from a remote computing device, such as a user smart phone, to initiate one or more output signals.

Fig. 20B-20D depict an example of a user inserting the removable electronic module 150 into the receptacle 530 of the interactive insole 520, according to an example aspect of the present disclosure. A user may insert the removable electronic module 150 into the receptacle 530 by placing the first lateral surface 206 (also referred to as a front surface) of the removable electronic module 150 into the receptacle 530 with a longitudinal force applied in a longitudinal direction. A user may apply a longitudinal force to insert a portion of the removable electronic module within the receptacle 530. When the rear of the removable electronic module reaches the rear of the receptacle 530, the user may apply downward pressure in a vertical direction parallel to the vertical axis 205 to insert the remainder of the removable electronic module 150 into the receptacle 530. The lower surface of removable electronic module 150 may contact the inner surface of interactive insole 520.

Fig. 21 is a flow diagram depicting an example method 550 of configuring a removable electronic device based on a type of interactive object to which a removable electronic module is coupled. One or more portions of the method 550 may be implemented by one or more computing devices, such as one or more computing devices of the computing environment 100 as illustrated in fig. 1, the computing environment 190 as illustrated in fig. 2, or the computing environment 1202 as illustrated in fig. 38. One or more portions of method 550 may be implemented as algorithms on hardware components of the devices described herein, for example, to configure the removable electronic module to process sensor data associated with the interactive object to generate data indicative of detecting one or more predefined motions (such as gestures). In an example embodiment, the method 550 may be performed by one or more processors included within the removable electronic module.

At 552, the method 550 may include detecting a connection between the interactive object and the removable electronic module. For example, the removable electronic module may detect the connection of the interactive object in response to one or more signals received at one or more contacts of the communication interface of the removable electronic module. In other examples, the removable electronic module may detect connection of the interactive object based at least in part on user input provided to the interactive object and/or the removable electronic module. In some examples, the removable electronic device may detect that the removable electronic device is physically coupled to the included pre-manufactured sensor assembly.

At 554, the method 550 can include obtaining an object identifier associated with the interactive object. In some examples, a pre-manufactured sensor assembly including an interactive object such as a touch sensor, e.g., a capacitive or resistive touch sensor, may provide a sensor identifier to the removable electronic module. In some examples, the interactive object may obtain an identifier of the interactive object itself, such as not including a preconfigured sensor component within the interactive object.

At 556, method 550 can include issuing a request for configuration data associated with the interactive object. For example, the removable electronic module may issue one or more requests to a remote server, such as may be associated with a cloud computing service that provides configuration data for various interactive objects and/or sensors. The one or more requests may include an interactive object identifier. In an example embodiment, the request may be issued using a wireless network interface of the removable electronic module. For example, in some embodiments, the request may be made over a Bluetooth connection or a Wi-Fi connection.

At 558, method 550 may include obtaining configuration data in response to the request issued at 556. In some examples, the configuration data may be obtained from a remote computing device. In other examples, the configuration data may be obtained from a local storage location (such as a local memory of the removable electronic device in some examples). The configuration data may include predefined parameters associated with the touch sensors of a particular sensor assembly. The removable electronic device can obtain one or more predefined parameters associated with the touch sensor of the first pre-manufactured sensor assembly.

At 560, the removable electronic module determines whether one or more motion detection processes (e.g., gesture detection processes) associated with the removable electronic device should be modified based on the configuration data. Examples of configuration data include, but are not limited to, predefined parameters, such as sensing parameters associated with a particular sensor layout. For example, the sensor may include various numbers of sensing elements, various spacings between sensing elements, various lengths or other dimensions of sensing elements, various sensing element materials from which the sensing elements are fabricated, and other differences that may affect the sensor data generated by the sensor. The configuration data may include or may be used by the removable electronic module to determine one or more predefined parameters associated with the touch sensors of the pre-manufactured sensor assembly of the interactive object into which the removable electronic module has been inserted.

If one or more gesture detection processes are to be modified based on the configuration data, the method 550 modifies the one or more gesture detection processes at 562. For example, the removable electronic module may apply one or more predefined parameters associated with a particular type of sensor in response to determining that the gesture detection process is to be modified. In some examples, the method 550 may include configuring one or more machine learning models associated with the gesture detection process at 562. In an example embodiment, configuring the one or more machine learning models may include modifying one or more weights associated with the one or more machine learning models. For example, the removable electronic device may be configured to detect the one or more predefined motions by configuring one or more machine learning models for detecting the one or more predefined motions based at least in part on the one or more first predefined parameters associated with the first touch sensor. The removable electronic device can be reconfigured to detect the one or more predefined motions by configuring one or more machine learning models for detecting the one or more predefined motions based at least in part on the one or more second predefined parameters associated with the second touch sensor. In some examples, the removable electronic device may configure one or more machine learning models to detect one or more predefined motions using a set of weights associated with the pre-manufactured sensor components. In other examples, configuring one or more machine learning models may include obtaining a particular machine learning model associated with a particular type of sensor. In response to the removable electronic device being physically coupled to the first pre-manufactured sensor assembly, the removable electronic module may analyze touch data associated with the first pre-manufactured sensor assembly to detect one or more predefined motions based on predefined parameters associated with the touch sensors of the first pre-manufactured sensor assembly. The removable electronic module may analyze touch data associated with the second pre-manufactured sensor assembly in response to the removable electronic device being physically coupled to the second pre-manufactured sensor assembly to detect one or more predefined motions based on predefined parameters associated with the touch sensors of the second pre-manufactured sensor assembly.

At 564, method 550 may include determining whether to modify one or more input/output (I/O) configurations of the removable electronic module based on the configuration data. For example, some pre-manufactured sensor assemblies may include output devices, such as audible output devices, visual output devices, and/or tactile output devices. Other pre-manufactured sensor assemblies may not include such output devices.

Accordingly, at 566, the method 550 may include updating one or more function maps to correspond to the interactive object type to which the removable electronic module has been connected. For example, in response to determining that the interactive object includes a pre-manufactured sensor component having an output device, the function associated with the particular gesture may include initiating an output by the output device of the pre-manufactured sensor component. However, in response to determining that the interactive object includes a pre-manufactured sensor assembly without an output device, the function associated with the same gesture may include initiating an output by the removable electronic module.

At 568, the removable electronic module setup of method 500 is complete.

Fig. 22-25 depict an example of another prefabricated sensor assembly 600 according to an example embodiment of the present disclosure. Fig. 22 and 23 depict top and bottom perspective views, respectively, of a sensor assembly 600. FIG. 24 depicts an exploded perspective view of an example layer set that may be used to form a pre-fabricated sensor assembly 600. Fig. 25 depicts a close-up view of a subset of the sense lines of a capacitive touch sensor used to form sensor assembly 600.

The pre-formed sensor assembly 600 includes a touch sensor 602 formed from a plurality of wires 608-1 through 608-12. The touch sensor 602 is one example of the touch sensor 102 as depicted in fig. 1 and 2. Wires 608-1 through 608-12 are one example of sense line 108. The wires 608-1 to 608-12 extend in a lateral direction parallel to the lateral axis 203 at the touch sensitive area 640 of the touch sensor 602. In an example embodiment, touch sensor 602 is a capacitive touch sensor. The wires 608-1 to 608-12 include a curved section 666 that connects the second transverse section 664 of each wire to the longitudinal section 668 of each wire that extends in a direction parallel to the longitudinal axis 601. The wires are coupled to a connection strip 314, which connection strip 314 may be used to position the wires for connection to a plurality of electrical contact pads (not shown) of the internal electronics module 124. The plurality of wires 608-1 through 608-2 may be collected and organized using the tape 314 at a pitch that matches a corresponding pitch of connection points of an electronic component, such as a component of the internal electronics module 124.

A lengthwise section 668 of each lead extends in a lengthwise direction across the non-touch sensitive area 642 of the touch sensor 602. More specifically, one or more shield layers 612 are formed on a longitudinal portion of each conductor to form a non-touch sensitive area 642. One or more adhesive layers 616 may be utilized to couple the plurality of wires to the one or more shield layers 612, while optionally providing insulation therebetween. In some examples, the one or more shielding layers 612 may be conductive shielding layers formed of the same or similar material as the wires 608. In other examples, one or more shield layers 612 may be one or more insulating layers. By utilizing one or more shield layers 612, touch sensitive area 640 can be selectively formed at desired locations of touch sensor 602. In this particular example, one or more shield layers 612 can be utilized to form a capacitive touch sensor that includes sense lines extending in a lateral direction with a spacing therebetween in a longitudinal direction. A longitudinal portion of each conductor may be covered by one or more shielding layers 612 so that touch sensor 602 is not touch sensitive in that area. In some examples, one or more shield layers may provide a ground. For example, due to the proximity of an object, such as a user's finger, a ground may be provided for electric fields originating in regions associated with non-touch sensitive regions.

The internal electronics module 124 may include sensing circuitry (not shown) in electrical communication with the plurality of leads 608-1 through 608-12. The internal electronics module 124 may include one or more communication ports. In the example of fig. 3, the internal electronics module 124 includes a communication port 326 and a communication port 328. The communication port 326 is coupled to a first end of the communication cable 320. Communications cable 320 is one example of a portion of communications interface 162 shown in fig. 2. The communication cable 320 includes a second end coupled to the receptacle 330. The receptacle 330 is configured to removably connect the removable electronic module 150 (not shown) to the pre-manufactured sensor assembly 600 via the communication cable 320. The receptacle 330 may be made of plastic, metal, polymer, or other suitable material. The receptacle 330 may include one or more electrical contacts, not shown, for electrically coupling the removable electronic module to the pre-manufactured sensor assembly 600. In some examples, the receptacle may extend at least partially outside of the one or more flexible retention layers to enable removable connection of the electronic module.

Referring to FIG. 24, a pre-fabricated sensor assembly 600 may include an upper flexible retention layer 310-1 and a lower flexible retention layer 310-2. One or more shielding layers 612, one or more adhesive layers 616, a set of wires 608, and the internal electronics module 124 may be formed between the retention layers. In some examples, a portion of the communication cable 320 may be formed between the illustrated encapsulation layers. In some examples, a single flexible retention layer 610 may be utilized while still forming a housing for enclosing the touch sensor 602 and optionally other components such as the internal electronics module 124. For example, a single flexible retention layer 310 may be folded with the touch sensor 602 and the internal electronics module 124 formed therebetween.

The one or more flexible retention layers can at least partially surround the first electronics module and the plurality of flexible sense lines of the capacitive touch sensor. The communications cable may extend from within the housing of the one or more flexible retaining layers to outside the one or more flexible retaining layers. The socket extends at least partially outside the one or more flexible retention layers to enable removable connection of the second electronic module.

The set of leads 608, the band 314, and the internal electronics module 124 may be positioned in a predetermined arrangement or sensor layout. The adhesive layer 616 and the shielding layer 612 may be positioned at a target location where the non-touch sensitive area 642 is to be formed. The flexible retention layers 610-1 and 610-2 may be positioned above contact with the one or more shield layers 612 and below contact with the set of wires and the internal electronics module 124. Vacuum sealing, heat, pressure, adhesive, or other techniques may be utilized to bond the upper flexible retention layer 310-1 to the lower flexible retention layer 310-2, thereby enclosing the internal components within a housing formed by the applicable retention layers. More specifically, the internal electronics module 124 and the set of leads 608 of the touch sensor 602 may be formed within a housing made of the flexible retention layers 310-1 and 310-2.

Referring to FIG. 25, more details of the spacing and arrangement of the leads 608 in the example of the prefabricated sensor assembly 600 are illustrated. A close-up view of the touch sensor is depicted showing a subset of the conductive lines including conductive line 608-1 and conductive line 608-2. Each wire includes a first transverse segment 662 extending in a direction parallel to the transverse axis 603, a second transverse segment 664 extending in a direction parallel to the transverse axis 603, and a longitudinal segment 668 extending in a longitudinal direction parallel to the longitudinal axis 601. The longitudinal segment 668 is connected to the second transverse segment 664 through a curved segment 666.

The first transverse section 662 of each lead 608 has a width 652. The second transverse section 664 has a smaller width 653. The second lateral portion of each sense line can have a different length than each other second lateral portion. In this manner, the length of the second section of each of the plurality of flexible sensing lines can be different from the length of the second portion of each other of the plurality of flexible sensing lines.

The longitudinal segments 668 include an even smaller width 656. The transverse segment 662 of the first lead 608-1 is separated from the transverse segment 662 of the second lead 608-2 by a distance 654. A lengthwise segment 668 of the first lead 608-1 is separated from a lengthwise segment 668 of the second lead 608-2 by a distance 658. The distance 654 between the transverse sections is greater than the distance 658 between the longitudinal sections. Such a configuration may enable sufficient spacing to be utilized in the touch sensitive area to utilize the conductive lines to receive and distinguish touch inputs. Moreover, such a configuration may enable smaller spacings to be utilized at non-touch sensitive areas in order to save space and ultimately make a more compact device. In addition, the reduced spacing and width of the longitudinal extent may enable tighter spacing to be utilized when connecting to the band 314 and ultimately to the sensing circuitry within the internal electronics module 124. In this way, tight or small spacing may be utilized to conserve space in making the connections, but greater spacing may be utilized at other areas where it is desirable to detect touch inputs.

In some examples, each of the plurality of flexible sense lines may include a multilayer flexible film. The multilayer flexible film may include at least a flexible base layer and a metal layer covering the flexible base layer. In some examples, each of the plurality of flexible sense lines includes a passivation layer covering the flexible base layer and separating the flexible base layer from the metal layer. For example, one or more passivation layers can be utilized to increase adhesion of the sense lines to other surfaces. In some examples, an electromagnetic field shielding fabric may be used to form the sensing line.

In some examples, the continuous adhesive layer 616 can be coupled to the first surface of each of the plurality of flexible sensing lines. The continuous adhesive layer may be disposed within a housing defined by one or more flexible retaining layers.

In fig. 22-25, each sensing wire of the plurality of flexible wires 608 includes a longitudinal segment 668 that extends in a first direction at a first portion of the pre-formed sensor assembly and a second transverse segment 664 and/or 662 that extends in a second direction at a second portion of the pre-formed sensor assembly. The first direction and the second direction may be substantially orthogonal. The width of the first portion of each sense line may be less than the width of the second portion of each sense line.

In some examples, the capacitive touch sensor includes an adhesive layer 616, the adhesive layer 616 including a first surface coupled to the lengthwise segment 668 of each sense line. The adhesive layer may include a second surface. The shielding layer may be coupled to the second surface of the adhesive layer. The shield layer can extend over at least a desired longitudinal portion of each sense line to provide a ground for an electric field generated by a touch input at the first portion of each sense line. In some examples, the transverse section 662 of each of the plurality of flexible sense lines extends beyond the outer perimeter of the shield layer. In some examples, adhesive layer 616 and shielding layer 612 may be combined into a single layer that includes both adhesive and shielding properties.

Fig. 26 and 27 depict a prefabricated sensor assembly 680, according to another example embodiment of the disclosed technology. Fig. 26 is a front perspective view of a prefabricated sensor assembly 680, and fig. 27 is a front detailed perspective view of an example prefabricated sensor assembly 680.

Multiple sense lines 678-1 through 678-10 including multiple layers of films as described with respect to fig. 22-25 may be used. In fig. 26, a plurality of conductive lines extend in a single direction (e.g., a direction parallel to the longitudinal axis) to form a touch sensitive area 690 of a touch sensor 672. In an example embodiment, touch sensor 672 may be configured as a capacitive touch sensor or a resistive touch sensor.

The plurality of sense lines are separated by a first interval at a first portion of the capacitive touch sensor configured to receive touch input. Smaller or tighter spacing between the plurality of wires can be utilized at the second portion of the capacitive touch sensor where the sense line 678 is routed or otherwise positioned to attach to the internal electronics module 124. It can be seen in this example that the plurality of sense lines have a tighter spacing or spacing at the second portion just prior to connection to the internal electronics module 124. In this way, even if a single direction is used for the capacitive touch sensor, a tighter spacing may be provided to properly align the set of sense lines 678 with the electrical contact pads of the internal electronics module 124. In some examples, such an arrangement may facilitate a tighter or more compact device architecture. The sense lines can connect to internal electronics with a smaller spacing, while also providing a larger spacing between sense lines at the touch sensitive area of the capacitive touch sensor designed to receive touch input.

The plurality of sensing lines 678 of the prefabricated sensor assembly 670 can be attached to a flexible substrate. The flexible substrate may include a continuous flexible substrate attached to each of the plurality of wires. In some examples, the flexible substrate includes one or more adhesive layers 616 having an upper surface coupled to the lower surface of the flexible base layer of each of the plurality of wires. Other types of flexible substrates may be used in other examples.

By utilizing a continuous flexible substrate attached to a plurality of sensing lines, a predefined sensor layout of a plurality of sensing elements can be maintained. A predefined sensor layout may be maintained while providing a flexible structure. The flexible sense line and substrate attached thereto, along with a flexible retention layer, etc., can provide a pre-fabricated sensor assembly 300 that enables efficient and simple techniques for integrating passive touch sensors into the substrate of an existing object.

The communication cable 320 includes a first end coupled to the communication port 328 of the internal electronics module 124 and a second end coupled to the receptacle 630. In this example, the socket 630 includes or is otherwise attached to a flexible attachment member 670. In various embodiments, flexible attachment member 670 may comprise a textile fabric or other flexible material. Flexible attachment member 670 may enable receptacle 630 to be attached to an interactive object. For example, flexible attachment member 670 may be stitched to a substrate used to form the interactive object such that socket 630 can be affixed to the interactive object. In this example, receptacle 630 includes connector pads 675 and

support members

674 and 676 that are configured to removably connect the removable electronic module to the prefabricated sensor assembly. The particular arrangement of the receptacle 630 in fig. 26 enables the removable electronic module 150 to be inserted within the

extended support members

674 and 676 of the receptacle 630 so that the removable electronic module may be securely attached to the receptacle 630, and thus to the interactive object that includes the pre-fabricated sensor assembly 600.

Fig. 28 and 29 illustrate another example of a prefabricated sensor assembly 700 according to an example embodiment of the present disclosure. Fig. 28 is a front perspective view of the sensor assembly 700 depicting the touch sensor 702, the internal electronics module 124, and the receptacle 630. Fig. 29 is a close-up front perspective view of the sensor assembly 700 depicting additional details of the touch sensor 702 and the internal electronics module 124. In an example embodiment, touch sensor 702 may be configured as a capacitive touch sensor or a resistive touch sensor.

The pre-manufactured sensor assembly 700 includes one or more flexible retention layers 310, the flexible retention layers 310 forming a housing that encloses the touch sensor 702 and the internal electronics module 124 as previously described. More specifically, in this example, one or more flexible retention layers at least partially surround the touch sensor 702 and the internal electronics module 124 to provide stability and maintain a predetermined arrangement and positioning of the conductive lines 308-1 through 308-10 forming the touch sensor 702. In an example embodiment, touch sensor 702 may be configured as a capacitive touch sensor or a resistive touch sensor.

The conductive lines 308-1 through 308-10 are formed on or within the textile-based substrate 322 as described earlier. By way of example, the textile-based substrate 332 may be formed by weaving, embroidering, stitching, or otherwise integrating the sets of conductive threads 308-1 through 308-10 and non-conductive threads. In the example of fig. 28, each conductive line 308 includes a longitudinal portion 709 extending in a longitudinal direction. The longitudinal portions of each conductive line collectively form a touch sensitive area 440 for touch sensor 702. Each conductive thread may include a loose portion 411 that is loose from the textile-based substrate 332. The relieved portion 411 of each conductive thread may be formed by not weaving, embroidering, etc. the relieved portion 411 with the conductive thread when forming the textile-based substrate 332. The relieved portion 411 may enable the conductive line to be more efficiently and/or easily connected to sensing circuitry within the internal electronics 124. As shown, the spacing between conductive lines where the conductive lines are connected to the internal electronics module may be less than the spacing between conductive lines at the touch sensitive area 440. Such designs may enable proper spacing and arrangement of the conductive lines in which the touch sensitive area is formed, while providing a tighter pitch to enable a compact arrangement in which the conductive lines are connected to the sensing circuitry. In the particular example of fig. 28, the tape 314 is used to collect and position the conductive wires at a pitch corresponding to the set of electrical contact pads (not shown) of the internal electronics module 124. The tape 314 may be used to collect and organize the plurality of conductive lines 308 into tapes having a pitch that matches a corresponding pitch of connection points of an electronic component, such as the sensing circuitry of the internal electronic module 124.

An optional set of stabilizing

members

732 and 734 are provided to selectively couple the loose portion 711 to the textile substrate to better facilitate positioning of the conductive thread relative to the band 314. Note that stabilizing

members

732 and 734 are optional. In some examples, the stabilizing

members

732 and 734 are formed from a film or other flexible material.

The internal electronics module 124 includes a single communication port 328 coupled to a first portion of the communication cable 320. A second end of the communication cable 320 is coupled to the receptacle 330. In this example, the receptacle 330 includes or is otherwise attached to a flexible attachment member 470. In various embodiments, flexible attachment member 470 may comprise a textile fabric or other flexible material. Flexible attachment member 470 may enable receptacle 330 to be attached to an interactive object. For example, flexible attachment member 470 may be stitched to a substrate used to form the interactive object such that socket 730 can be affixed to the interactive object. In this example, the receptacle 330 includes a connector having a set of electrical contact pads 675 and 677. In other examples, more or fewer electrical contacts may be utilized. The particular arrangement of the receptacle 330 enables the removable electronic module 150 to be inserted within the extension member of the receptacle 330 such that the removable electronic module may be securely attached to the receptacle 330, and thus to the interactive object comprising the pre-fabricated sensor assembly 700.

FIG. 30 illustrates an example 800 of an interactive object 104 having multiple electronic modules in accordance with one or more embodiments. In this example, the touch sensor 802 of the interactive object 104 includes non-conductive wires 315 woven with the conductive wires 308 to form the touch sensor 802 (e.g., an interactive textile). The non-conductive thread may correspond to any type of non-conductive thread, fiber, or fabric, such as cotton, wool, silk, nylon, polyester, and the like. In an example embodiment, touch sensor 802 may be configured as a capacitive touch sensor or a resistive touch sensor. The non-conductive wires 315 and the conductive wires 308 together form a textile or textile-based substrate 820.

At 804, an enlarged view of the conductive line 308 is illustrated. Conductive wire 308 comprises a conductive wire 816 or a plurality of conductive filaments twisted, woven, or wound with a flexible wire 818. As shown, the conductive threads 308 can be woven or otherwise integrated with non-conductive threads to form a fabric or textile-based substrate 332. Although conductive wires and textiles are shown, it should be understood that other sensing wires and substrates may be used, such as flexible metal wires formed on a plastic substrate.

In one or more embodiments, conductive line 308 comprises a thin copper line. It should be noted, however, that the conductive lines 308 may also be implemented using other materials such as silver, gold, or other materials coated with a conductive material. The conductive thread 308 may include an outer covering formed by weaving non-conductive threads together. The non-conductive wire may be implemented as any type of flexible wire or fiber, such as cotton, wool, silk, nylon, polyester, and the like.

Touch sensor 802 can be formed in an efficient and low cost manner using any conventional weaving process (e.g., jacquard weaving or 3D weaving) that includes interlacing a set of longer woven threads (referred to as warp threads) with a set of crossing woven threads (referred to as weft threads). Weaving can be carried out on a frame or machine called a loom, of which there are several types. Thus, the loom may weave the non-conductive wires 315 with the conductive wires 308 to create the touch sensor 802.

Conductive wires 308 can be woven into touch sensor 802 in any suitable pattern or array. For example, in one embodiment, the conductive lines 308 may form a single series of parallel lines. For example, in one embodiment, the capacitive touch sensor may comprise a single plurality of conductive wires conveniently located on an interactive object, such as on a sleeve of a jacket. In an alternative embodiment, the conductive lines 308 may form a grid.

In the example of prefabricated sensor assembly 800, conductive lines 308 are woven into touch sensor 802 to form a sensor comprising a single set of substantially parallel conductive lines 308. In other examples, the second set of substantially parallel conductive lines 308 that intersect the first set of conductive lines may form a grid.

In such an example (not shown), the first set of conductive lines 308 are oriented horizontally and the second set of conductive lines 308 are oriented vertically such that the first set of conductive lines through a is substantially orthogonal to the second set of conductive lines 308. However, it should be understood that the conductive lines 308 may be oriented such that the crossing conductive lines 308 are not orthogonal to each other. For example, in some cases, crossing conductive lines 308 may form a diamond-shaped grid. Although the conductive wires 308 are shown spaced apart from each other in fig. 30, it should be noted that the conductive wires 308 may be woven very closely together. For example, in some cases, two or three conductive wires may be tightly woven together in each direction. Further, in some cases, the conductive lines can be oriented as parallel sense lines that do not cross or intersect each other.

In the example of the prefabricated sensor assembly 800, the sensing circuitry 126 is shown integrated within the object 104 and directly connected to the conductive wires 308. During operation, the sensing circuitry 126 can use self-capacitance sensing or projected capacitance sensing to determine the location of the touch input on the conductive lines 308. For example, the sensing circuitry 126 may detect a change in capacitance associated with one or more conductive lines 308.

Although not shown, the sensing elements, such as conductive lines 308, may be implemented as a grid of sense lines. For example, when configured as a self-capacitance sensor, the sensing circuitry 126 may charge the crossing conductive lines 308 (e.g., horizontal and vertical conductive lines) by applying a control signal (e.g., a sinusoidal signal) to each conductive line 308. When an object, such as a user's finger, touches or approaches the parallel arrangement or grid of conductive lines 308, the touched conductive lines are grounded, which changes the capacitance (e.g., increases or decreases the capacitance) on the touched conductive lines 308.

The sensing circuit 126 uses the change in capacitance to identify the presence of an object. If a grid of conductive lines is used, the sensing circuitry 126 detects the location of the touch input by detecting which horizontal conductive line 308 is touched and which vertical conductive line 308 is touched by detecting a change in capacitance of each respective conductive line 308. The sense circuitry 126 uses the intersections of the crossed conductive lines 308 that are touched to determine the location of the touch input on the grid of conductive lines 308. For example, the sensing circuitry 126 can determine the touch data by determining the location of each touch as an X, Y coordinate on the grid of conductive lines 308.

When implemented as self-capacitance sensors, "ghosting" may occur when multiple touch inputs are received. For example, consider a user touching a grid of conductive lines 308 with two fingers. When this occurs, the sensing circuit 126 determines the X and Y coordinates of each of the two touches. However, the sensing circuitry 126 may not be able to determine how to match each X coordinate to its corresponding Y coordinate. For example, if the first touch and the second touch have different coordinates, the sensing circuitry 126 may also detect "ghost" coordinates.

In one or more implementations, the sensing circuitry 126 is configured to detect "areas" of touch input corresponding to two or more touch input points on the grid of conductive lines 308. The conductive lines 308 may be tightly woven together such that when an object touches the grid of conductive lines 308, the capacitance of the plurality of horizontal conductive lines 308 and/or the plurality of vertical conductive lines 308 will change. For example, a single touch with a single finger may generate the coordinates. The sensing circuitry 126 may be configured to detect a touch input if the capacitance of the plurality of horizontal conductive lines 308 and/or the plurality of vertical conductive lines 308 changes. Note that this eliminates the effects of ghosting, as the sensing circuitry 126 will not detect a touch input if two single touches are detected that are spaced apart.

Alternatively, when implemented as a projected capacitance sensor, the sensing circuit 126 charges the single set of conductive lines 308 by applying a control signal (e.g., a sinusoidal signal) to the single set of conductive lines 308 (e.g., horizontal conductive lines 308). The sense circuitry 126 then senses a change in capacitance in another set of conductive lines 308 (e.g., vertical conductive lines 308).

In this embodiment, the vertical conductive lines 308 are not charged and therefore act as a virtual ground. However, when the horizontal conductive lines 308 are charged, the horizontal conductive lines are capacitively coupled to the vertical conductive lines 308. Thus, when an object, such as a user's finger, touches the grid of conductive lines 308, the capacitance on the vertical conductive lines changes (e.g., increases or decreases). The sensing circuit 126 uses the capacitance change on the vertical conductive line 308 to identify the presence of an object. To this end, the sensing circuit 126 detects the location of the touch input by scanning the vertical conductive lines 308 to detect a change in capacitance. The sensing circuit 126 determines the location of the touch input as the intersection between the vertical conductive lines 308 having the changed capacitance and the horizontal conductive lines 308 on which the control signals are transmitted. For example, the sensing circuitry 126 can determine the touch data by determining the location of each touch as an X, Y coordinate on the grid of conductive lines 308.

Whether implemented as self-capacitance sensors or projected capacitance sensors, the conductive lines 308 and the sensing circuitry 126 are configured to communicate touch data representing detected touch inputs to a removable electronic module 150, which removable electronic module 150 is removably coupled to the interactive object 104 via the communication interface 162. The microprocessor 152 can then cause the touch data to be communicated to the computing device 106 via the network interface 156 to enable the device to determine a gesture based on the touch data, the gesture can be used to control the object 104, the computing device 106, or an application implemented at the computing device 106. In some implementations, the gesture can be determined by an internal electronic module and/or a removable electronic module, and data indicative of the gesture can be transmitted to the computing device 106 to control the object 104, the computing device 106, or an application implemented at the computing device 106.

The computing device 106 may be implemented to recognize a variety of different types of gestures, such as touches, taps, swipes, grips, and overlays on the touch sensor 602. To recognize various different types of gestures, the computing device may be configured to determine a duration of touch, swipe or hold (e.g., one or two seconds), a number of touches, swipes or holds (e.g., a single tap, a double tap, or a triple tap), a number of fingers touched, swiped or held (e.g., one finger touch or swipe, two finger touch or swipe, or a three finger touch or swipe), a frequency of touches, and a dynamic direction of touch or swipe (e.g., up, down, left, right). With regard to retention, the computing device 106 may also determine an area (e.g., top, bottom, left side, right side, or top and bottom) of the grid of retained conductive lines 308. Thus, the computing device 106 may recognize a variety of different types of holds, such as cover, cover and hold, five finger cover and hold, three finger pinch and hold, and so forth.

Fig. 31 illustrates an example of a pre-fabricated sensor assembly 850 according to an example embodiment of the present disclosure. Fig. 31 is a top view of the sensor assembly 850 depicting the touch sensor 302, the internal electronics module 124, the receptacle 330, the communication cable 320, and the communication cable 221 as illustrated in fig. 8. FIG. 31 depicts another example in which a sense line is formed from a plurality of conductive lines 308-1 through 308-12. Similar to the example depicted in fig. 8, the plurality of conductive lines 308 are woven or otherwise integrated with one or more conductive lines or another flexible material to form the flexible substrate 332. In an example embodiment, the touch sensor 302 may be configured as a capacitive touch sensor or a resistive touch sensor.

More specifically, in this example, each conductive line 308 includes a longitudinal section 353 extending in a longitudinal direction from the band 314. In some examples, the longitudinal section 353 may be integrated with the flexible substrate 332, such as by weaving the longitudinal section 353 with one or more non-conductive wires, to form the flexible substrate 332. Each conductive line further comprises a curved section attaching the longitudinal extent to the first lateral section 357. In some embodiments, first transverse section 357 may also be integrated with the flexible substrate, such as by weaving, embroidery, or the like. In other embodiments, the first lateral section 357, or a portion thereof, may be unfastened from the flexible substrate 332 such that it is removable relative to the flexible substrate. Each conductive line includes a second lateral segment 359 that extends beyond the periphery of the flexible substrate 332. The second lateral segments 359 of the plurality of conductive lines collectively form the touch sensitive area 340 of the touch sensor 302.

One or more flexible retention layers 310 may be used to form the housing for the touch sensor 302 and the internal electronics module 124. In this example, the internal electronics module 124 is included in the flexible retention layer 310. By way of example, vacuum sealing, heat sealing, and/or another technique may be used such that the second lateral segments 359 of each conductive line are formed within the sensor assembly at predefined locations and intervals relative to the other conductive lines. One or more flexible retention layers may facilitate such positioning and spacing of the conductive wires while allowing the conductive wires to extend beyond the outer perimeter of the flexible substrate on which they are at least partially formed.

The conductive lines may be spaced apart from each other by a variable distance to facilitate a compact arrangement while also providing suitable space for the capacitive touch sensor. As shown in fig. 31, for example, the longitudinal segment 353 of each conductive line is spaced apart from an adjacent longitudinal segment 353 of another conductive line by a distance that is less than the distance between the lateral segments 359 of each conductive line. In this manner, the close spacing or pitch between the longitudinal sections may be used to facilitate connection with the internal electronics module 124 at a smaller pitch or pitch than that used at the touch-sensitive area 340. The distance between the lateral segments may be made larger at the touch sensitive area 340 to facilitate a capacitive touch sensor adapted to receive touch input.

The internal electronics module 124 includes a plurality of ports including a communication port 326 and a communication port 328. The communication port 326 is coupled to a first end of the communication cable 320. The communication cable 320 includes a second end coupled to the receptacle 330. The communication port 328 is coupled to a first end of the communication cable 322. A second end of the communication cable 322 is coupled to an output device 323. The output device 323 can be a visual output device including one or more LEDs to provide a visual output response to touch input received at the capacitive touch sensor and input from the one or more computing devices 106. In other examples, the communication cable 322 may be coupled to other types of input and/or output devices, such as an audio output device (e.g., a speaker) and/or a haptic output device (e.g., a haptic motor). The object 104 may also include one or more output devices configured to provide a haptic response, a tactile response, an audio response, a visual response, or some combination thereof. The communication cable may be attached to or otherwise coupled to an output device such as one or more output devices configured to provide a haptic response, a tactile response, an audio response, a visual response, or some combination thereof. The output devices may include a visual output device such as one or more Light Emitting Diodes (LEDs), an audio output device such as one or more speakers, one or more tactile output devices, and/or one or more tactile output devices.

Fig. 32-33 illustrate examples of an interactive object 900 in accordance with example embodiments of the disclosed technology. In this example, interactive object 900 is depicted as a band or other flexible member. By way of example, interactive object 900 may include a backpack, a satchel, a purse, a bag, or a strap of another object. In this manner, interactive object 900 may comprise an object that is suitable for its primary purpose and intended to be attached to another object to form a final product. FIG. 32 is a front perspective view of a portion of an example interactive object having a pre-fabricated sensor assembly integrated therein according to an example embodiment. FIG. 33 is a side perspective view of an example interactive object having a pre-fabricated sensor assembly according to an example embodiment integrated therein.

The preformed sensor assembly may be attached to a preformed tape substrate, which may be formed from one or more flexible object substrates. By way of example, the strap may be formed of a flexible foam material, a flexible woven or non-woven fabric, or other flexible material. In some examples, the strap may be formed of one or more rigid materials. The touch sensor 902 of the pre-fabricated sensor assembly includes a plurality of wires 608-1 through 608-24, similar to those illustrated in FIG. 22. Each sense line may include a multi-layer wire structure as previously described. In other examples, each of the sense lines may include a conductive line. In an example embodiment, touch sensor 902 may be configured as a capacitive touch sensor or a resistive touch sensor.

In the specifically depicted example, a plurality of conductive lines are formed along a first surface of the object substrate 920. A plurality of conductive lines may also extend along the rear surface of the object substrate 920. In some examples, one or more shielding layers 612 may be applied over the plurality of sense lines at the back surface of the object substrate. One or more adhesive layers 616 can be used to attach the plurality of sense lines to the subject substrate. One or more adhesive layers may be formed over the plurality of sense lines or under the plurality of sense lines. In other examples, the plurality of sense lines can be attached to the subject substrate using glue, heat, or other techniques. In some examples, the substrate may be folded to encapsulate the plurality of sense lines such that the back surfaces of the plurality of sense lines will be separated from other objects of the user that may come into contact with the band.

FIG. 32 illustrates that multiple sense lines can be divided into sections with spaces between them. For example, the sense lines 908-1 to 908-12 can form a first touch sensitive area, while the sense lines 908-13 to 908-24 can form a second touch sensitive area. In some examples, sense lines 908-1 to 908-12 can form a first capacitive touch sensor and sense lines 908-13 to 908-24 can form a second capacitive touch sensor. In other examples, sense lines 908-1 to 908-24 can form a single touch sensor.

In some examples, touch sensor 902 may be formed by folding sensor assembly 600. For example, the internal electronics module 124 may be formed between two layers of foam that form the straps of a backpack. In other examples, the internal electronics module 124 may be placed in other locations. The receptacle 330 is integrated within the strap. A portion of the receptacle 330 may be exposed to facilitate removal and insertion of the removable electronic module 150 by a user. In other examples, the receptacle may be formed within the body portion of the backpack or at another location.

Fig. 34 illustrates a user 952 wearing an interactive backpack 954 that includes a belt 956 and a belt 958. A strap 958 incorporating a prefabricated sensor assembly according to an example embodiment has been integrated. In the specifically described example, the plurality of sense lines 908 of the capacitive touch sensor are formed on a band as previously described.

Although fig. 34 depicts multiple sense lines 608 being visible, in other examples, the multiple sense lines can be hidden. For example, one or more layers may be formed over the plurality of sense lines such that the plurality of sense lines are not visible.

In some examples, receptacle 330 may be coupled to touch sensor 902 integrated within a band or other portion of the interacted with object, as shown in fig. 35. By way of example, the receptacle may be integrated in a portion of the backpack, such as inside the backpack. In another example, the receptacle may be integrated within the rear portion of the strap, for example. In an example embodiment, touch sensor 902 may be configured as a capacitive touch sensor or a resistive touch sensor.

Fig. 35 illustrates an example receptacle 330 of a pre-fabricated sensor assembly 970 according to an example embodiment. In the example shown in fig. 35, socket 330 is integrated within a rear portion of a band 958 of an interactive object, such as an interactive garment, an interactive garment container, or an interactive garment accessory.

In some examples, a portion of the object substrate or other portion of the interactive object may be molded to secure the socket in the interactive object. In other examples, socket 330 may be glued, bonded, or otherwise coupled to the object substrate of the interactive object.

Fig. 35 illustrates that the removable electronic module 150 may be removably connected to the receptacle by inserting the removable electronic module into the receptacle. The receptacle 330 may include one or more electrical contact pads 382, the electrical contact pads 382 configured to provide electrical communication between the removable electronic module 150 and the pre-fabricated sensor assembly.

Fig. 36 illustrates an example of an interactive object, such as an interactive garment including sleeves 1002, to which prefabricated sensor assemblies 300 according to one or more embodiments are attached. Fig. 36 illustrates an example of attaching a pre-fabricated sensor assembly to an object that is at least partially performed, according to an example embodiment. Fig. 36 depicts an example of an interactive garment including a sleeve 1002 having a pre-formed sensor assembly 300 to be integrated therein. Note that the use of pre-fabricated sensor assembly 300 is provided by way of example only. Any of the prefabricated sensor assemblies as described herein may be used.

In some examples, the pre-formed sensor assembly 300 may be applied to the interior of the cuff 1004. For example, the pre-fabricated sensor assembly 300 can be positioned such that a plurality of sensing lines are adjacent to an inner surface of a textile substrate forming the interactive object. In some examples, the shielding layer may be used to inhibit touch input between a user's arm or other portion on the inner surface of the sleeve. In some examples, a heat press or other application of heat may be applied to attach the one or more retaining layers to the textile substrate. In other examples, other fastening techniques may be used, such as gluing, stitching, bonding, or other techniques.

The pre-formed sensor assembly 300 may be inserted into the opening 1006. The cuff 1004 of the interactive object may include an opening 1006. The opening 1006 in the cuff is one example of a receiving feature of the interactive object. After the sleeves have been formed, pre-formed sensor assembly 300 may be inserted into opening 1006. After insertion of the pre-formed sensor assembly, one or more processes may be used to attach the pre-formed sensor assembly to the textile substrate. After the pre-fabricated sensor assembly is attached, the opening 1006 may be closed by stitching or other techniques. It should be noted, however, that in some examples, the pre-formed sensor may simply be inserted directly into the cuff without utilizing an opening. The plurality of sensing lines may extend circumferentially around at least a portion of the cuff. In this manner, a user wearing the interactive jacket may provide a sliding or other motion in a direction along the direction of the sleeves to provide sliding and other gestures using the interactive garment. Note that other arrangements of multiple sense lines can be used.

Fig. 37 is a block diagram depicting a manufacturing process 1100 that may be utilized in accordance with an example embodiment of the present disclosure. The pre-fabricated sensor assembly may be applied to an object substrate that has been at least partially formed into an object.

At 1102, the process 1100 includes providing a fabrication object having an object substrate. The fabricated object may be a fabricated object including an object substrate. The manufactured object may be received through a connection system. The manufactured object may be a shape suitable for its primary purpose. For example, the manufacturer's object may be a garment suitable for wearing or a garment accessory suitable for use. As a specific example, one or more seams in the garment may be left open so that a pre-manufactured sensor assembly may be inserted into the opening. In this manner, the production object may include a receiving feature. The receiving feature may be an opening or other mechanism into which a pre-manufactured sensor assembly may be inserted. Various types of receiving functions may be used. At 1104, process 1100 can include providing a pre-fabricated sensor assembly. In an example embodiment, the pre-fabricated sensor assembly may have a touch sensor (e.g., capacitive or resistive), an internal electronics module, and a receptacle. The pre-manufactured sensor assembly may include a communication interface having a first internal portion coupled to the first electronic module and a second and portion coupled to a receptacle configured to removably connect the second electronic module to the pre-manufactured sensor assembly. The touch sensor can include a plurality of flexible sensing elements, such as flexible sensing lines elongated in a first direction, coupled to a first electronic module. The first electronic module may be powered by the power source of the second electronic module when the second electronic module is connected to the pre-fabricated sensor assembly. The fabrication objects and the pre-fabricated sensor assemblies may be provided to a connection system 1106.

Attachment system 1106 can include heating component 1108, sewing component 1110, adhesive component 1112, bonding component 1114, and/or other components that can be used to attach the pre-fabricated sensor assembly to a fabrication object having an object substrate.

The connection system 1106 can be used to create an interactive object with an integrated capacitive touch sensor as shown at 1116. In some examples, a first connection component can be used to attach a portion of the pre-manufactured sensor assembly to the interactive object, and a second connection-related component can be used to connect a second portion of the pre-manufactured sensor assembly to the interactive object. By way of example, one or more flexible retention layers, such as one or more encapsulation films, may be heat pressed to attach the capacitive touch sensor portion of the capacitive sensor assembly to the interactive object. In another example, the capacitive touch sensor may be attached to the interactive object with a sewn or other adhesive component.

The second connection component may be used to attach a second portion of the pre-fabricated sensor assembly to the interactive object. For example, after attaching one or more holding layers housing capacitive touch sensors using heating component 1108, a socket may be attached to the interactive object using stitching component 1110. Other examples and combinations may be used.

According to an example embodiment, a pre-fabricated sensor assembly for an interactive object including an object base may be provided. The pre-formed sensor assembly can include a capacitive touch sensor including a plurality of flexible sensing lines elongated in at least a first direction. The pre-fabricated sensor assembly can include a first electronic module including sensing circuitry in electrical communication with a plurality of flexible sensing wires. The pre-manufactured sensor assembly may include a communication interface including a first end coupled to the first electronic module and including a second end. The pre-formed sensor assembly may include a receptacle coupled to the second end of the communication interface. The receptacle may include one or more electrical contacts for electrically coupling to the second electronic module. The receptacle may be configured to removably connect the second electronic module to the pre-manufactured sensor assembly. The pre-manufactured sensor assembly may include one or more flexible retaining layers defining a housing for the first portion of the pre-manufactured sensor assembly. The first portion of the pre-fabricated sensor assembly can include at least a portion of each of the plurality of flexible sensing wires.

Fig. 38 illustrates various components of an example computing system 1202 that may implement any type of client, server, and/or computing device described herein with the example computing system 1202. In embodiments, the computing system 1202 may be implemented as one or a combination of a wired and/or wireless wearable device, in a system on a chip (SoC), and/or another type of device or portion thereof. Computing system 1202 may also be associated with a user (e.g., a person) and/or an entity that operates the device such that a device describes logical devices that include users, software, firmware, and/or a combination of devices.

The computing system 1202 includes a communication interface 1214 that enables wired and/or wireless communication of data 1208 (e.g., received data, data that is being received, data scheduled for broadcast, data packets of the data, etc.). The data 1208 may include configuration settings of the device, media content stored on the device, and/or information associated with a user of the device. Media content stored on computing system 1202 may include any type of audio, video, and/or image data. Computing system 1202 includes one or more data inputs via which any type of data, media content, and/or inputs can be received, such as human speech, touch data generated by a touch sensor, user-selectable inputs (explicit or implicit), messages, music, television media content, recorded video content, and any other type of audio, video, and/or image data received from any content and/or data source.

The communication interfaces can be implemented as any one or more of a serial and/or parallel interface, a wireless interface, any type of network interface, a modem, and as any other type of communication interface. The communication interfaces provide a connection and/or communication links between computing system 1202 and a communication network by which other electronic, computing, and communication devices communicate data with computing system 1202.

Computing system 1202 includes one or more processors 1204 (e.g., any of microprocessors, controllers, and the like) which the one or more processors 1204 process various computer-executable instructions to control the operation of computing system 1202 and to enable the techniques for or in which interactive ropes (cord) may be embodied. Alternatively or in addition, computing system 1202 may be implemented with any one or combination of hardware, firmware, or fixed logic circuitry that is implemented in connection with processing and control circuits. Although not shown, computing system 1202 may include a system bus or data transfer system that couples the various components within the device. A system bus can include any one or combination of different bus structures, such as a memory bus or memory controller, a peripheral bus, a universal serial bus, and/or a processor or local bus that utilizes any of a variety of bus architectures.

The computing system 1202 also includes memory 1206, which may include computer-readable media, such as one or more storage devices enabling persistent and/or non-transitory data storage (i.e., as opposed to mere signal transmission), examples of which include Random Access Memory (RAM), non-volatile memory (e.g., any one or more of a read-only memory (ROM), flash memory, EPROM, EEPROM, etc.), and a disk storage device. The disk storage devices may be implemented as any type of magnetic or optical storage device such as a hard disk drive, a recordable and/or rewriteable Compact Disc (CD), any type of a Digital Versatile Disc (DVD), and the like. The memory 1206 may also include mass storage media devices for the computing system 1202.

The computer-readable media provides data storage mechanisms for storing device data, and computer-readable instructions 1210 that can implement various device applications and any other types of information and/or data related to operational aspects of computing system 1202. For example, an operating system can be maintained as a computer application with a computer-readable medium and executed on processors 1204. The device applications may include a device manager, such as any form of a control application, software application, signal processing and control module, native code for a particular device, a hardware abstraction layer for a particular device, and so forth.

The memory 1206 may also include a motion manager 1212. The motion manager 1212 can interact with the application and the touch sensor 102 through touch inputs (e.g., gestures) received by the touch sensor 102 to effectively activate various functions associated with the computing device 106 and/or the application. The motion manager 1212 may be implemented at the computing device 106 local to the object 104 or remote from the object 104. Motion manager 1212 is one example of a controller.

The techniques discussed herein make reference to servers, databases, software applications, and other computer-based systems, as well as actions taken and information sent to and from such systems. Those of ordinary skill in the art will recognize that the inherent flexibility of computer-based systems allows for a variety of possible configurations, combinations, and divisions of tasks and functions between and among components. For example, the server processes discussed herein may be implemented using a single server or multiple servers operating in combination. The database and applications may be implemented on a single system or distributed across multiple systems. The distributed components may operate sequentially or in parallel.

While the present subject matter has been described in detail with respect to specific exemplary embodiments thereof, it will be appreciated that those skilled in the art, upon attaining an understanding of the foregoing, may readily produce alterations to, variations of, and equivalents to such embodiments. Accordingly, the scope of the present disclosure is by way of example rather than by way of limitation, and the subject disclosure does not preclude inclusion of such modifications, variations and/or additions to the present subject matter as would be readily apparent to one of ordinary skill in the art.

The techniques discussed herein make reference to servers, databases, software applications, and other computer-based systems, actions taken and information sent to and from such systems. Those of ordinary skill in the art will recognize that the inherent flexibility of computer-based systems allows for a variety of possible configurations, combinations, and divisions of tasks and functions between and among components. For example, the server processes discussed herein may be implemented using a single server or multiple servers operating in combination. The database and applications may be implemented on a single system or distributed across multiple systems. The distributed components may run sequentially or in parallel.

Claims

1. A removable electronic device, comprising:

one or more processors;

a first communication interface configured to communicatively couple the removable electronic device to one or more remote computing devices;

a second communication interface configured to communicatively couple the removable electronic device to at least a first pre-manufactured sensor assembly and a second pre-manufactured sensor assembly, the first pre-manufactured sensor assembly comprising a first touch sensor having a first set of sense elements, the second pre-manufactured sensor assembly comprising a second touch sensor having a second set of sense elements, wherein a first sensor layout of the first set of sense elements is different from a second sensor layout of the second set of sense elements; and

one or more non-transitory computer-readable media collectively storing instructions for execution by the one or more processors.

2. The removable electronic device of claim 1, wherein:

the first communication interface is configured to physically and removably couple the removable electronic device to the one or more remote computing devices;

the second communication interface is configured to physically and removably couple the removable electronic device to the first pre-manufactured sensor assembly and the second pre-manufactured sensor assembly; and is

The removable electronic device includes a wireless network interface configured to communicatively couple the removable electronic device to at least one remote computing device.

3. The removable electronic device of claim 1, wherein the first sensor layout comprises at least one of a different number of sensing elements, a different spacing of sensing elements, or a different sensing element material relative to the second sensor layout.

4. The removable electronic device of claim 1, wherein:

the removable electronic device is configured to provide power to sensing circuitry of the first set of sensing elements of the first pre-manufactured sensor assembly when the removable electronic device is physically coupled to the first pre-manufactured sensor assembly; and is

The removable electronic device is configured to provide power to sensing circuitry of the second set of sensing elements of the second pre-manufactured sensor assembly when the removable electronic device is physically coupled to the second pre-manufactured sensor assembly.

5. The removable electronic device of claim 1, further comprising:

an interactive backpack including the first pre-manufactured sensor assembly; and

an interactive jacket comprising the second pre-manufactured sensor assembly.

6. A removable electronic device, comprising:

one or more processors;

an inertial measurement unit;

a first communication interface configured to communicatively couple the removable electronic device to one or more computing devices;

a second communication interface comprising a plurality of contact pads configured to communicatively couple the removable electronic device to a plurality of pre-manufactured sensor assemblies, each pre-manufactured sensor assembly of the plurality of pre-manufactured sensor assemblies comprising a respective touch sensor having a respective plurality of sensing elements, wherein the respective touch sensors of at least two of the pre-manufactured sensor assemblies comprise different sensor layouts for the respective plurality of sensing elements; and

a housing at least partially enclosing the processor, the inertial measurement unit, the first communication interface, and the second communication interface, wherein the housing includes a first opening in at least one longitudinal surface and adjacent to at least a portion of the first communication interface and a plurality of second openings in a lower surface and adjacent to the plurality of contact pads of the second communication interface.

7. The removable electronic device of claim 6, wherein:

the housing includes one or more retaining elements configured to removably couple the removable electronic device to a plurality of respective receptacles of the plurality of pre-manufactured sensor assemblies, wherein the respective receptacles of two or more of the plurality of pre-manufactured sensor assemblies have different form factors; and is

The one or more retaining elements include a first indentation disposed along a first longitudinal surface of the housing and a second indentation disposed along a second longitudinal surface of the housing.

8. The removable electronic device of claim 7, wherein:

the one or more retaining elements comprise a third indentation arranged along a lateral wall of the housing.

9. The removable electronic device of claim 8, wherein:

the first communication interface includes a connector adjacent to the first opening, the connector configured to removably and physically couple the removable electronic device to the one or more computing devices.

10. The removable electronic device of claim 9, wherein:

the plurality of contact pads are configured to communicatively couple the removable electronic device to a first pre-manufactured sensor assembly when the removable electronic device is inserted into a first receptacle of the first pre-manufactured sensor assembly and to communicatively couple the removable electronic device to a second pre-manufactured sensor assembly when the removable electronic device is inserted into a second receptacle of the second pre-manufactured sensor assembly.

11. The removable electronic device of claim 10, wherein:

a respective upper surface of each of the plurality of contact pads defines a plane that is vertically separated from a plane defined by a lower surface of the housing.

12. The removable electronic device of claim 10, wherein:

at least one of the plurality of contact pads is configured to provide power from a power source of the removable electronic device to a respective pre-manufactured sensor assembly of the plurality of pre-manufactured sensor assemblies when the removable electronic device is physically coupled to the respective pre-manufactured sensor assembly.

13. The removable electronic device of claim 12, wherein:

at least one contact pad of the plurality of contact pads is configured to provide data from the one or more processors to the respective pre-manufactured sensor assembly when the removable electronic device is physically coupled to the respective pre-manufactured sensor assembly.

14. The removable electronic device of claim 6, further comprising:

an interactive backpack including a first prefabricated sensor assembly; and

an interactive jacket includes a second pre-formed sensor assembly.

15. A pre-manufactured sensor assembly for an interactive object, the pre-manufactured sensor assembly comprising:

a touch sensor comprising a plurality of flexible sensing elements;

a first electronic device including sensing circuitry in electrical communication with the plurality of flexible sensing elements;

one or more flexible retention layers defining a housing for at least a portion of each of the plurality of flexible sensing elements;

a receptacle coupled to the first electronic device and disposed outside of the housing; and

a removable electronic device comprising: a first communication interface configured for data and power communication with one or more computing devices; a second communication interface configured for data and power communication with the pre-manufactured sensor assembly; and a housing at least partially enclosing the first communication interface and the second communication interface, wherein the housing includes a first opening in at least one longitudinal surface and adjacent to at least a portion of the first communication interface and a plurality of second openings in a lower surface and adjacent to a plurality of contact pads of the second communication interface.

16. The pre-fabricated sensor assembly of claim 15, wherein the receptacle comprises:

a trough comprising a base member, a top member, a first longitudinal sidewall, and a second longitudinal sidewall, wherein the first longitudinal sidewall is coupled to the base member by a first curved section and is coupled to the top member by a second curved section, wherein the second longitudinal sidewall is connected to the base member by a third curved section and is connected to the top member by a fourth curved section, wherein a length of the base member in a longitudinal direction is less than a length of the top member in the longitudinal direction.

17. The pre-fabricated sensor assembly of claim 16, wherein the receptacle comprises:

a plurality of openings in the base member;

a plurality of contact protrusions extending at least partially through the plurality of openings in the base member, the plurality of contact protrusions configured to contact a plurality of contacts of the removable electronic device;

a flexible attachment member coupled to the slot and configured for attachment to an interactive object, the flexible attachment member at least partially surrounding the slot; and

one or more retaining elements comprising a first pawl on a first longitudinal side wall of the slot and a second pawl on a second longitudinal side wall of the slot, the first pawl configured to extend at least partially within a first retraction of the receptacle and the second pawl configured to extend at least partially within a second retraction of the receptacle.

18. The pre-fabricated sensor assembly of claim 15, wherein the receptacle comprises:

one or more retaining elements;

a base member comprising a plurality of openings;

a first longitudinal side wall comprising a first vertically extending retaining member, the one or more retaining elements comprising a first detent on the first vertically extending retaining member, wherein the first detent is configured to extend at least partially within a first indentation of the receptacle when the removable electronic device is inserted into the receptacle; and

a second longitudinal sidewall comprising a second vertically extending retaining member, the one or more retaining elements comprising a second detent on the second vertically extending retaining member, wherein the second detent is configured to extend at least partially within a second indentation of the receptacle upon insertion of the removable electronic device into the receptacle.

19. The pre-fabricated sensor assembly of claim 18, wherein the receptacle comprises:

a plurality of contact protrusions extending at least partially through the plurality of openings in the base member of the receptacle, the plurality of contact protrusions configured to contact a plurality of contacts of the removable electronic device when the removable electronic device is inserted into the receptacle; and

a lateral wall comprising a vertical section and a curved section, the curved section configured to contact at least a portion of an upper surface of the removable electronic device when the removable electronic device is inserted into the receptacle.

20. The prefabricated sensor assembly of claim 19, wherein:

the first longitudinal sidewall includes a first curved section configured to contact a lateral surface of the removable electronic device when the removable electronic device is inserted into the receptacle; and is

The second longitudinal sidewall includes a second curved section configured to contact a lateral surface of the removable electronic device when the removable electronic device is inserted into the receptacle.

21. An electronic system, comprising:

a removable electronic device comprising a processor, an inertial measurement unit, a communication interface comprising a plurality of contact pads configured to communicate with a plurality of pre-fabricated sensor assemblies, and a housing at least partially enclosing the processor, the inertial measurement unit, and the communication interface, wherein the housing comprises one or more retention elements;

a first interactive object comprising a first pre-manufactured sensor assembly, the first pre-manufactured sensor assembly comprising:

a first capacitive touch sensor comprising a first plurality of flexible sensing elements having a first sensor layout;

a first internal electronic device comprising sensing circuitry in electrical communication with the first plurality of flexible sensing elements; and

a first socket having a first form factor and comprising one or more receiving elements configured to physically and removably couple to the one or more retaining elements of the removable electronic device, the first socket comprising a first plurality of contact protrusions extending from a first plurality of openings of a first base member of the first socket to contact the plurality of contact pads of the removable electronic device when the removable electronic device is inserted into the first socket; and

a second interactive object comprising a second pre-fabricated sensor assembly, the second pre-fabricated sensor assembly comprising:

a second capacitive touch sensor comprising a second plurality of flexible sensing elements;

a second internal electronic device comprising a second sensing circuit in electrical communication with the second plurality of flexible sensing elements; and

a second receptacle having a second form factor and comprising one or more receiving elements configured to physically and removably couple to the one or more retaining elements of the removable electronic device, the second receptacle comprising a second plurality of contact protrusions extending from a second plurality of openings in a second base member of the second receptacle.