CN214098351U - Server with locally enhanced heat dissipation - Google Patents
Server with locally enhanced heat dissipation Download PDFInfo
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- CN214098351U CN214098351U CN202120161291.8U CN202120161291U CN214098351U CN 214098351 U CN214098351 U CN 214098351U CN 202120161291 U CN202120161291 U CN 202120161291U CN 214098351 U CN214098351 U CN 214098351U
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- heat dissipation
- side plate
- dissipation cover
- memory
- server
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Abstract
The utility model discloses a server with locally enhanced heat dissipation, which comprises a box body and a fan set, hard disk module, control mainboard and cooling jacket, it holds the chamber to have in the box, fan group sets up and will hold the chamber and split into first cavity and second cavity, hard disk module sets up in first cavity, the control mainboard sets up in the second cavity, set up the memory subassembly on the control mainboard, the memory subassembly includes a plurality of parallels and spaced memory strip, the length direction of memory strip is perpendicular with fan group's the direction of blowing, the cooling jacket cover is established outside the memory strip, the cooling jacket has first curb plate and the second curb plate that is located the both ends of memory strip length direction, first curb plate is close to the center of box, be provided with radiator fan on the first curb plate, first exhaust vent has been seted up on the second curb plate, set up the second exhaust vent corresponding every first exhaust vent on the inside wall of box. The utility model discloses a radiating server is strengthened to part simple structure, the radiating effect is good.
Description
Technical Field
The utility model relates to a server technical field especially relates to a radiating server is strengthened to part.
Background
The server generally includes box, power, control mainboard, hard disk module and fan group, has in the box and holds the chamber, and fan group will hold the chamber and cut apart into two independent cavities, and the hard disk module is installed in one of them cavity, and control mainboard and power setting are provided with a plurality of memory banks on the control mainboard in another cavity, and a plurality of memory banks are parallel and the interval. The prior art has the following defects: the length direction of the memory bank is perpendicular to the air outlet direction of the fan set, and when the fan set dissipates heat to the memory bank, the memory bank adjacent to the fan set blocks all wind, so that the heat dissipation effect of the rest of the memory banks is poor.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides an aim at: the server with the local enhanced heat dissipation function is provided, the heat dissipation cover is additionally arranged to perform local heat dissipation on the memory bank, and good heat dissipation effects of all the memory banks can be achieved.
To achieve the purpose, the embodiment of the present invention adopts the following technical solutions:
provided is a server locally enhancing heat dissipation, including:
the box body is internally provided with an accommodating cavity;
the fan set is arranged in the accommodating cavity and divides the accommodating cavity into a first cavity and a second cavity;
a hard disk module disposed within the first chamber;
the control main board is arranged in the second cavity, a memory assembly is arranged on the control main board and comprises a plurality of parallel and spaced memory bars, the length direction of each memory bar is perpendicular to the blowing direction of the fan set, and a gap is formed between every two adjacent memory bars;
the heat dissipation cover is arranged outside the memory strip, the heat dissipation cover is provided with a first side plate and a second side plate, the first side plate is located at two ends of the length direction of the memory strip, the first side plate is adjacent to the center of the box body, a heat dissipation fan is arranged on the first side plate, the second side plate corresponds to each gap, a first air outlet is formed in the gap, the inner side wall of the box body corresponds to each first air outlet, and a second air outlet is formed in the first air outlet.
As an optimal scheme of the server for locally enhancing heat dissipation, the heat dissipation cover is detachably connected with the control mainboard, a first interface is arranged on the heat dissipation cover and electrically connected with the heat dissipation fan through a wire, a second interface matched with the first interface in an inserting mode is arranged on the control mainboard, and when the heat dissipation cover is installed on the control mainboard in place, the first interface is inserted into the second interface.
As a preferable scheme of the server for locally enhancing heat dissipation, the heat dissipation cover has a first end and a second end that are arranged opposite to each other, where the first end is sealed, the second end is open, the memory component is inserted into the heat dissipation cover from the second end, and the first interface is arranged on an end face of the second end.
As a preferable scheme of the server for locally enhancing heat dissipation, the first end is provided with an auxiliary heat dissipation hole, the auxiliary heat dissipation hole is arranged in an inclined manner, and the inclined direction of the auxiliary heat dissipation hole is inclined along the air outlet direction of the fan set.
As a preferred scheme of the server with the local heat dissipation strengthening function, a fixing ring is arranged on the control mainboard and surrounds the periphery of the memory component, a threaded hole is formed in the fixing ring, the heat dissipation cover is provided with a connecting portion at one end connected with the control mainboard, the connecting portion corresponds to the threaded hole, and a fastening screw penetrates through the through hole and then is screwed in the threaded hole.
As a preferred scheme of the server with the heat dissipation locally strengthened, a fixing ring is arranged on the control mainboard and surrounds the periphery of the memory component, a magnet is arranged on one of the fixing ring and the heat dissipation cover, and the other of the fixing ring and the heat dissipation cover is made of metal.
As an optimal scheme of the server with locally enhanced heat dissipation, the heat dissipation cover is made of metal, a plurality of positioning grooves are concavely arranged on the fixing ring at intervals, the magnet is arranged at the bottom of the positioning grooves, a positioning column is convexly arranged on one side surface of the heat dissipation cover close to the fixing ring, and the positioning column is inserted into the positioning grooves and is in magnetic attraction fit with the magnet.
As a preferable scheme of the server for locally enhancing heat dissipation, a mounting hole for mounting the heat dissipation fan is formed in the first side plate, a wire groove is concavely formed in the outer side wall of the first side plate, one end of the wire groove is communicated with the mounting hole, the other end of the wire groove extends to the first interface, and the wire is arranged in the wire groove.
As a preferable mode of the server for locally enhancing heat dissipation, the wires are adhered to the wire grooves by an adhesive.
As a preferable scheme of the server for locally enhancing heat dissipation, the heat dissipation cover has a third side plate facing the fan set, the third side plate is connected to the first side plate and the second side plate respectively, and an air inlet communicated with the inside of the heat dissipation cover is formed in the third side plate.
The utility model discloses beneficial effect does: through setting up the heat exchanger that looses, independently dispel the heat to the memory strip with radiator fan from the length direction's of memory strip tip, guarantee that the clearance between two adjacent memory strips all has wind to pass through in order to take away the heat on the memory strip, promoted memory assembly's whole radiating effect.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Fig. 1 is a schematic structural diagram of a server with locally enhanced heat dissipation according to an embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view of a server with locally enhanced heat dissipation according to an embodiment of the present invention.
Fig. 3 is a schematic view of the heat dissipation cover in the direction a of fig. 2.
Fig. 4 is a schematic view of the structure in the direction B of fig. 3.
Fig. 5 is an exploded schematic view of the control motherboard, the memory module and the heat dissipation cover according to the embodiment of the present invention.
Fig. 6 is a schematic cross-sectional view of a heat dissipation cover according to an embodiment of the present invention.
In the figure:
1. a box body; 11. an accommodating chamber; 111. a first chamber; 112. a second chamber; 12. a second air outlet hole; 2. a fan set; 3. a hard disk module; 4. a control main board; 41. a second interface; 42. a fixing ring; 5. a memory component; 51. a memory bank; 52. a gap; 6. a heat dissipation cover; 61. a first side plate; 611. mounting holes; 612. a wire guide groove; 62. a second side plate; 621. a first air outlet; 63. a heat radiation fan; 64. a first interface; 65. a wire; 66. a first end; 661. auxiliary heat dissipation holes; 67. a second end; 68. a connecting portion; 69. a third side plate; 691. and air inlet holes.
Detailed Description
In order to make the technical problems, technical solutions and technical effects achieved by the present invention more clear, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1 to 6, a server with locally enhanced heat dissipation according to an embodiment of the present invention includes a box 1, a fan set 2, a hard disk module 3, a control motherboard 4, and a heat dissipation cover 6, wherein the box 1 has a receiving cavity 11 therein, the fan set 2 is disposed in the receiving cavity 11 and divides the receiving cavity 11 into a first cavity 111 and a second cavity 112, the hard disk module 3 is disposed in the first cavity 111, the control motherboard 4 is disposed in the second cavity 112, a memory module 5 is disposed on the control motherboard 4, the memory module 5 includes a plurality of parallel and spaced memory bars 51, a length direction of the memory bars 51 is perpendicular to an air blowing direction of the fan set 2, a gap 52 is formed between two adjacent memory bars 51, the heat dissipation cover 6 is disposed outside the memory bars 51, the heat dissipation cover 6 has a first side plate 61 and a second side plate 62 which are located at two ends of the memory bars 51 in the length direction, first curb plate 61 is adjacent to the center of box 1, be provided with radiator fan 63 on the first curb plate 61, correspond every on the second curb plate 62 first exhaust vent 621 has been seted up to clearance 52, correspond every on the inside wall of box 1 second exhaust vent 12 is seted up to first exhaust vent 621. Through setting up the heat exchanger 6, independently dispel the heat to the memory bank 51 from radiator fan 63 for the length direction's of memory bank 51 tip, guarantee that the clearance 52 between two adjacent memory banks 51 all has wind to pass through in order to take away the heat on the memory bank 51, promoted memory module 5's whole radiating effect.
In this embodiment, the heat dissipation cover 6 is detachably connected to the control main board 4, the heat dissipation cover 6 is provided with a first interface 64, the first interface 64 is electrically connected to the heat dissipation fan 63 through a wire 65, the control main board 4 is provided with a second interface 41 in plug-in fit with the first interface 64, and when the heat dissipation cover 6 is installed on the control main board 4 in place, the first interface 64 is in plug-in fit with the second interface 41. Through setting up the interface, can just realize radiator fan 63 and control mainboard 4's signal of telecommunication and switch on after radiator shroud 6 installs in place, preset radiator fan 63's start-up and stop program in control mainboard 4, just can realize radiator fan 63's control, simplified radiator fan 63's the wiring degree of difficulty.
In one embodiment, the heat dissipation cover 6 has a first end 66 and a second end 67 that are opposite to each other, wherein the first end 66 is closed, the second end 67 is open, the memory module 5 is inserted into the heat dissipation cover 6 from the second end 67, and the first interface 64 is disposed at an end surface of the second end 67.
In this embodiment, the first end 66 is provided with auxiliary heat dissipation holes 661, the auxiliary heat dissipation holes 661 are disposed in an inclined manner, and the inclined direction of the auxiliary heat dissipation holes 661 is inclined along the air outlet direction of the fan set 2. This design can guarantee that the wind that fan group 2 blew out can not enter into heat exchanger 6 by supplementary louvre 661 in, avoids disturbing the wind that radiator fan 63 blew out, guarantees that radiator fan 63's wind energy blows to DRAM 51 and dispels the heat to DRAM 51 along appointed direction, and supplementary louvre 661 can also discharge the heat of DRAM 51 outside heat exchanger 6, accelerates the heat dissipation in the heat exchanger 6 under the cooperation of the wind that fan group 2 blew out.
Further, be provided with solid fixed ring 42 on the control mainboard 4, gu fixed ring 42 encircles the periphery of memory module 5, gu set up threaded hole (not shown on the picture) on the fixed ring 42, heat exchanger 6 with the one end that control mainboard 4 is connected is provided with connecting portion 68, and the open-ended second end 67 of heat exchanger 6 that dispels the heat promptly forms this connecting portion 68 towards outside extension, correspond on the connecting portion 68 the screw hole seted up the through-hole, fastening screw passes screw twists behind the through-hole in the screw hole. The fastening screw is simple in fixing mode, the first interface 64 and the second interface 41 can be combined stably, looseness of connection between the first interface and the second interface is prevented, and the heat dissipation fan 63 can be well electrically connected with the control main board 4.
In other embodiments, the fixing of the heat dissipation cover 6 and the control main board 4 by fastening screws is not limited, and other fixing methods may be adopted, for example, one of the fixing ring 42 and the heat dissipation cover 6 is provided with a magnet, and the other of the fixing ring 42 and the heat dissipation cover 6 is made of metal. Specifically, the heat dissipation cover 6 is made of metal, a plurality of positioning grooves are concavely arranged on the fixing ring 42 at intervals, the magnet is arranged at the bottom of the positioning grooves, a positioning column is convexly arranged on one side face, close to the fixing ring 42, of the heat dissipation cover 6, and the positioning column is inserted into the positioning grooves and is in magnetic attraction fit with the magnet. The cooperation of reference column and constant head tank can guarantee that the fixed position of heat exchanger 6 and solid fixed ring 42 is accurate, is difficult for taking place the offset.
In an embodiment, the first side plate 61 is provided with a mounting hole 611 for the heat dissipation fan 63 to be mounted thereon, a wire groove 612 is concavely disposed on an outer side wall of the first side plate 61, one end of the wire groove 612 is communicated with the mounting hole 611, the other end extends to the first interface 64, and the wire 65 is disposed in the wire groove 612. By providing the wire guide groove 612, the wires 65 connecting the heat dissipation fan 63 and the first interface 64 can be more reasonably routed, and the wire winding is not easy to occur.
In this embodiment, the wires 65 are adhered to the wire grooves 612 by adhesive.
In an embodiment, the heat dissipation cover 6 has a third side plate 69 facing the fan set 2, the third side plate 69 is connected to the first side plate 61 and the second side plate 62, and an air inlet 691 communicating with the inside of the heat dissipation cover 6 is formed in the third side plate 69. The air inlet hole 691 is formed in the side, opposite to the fan set 2, of the heat dissipation cover 6, so that air volume entering the heat dissipation cover 6 can be increased, and the heat dissipation effect in the heat dissipation cover 6 is enhanced.
In the description herein, it is to be understood that the terms "upper" and "lower" are used in a descriptive sense only and not for purposes of limitation, and are not to be construed as indicating or implying that a particular device or element must have a particular orientation, be constructed and operated in a particular manner, based on the orientation or positional relationship shown in the figures.
In the description herein, references to the description of "an embodiment" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.
The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. A server for locally enhancing heat dissipation, comprising:
the box body is internally provided with an accommodating cavity;
the fan set is arranged in the accommodating cavity and divides the accommodating cavity into a first cavity and a second cavity;
a hard disk module disposed within the first chamber;
the control main board is arranged in the second cavity, a memory assembly is arranged on the control main board and comprises a plurality of parallel and spaced memory bars, the length direction of each memory bar is perpendicular to the blowing direction of the fan set, and a gap is formed between every two adjacent memory bars;
the heat dissipation cover is arranged outside the memory strip, the heat dissipation cover is provided with a first side plate and a second side plate, the first side plate is located at two ends of the length direction of the memory strip, the first side plate is adjacent to the center of the box body, a heat dissipation fan is arranged on the first side plate, the second side plate corresponds to each gap, a first air outlet is formed in the gap, the inner side wall of the box body corresponds to each first air outlet, and a second air outlet is formed in the first air outlet.
2. The server according to claim 1, wherein the heat dissipation cover is detachably connected to the control motherboard, the heat dissipation cover is provided with a first interface, the first interface is electrically connected to the heat dissipation fan through a wire, the control motherboard is provided with a second interface in plug-in fit with the first interface, and when the heat dissipation cover is installed on the control motherboard in place, the first interface is in plug-in fit with the second interface.
3. The server according to claim 2, wherein the heat dissipation cover has a first end and a second end opposite to each other, wherein the first end is closed, the second end is open, the memory module is inserted into the heat dissipation cover from the second end, and the first interface is disposed at an end surface of the second end.
4. The server according to claim 3, wherein the first end has auxiliary heat dissipation holes, the auxiliary heat dissipation holes are disposed in an inclined manner, and the inclined direction of the auxiliary heat dissipation holes is inclined along the air outlet direction of the fan set.
5. The server according to claim 2, wherein a fixing ring is disposed on the control motherboard, the fixing ring surrounds the periphery of the memory module, a threaded hole is formed in the fixing ring, a connecting portion is disposed at an end of the heat dissipation cover connected to the control motherboard, a through hole is formed in the connecting portion corresponding to the threaded hole, and a fastening screw passes through the through hole and is screwed into the threaded hole.
6. The server according to claim 2, wherein a fixing ring is disposed on the control motherboard, the fixing ring surrounds the periphery of the memory module, one of the fixing ring and the heat dissipation cover is provided with a magnet, and the other of the fixing ring and the heat dissipation cover is made of metal.
7. The server of claim 6, wherein the heat dissipation cover is made of metal, the fixing ring has a plurality of positioning slots at intervals, the magnet is disposed at the bottom of the positioning slots, and a positioning post is protruded from a side of the heat dissipation cover close to the fixing ring and inserted into the positioning slots and magnetically engaged with the magnet.
8. The server according to claim 2, wherein the first side plate has a mounting hole for mounting the heat dissipation fan, a wire groove is recessed in an outer side wall of the first side plate, one end of the wire groove communicates with the mounting hole, and the other end extends to the first interface, and the wire is disposed in the wire groove.
9. The server with locally enhanced heat dissipation according to claim 8, wherein the wires are adhered to the wire grooves by an adhesive.
10. The server with locally enhanced heat dissipation according to claim 1, wherein the heat dissipation cover has a third side plate facing the fan set, the third side plate is connected to the first side plate and the second side plate, and the third side plate is provided with an air inlet hole communicated with the inside of the heat dissipation cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120161291.8U CN214098351U (en) | 2021-01-20 | 2021-01-20 | Server with locally enhanced heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120161291.8U CN214098351U (en) | 2021-01-20 | 2021-01-20 | Server with locally enhanced heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214098351U true CN214098351U (en) | 2021-08-31 |
Family
ID=77439323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120161291.8U Active CN214098351U (en) | 2021-01-20 | 2021-01-20 | Server with locally enhanced heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214098351U (en) |
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2021
- 2021-01-20 CN CN202120161291.8U patent/CN214098351U/en active Active
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