CN214070204U

CN214070204U - Drive chip set, drive device and drive system

Info

Publication number: CN214070204U
Application number: CN202023026421.1U
Authority: CN
Inventors: 孙承刚; 徐鹏
Original assignee: GOOGOL TECHNOLOGY (SHENZHEN) Ltd
Current assignee: Solid High Tech Co.,Ltd.
Priority date: 2020-12-15
Filing date: 2020-12-15
Publication date: 2021-08-27
Anticipated expiration: 2030-12-15

Abstract

The utility model relates to a drive chip group, drive arrangement and actuating system. The driver chip set includes: at least one drive chip, drive chipset's drive input end is connected with the treater electricity, at least one drive chip is connected with the input electricity of work load respectively, drive chipset is used for following the treater receives and is used for driving the drive signal of work load work, and pass through at least one drive chip is right respectively the drive signal is transmitted after enlargiing the processing for work load work, in order to drive work load work. The composition of the drive circuit is simplified. The driving device comprises the driving chip group. The driving system comprises the driving device.

Description

Drive chip set, drive device and drive system

Technical Field

The utility model relates to a drive technical field especially relates to a drive chip group, drive arrangement and actuating system.

Background

With the rapid development of driving technology, it is more and more important to simplify the structure of the driving circuit.

The current driving circuit is a split device driving circuit, which uses push-pull output. The push-pull output built by the separating device needs to use two complementary upper and lower power tubes, and meanwhile, the parallel power tubes are needed for decentralized heat dissipation so that heating is not concentrated.

However, the number of power transistors used in the discrete device driving circuit is large, which results in a complicated composition of the driving circuit.

SUMMERY OF THE UTILITY MODEL

Accordingly, there is a need for a driver chipset, a driver and a driving system that can simplify the configuration of the driver circuit.

A driver chipset, comprising:

at least one drive chip, drive chipset's drive input end is connected with the treater electricity, at least one drive chip is connected with the input electricity of work load respectively, drive chipset is used for following the treater receives and is used for driving the drive signal of work load work, and pass through at least one drive chip is right respectively the drive signal is transmitted after enlargiing the processing for work load work, in order to drive work load work.

In one embodiment, the number of the driving chips is multiple, and the multiple driving chips include:

the main driving chip is configured with a driving signal input pin and at least one operational amplifier output pin, wherein the driving signal input pin is used for receiving the driving signal so as to carry out operational amplifier processing on the driving signal and carry out power amplification processing on the driving signal after the operational amplifier processing;

the at least one slave driving chip is electrically connected with the operational amplifier output pin of the corresponding main driving chip, and each slave driving chip is used for receiving the driving signal processed by the operational amplifier from the main driving chip and performing power amplification processing on the driving signal processed by the operational amplifier;

the power amplified driving signal output by the main driving chip and the power amplified driving signal output by each secondary driving chip are combined to the input end of the working load.

In one embodiment, the main driving chip includes:

the driving input end of the operational amplifier integrated unit is electrically connected with the processor and is used for receiving the driving signal and carrying out operational amplifier processing on the driving signal;

the input end of the first amplification integration unit is electrically connected with the output end of the operational amplifier integration unit and is used for performing power amplification processing on the drive signal after the operational amplifier processing;

each of the slave driving chips includes:

the input end of the second amplification integration unit is electrically connected with the output end of the operational amplifier integration unit and is used for receiving the driving signal after the operational amplifier processing and performing power amplification processing on the driving signal after the operational amplifier processing;

the power amplified driving signal output by the first amplification integration unit and the power amplified driving signal output by each second amplification integration unit are combined to the input end of the working load.

In one embodiment, the drive signal comprises a sine wave signal for driving the electronic engraving machine to engrave.

A driving device comprises the driving chip set.

In one embodiment, the method further comprises the following steps:

the input end of the negative feedback circuit is electrically connected with the working load, the output end of the negative feedback circuit is electrically connected with the feedback input end of the driving chip set, and the negative feedback circuit is used for feeding back a feedback electric signal related to the working load to the driving chip set;

the driving chip set is further used for carrying out operational amplification processing on the driving signals based on the feedback electric signals, carrying out power amplification processing on the driving signals after the operational amplification processing, and transmitting the driving signals after the power amplification to the working load.

In one embodiment, the negative feedback circuit comprises:

and the input end of the current negative feedback circuit is electrically connected with the output end of the working load, and the output end of the current negative feedback circuit is electrically connected with the negative feedback input end of the operational amplifier integration unit of the driving chip and is used for feeding back a first feedback signal related to the working load to the operational amplifier integration unit so that the operational amplifier integration unit carries out operational amplifier processing on the driving signal based on the first feedback signal.

In one embodiment, the negative feedback circuit further comprises:

and the input end of the voltage negative feedback circuit is electrically connected with the input end of the working load, and the output end of the voltage negative feedback circuit is electrically connected with the negative feedback input end of the operational amplifier integration unit and is used for feeding back a second feedback signal related to the working load to the operational amplifier integration unit so that the operational amplifier integration unit carries out operational amplifier processing on the driving signal based on the second feedback signal and the first feedback signal.

In one embodiment, the method further comprises the following steps:

and the heat dissipation module is used for dissipating heat of the driving chip set.

In one embodiment, the heat dissipation module includes:

the radiator is in contact with the driving chip set and is used for transferring heat generated by the driving chip set;

the heat dissipation fan is used for generating an air channel, and the air channel is used for carrying away heat of the driving chip group and/or the radiator.

In one embodiment, the at least one driver chip includes a master driver chip and four slave driver chips.

In one embodiment, the method further comprises the following steps:

and the protection module is used for protecting the driving device.

In one embodiment, the driving chip is configured with a standby pin, and the protection module comprises:

the protection optocoupler is electrically connected with the standby pin and used for inputting a first high level to the standby pin when the protection optocoupler is switched on so as to enable the driving chip set to be in a working state; and when the driver chip is disconnected, a first low level is input to the standby pin so that the driver chip is in a standby state.

In one embodiment, the driving chip is configured with an output control pin, the protection optocoupler is further electrically connected with the output control pin, and the protection optocoupler is further configured to input a second high level to the output control pin when the protection optocoupler is turned on, so that the driving chip starts to output a driving signal after signal amplification; and when the driver chip is disconnected, a second low level is input to the output control pin, so that the driver chip stops outputting the amplified driving signal.

In one embodiment, the protection optocoupler is switched off when receiving a switching-off control signal, wherein the switching-off control signal is generated when a controller electrically connected with an output end of the driving chipset determines that a power amplified driving signal output by the driving chipset exceeds a set threshold.

A driving system comprises the driving device.

Above-mentioned drive chipset, including at least one driver chip, drive chipset's drive input end is connected with the treater electricity, at least one driver chip is connected with the input electricity of work load respectively, driver chipset is used for following the treater receives and is used for driving the drive signal of work load work, and pass through at least one driver chip is right respectively the drive signal is given after enlargiing the processing for work load, in order to drive work load work, because driver chip is integrated, compare in disconnect-type device drive circuit, can reduce the quantity of power tube, realized improving the constitution of simplifying drive circuit.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1A is a schematic structural diagram of a driver chipset according to an embodiment;

fig. 1B is a schematic structural diagram of another driver chipset according to an embodiment;

FIG. 2 is a schematic diagram illustrating a connection between a master driver chip and a slave driver chip according to an embodiment;

FIG. 3 is a schematic structural diagram of a driving device according to an embodiment;

FIG. 4 is a schematic structural diagram of another driving device provided in one embodiment;

FIG. 5 is a schematic structural diagram of a current sampling unit according to an embodiment;

FIG. 6 is a schematic structural diagram of another driving device provided in one embodiment;

FIG. 7 is a schematic structural diagram of another driving device provided in one embodiment;

fig. 8 is a schematic structural diagram of a driving system according to an embodiment.

Description of reference numerals: the driving system comprises a driving chip set 100, a driving chip 110, a processor 20, a work load 2, a main driving chip 111, a slave driving chip 112, an operational amplifier integrated unit 1111, a first amplifier integrated unit 1112, a second amplifier integrated unit 1121, a negative feedback circuit 200, a current negative feedback circuit 210, a voltage negative feedback circuit 220, a current sampling unit 211, a first feedback unit 212, a current sampling resistor R1, a current feedback resistor R2, a second feedback unit 221, a first voltage dividing resistor R3, a second voltage dividing resistor R4, a heat dissipation module 300, a heat sink 310, a heat dissipation fan 320, a protection module 400, a protection optocoupler 410, a driving system 1, a driving device 10, a processor 20, a digital signal processor 30, a memory 40 and a controller 50.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Embodiments of the present application are set forth in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, a first resistance may be referred to as a second resistance, and similarly, a second resistance may be referred to as a first resistance, without departing from the scope of the present application. The first resistance and the second resistance are both resistances, but they are not the same resistance.

It is to be understood that "connection" in the following embodiments is to be understood as "electrical connection", "communication connection", and the like if the connected circuits, modules, units, and the like have communication of electrical signals or data with each other.

As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Also, as used in this specification, the term "and/or" includes any and all combinations of the associated listed items.

Referring to fig. 1A, fig. 1A is a schematic structural diagram of a driver chipset 100 according to an embodiment. As shown in fig. 1A, the driver chipset 100 of an embodiment includes at least one driver chip 110. The driving input end of the driving chip set 100 is electrically connected to the processor 20, the at least one driving chip 110 is electrically connected to the input end of the working load 2, the driving chip set 100 is configured to receive a driving signal for driving the working load 2 from the processor 20, and the driving signal is amplified and transmitted to the working load 2 through the at least one driving chip 110, so as to drive the working load 2 to work.

The processor 20 is a unit that sends a driving signal to the driving chipset 100. Optionally, the processor 20 is a decoding chip. For example a DAC chip (digital-to-analog converter). Specifically, the working data of the workload 2 is sent to a controller (e.g., a field programmable gate array chip) for decoding and then sent to a digital signal processor for calculation, the digital signal processor 20 stores the calculated working data in a memory, and the controller reads the calculated working data from the memory to control the processor 20 to simulate a driving signal as a small signal and send the driving signal to an input end of the driving chipset 100. The work load 2 refers to a unit which can perform work, for example, the work load 2 may be an engraving head for engraving, an audio device, and the like, and is not limited herein. The engraving head is a unit for performing work on an electronic engraving machine. When the work load 2 is an engraving head, the driving signal comprises a sine wave signal for driving the electronic engraving machine to perform engraving.

Specifically, after the driving chipset 100 receives the driving signal sent by the processor 20, the driving chips 110 are integrated with an amplification integration unit, so that at least one of the driving chips 110 respectively amplifies the driving signal, the output end of at least one of the driving chips 110 is respectively electrically connected to the workload 2, and the amplified driving chip 110 is transmitted to the workload 2 through the respective corresponding output end of the driving chip 110, so as to drive the workload 2 to work.

It should be noted that the at least one driving chip 110 in this embodiment means that one or more driving chips 110 are provided.

In the technical solution of this embodiment, since the driving chip 110 is integrated, compared with a separate device driving circuit, the number of power transistors can be reduced, and the improvement and simplification of the composition of the driving circuit are realized.

Referring to fig. 1B, fig. 1B is a schematic structural diagram of another driver chipset 100 according to an embodiment. As shown in fig. 1B, in one embodiment, the driving chip 110 is multiple, and the multiple chips include a master driving chip 111 and at least one slave driving chip 112. The main driving chip 111 is configured with a driving signal input pin and at least one operational amplifier output pin, where the driving signal input pin is configured to receive the driving signal, perform operational amplifier processing on the driving signal, and perform power amplification processing on the operational amplifier processed driving signal. At least one slave driving chip 112 is electrically connected to the corresponding operational amplifier output pin of the master driving chip 111, and each slave driving chip 112 is configured to receive the driving signal after the operational amplifier processing from the master driving chip 111 and perform power amplification processing on the driving signal after the operational amplifier processing.

Specifically, after the driving input pin of the main driving chip 111 receives the driving signal, the main driving chip 111 performs an operational amplifier process on the driving signal, the main driving chip 111 performs a power amplification process on the operational amplifier processed driving signal and simultaneously sends the operational amplifier processed driving signal to the slave driving chip 112 through the operational amplifier output pin, the slave driving chip 112 performs a power amplification process on the operational amplifier processed driving signal received from the main driving chip 111, wherein the power amplified driving signal output by the main driving chip 111 and the power amplified driving signal output by each slave driving chip 112 are combined to the input end of the workload 2.

In the technical solution of this embodiment, the signals for driving the working load 2 to work are output jointly by the plurality of driving chips 110, and the driving chips 110 generate heat when amplifying the driving signals, each driving chip 110 only needs to amplify the received driving signals to 1/n of the signals required by the working load 2, where n is the number of the driving chips 110, and the amplification degree of each driving chip 110 is reduced, so that the heating degree of the driving chip set 100 is correspondingly reduced, the driving process is more stable, and the driving stability is improved.

Referring to fig. 2, fig. 2 is a schematic diagram illustrating a connection between a master driving chip 111 and a slave driving chip 112 according to an embodiment. As shown in fig. 2, in one embodiment, the main driving chip 111 includes an op-amp integrated unit 1111 and a first amplifier integrated unit 1112. The operational amplifier integrated unit 1111 is electrically connected to the processor 20 as a driving input terminal of the driving chipset 100, and configured to receive the driving signal and perform an operational amplifier process on the driving signal. The input end of the first amplification integration unit 1112 is electrically connected to the output end of the operational amplifier integration unit 1111, and is configured to perform power amplification processing on the driving signal after the operational amplifier processing.

In one embodiment, each of the slave driving chips 112 includes a second amplification integrated unit 1121. An input end of the second amplification integration unit 1121 is electrically connected to an output end of the operational amplifier integration unit 1111, and is configured to receive the driving signal after the operational amplifier processing, and perform power amplification processing on the driving signal after the operational amplifier processing. The power-amplified driving signal output by the first amplification integration unit 1112 and the power-amplified driving signal output by each second amplification integration unit 1121 are combined to the input end of the workload 2.

Specifically, the driving signal is sent to the operational amplifier integrated unit 1111 through a driving signal input pin of the main driving chip 111, and the operational amplifier integrated unit 1111, after receiving the driving signal, performs the operational amplifier processing on the driving signal, and sends the driving signal after the operational amplifier processing to the first amplifier integrated unit 1112 and sends the driving signal after the operational amplifier processing to the second amplifier integrated unit 1121 through an operational amplifier output pin. The first amplification integrated unit 1112 and the second amplification integrated unit 1121 both perform power amplification processing on the operational-amplification processed driving signal, and since the first amplification integrated unit 1112 and the second amplification integrated unit 1121 are both electrically connected to an input end of the working load 2, the power-amplified driving signal output by the first amplification integrated unit 1112 and the power-amplified driving signal output by each second amplification integrated unit 1121 are combined to the input end of the working load 2, so as to drive the working load 2 to operate. Optionally, the operational amplifier integration unit 1111 of this embodiment is an in-phase proportional operation circuit.

It should be noted that, when the number of the slave driving chips 112 is increased, a loop for transmitting the driving signal from the master driving chip 111 to the slave driving chip 112 is lengthened, and the output master driving chip 111 may not be consistent with the slave driving chip 112 due to signal delay. It is not preferable that the number of slave driving chips 112 is larger. The number of the slave driving chips 112 is not limited in the present embodiment, and the number of the slave driving chips 112 may be determined as needed. Generally, the number of the master driving chip 111 is one, and the number of the slave driving chips 112 is less than ten.

According to the technical scheme of this embodiment, the operational amplifier integrated unit 1111 and the first amplifier integrated unit 1112 are integrated in the main driver chip 111, while the slave driver chip 112 only needs to be integrated with the second amplifier integrated unit 1121, and the operational amplifier integrated unit 1111 integrated in the main driver chip 111 sends the operational amplifier processed driving signal to the second amplifier integrated unit 1121 for amplification, so that the slave driver chip 112 does not need to additionally integrate the operational amplifier integrated unit 1111, the structure of the slave driver chip 112 is simplified, and the structure of the driver chipset 100 is correspondingly simplified.

Referring to fig. 3, fig. 3 is a schematic structural diagram of a driving device 10 according to an embodiment. As shown in fig. 3, in one embodiment, the driving apparatus 10 includes the driving chipset 100 of any of the above embodiments.

In one embodiment, the driving device 10 further comprises a negative feedback circuit 200. An input end of the negative feedback circuit 200 is electrically connected to the working load 2, an output end of the negative feedback circuit 200 is electrically connected to a feedback input end of the driving chipset 100, and the negative feedback circuit 200 is configured to feed back a feedback electrical signal associated with the working load 2 to the driving chipset 100. The driving chipset 100 is further configured to perform an operational amplifier processing on the driving signal based on the feedback electrical signal, perform a power amplification processing on the driving signal after the operational amplifier processing, and transmit the amplified driving signal to the workload 2.

Specifically, when the workload 2 is driven by the processed driving signal to operate, the negative feedback circuit 200 feeds back the feedback electrical signal associated with the workload 2 to the driving chipset 100, and the driving chipset 100 adjusts the amplification factor based on the feedback electrical signal and outputs the driving signal suitable for the workload 2. When the driver chipset 100 includes the main driver chip 111 and the main driver chip 111 includes the op-amp integrated unit 1111, a feedback input terminal of the op-amp integrated unit 1111 serves as a feedback input terminal of the driver chipset 100. Wherein the feedback electrical signal associated with the work load 2 may be a feedback electrical signal associated with the work electrical signal of the work load 2. Specifically, the feedback electrical signal may be a current feedback signal, i.e. a first feedback signal related to the working current signal of the working load 2; the feedback electrical signal may also be a voltage feedback signal, i.e. a second feedback signal related to the operating voltage signal of the workload 2. It should be noted that the type of the feedback electric signal is determined by the type of the negative feedback circuit 200, and different negative feedback circuits 200 may be provided as needed. In this embodiment, the operational amplifier integration unit 1111 mainly amplifies the driving signal based on the first feedback signal.

According to the technical scheme of the embodiment, the feedback electric signal associated with the working load 2 is fed back to the driving chip set 100 by the negative feedback circuit 200, so that the driving signal output by the driving chip set 100 is adjusted in real time, the driving signal suitable for the working load 2 is output, and the working accuracy of the working load 2 is ensured. Specifically, the output current is only reduced by 4.7mA under the condition of continuously outputting the driving signal with the maximum current of +/-7A, and the fluctuation of the output current is within 1mA under the condition of small current.

In one embodiment, the negative feedback circuit 200 includes a current negative feedback circuit 210. The input end of the current negative feedback circuit 210 is electrically connected to the output end of the working load 2, and the output end of the current negative feedback circuit 210 is electrically connected to the negative feedback input end of the operational amplifier integration unit 1111 of the driving chip 110, and is configured to feed back a first feedback signal associated with the working load 2 to the operational amplifier integration unit 1111, so that the operational amplifier integration unit 1111 performs the operational amplifier processing on the driving signal based on the first feedback signal.

In this embodiment, the current negative feedback circuit 210 is connected to the output terminal of the working load 2, and a first feedback signal related to the working load 2, that is, a working current signal of the working load 2 is fed back to the operational amplifier integration unit 1111 in the driving chip 110, so that the operational amplifier integration unit 1111 performs the operational amplifier processing on the driving signal based on the first feedback signal, thereby ensuring the accuracy of the working load 2. The current negative feedback has the function of stabilizing output current, namely constant current output characteristic. It should be noted that, when there are a plurality of driver chips 110, the plurality of driver chips 110 include the main driver chip 111, and the operational amplifier integration unit 1111 is only disposed in the main driver chip 111, the first feedback signal is fed back to the operational amplifier integration unit 1111 of the main driver chip 111.

In one embodiment, the negative feedback circuit 200 further includes a voltage negative feedback circuit 220. An input end of the voltage negative feedback circuit 220 is electrically connected to an input end of the working load 2, and an output end of the voltage negative feedback circuit 220 is electrically connected to a negative feedback input end of the operational amplifier integration unit 1111, and is configured to feed back a second feedback signal associated with the working load 2 to the operational amplifier integration unit 1111, so that the operational amplifier integration unit 1111 performs the operational amplifier processing on the driving signal based on the second feedback signal and the first feedback signal.

Specifically, in some of the workloads 2, the workloads 2 include inductive elements, and the driving signals that drive the workloads 2 are alternating current signals. For example, in an engraving machine, the engraving head serves as the engraving work load 2, the internal coil of the engraving head presents different impedances at different frequencies, the engraving head is dotted at a corresponding position on a copper roller, the vibration frequency of the engraving head is corresponding to the rotation speed of the copper roller, but the gain of the current negative feedback circuit 210 at different frequencies is greatly different, the driving frequency response curve is not straight, and therefore the feedback response of the current negative feedback circuit 210 has a certain lag. In this embodiment, the voltage negative feedback circuit 220 is further added on the basis of the current negative feedback circuit 210, and the second feedback signal associated with the working load 2 is fed back to the operational amplifier integration unit 1111, so that the operational amplifier integration unit 1111 may perform the operational amplifier processing on the driving signal based on the second feedback signal and the first feedback signal, and the voltage negative feedback circuit 220 is not affected by the inductance element, so that the response time of driving may be shortened, and the response speed of driving may be increased. In particular, the output drive signal may be boosted to 1A within a few uS. In addition, the voltage negative feedback circuit 220 can prevent the voltage discharged by the coil from being too high due to sudden change of current to damage other devices.

Referring to fig. 4, fig. 4 is a schematic structural diagram of another driving device 10 according to an embodiment. As shown in fig. 4, in one embodiment, the current degeneration circuit 210 includes a current sampling unit 211 and a first feedback unit 212. One end of the current sampling unit 211 is connected with the working load 2 in series, and the other end of the current sampling unit 211 is connected with the ground and used for collecting a current signal connected with the working load 2 in series and converting the current signal connected in series into a voltage signal, wherein the voltage signal converted by the current signal is used as the first feedback signal. One end of the first feedback unit 212 is electrically connected to the connection end point of the current sampling unit 211 and the workload 2, and the other end of the first feedback unit 212 is electrically connected to the feedback input end of the driving chipset 100, and is configured to feed back the first feedback signal to the driving chipset 100.

The current signal of the working load 2 in series is the current signal of the working load 2. Specifically, the current signal flows through the current sampling unit 211, is sent out as a voltage signal thereon, and is fed back to the driving chipset 100 through the first feedback unit 212. The current sampling unit 211 corresponds to a first resistance value, the first feedback unit 212 corresponds to a second resistance value, the working current signal of the working load 2 can be determined according to the proportional relation between the first resistance value and the second resistance value and the first feedback signal fed back by the first feedback unit 212, and then the driving signal suitable for the working load 2 can be output according to the first feedback signal.

Specifically, the driving signal INPUT pin is a NON INVERTING INPUT pin (i.e., pin 3) in fig. 4; the output pin of the operational amplifier is the BUFFER DRIVER pin (i.e. pin 11) of fig. 4. Pin INVERTING INPUT (i.e., pin No. 2) of fig. 4 is a feedback input pin that receives a feedback electrical signal as a feedback input. The OUT pin (i.e., pin 14) of fig. 4 is a pin for outputting a driving signal to the workload 2.

In this embodiment, optionally, the current sampling unit 211 includes at least one current sampling resistor or a hall type current sensor. Specifically, the resistor has the advantages of simplicity, good linearity, high precision, high cost performance and stable temperature coefficient. The alloy resistor with low resistance has very good surge resistance, and can realize reliable protection under the conditions of short circuit and overcurrent. However, the current is measured when the resistor is used, and the sampled resistor is connected in a current loop in series, so that a small part of electric energy is converted into heat by the current flowing through the resistor, and the current is generally used in a detection circuit with small current. When a conductor with current is put into the magnetic field force, a potential difference is generated in the direction perpendicular to the magnetic field and the current flowing direction, and the point is in direct proportion to the current, so that the Hall type can measure large current, the power loss is small, and the Hall type has the advantage. But the defects are that the nonlinear temperature drift needs to be compensated, the accuracy of measuring the current with small range is not high, the current is easily influenced by the external magnetic field, the ESD sensitivity is high, the cost is high, and the like. In the use of engravers, high current accuracy and linearity are required, while maintaining sufficient accuracy at low current. Only resistive pick-up currents can be used. Optionally, the first feedback unit 212 includes at least one current feedback resistor R2.

With continued reference to fig. 4. In one embodiment, the voltage negative feedback circuit 220 includes a second feedback unit 221 and a voltage sampling unit. The voltage sampling unit comprises a first voltage-dividing resistor R3 and a second voltage-dividing resistor R4, wherein a first end of the first voltage-dividing resistor R3 is electrically connected with an output end of the driving chipset 100, a first end of the second voltage-dividing resistor R4 is grounded, a second end of the first voltage-dividing resistor R3 is electrically connected with a second end of the second voltage-dividing resistor R4, the voltage sampling unit is used for dividing a voltage signal related to the working load, and the divided voltage signal serves as the second feedback signal;

one end of the second feedback unit 221 is electrically connected to the second end of the first voltage dividing resistor R3, and the other end of the second feedback unit 221 is electrically connected to the feedback input end of the driving chipset 100, so as to feed back the second feedback signal to the driving chipset 100.

The second feedback signal is obtained by dividing the working voltage signal of the working load 2 through the first voltage dividing resistor R3 and the second voltage dividing resistor R4. Specifically, the first divider resistor R3 corresponds to a third resistance value, the first divider resistor R3 corresponds to a fourth resistance value, the working voltage signal of the working load 2 can be determined according to the proportional relationship between the third resistance value and the fourth resistance value and the second feedback signal fed back by the second feedback unit 210, and then the driving signal suitable for the working load 2 can be output according to the second feedback signal.

In one embodiment, optionally, each driving chip 110 is electrically connected to the working load 2 through a current sharing resistor R321. The current equalizing resistor R321 can ensure that the current output by each driving chip 110 is stabilized, and the feedback accuracy is ensured.

Referring to fig. 5, fig. 5 is a schematic structural diagram of a current sampling unit 211 according to an embodiment. In one embodiment, the current sampling unit 211 includes m current sampling resistors R1, and each n current sampling resistors R1 of the plurality of current sampling resistors R1 are connected in parallel to form combined branches, and the combined branches are connected in series in sequence. Wherein m is an integral multiple of n, and n is more than or equal to 2.

In the embodiment, the power consumption of the single current sampling resistor R1 is reduced in a series-parallel connection mode, and the heating degree of the single current sampling resistor R1 is reduced. Specifically, when the current sampling resistor R1 generates heat differently, the operation of the current sampling resistor R1 may be unstable, which may affect the accuracy of the current feedback. The working stability of the current sampling resistor R1 is improved by reducing the heating degree of the single current sampling resistor R1, so that the accuracy of current feedback is improved.

Optionally, the current sampling resistor R1 of this embodiment may be a constantan wire gate-type resistor. The constantan wire resistor is made of high-precision closely-fit gold wire and processed by special process, and has the advantages of low resistance, high precision, low temperature coefficient, no inductance, high overload capacity, very small resistance change caused by temperature change, and greatly improved accuracy of current feedback.

It should be noted that, the first feedback unit 212, the second feedback unit 221, or the voltage sampling unit may refer to the description of the current sampling unit 211, which is not described herein again.

Referring to fig. 6, fig. 6 is a schematic structural diagram of another driving device 10 according to an embodiment. As shown in fig. 6, in one embodiment, the driving device 10 further includes a heat sink module 300. The heat dissipation module 300 is used for dissipating heat from the driver chipset 100.

Specifically, the heat generated by the driver chipset 100 during operation may affect the stability of the driver. The driving stability can be improved by providing the heat dissipation module 300 to dissipate heat of the driving chipset 100.

In one embodiment, the heat dissipation module 300 includes a heat sink 310 and a heat dissipation fan 320. The heat sink 310 is in contact with the driving chipset 100 for transferring heat generated by the driving chipset 100. The heat dissipation fan 320 is used to generate an air duct for carrying away heat from the driving chip set 100 and/or the heat sink 310.

Specifically, the heat sink 310 contacts the driver chipset 100 to transfer heat of the driver chipset 100, so that heat generation of the driver chipset 100 is reduced. In addition, the heat dissipation fan 320 generates an air channel to carry away heat from the driving chipset 100 and/or the heat sink 310, thereby further reducing heat generation of the driving chipset 100.

It should be noted that the heat dissipation fan 320 may also dissipate heat from the current sampling resistor R1 and the second voltage dividing resistor R4.

In one embodiment, the heat spreader 310 is an aluminum substrate heat spreader 310 or a copper substrate heat spreader 310. Although the heat dissipation capability of the aluminum substrate heat sink 310 is better, the heat of the driving chipset 100 cannot be well conducted out through the aluminum substrate. The heat conductivity coefficient of the copper substrate heat spreader 310 is higher than that of the aluminum substrate heat spreader 310, so that the copper substrate heat spreader 310 can well conduct the heat of the driver chipset 100, and can better dissipate the heat of the driver chipset 100. Preferably, the heat sink 310 is a copper substrate heat sink 310.

Specifically, the first version of circuit uses the aluminum substrate heat sink 310 and one main driving chip 111+ two heat dissipation fans 320 connected in parallel with the driving chip 112(3 driving chips 110) to take heat away through the bottom of the aluminum substrate heat sink 310, and the maximum temperature reaches 120 ℃ after the test, and approaches the limit (150 ℃) of the internal node of the driving chip 110. The second version uses a copper heat sink 310 instead (the copper thermal conductivity is higher than that of aluminum, and the heat conduction is better) and one main driving chip 111+ four sub-driving chips 112(5 driving chips 110) connected in parallel with the air duct of the heat dissipation fan 320, and the air duct passes through not only the heat sink 310 but also the driving chip 110, the current sampling resistor R1 and the second voltage dividing resistor R4. The test results show that the maximum temperature of the surface of the drive chip set 100 is 77.6 ℃.

Therefore, the at least one driving chip 110 of the present embodiment includes one master driving chip 111 and four slave driving chips 112. The heat sink 310 is a copper substrate heat sink 310, so that the temperature of the driving chipset 100 is low and the stability is high.

Referring to fig. 7, fig. 7 is a schematic structural diagram of another driving device 10 according to an embodiment. As shown in fig. 7, in one embodiment, the driving device 10 further includes a protection module 400, and the protection module 400 is used for protecting the driving device 10.

Specifically, in the driving operation of the driving device 10, there may be some sudden changes in current and voltage, and the safety of the driving device 10 can be improved by providing the protection module 400 to protect the driving device 10.

In one embodiment, the driving chip 110 is configured with a standby pin, and the protection module 400 includes a protection optocoupler 410. The protection optocoupler 410 is electrically connected with the standby pin, and the protection optocoupler 410 is used for inputting a first high level to the standby pin when the protection optocoupler is turned on, so that the driving chipset 100 is in a working state; and inputs a first low level to the standby pin when itself is turned off, so that the driving chip 110 is in a standby state.

The protection optocoupler 410 is a device that transmits an electrical signal using light as a medium, and generally encapsulates a light emitter (infrared light emitting diode LED) and a light receiver (photosensitive semiconductor, photoresistor) in the same package. When the input end is powered on, the light emitter emits light, and the light receiver receives the light to generate light current which flows out from the output end, so that the electro-optic-electro control is realized, and the driving device 10 is protected by the components. The first high level may be set as desired. Specifically, the voltage of the first high level is higher than the first threshold, for example, 2.4V. The voltage of the first low level is below a second threshold, e.g. 2.4V. Wherein the first threshold value is greater than or equal to the second threshold value. The standby state of the driver chipset 100 means that at least one driver chip 110 stops performing the operational amplification and amplification processes on the driving signal.

Specifically, the protection optocoupler 410 inputs a first low level to the standby pin when the protection optocoupler is turned off, so that the driving chip 110 is in a standby state, thereby preventing the driving chip 110 from being damaged due to continuous abnormal operation, and protecting the driving chip 110. The protection optocoupler 410 inputs a first high level to the standby pin when it is turned on, so that the driving chip 110 is in a working state, thereby releasing the protection state.

In one embodiment, the driving chip 110 is configured with an output control pin, the protection optocoupler 410 is further electrically connected to the output control pin, and the protection optocoupler 410 is further configured to input a second high level to the output control pin when the protection optocoupler is turned on, so that the driving chip 110 starts to output a driving signal after signal amplification; and inputs a second low level to the output control pin when itself is turned off, so that the driving chip 110 stops outputting the amplified driving signal.

Wherein the second high level can be set as desired. Specifically, the voltage of the second high level is higher than the third threshold, for example, 2.5V. The voltage of the second low level is lower than a fourth threshold, for example 2.5V. Wherein the third threshold value is larger than or equal to the fourth threshold value. The driving chip 110 stopping outputting the amplified driving signal means that the inside of the driving chip 110 is still in a working state, but the amplified driving signal is not output.

The standby pin may be the STAND-BY pin (i.e., pin 9) as in fig. 7. The output control pin may be the MUTE pin (i.e., pin number 10) as in FIG. 7.

Specifically, the protection optocoupler 410 inputs a second low level to the output control pin when the protection optocoupler is disconnected, so that the driving chip 110 stops outputting the amplified driving signal, thereby protecting the working load 2. When the protection optocoupler 410 is turned on, a second high level is input to the output control pin, so that the driving chip 110 starts to output a driving signal after signal amplification, thereby contacting a protection state of the working load 2.

In one embodiment, the protection optocoupler 410 is turned off when receiving a turn-off control signal, where the turn-off control signal is generated when a controller electrically connected to an output end of the driver chipset 100 determines that a power amplified driver signal output by the driver chipset 100 exceeds a set threshold.

In this embodiment, the protection optocoupler 410 is turned on or off when the controller determines that the driving signal output by the driving chipset 100 exceeds a set threshold, so as to protect the driving chip 110 and/or the workload 2.

Referring to fig. 8, fig. 8 is a schematic structural diagram of a driving system according to an embodiment. As shown in fig. 8, a driving system of an embodiment includes the driving device 10 of any of the above embodiments.

In one embodiment, the drive system 1 further comprises a processor 20, a digital signal processor 30, a memory 40 and a controller 50. Specifically, the working data is sent to the controller 50, the controller 50 decodes the working data and then sends the decoded working data to the digital signal processor 30 for calculation, the digital signal processor 30 stores the calculated working data in the memory 40, the controller 50 reads the calculated working data from the memory 40 to control the processor 20 to simulate a driving signal as a small signal and send the driving signal to the driving input end of the driving chipset 100 of the driving device 10, and the driving chipset 100 outputs the driving signal to control the working load 2 to work.

In the description herein, references to the description of "some embodiments," "other embodiments," "desired embodiments," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, a schematic description of the above terminology may not necessarily refer to the same embodiment or example.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A driver chipset, comprising:

2. The driver chipset of claim 1, wherein the driver chips are plural, the plural driver chips comprising:

3. The driver chipset of claim 2, wherein the master driver chip comprises:

each of the slave driving chips includes:

4. The driver chipset of any one of claims 1-3, wherein the drive signal comprises a sine wave signal for driving an electronic engraving machine to engrave.

5. A drive device comprising a drive chip set according to any one of claims 1 to 4.

6. The drive of claim 5, further comprising:

7. The drive of claim 6, wherein the negative feedback circuit comprises:

8. The drive of claim 7, wherein the negative feedback circuit further comprises:

9. The drive of claim 6, further comprising:

and the protection module is used for protecting the driving device.

10. A drive system comprising a drive device according to any one of claims 5-9.