CN214046534U - Low-temperature superconducting quantum device structure - Google Patents
Low-temperature superconducting quantum device structure Download PDFInfo
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- CN214046534U CN214046534U CN202120223481.8U CN202120223481U CN214046534U CN 214046534 U CN214046534 U CN 214046534U CN 202120223481 U CN202120223481 U CN 202120223481U CN 214046534 U CN214046534 U CN 214046534U
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Abstract
The utility model discloses a low temperature superconducting quantum device structure in superconducting quantum device equipment field, the power distribution box comprises a box body, the bottom of box inner chamber is provided with the device body, the equal fixedly connected with bracing piece in both sides of box inner chamber bottom, the first U template of one side fixedly connected with of bracing piece, the surperficial swing joint of bracing piece has first movable rod, one side of first movable rod runs through first U template and fixedly connected with clamp plate. The utility model discloses in, through the box, reach the effect of placing the device body, through the bracing piece, reach the effect of fixed first U template, through first U template, first movable rod and clamp plate, reach the effect of fixed device body, through the heat dissipation case, reach the effect of placing the fan, through the fan, reach the effect of conveying air, through second U template, reach the effect of placing the filter screen, this equipment can dispel the heat to electronic component, makes things convenient for people to use.
Description
Technical Field
The utility model relates to a superconductive quantum device equipment field specifically is a low temperature superconductive quantum device structure.
Background
Superconducting means that the resistance of a conductor is zero at a certain temperature, and in an experiment, if the measured value of the resistance of the conductor is lower than 10-25 omega, the resistance can be considered to be zero.
When the superconducting quantum device is used for a long time, a large amount of heat is generated, if the heat is not dissipated in time, the internal electronic elements are damaged, and unnecessary troubles are brought to a user.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a low temperature superconducting quantum device structure to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a low-temperature superconducting quantum device structure comprises a box body, wherein a device body is arranged at the bottom of an inner cavity of the box body, supporting rods are fixedly connected to two sides of the bottom of the inner cavity of the box body, a first U-shaped plate is fixedly connected to one side of each supporting rod, a first movable rod is movably connected to the surface of each supporting rod, one side of each first movable rod penetrates through the corresponding first U-shaped plate and is fixedly connected with a pressing plate, one side of each pressing plate is in contact with the device body, a heat dissipation box is fixedly connected to the top of the box body, a fan is fixedly connected to the top of the inner cavity of the heat dissipation box, a second U-shaped plate is fixedly connected to two sides of the bottom of the inner cavity of the heat dissipation box, a filter screen is arranged inside the corresponding second U-shaped plate, a cross rod is fixedly connected to one side of the corresponding second U-shaped plate, a second movable rod is movably connected to one side of the cross rod through a rotating shaft, and an inserting rod is movably connected to one side of the second movable rod through a rotating shaft, one side of the inserted rod extends into the filter screen, the top of the box body is communicated with an air guide pipe, and the top of the air guide pipe is communicated with the heat dissipation box.
As a further aspect of the present invention: the top and the bottom of first U template have all seted up the spout, the inside sliding connection of spout has the slider, one side and the first movable rod fixed connection of slider.
As a further aspect of the present invention: the surface cover of first movable rod is equipped with first spring, one side and the bracing piece fixed connection of first spring, the opposite side and the slider fixed connection of first spring.
As a further aspect of the present invention: one side fixedly connected with second spring of second U template, one side and the second movable rod fixed connection of second spring.
As a further aspect of the present invention: the both sides of heat dissipation case inner chamber bottom all are provided with collects the box, one side and the contact of second U template of collecting the box.
As a further aspect of the present invention: the air inlet has all been seted up to the both sides of heat dissipation case, the exhaust hole has all been seted up to the both sides of box.
As a further aspect of the present invention: the front of the heat dissipation box is hinged with a cover plate through a hinge, and the front of the cover plate is fixedly connected with a handle.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses in, through the box, reach the effect of placing the device body, through the bracing piece, reach the effect of fixed first U template, through first U template, first movable rod and clamp plate, reach the effect of fixed device body, through the heat dissipation case, reach the effect of placing the fan, through the fan, reach the effect of conveying air, through second U template, reach the effect of placing the filter screen, through the horizontal pole, second movable rod and inserted bar, reach the effect of fixed filter screen, through the guide duct, reach the effect that makes things convenient for the air to get into the box, this equipment can dispel the heat to electronic component, make things convenient for people to use.
2. The utility model discloses in, through spout and slider, reach the effect of supplementary first movable rod removal, through first spring, reach the effect that drives first movable rod and reset, through the second spring, reach the effect that resets to the second movable rod, through collecting the box, reach the effect of collecting the dust, through inlet port and exhaust hole, reach and admit air and carminative effect, through apron and handle, reach the effect of opening or closing the heat dissipation case.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic front view of the structure of the present invention;
fig. 3 is an enlarged schematic view of a structure shown in fig. 1 according to the present invention.
In the figure: 1. a box body; 2. a device body; 3. a support bar; 4. a first U-shaped plate; 5. a first movable bar; 6. pressing a plate; 7. a heat dissipation box; 8. a fan; 9. a second U-shaped plate; 10. a filter screen; 11. a cross bar; 12. a second movable bar; 13. inserting a rod; 14. an air guide pipe; 15. a chute; 16. a slider; 17. a first spring; 18. a second spring; 19. a collection box; 20. an air inlet; 21. an exhaust hole; 22. a cover plate; 23. a handle.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, in the embodiment of the present invention, a low temperature superconducting quantum device structure comprises a box body 1, a device body 2 is disposed at the bottom of an inner cavity of the box body 1, support rods 3 are fixedly connected to both sides of the bottom of the inner cavity of the box body 1, a first U-shaped plate 4 is fixedly connected to one side of the support rods 3, a first movable rod 5 is movably connected to the surface of the support rods 3, one side of the first movable rod 5 penetrates through the first U-shaped plate 4 and is fixedly connected with a pressing plate 6, one side of the pressing plate 6 is in contact with the device body 2, a heat dissipation box 7 is fixedly connected to the top of the inner cavity of the box body 1, a fan 8 is fixedly connected to the top of the inner cavity of the heat dissipation box 7, a second U-shaped plate 9 is fixedly connected to both sides of the bottom of the inner cavity of the heat dissipation box 7, a filter screen 10 is disposed inside the second U-shaped plate 9, a cross rod 11 is fixedly connected to one side of the second U-shaped plate 9, a second movable rod 12 is movably connected to one side of the cross rod 11 through a rotating shaft, one side of the second movable rod 12 is movably connected with an inserted rod 13 through a rotating shaft, one side of the inserted rod 13 extends into the filter screen 10, the top of the box body 1 is communicated with an air guide pipe 14, and the top of the air guide pipe 14 is communicated with the heat dissipation box 7.
Through box 1, reach the effect of placing device body 2, through bracing piece 3, reach the effect of fixed first U template 4, through first U template 4, first movable rod 5 and clamp plate 6, reach the effect of fixed device body 2, through heat dissipation case 7, reach the effect of placing fan 8, through fan 8, reach the effect of carried air, through second U template 9, reach the effect of placing filter screen 10, through horizontal pole 11, second movable rod 12 and inserted bar 13, reach the effect of fixed filter screen 10, through guide duct 14, reach the effect that makes things convenient for air to get into box 1, this equipment can dispel the heat to electronic component, make things convenient for people to use.
In this embodiment, spout 15 has all been seted up to the top and the bottom of first U template 4, and the inside sliding connection of spout 15 has slider 16, and one side and the 5 fixed connection of first movable rod of slider 16 reach the effect of supplementary first movable rod 5 removal through spout 15 and slider 16.
In this embodiment, the surface cover of first movable rod 5 is equipped with first spring 17, and one side and bracing piece 3 fixed connection of first spring 17, the opposite side and the slider 16 fixed connection of first spring 17 reach the effect that drives first movable rod 5 and reset through first spring 17.
In this embodiment, one side of the second U-shaped plate 9 is fixedly connected with a second spring 18, one side of the second spring 18 is fixedly connected with the second movable rod 12, and the second spring 18 is used to achieve the effect of resetting the second movable rod 12.
In this embodiment, both sides of the bottom of the inner cavity of the heat dissipation box 7 are provided with a collection box 19, one side of the collection box 19 is in contact with the second U-shaped plate 9, and the effect of collecting dust is achieved through the collection box 19.
In this embodiment, the air inlet 20 has been all seted up to the both sides of heat dissipation case 7, and the exhaust hole 21 has all been seted up to the both sides of box 1, through air inlet 20 and exhaust hole 21, reaches the effect of admitting air and exhausting.
In this embodiment, the front surface of the heat dissipation box 7 is hinged to a cover plate 22 through a hinge, a handle 23 is fixedly connected to the front surface of the cover plate 22, and the effect of opening or closing the heat dissipation box 7 is achieved through the cover plate 22 and the handle 23.
The utility model discloses a theory of operation is: when needs dispel the heat to device body 2, fan 8 moves and drives the inside air flow of heat dissipation case 7 simultaneously, it gets into the inside of heat dissipation case 7 through inlet port 20 to drive the outside air of heat dissipation case 7 simultaneously, the air passes through the inside that guide duct 14 got into box 1, flow in the inside of box 1 through the air, can make the inside heat flow, the heat passes through exhaust hole 21, the inside of box 1 discharges, can dispel the heat to device body 2, when needs are dismantled filter screen 10, press second movable rod 12 and remove, when second movable rod 12 removed, drive inserted bar 13 and take filter screen 10 out, can demolish filter screen 10, this equipment can dispel the heat to electronic component, make things convenient for people to use.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (7)
1. The utility model provides a low temperature superconducting quantum device structure, includes box (1), its characterized in that: the device comprises a box body (1), a device body (2) is arranged at the bottom of an inner cavity of the box body (1), supporting rods (3) are fixedly connected to two sides of the bottom of the inner cavity of the box body (1), a first U-shaped plate (4) is fixedly connected to one side of each supporting rod (3), a first movable rod (5) is movably connected to the surface of each supporting rod (3), one side of each first movable rod (5) penetrates through the corresponding first U-shaped plate (4) and is fixedly connected with a pressing plate (6), one side of each pressing plate (6) is in contact with the corresponding device body (2), a heat dissipation box (7) is fixedly connected to the top of the box body (1), a fan (8) is fixedly connected to the top of the inner cavity of the heat dissipation box (7), a second U-shaped plate (9) is fixedly connected to two sides of the bottom of the inner cavity of the heat dissipation box (7), a filter screen (10) is arranged inside the second U-shaped plate (9), a cross rod (11) is fixedly connected to one side of the second U-shaped plate (9), one side of the cross rod (11) is movably connected with a second movable rod (12) through a rotating shaft, one side of the second movable rod (12) is movably connected with an inserting rod (13) through the rotating shaft, one side of the inserting rod (13) extends to the inside of the filter screen (10), the top of the box body (1) is communicated with an air guide pipe (14), and the top of the air guide pipe (14) is communicated with the heat dissipation box (7).
2. A low temperature superconducting quantum device structure according to claim 1, wherein: spout (15) have all been seted up to the top and the bottom of first U template (4), the inside sliding connection of spout (15) has slider (16), one side and first movable rod (5) fixed connection of slider (16).
3. A low temperature superconducting quantum device structure according to claim 1, wherein: the surface cover of first movable rod (5) is equipped with first spring (17), one side and bracing piece (3) fixed connection of first spring (17), the opposite side and slider (16) fixed connection of first spring (17).
4. A low temperature superconducting quantum device structure according to claim 1, wherein: one side of the second U-shaped plate (9) is fixedly connected with a second spring (18), and one side of the second spring (18) is fixedly connected with a second movable rod (12).
5. A low temperature superconducting quantum device structure according to claim 1, wherein: the two sides of the bottom of the inner cavity of the heat dissipation box (7) are provided with collecting boxes (19), and one side of each collecting box (19) is in contact with the second U-shaped plate (9).
6. A low temperature superconducting quantum device structure according to claim 1, wherein: both sides of the heat dissipation box (7) are provided with air inlets (20), and both sides of the box body (1) are provided with exhaust holes (21).
7. A low temperature superconducting quantum device structure according to claim 1, wherein: the front of the heat dissipation box (7) is hinged with a cover plate (22) through a hinge, and the front of the cover plate (22) is fixedly connected with a handle (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120223481.8U CN214046534U (en) | 2021-01-26 | 2021-01-26 | Low-temperature superconducting quantum device structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120223481.8U CN214046534U (en) | 2021-01-26 | 2021-01-26 | Low-temperature superconducting quantum device structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214046534U true CN214046534U (en) | 2021-08-24 |
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ID=77347341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120223481.8U Active CN214046534U (en) | 2021-01-26 | 2021-01-26 | Low-temperature superconducting quantum device structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214046534U (en) |
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2021
- 2021-01-26 CN CN202120223481.8U patent/CN214046534U/en active Active
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