CN214046437U - High heat dissipation power adapter - Google Patents
High heat dissipation power adapter Download PDFInfo
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- CN214046437U CN214046437U CN202022396008.8U CN202022396008U CN214046437U CN 214046437 U CN214046437 U CN 214046437U CN 202022396008 U CN202022396008 U CN 202022396008U CN 214046437 U CN214046437 U CN 214046437U
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- heat dissipation
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Abstract
The application relates to a high heat dissipation power adapter is used in power adapter's field, and it includes the circuit board, the back of circuit board is provided with the heating panel, the heating panel deviates from and is provided with heat radiation fins on the wall of circuit board. This application has the effect that improves circuit board heat dispersion.
Description
Technical Field
The application relates to the field of power adapters, in particular to a high-heat-dissipation power adapter.
Background
A power adapter is a power supply conversion device for small electronic devices, and generally converts input ac power into dc power for output to an electric device.
The structure of the power adapter generally comprises an outer shell and a circuit board arranged inside the outer shell, the circuit board can generate more heat in the current conversion process, the current circuit board has poor heat dissipation effect, and therefore the circuit board is easily burnt out, and the normal work of the circuit board is influenced.
SUMMERY OF THE UTILITY MODEL
In order to improve the poor problem of circuit board radiating effect, this application provides a high heat dissipation power adapter.
The application provides a high heat dissipation power adapter adopts following technical scheme:
the high-heat-dissipation power adapter comprises a circuit board, wherein a heat dissipation plate is arranged on the back face of the circuit board, and heat dissipation fins are arranged on the wall face, deviating from the circuit board, of the heat dissipation plate.
Through adopting above-mentioned technical scheme, heating panel and heat radiation fins's setting has increased the heat radiating area of circuit board, improves the radiating effect of circuit board for the heat that the circuit board produced can quick giveaway, thereby reduces the possibility that the circuit board is burnt out, has guaranteed that the circuit board normally works.
Optionally, the plurality of heat dissipation fins include a plurality of transverse fins and a plurality of longitudinal fins, the transverse fins extend along the width direction of the heat dissipation plate, two adjacent transverse fins are arranged at intervals, the longitudinal fins extend along the length direction of the heat dissipation plate, and two adjacent longitudinal fins are arranged at intervals.
By adopting the technical scheme, the radiating fins are composed of the plurality of transverse fins and the plurality of longitudinal fins, so that the surface area of the radiating fins is increased, the radiating area of the radiating fins is increased, and the radiating effect of the radiating fins can be effectively improved.
Optionally, the plurality of transverse fins and the plurality of longitudinal fins are all arranged in a wave-shaped bending manner.
By adopting the technical scheme, the transverse fins and the longitudinal fins are both wave-shaped, so that the surface areas of the transverse fins and the longitudinal fins can be increased, the heat dissipation areas of the transverse fins and the longitudinal fins are increased, and the heat dissipation effects of the transverse fins and the longitudinal fins are improved.
Optionally, two side wall surfaces of the transverse fins are both provided with transverse heat dissipation grooves, the transverse heat dissipation grooves extend along the length direction of the transverse fins, and two ends of each transverse heat dissipation groove penetrate through the side walls of the transverse fins; longitudinal radiating grooves are formed in the two side wall surfaces of the longitudinal fins, the longitudinal radiating grooves extend along the length direction of the longitudinal fins, and the two ends of each longitudinal radiating groove penetrate through the side walls of the longitudinal fins.
By adopting the technical scheme, the transverse radiating grooves and the longitudinal radiating grooves are respectively formed in the wall surfaces of the transverse fins and the longitudinal fins, so that the radiating areas of the transverse fins and the longitudinal fins are increased, and the radiating effect of the transverse fins and the longitudinal fins is improved.
Optionally, a heat dissipation cavity is formed between every two adjacent transverse fins and every two adjacent longitudinal fins, a cross-shaped reinforcing sheet is arranged in the heat dissipation cavity, the reinforcing sheet is fixedly connected to the heat dissipation plate, and four support legs of the reinforcing sheet are fixedly connected with the two transverse fins and the two longitudinal fins.
By adopting the technical scheme, the cross-shaped reinforcing sheet plays a role in supporting and reinforcing the transverse fins and the longitudinal fins so as to improve the structural stability of the transverse fins and the longitudinal fins and reduce the possibility of compression deformation of the transverse fins and the longitudinal fins.
Optionally, longitudinal embedded pieces are arranged on two side walls of the heat dissipation plate along the length direction, a transverse embedded piece is arranged on one side wall of the heat dissipation plate along the width direction, the transverse embedded pieces and the two longitudinal embedded pieces are arranged in an L-shaped structure, the transverse embedded pieces and the two longitudinal embedded pieces extend towards the circuit board, a space for embedding the circuit board is formed between each of the transverse embedded pieces, the two longitudinal embedded pieces and the heat dissipation plate, and the circuit board and the heat dissipation plate are fixed through a connecting piece.
Through adopting above-mentioned technical scheme, when fixed heating panel and circuit board, the operator slides the circuit board on the heating panel from the heating panel does not set up one side horizontal gomphosis piece and vertical gomphosis piece to make the laminating of circuit board back on the heating panel, the border of circuit board is pushed down to horizontal gomphosis piece and two vertical gomphosis pieces this moment, plays the effect of fixing in advance to the circuit board, then the operator fixes heating panel and circuit board through the connecting piece again.
Optionally, the connecting piece includes the screw, the connecting hole has all been seted up to four edges of circuit board, the screw hole corresponding with the connecting hole has all been seted up to four edges of heating panel, the screw is worn to establish behind the connecting hole and is connected with screw hole threaded connection.
By adopting the technical scheme, after the circuit board completely slides onto the heat dissipation plate, the connecting holes at the four corners of the circuit board correspond to the threaded holes at the four corners of the heat dissipation plate, an operator penetrates through the connecting holes and then is in threaded connection with the threaded holes, and the heat dissipation plate and the circuit board can be firmly fixed together.
Optionally, a gasket with a diameter larger than the aperture of the connection hole is sleeved on the screw, and the gasket is compressed between the head of the screw and the circuit board.
Through adopting above-mentioned technical scheme, the area of contact between screw head and the circuit board can be enlarged to the gasket that sets up to improve the fixed stability of screw to heating panel and circuit board.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the arrangement of the heat dissipation plate and the plurality of heat dissipation fins increases the heat dissipation area of the circuit board and improves the heat dissipation effect of the circuit board, thereby reducing the possibility that the circuit board is burnt and ensuring the normal work of the circuit board;
2. the radiating fins are composed of a plurality of transverse fins and a plurality of longitudinal fins, so that the surface area of the radiating fins is increased, the radiating area of the radiating fins is increased, and the radiating effect of the radiating fins can be effectively improved;
3. the cross-shaped reinforcing sheet plays a role in supporting and reinforcing the transverse fins and the longitudinal fins so as to improve the structural stability of the transverse fins and the longitudinal fins and reduce the possibility of compression deformation of the transverse fins and the longitudinal fins.
Drawings
Fig. 1 is a schematic diagram of a connection structure of a circuit board and a heat dissipation plate according to the present embodiment.
Fig. 2 is a schematic structural diagram of a heat dissipation plate and heat dissipation fins according to the present embodiment.
Reference numerals: 1. a circuit board; 11. connecting holes; 2. a heat dissipation plate; 21. a longitudinal fitting piece; 22. a transverse tabling sheet; 23. a threaded hole; 3. heat dissipation fins; 31. transverse fins; 311. a transverse heat dissipation groove; 32. longitudinal fins; 321. a longitudinal heat dissipation groove; 4. a heat dissipation cavity; 5. a reinforcing sheet; 6. a screw; 7. and (7) a gasket.
Detailed Description
The present application is described in further detail below with reference to figures 1-2.
The embodiment of the application discloses high heat dissipation power adapter. Referring to fig. 1, the power adapter with high heat dissipation includes a circuit board 1, a heat dissipation plate 2 is disposed on the back of the circuit board 1, the heat dissipation plate 2 and the circuit board 1 have the same shape and cross-sectional dimension, the thickness of the heat dissipation plate 2 is greater than that of the circuit board 1, longitudinal embedded pieces 21 are fixedly connected to both side walls of the heat dissipation plate 2 along the length direction, a transverse embedded piece 22 is fixedly connected to one side wall of the heat dissipation plate 2 along the width direction, the transverse embedded piece 22 and the two longitudinal embedded pieces 21 are disposed in an L-shaped structure, the transverse embedded piece 22 and the two longitudinal embedded pieces 21 extend toward the circuit board 1, and the distance between the transverse embedded piece 22 and the two longitudinal embedded pieces 21 and the heat dissipation plate 2 is equal to the thickness of the circuit board 1.
Referring to fig. 1, an operator can slide the circuit board 1 onto the heat dissipation plate 2 from the side of the heat dissipation plate 2 where the transverse engaging pieces 22 and the longitudinal engaging pieces 21 are not disposed, and attach the back surface of the circuit board 1 to the heat dissipation plate 2, at this time, the transverse engaging pieces 22 and the two longitudinal engaging pieces 21 press the edge of the circuit board 1, so as to pre-fix the circuit board 1.
Referring to fig. 1, and it is fixed through the connecting piece between circuit board 1 and the heating panel 2, the connecting piece includes screw 6, connecting hole 11 has all been seted up at four edges of circuit board 1, screw hole 23 corresponding with connecting hole 11 has all been seted up at four edges of heating panel 2, and screw hole 23 and the screw 6 screw-thread fit, the operator wears to establish with screw 6 behind the connecting hole 11 with screw hole 23 threaded connection, can realize the stable fixed to circuit board 1 and heating panel 2. In addition, the screw 6 is sleeved with the gasket 7 with the diameter larger than the aperture of the connecting hole 11, the gasket 7 is positioned between the head of the screw 6 and the circuit board 1, after an operator screws the screw 6, the gasket 7 is pressed between the head of the screw 6 and the circuit board 1, the contact area between the head of the screw 6 and the circuit board 1 can be enlarged, and therefore the fixing stability of the screw 6 to the heat dissipation plate 2 and the circuit board 1 is improved.
Referring to fig. 1 and 2, a wall surface of the heat dissipation plate 2 facing away from the circuit board 1 is fixedly connected with heat dissipation fins 3, each heat dissipation fin 3 includes a plurality of transverse fins 31 and a plurality of longitudinal fins 32, the plurality of transverse fins 31 extend along a width direction of the heat dissipation plate 2, the adjacent two transverse fins 31 are arranged at intervals, intervals between the adjacent two transverse fins 31 are equal, the plurality of longitudinal fins 32 extend along a length direction of the heat dissipation plate 2, the adjacent two longitudinal fins 32 are arranged at intervals, and intervals between the adjacent two longitudinal fins 32 are equal. Dividing the radiator fin 3 into the lateral fins 31 and the longitudinal fins 32 increases the surface area of the radiator fin 3, thereby increasing the heat radiation area of the radiator fin 3.
Referring to fig. 1 and 2, the heat dissipation area of the circuit board 1 is increased through the heat dissipation plate 2 and the heat dissipation fins 3, the heat dissipation effect of the circuit board 1 is improved, heat generated by the circuit board 1 can be quickly dissipated, the possibility that the circuit board 1 is burnt is reduced, and the normal work of the circuit board 1 is guaranteed.
Referring to fig. 2, the plurality of transverse fins 31 and the plurality of longitudinal fins 32 are both arranged in a wave-shaped bent manner, so that the surface areas of the transverse fins 31 and the longitudinal fins 32 can be increased, and thus the heat dissipation areas of the transverse fins 31 and the longitudinal fins 32 can be increased, and the heat dissipation effect of the transverse fins 31 and the longitudinal fins 32 can be improved.
Referring to fig. 2, in addition, two side wall surfaces of the transverse fin 31 are both provided with transverse heat dissipation grooves 311, the transverse heat dissipation grooves 311 extend along the length direction of the transverse fin 31, and two ends of the transverse heat dissipation grooves 311 both penetrate through two side walls of the transverse fin 31; the two side wall surfaces of the longitudinal fins 32 are respectively provided with a longitudinal heat dissipation groove 321, the longitudinal heat dissipation grooves 321 extend along the length direction of the longitudinal fins 32, and two ends of the longitudinal heat dissipation grooves 321 penetrate through two side walls of the longitudinal fins 32. The heat dissipation areas of the horizontal fins 31 and the vertical fins 32 can be increased by the horizontal heat dissipation grooves 311 and the vertical heat dissipation grooves 321, thereby improving the heat dissipation effect of the horizontal fins 31 and the vertical fins 32.
Referring to fig. 2, a space formed between two adjacent transverse fins 31 and two adjacent longitudinal fins 32 is set as a heat dissipation cavity 4, a reinforcing plate 5 in a cross-shaped structure is arranged in the heat dissipation cavity 4, the reinforcing plate 5 is fixedly connected to the heat dissipation plate 2, four legs of the reinforcing plate 5 are also fixedly connected to the two transverse fins 31 and the two longitudinal fins 32, and the transverse fins 31 and the longitudinal fins 32 can be supported and reinforced by the reinforcing plate 5, so that structural stability of the transverse fins 31 and the longitudinal fins 32 is improved, and possibility of compression deformation of the transverse fins 31 and the longitudinal fins 32 is reduced.
The implementation principle of the high heat dissipation power adapter in the embodiment of the application is as follows: an operator slides the circuit board 1 onto the heat dissipation plate 2 from one side of the heat dissipation plate 2 without the transverse embedded sheet 22 and the longitudinal embedded sheet 21, and the back of the circuit board 1 is attached to the heat dissipation plate 2, at the moment, the transverse embedded sheet 22 and the two longitudinal embedded sheets 21 press the edge of the circuit board 1 to play a role in pre-fixing the circuit board 1, at the moment, the connecting holes 11 at the four corners of the circuit board 1 correspond to the threaded holes 23 at the four corners of the heat dissipation plate 2, the operator penetrates the screws 6 through the connecting holes 11 and then is in threaded connection with the threaded holes 23, and the heat dissipation plate 2 and the circuit board 1 can be firmly fixed together; the heat generated in the working process of the circuit board 1 can be quickly dissipated through the heat dissipation plate 2 and the heat dissipation fins 3, so that the possibility that the circuit board 1 is burnt is reduced, and the normal work of the circuit board 1 is ensured.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (6)
1. The utility model provides a high heat dissipation power adapter, includes circuit board (1), its characterized in that: the back surface of the circuit board (1) is provided with a heat dissipation plate (2), and the wall surface of the heat dissipation plate (2) departing from the circuit board (1) is provided with heat dissipation fins (3);
the radiating fins (3) comprise a plurality of transverse fins (31) and a plurality of longitudinal fins (32), the transverse fins (31) extend along the width direction of the radiating plate (2), two adjacent transverse fins (31) are arranged at intervals, the longitudinal fins (32) extend along the length direction of the radiating plate (2), and two adjacent longitudinal fins (32) are arranged at intervals;
the plurality of transverse fins (31) and the plurality of longitudinal fins (32) are arranged in a wave-shaped bending mode.
2. The power adapter with high heat dissipation according to claim 1, wherein: two side wall surfaces of the transverse fins (31) are respectively provided with a transverse heat dissipation groove (311), the transverse heat dissipation grooves (311) extend along the length direction of the transverse fins (31), and two ends of each transverse heat dissipation groove (311) penetrate through the side walls of the transverse fins (31); longitudinal heat dissipation grooves (321) are formed in two side wall surfaces of the longitudinal fins (32), the longitudinal heat dissipation grooves (321) extend along the length direction of the longitudinal fins (32), and two ends of each longitudinal heat dissipation groove (321) penetrate through the side walls of the longitudinal fins (32).
3. The power adapter with high heat dissipation according to claim 1, wherein: adjacent two horizontal fin (31) and adjacent two be formed with heat dissipation chamber (4) between longitudinal fin (32), be provided with in heat dissipation chamber (4) and be criss-cross reinforcement piece (5), reinforcement piece (5) fixed connection is on heating panel (2), just four stabilizer blades of reinforcement piece (5) all with two horizontal fin (31) and two longitudinal fin (32) fixed connection.
4. The power adapter with high heat dissipation according to claim 1, wherein: the heat dissipation plate is characterized in that longitudinal embedded pieces (21) are arranged on two side walls of the heat dissipation plate (2) in the length direction, a transverse embedded piece (22) is arranged on one side wall of the heat dissipation plate (2) in the width direction, the transverse embedded piece (22) and the two longitudinal embedded pieces (21) are arranged in an L-shaped structure, the transverse embedded piece (22) and the two longitudinal embedded pieces (21) extend towards the circuit board (1), a space for embedding the circuit board (1) is formed between the transverse embedded piece (22) and the two longitudinal embedded pieces (21) and the heat dissipation plate (2), and the circuit board (1) and the heat dissipation plate (2) are fixed through connecting pieces.
5. The power adapter with high heat dissipation according to claim 4, wherein: the connecting piece includes screw (6), connecting hole (11) have all been seted up at four edges of circuit board (1), screw hole (23) corresponding with connecting hole (11) have all been seted up at four edges of heating panel (2), screw (6) wear to establish behind connecting hole (11) and screw hole (23) threaded connection.
6. The adapter for power supply with high heat dissipation according to claim 5, wherein: the screw (6) is sleeved with a gasket (7) with the diameter larger than the aperture of the connecting hole (11), and the gasket (7) is pressed between the head of the screw (6) and the circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022396008.8U CN214046437U (en) | 2020-10-24 | 2020-10-24 | High heat dissipation power adapter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022396008.8U CN214046437U (en) | 2020-10-24 | 2020-10-24 | High heat dissipation power adapter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214046437U true CN214046437U (en) | 2021-08-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022396008.8U Active CN214046437U (en) | 2020-10-24 | 2020-10-24 | High heat dissipation power adapter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214046437U (en) |
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2020
- 2020-10-24 CN CN202022396008.8U patent/CN214046437U/en active Active
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