CN214044244U - Chip circuit conduction test tool - Google Patents

Chip circuit conduction test tool Download PDF

Info

Publication number
CN214044244U
CN214044244U CN202120292905.6U CN202120292905U CN214044244U CN 214044244 U CN214044244 U CN 214044244U CN 202120292905 U CN202120292905 U CN 202120292905U CN 214044244 U CN214044244 U CN 214044244U
Authority
CN
China
Prior art keywords
usb interface
plate
chip
welding
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202120292905.6U
Other languages
Chinese (zh)
Inventor
黄本涛
宋成龙
程传博
吴声亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Weilaixin Technology Co ltd
Original Assignee
Shenzhen Weilaixin Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Weilaixin Technology Co ltd filed Critical Shenzhen Weilaixin Technology Co ltd
Priority to CN202120292905.6U priority Critical patent/CN214044244U/en
Application granted granted Critical
Publication of CN214044244U publication Critical patent/CN214044244U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Tests Of Electronic Circuits (AREA)

Abstract

The utility model discloses a chip circuit conduction testing tool, the upper end of bottom plate is connected with the bracing piece, bracing piece and bottom plate pass through welded connection together, the upper end of bracing piece is connected with the backup pad, backup pad and bracing piece pass through welded connection together, the chip placing plate is installed to the upper end of backup pad, one side of chip placing plate is connected with first connecting plate, first connecting plate and chip placing plate pass through welded connection together, the internally mounted of first connecting plate has first USB interface, one side of first USB interface is installed the second USB interface, one side of second USB interface is installed USB interface bottom plate; the utility model discloses well conducting pin, first USB interface, second USB interface, third USB interface, elevating system and chip place the design of board and can let chip circuit conduction test become portably to avoid causing because the operation is numerous and diverse and leak the condition emergence of examining and damaging the chip, avoided the trouble that follow-up needn't take place simultaneously.

Description

Chip circuit conduction test tool
Technical Field
The utility model relates to an electronic components technical field, in particular to chip circuit conduction testing frock.
Background
The operation of chip circuit conduction test frock is too complicated, and simultaneously at the in-process of chip circuit conduction test, because the operation is too complicated and certain step has been forgotten, will cause the chip conduction test incomplete to can not detect the problem in the chip, will cause subsequent some troubles like this, can cause the chip to damage simultaneously in complicated operation process easily.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the present invention is to overcome the drawbacks of the prior art, and to provide a chip circuit conduction testing tool, wherein a chip is placed on a chip placing plate, a power line is inserted into a third USB interface to provide power for the whole chip circuit conduction testing tool, a data line is inserted into a first USB interface and a second USB interface to start the whole chip circuit conduction testing tool to operate, then a lifting mechanism is adjusted to make a conduction pin touch the chip, the height of a lifting column is adjusted first, and then the angle of a stretching block is adjusted to adjust the height of a lifting arm, and the height of a second connecting plate is adjusted along with the adjustment of the height of the lifting arm, and simultaneously the telescopic motion of a first telescopic mechanism and a second telescopic mechanism is driven along with the adjustment of the height of the lifting arm, and the telescopic motion of the first telescopic mechanism and the second telescopic mechanism drives the up-and-down motion of a telescopic rod, at the moment, the circuit conduction test is carried out on the chip through conduction, after the operation is finished, the power line and the data line are pulled out, then the lifting arm moves upwards, so as to drive the second connecting plate to move upwards, and the second connecting plate moves upwards to drive the conduction needle to leave the chip, at the moment, the chip is taken down, so that the chip circuit conduction test is finished, the design of the conduction needle, the first USB interface, the second USB interface, the third USB interface, the lifting mechanism and the chip placing plate in the utility model can lead the chip circuit conduction test to be simple and convenient, thereby avoiding the condition of missing detection and chip damage caused by complicated operation, simultaneously avoiding the trouble which is not needed to be generated in the follow-up process, solving the problems mentioned in the background technology that the operation of the chip circuit conduction test tool is too complicated at present, and simultaneously in the chip circuit conduction test process, a certain step is forgotten because the operation is too complicated, the chip conduction test is incomplete, so that the problems in the chip can not be detected, subsequent troubles can be caused, and the chip is easy to damage in a complicated operation process.
In order to solve the technical problem, the utility model provides a following technical scheme:
the utility model relates to a chip circuit conduction testing tool, which comprises a bottom plate, a first connecting plate, a USB interface bottom plate and a USB connecting block, wherein the upper end of the bottom plate is connected with a supporting rod, the supporting rod and the bottom plate are connected together by welding, the upper end of the supporting rod is connected with a supporting plate, the supporting plate and the supporting rod are connected together by welding, a chip placing plate is arranged at the upper end of the supporting plate, one side of the chip placing plate is connected with the first connecting plate, the first connecting plate and the chip placing plate are connected together by welding, a first USB interface is arranged in the first connecting plate, a second USB interface is arranged at one side of the first USB interface, a USB interface bottom plate is arranged at one side of the second USB interface, the USB interface bottom plate and the second USB interface are connected together by welding, a plurality of data lines penetrate through the interior of the USB interface bottom plate, a conducting needle is arranged on one side of the data line, the upper end of the conducting needle is connected with a second connecting plate, the second connecting plate and the conduction needle are connected together by welding, one side of the second connecting plate is connected with a lifting mechanism, the lifting mechanism and the supporting plate are connected together by welding, a first telescopic mechanism is arranged at one side of the lifting mechanism, the first telescopic mechanism and the supporting plate are connected together by welding, and the other side of the lifting mechanism is provided with a second telescopic mechanism which is connected with the supporting plate by welding, the lower end of one side of the supporting plate is connected with a fixed block, the fixed block and the supporting plate are connected together by welding, the USB connecting block is installed to one side of fixed block, USB connecting block and backup pad pass through welded connection and are in the same place, the internally mounted of USB connecting block has the third USB interface.
As a preferred technical scheme of the utility model, elevating system is including the lifing arm, the one end and the second connecting plate of lifing arm pass through welded connection together, the other end of lifing arm is connected with tensile piece, the other end of tensile piece is connected with the lift post, the cylinder protection piece is installed in the outside of lift post.
As an optimal technical scheme of the utility model, the one end of lifing arm is provided with circular hole, the both ends of tensile piece all are provided with circular hole, the top of lifing post is provided with circular hole, the circular hole size diameter that lifing arm, tensile piece and lifing post set up all equals, lifing arm and tensile piece run through circular hole through the screw and link together, lifing post and tensile piece run through circular hole through the screw and link together, the end of lifing post can touch the recess of fixed block at minimum height.
As a preferred technical scheme of the utility model, first telescopic machanism is including the telescopic link, the outside of telescopic link is provided with the telescopic link bearer bar, the telescopic link bearer bar outside is provided with the rectangle fixed block, rectangle fixed block and telescopic link bearer bar pass through welded connection and are in the same place, the upper end of telescopic link passes through welded connection with the second connecting plate and is in the same place, the telescopic link runs through the backup pad, first telescopic machanism structure is the same with second telescopic machanism's structure.
As a preferred technical scheme of the utility model, the bracing piece is provided with four altogether, four corners of backup pad all are connected with the bracing piece, four corners that the board was placed to the chip are provided with circular hole, the backup pad be provided with four circular holes on the surface, the circular hole size diameter that the board set up was placed to backup pad and chip all equals, backup pad and chip are placed the board and are run through circular hole through the bolt and link together.
As a preferred technical scheme of the utility model, the conduction needle is provided with six altogether, the upper end of conduction needle is the cylinder, the lower extreme of conduction needle is the cone, switch on the core position to answering the chip.
Compared with the prior art, the beneficial effects of the utility model are as follows:
the utility model places the chip on the chip placing plate, then inserts the power cord into the third USB interface, provides power for the whole chip circuit conduction test tool, inserts the data cord into the first USB interface and the second USB interface, thereby the whole chip circuit conduction test tool starts to operate, then adjusts the lifting mechanism to make the conduction needle touch the chip, firstly adjusts the height of the lifting column, then adjusts the angle of the stretching block, thereby adjusts the height of the lifting arm, and adjusts the height of the second connecting plate along with the height adjustment of the lifting arm, simultaneously drives the telescopic motion of the first telescopic mechanism and the second telescopic mechanism along with the height adjustment of the lifting arm, and the telescopic motion of the first telescopic mechanism and the second telescopic mechanism can drive the up-and-down motion of the telescopic rod, at the moment, the circuit conduction test is carried out to the chip through conduction, after the operation is finished, the power cord and the data cord are pulled out, then with lifing arm upward movement to drive second connecting plate upward movement, and the second connecting plate is upward movement and can drive to switch on the needle and leave the chip, take off the chip this moment, so far, chip circuit conduction test finishes, the utility model discloses well switch on needle, first USB interface, second USB interface, third USB interface, elevating system and chip place the design of board and can let the chip circuit conduction test become portably, thereby avoid causing the condition emergence of lou examining and damaging the chip because the operation is numerous and diverse, avoided the trouble that follow-up needn't take place simultaneously.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is one of the overall structural schematic diagrams of the present invention;
fig. 2 is a second schematic view of the overall structure of the present invention;
fig. 3 is a third schematic view of the overall structure of the present invention.
In the figure: 1. a base plate; 2. a support bar; 3. a support plate; 4. a chip placement board; 5. a first connecting plate; 6. a first USB interface; 7. a second USB interface; 8. a USB interface backplane; 9. a data line; 10. a guide needle; 11. a second connecting plate; 12. a lifting mechanism; 13. a first telescoping mechanism; 14. a second telescoping mechanism; 15. a fixed block; 16. a USB connecting block; 17. a third USB interface; 1201. a lifting arm; 1202. stretching the block; 1203. a lifting column; 1204. a cylinder protection block; 1301. a telescopic rod; 1302. a telescopic rod protection frame; 1303. and a rectangular fixed block.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
Example 1
As shown in fig. 1-3, the utility model provides a chip circuit conduction testing tool, which comprises a bottom plate 1, a first connecting plate 5, a USB interface bottom plate 8 and a USB connecting block 16, wherein the upper end of the bottom plate 1 is connected with a supporting rod 2, the supporting rod 2 is connected with the bottom plate 1 by welding, the upper end of the supporting rod 2 is connected with a supporting plate 3, the supporting plate 3 is connected with the supporting rod 2 by welding, the upper end of the supporting plate 3 is provided with a chip placing plate 4, one side of the chip placing plate 4 is connected with the first connecting plate 5, the first connecting plate 5 is connected with the chip placing plate 4 by welding, the first USB interface 6 is arranged inside the first connecting plate 5, one side of the first USB interface 6 is provided with a second USB interface 7, one side of the second USB interface 7 is provided with a USB interface bottom plate 8, the USB interface bottom plate 8 is connected with the second USB interface 7 by welding, a plurality of data wires 9 penetrate through the USB interface bottom plate 8, a conducting needle 10 is installed on one side of each data wire 9, a second connecting plate 11 is connected to the upper end of each conducting needle 10, the second connecting plate 11 and the conducting needle 10 are connected together through welding, a lifting mechanism 12 is connected to one side of the second connecting plate 11, the lifting mechanism 12 and a supporting plate 3 are connected together through welding, a first telescopic mechanism 13 is installed on one side of the lifting mechanism 12, the first telescopic mechanism 13 and the supporting plate 3 are connected together through welding, a second telescopic mechanism 14 is installed on the other side of the lifting mechanism 12, the second telescopic mechanism 14 and the supporting plate 3 are connected together through welding, a fixed block 15 is connected to the lower end of one side of the supporting plate 3, the fixed block 15 and the supporting plate 3 are connected together through welding, a USB connecting block 16 is installed on one side of the fixed block 15, and the USB connecting block 16 and the supporting plate 3 are connected together through welding, the inside of the USB connection block 16 is mounted with a third USB interface 17.
The lifting mechanism 12 comprises a lifting arm 1201, one end of the lifting arm 1201 is connected with the second connecting plate 11 through welding, the other end of the lifting arm 1201 is connected with a stretching block 1202, the other end of the stretching block 1202 is connected with a lifting column 1203, and a cylindrical protection block 1204 is installed on the outer side of the lifting column 1203, so that the components of the lifting mechanism 12 are described.
One end of the lifting arm 1201 is provided with a circular hole, both ends of the stretching block 1202 are provided with circular holes, the top end of the lifting column 1203 is provided with a circular hole, the lifting arm 1201, the stretching block 1202 and the circular hole set by the lifting column 1203 are equal in size and diameter, the lifting arm 1201 and the stretching block 1202 are connected together by penetrating through the circular hole through a screw, the lifting column 1203 and the stretching block 1202 are connected together by penetrating through the circular hole through a screw, the end of the lifting column 1203 can touch a groove of the fixing block 15 at the lowest height, the connection relation of the lifting arm 1201 and the stretching block 1202 is described, and the connection relation of the lifting column 1203 and the stretching block 1202 is also described.
The first telescopic mechanism 13 comprises a telescopic rod 1301, a telescopic rod protection frame 1302 is arranged on the outer side of the telescopic rod 1301, a rectangular fixing block 1303 is arranged on the outer side of the telescopic rod protection frame 1302, the rectangular fixing block 1303 and the telescopic rod protection frame 1302 are connected together in a welding mode, the upper end of the telescopic rod 1301 is connected with the second connecting plate 11 in a welding mode, the telescopic rod 1301 penetrates through the supporting plate 3, the structure of the first telescopic mechanism 13 is the same as that of the second telescopic mechanism 14, and the components of the first telescopic mechanism 13 are explained.
The bracing piece 2 is provided with four altogether, four corners of backup pad 3 all are connected with bracing piece 2, four corners that board 4 was placed to the chip are provided with circular hole, backup pad 3 is provided with four circular holes on the surface, backup pad 3 and chip place the circular hole size diameter that board 4 set up and all equal, backup pad 3 and chip place board 4 and run through circular hole through the bolt and link together, have explained the quantity that sets up of bracing piece 2, have also explained backup pad 3 and chip and placed the relation of connection of board 4 simultaneously.
The number of the conducting pins 10 is six, the upper ends of the conducting pins 10 are cylinders, the lower ends of the conducting pins 10 are cones, and the conducting pins 10 correspond to the core parts of the chips, so that the number of the conducting pins 10 is described.
The working principle is as follows: firstly, a chip is placed on a chip placing plate 4, then a power line is inserted into a third USB interface 17 to provide power for the whole chip circuit conduction testing tool, a data line is inserted into a first USB interface 6 and a second USB interface 7 to enable the whole chip circuit conduction testing tool to start running, then a lifting mechanism 12 is adjusted to enable a conduction pin 10 to touch the chip, the height of a lifting column 1203 is adjusted firstly, then the angle of a stretching block 1202 is adjusted, the height of a lifting arm 1201 is adjusted, the height of a second connecting plate 11 is adjusted along with the adjustment of the height of the lifting arm 1201, meanwhile, the telescopic motion of a first telescopic mechanism 13 and a second telescopic mechanism 14 is driven along with the adjustment of the height of the lifting arm 1201, the telescopic motion of the first telescopic mechanism 13 and the second telescopic mechanism 14 drives the up-down movement of a telescopic rod 1301, and at the moment, the chip is subjected to circuit conduction testing through the conduction pin 10, after the operation is finished, pull out power cord and data line, then with lifing arm 1201 upward movement to drive second connecting plate 11 upward movement, and second connecting plate 11 is upward movement and can drive conduction needle 10 and leave the chip, takes off the chip this moment, and so far, chip circuit conduction test finishes.
It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions, and furthermore, the terms "comprise", "include", or any other variation thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. A chip circuit conduction testing tool comprises a bottom plate (1), a first connecting plate (5), a USB interface bottom plate (8) and a USB connecting block (16), and is characterized in that the upper end of the bottom plate (1) is connected with a supporting rod (2), the supporting rod (2) is connected with the bottom plate (1) through welding, the upper end of the supporting rod (2) is connected with a supporting plate (3), the supporting plate (3) is connected with the supporting rod (2) through welding, a chip placing plate (4) is installed at the upper end of the supporting plate (3), one side of the chip placing plate (4) is connected with the first connecting plate (5), the first connecting plate (5) is connected with the chip placing plate (4) through welding, a first USB interface (6) is installed inside the first connecting plate (5), a second USB interface (7) is installed at one side of the first USB interface (6), a USB interface bottom plate (8) is installed on one side of the second USB interface (7), the USB interface bottom plate (8) and the second USB interface (7) are connected together through welding, a plurality of data lines (9) penetrate through the inside of the USB interface bottom plate (8), a conducting needle (10) is installed on one side of each data line (9), a second connecting plate (11) is connected to the top end of the conducting needle (10), the second connecting plate (11) and the conducting needle (10) are connected together through welding, an elevating mechanism (12) is connected to one side of the second connecting plate (11), the elevating mechanism (12) and the supporting plate (3) are connected together through welding, a first telescopic mechanism (13) is installed on one side of the elevating mechanism (12), the first telescopic mechanism (13) and the supporting plate (3) are connected together through welding, and a second telescopic mechanism (14) is installed on the other side of the elevating mechanism (12), second telescopic machanism (14) and backup pad (3) are in the same place through welded connection, one side lower extreme of backup pad (3) is connected with fixed block (15), fixed block (15) and backup pad (3) are in the same place through welded connection, USB connecting block (16) is installed to one side of fixed block (15), USB connecting block (16) and backup pad (3) are in the same place through welded connection, the internally mounted of USB connecting block (16) has third USB interface (17).
2. The chip circuit conduction testing tool according to claim 1, wherein the lifting mechanism (12) comprises a lifting arm (1201), one end of the lifting arm (1201) is connected with the second connecting plate (11) through welding, the other end of the lifting arm (1201) is connected with a stretching block (1202), the other end of the stretching block (1202) is connected with a lifting column (1203), and a cylindrical protection block (1204) is installed on the outer side of the lifting column (1203).
3. The chip circuit conduction testing tool according to claim 2, wherein one end of the lifting arm (1201) is provided with a circular hole, two ends of the stretching block (1202) are provided with circular holes, the top end of the lifting column (1203) is provided with a circular hole, the circular holes formed in the lifting arm (1201), the stretching block (1202) and the lifting column (1203) are equal in size and diameter, the lifting arm (1201) and the stretching block (1202) are connected together by penetrating through the circular holes through screws, the lifting column (1203) and the stretching block (1202) are connected together by penetrating through the circular holes through screws, and the end of the lifting column (1203) can touch a groove of the fixing block (15) at the lowest height.
4. The chip circuit conduction testing tool according to claim 1, wherein the first telescopic mechanism (13) comprises a telescopic rod (1301), a telescopic rod protection frame (1302) is arranged on the outer side of the telescopic rod (1301), a rectangular fixing block (1303) is arranged on the outer side of the telescopic rod protection frame (1302), the rectangular fixing block (1303) and the telescopic rod protection frame (1302) are connected together through welding, the upper end of the telescopic rod (1301) is connected with the second connecting plate (11) through welding, the telescopic rod (1301) penetrates through the supporting plate (3), and the first telescopic mechanism (13) and the second telescopic mechanism (14) are identical in structure.
5. The chip circuit conduction testing tool according to claim 1, wherein four supporting rods (2) are arranged, the supporting rods (2) are connected to four corners of the supporting plate (3), circular holes are formed in four corners of the chip placing plate (4), four circular holes are formed in the surface of the supporting plate (3), the circular holes formed in the supporting plate (3) and the chip placing plate (4) are equal in size and diameter, and the supporting plate (3) and the chip placing plate (4) are connected together through the circular holes through bolts.
6. The chip circuit conduction testing tool according to claim 1, wherein six conduction pins (10) are arranged, the upper end of each conduction pin (10) is a cylinder, and the lower end of each conduction pin (10) is a cone.
CN202120292905.6U 2021-02-01 2021-02-01 Chip circuit conduction test tool Active CN214044244U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120292905.6U CN214044244U (en) 2021-02-01 2021-02-01 Chip circuit conduction test tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120292905.6U CN214044244U (en) 2021-02-01 2021-02-01 Chip circuit conduction test tool

Publications (1)

Publication Number Publication Date
CN214044244U true CN214044244U (en) 2021-08-24

Family

ID=77348475

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120292905.6U Active CN214044244U (en) 2021-02-01 2021-02-01 Chip circuit conduction test tool

Country Status (1)

Country Link
CN (1) CN214044244U (en)

Similar Documents

Publication Publication Date Title
CN213398815U (en) Automatic test equipment for integrated circuit board
CN206362897U (en) A kind of PCB monitor stations
CN218647017U (en) Automatic testing jig for timing
CN214044244U (en) Chip circuit conduction test tool
CN211123137U (en) ICT light sensation test fixture
CN207290722U (en) A kind of automatic feeder
CN211577341U (en) Circuit board detection device
CN219891363U (en) Circuit board test fixture
CN210835143U (en) Servo drive board card testing device
CN218601451U (en) Comprehensive testing device for transformer manufacturing
CN207675211U (en) A kind of rivet installation detecting device
CN115184357A (en) Appearance detection device is used in production of electron bee calling organ
CN115922284A (en) Automatic press-fitting machine for dry vacuum pump bearing
CN212340965U (en) Conductive paste adhesion force testing device
CN216560669U (en) Testing device and mobile phone testing equipment
CN107462263B (en) Test structure of level bubble assembly
CN221148739U (en) Circuit board detection jig
CN216526152U (en) Semi-automatic equipment for detecting circuit board
CN212749155U (en) Multi-group control board testing tool and pressing mechanism
CN211826181U (en) Semiconductor device test probe platform
CN216485386U (en) Novel structure for testing circuit board
CN213210213U (en) LCD module automatic test frame
CN213377928U (en) Quick detection device of terminal and wire rod
CN211061678U (en) Semi-automatic test auxiliary device of voltage or current sensor
CN221007792U (en) Circuit board flying probe test equipment

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant