CN214014834U

CN214014834U - High frequency power supply cooling plate assembly

Info

Publication number: CN214014834U
Application number: CN202022371266.0U
Authority: CN
Inventors: 陈学彬
Original assignee: Shenzhen Huaqiang Zhilian Technology Co ltd
Current assignee: Shenzhen Huaqiang Zhilian Technology Co ltd
Priority date: 2020-10-22
Filing date: 2020-10-22
Publication date: 2021-08-20
Anticipated expiration: 2030-10-22

Abstract

The utility model belongs to the technical field of heat dissipation, especially, high frequency power supply radiator block subassembly, the problem that radiator block subassembly radiating efficiency is low, radiator block subassembly dismantlement is inconvenient has been directed against, the following scheme is proposed at present, it includes the mounting bracket, can dismantle on the mounting bracket and be connected with the mainboard, the mainboard inside is the cavity form, the mainboard bottom is fixed with the heat insulating board, the slip runs through has the cooling tube on the heat insulating board, the cooling tube is the font and distributes, the cooling tube surface has cup jointed a plurality of rectangle fin, the cooling tube is located heat insulating board one end and is connected with the water gathering box, the water gathering box is fixed in the mainboard bottom, mainboard one side is fixed with circulating water pump, the intercommunication has the pipe between circulating water pump and the water gathering box, the cooling tube communicates with circulating water pump; the utility model discloses the top of well mainboard is fixed with two radiator fan that are the symmetric distribution, and radiator fan is located the cooling tube directly over, and radiator fan's setting has improved the rate of heat dissipation of heating panel, has improved the radiating effect of heating panel subassembly.

Description

High frequency power supply cooling plate assembly

Technical Field

The utility model relates to a heat dissipation technical field especially relates to a high frequency power supply cooling panel assembly.

Background

The high-frequency power supply is also called as an electronic tube frequency conversion device, the existing high-frequency power supply inevitably generates heat due to overlarge current, and in order to enable the high-frequency power supply to work better and prolong the service life of the high-frequency power supply, a designer adds a heat dissipation assembly for the high-frequency power supply.

However, the heat dissipation assemblies of the existing high-frequency power supplies have poor heat dissipation effects and slow heat dissipation speed, and the heat dissipation assemblies are inconvenient and rapid to mount and dismount.

Therefore, a high-frequency power supply cooling plate assembly is needed to solve the problems of low cooling efficiency and inconvenient disassembly of the cooling assembly.

SUMMERY OF THE UTILITY MODEL

The utility model provides a pair of high frequency power supply heating panel subassembly has solved the radiating component radiating efficiency low, and radiating component dismantles inconvenient problem.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a high-frequency power supply heat dissipation plate assembly comprises a mounting frame, a main plate is detachably connected to the mounting frame, the interior of the main board is hollow, the bottom end of the main board is fixed with a heat insulation board, a cooling pipe penetrates through the heat insulation board in a sliding manner, the cooling pipe is fixed at the bottom of the main board, two fixed blocks which are symmetrically distributed are sleeved on the outer surface of the cooling pipe, the fixed blocks are fixed on the side walls of the adjacent main boards, the cooling pipes are distributed in a concave shape, the outer surface of each cooling pipe is sleeved with a plurality of rectangular radiating fins, the distances among the plurality of rectangular radiating fins are the same, one end of the cooling pipe, which is positioned on the heat insulation plate, is connected with a water collecting tank which is fixed at the bottom of the mainboard, and a circulating water pump is fixed on one side of the main plate, a conduit is communicated between the circulating water pump and the water collecting tank, and the cooling pipe is communicated with the circulating water pump.

Preferably, the surface of mounting bracket is the character cut in bas-relief, mainboard bottom with the surface of mounting bracket contacts.

Preferably, the lateral walls of the two sides of the main board are provided with limit grooves, the lateral walls of the two sides of the mounting rack are provided with sliding grooves, limit rods penetrate through the sliding grooves in a sliding mode, the sliding grooves are matched with the limit rods in size, the bottom ends of the limit rods extend into the limit grooves, pull blocks are fixed to the top ends of the limit rods, limit blocks are fixedly sleeved on the pull block limit rods, compression springs are fixed between the limit blocks and the sliding grooves, and the compression springs are sleeved on the outer surfaces of the limit rods.

Preferably, the outer surface of the rectangular heat sink contacts the bottom end of the main board.

Preferably, two cooling fans which are symmetrically distributed are fixed at the top end of the main board, and the cooling fans are located right above the cooling pipe.

Preferably, a heat insulation layer is fixed on the main board and located below the heat dissipation fan, and a ventilation net is installed on the heat insulation layer and located right below the heat dissipation fan.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses in when needs are installed the mainboard, outwards pull out the gag lever post, advance the mainboard installation in the mounting bracket, when mainboard and mounting bracket surface contact, inwards push in the gag lever post until the spacing inslot, then the mainboard is in the stationary state this moment, and the setting of gag lever post subassembly makes the installation of heating panel dismantle convenient and fast more.

2. The utility model discloses two radiator fan that are the symmetric distribution are installed on the top of well mainboard, and radiator fan is located the cooling tube directly over, and radiator fan's setting has improved the rate of heat dissipation of heating panel, has improved the radiating effect of heating panel subassembly.

Drawings

Fig. 1 is a schematic diagram of a main board main section structure of a high-frequency power supply cooling plate assembly provided by the present invention;

fig. 2 is a top view of a main board of a high-frequency power supply cooling plate assembly provided by the present invention;

fig. 3 is a side sectional view of a high-frequency power supply cooling plate assembly provided by the present invention.

In the figure: 1. a mounting frame; 2. a main board; 3. a heat insulation plate; 4. a cooling tube; 5. a fixed block; 6. a heat sink; 7. a water collecting tank; 8. a water circulating pump; 9. a limiting groove; 10. a chute; 11. a limiting rod; 12. pulling the block; 13. a limiting block; 14. a compression spring; 15. a heat radiation fan; 16. a thermal insulation layer; 17. a ventilation net.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-3, a high frequency power supply heat dissipation plate assembly, including a mounting bracket 1, the mounting bracket 1 is connected with a casing of a high frequency power supply, a main plate 2 is detachably connected on the mounting bracket 1, the inside of the main plate 2 is hollow, a heat insulation plate 3 is fixed at the bottom end of the main plate 2, the heat insulation plate 3 plays a role of heat insulation, and prevents heat influence generated by a circulating water pump 8 during movement, a cooling pipe 4 is slidably penetrated on the heat insulation plate 3, the cooling pipe 4 is fixed at the bottom of the main plate 2, two fixing blocks 5 which are symmetrically distributed are sleeved on the outer surface of the cooling pipe 4, the fixing blocks 5 are fixed on the side wall of the adjacent main plate 2, the cooling pipe 4 is distributed in a concave shape, so as to increase the area of the cooling pipe 4 and enhance the heat dissipation effect of the cooling pipe 4, a plurality of rectangular heat dissipation fins 6 are sleeved on the outer surface of the cooling pipe 4, the intervals of the plurality of rectangular heat dissipation fins 6 are the same, and the rectangular heat dissipation area can be enlarged by the rectangular heat dissipation fins 6, cooling tube 4 is located 3 one ends of heat insulating board and is connected with and gathers water tank 7, gathers water tank 7 and fixes in mainboard 2 bottom, and 2 one side of mainboard are fixed with circulating water pump 8, and circulating water pump 8 and gather and to communicate between the water tank 7 has the pipe, and cooling tube 4 is linked together with circulating water pump 8, and is concrete, because gather water tank 7, circulating water pump 8, cooling tube 4 and communicate each other, can carry out the recycle to the coolant liquid in cooling tube 4.

The surface of mounting bracket 1 is character cut in bas-relief, and 2 bottoms of mainboard contact with the surface of mounting bracket 1, and is concrete, has consolidated mounting bracket 1 and mainboard 2's stability.

The side walls of the two sides of the main board 2 are respectively provided with a limiting groove 9, the side walls of the two sides of the mounting rack 1 are respectively provided with a sliding groove 10, a limiting rod 11 penetrates through the sliding grooves 10 in a sliding manner, the sliding grooves 10 are matched with the limiting rods 11 in size, the bottom end of each limiting rod 11 extends into the corresponding limiting groove 9, the top end of each limiting rod 11 is fixedly provided with a pull block 12, each limiting rod 11 of the pull block 12 is fixedly sleeved with a limiting block 13, a compression spring 14 is fixedly arranged between each limiting block 13 and the corresponding sliding groove 10, the compression spring 14 is sleeved on the outer surface of each limiting rod 11, specifically, when the main board 2 needs to be arranged on the mounting rack 1, the limiting rods 11 are pulled outwards, the main board 2 is arranged in grooves of the mounting rack 1, when the main board 2 is attached to the mounting rack 1, the limiting rods 11 are pushed in, the limiting rods 11 are inserted into the corresponding limiting grooves 9, the main board 2 and the mounting rack 1 are in a fixed state, and limiting mechanisms on the main board 1 and the main board 2 are arranged, the heat dissipation plate assembly is more convenient and faster to disassemble.

The outer surface of the rectangular heat sink 6 is in contact with the bottom end of the main board 2, and particularly, the stability of the heat sink 6 is increased.

Two radiator fan 15 that are the symmetric distribution are installed on the top of mainboard 2, and radiator fan 15 is located cooling tube 4 directly over, and is concrete, and radiator fan 15's setting has improved the rate of heat dissipation of heating panel, has improved the radiating effect of heating panel subassembly.

Be fixed with insulating layer 16 on mainboard 2, insulating layer 16 is located radiator fan 15 below, installs ventilation net 17 on the insulating layer 16, and ventilation net 17 is located radiator fan 15 under, and is concrete, and setting up of ventilation net 17 makes radiator fan 15 work that can be better, has improved radiator fan 15's work efficiency.

The working principle is as follows: when the mainboard 2 needs to be installed, the limiting rod 11 is pulled out outwards, the mainboard 2 is installed in the installation frame 1, when the mainboard 2 is in contact with the outer surface of the installation frame 1, the limiting rod 11 is pushed inwards until the limiting groove 9 is formed, the mainboard 2 is in a fixed state at the moment, when the mainboard 2 needs to be disassembled, the limiting rod 11 is pulled out until the limiting rod 11 is pulled out of the limiting groove 9, the mainboard 2 is in a movable state at the moment, the arrangement of the limiting rod component enables the disassembly of the heat dissipation plate to be more convenient and rapid, when the heat dissipation plate component works, the circulating water pump 8 and the heat dissipation fan 15 in the mainboard 2 are both communicated with a power supply, one side of the mainboard 2 is provided with a power-on button, the circulating water pump 8 is controlled to run through the power-on button, the cooling liquid moves in the cooling pipe 4, when the cooling liquid enters the water collecting tank 7, the cooling liquid is pumped into the cooling pipe 4 by the circulating water pump 8 again to form circulation, the cooling fan 15 on the top of the mainboard 2 moves simultaneously to blow and dissipate heat of the cooling pipe 4 in the mainboard 2, so that the heat dissipation effect of the heat dissipation plate is improved, and the heat dissipation efficiency of the heat dissipation plate assembly is improved.

The circulating water pump 8 is commercially available, and the circulating water pump 8 is provided with a power supply, which belongs to the mature technology in the field and is fully disclosed, so repeated description in the specification is omitted.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The high-frequency power supply cooling plate assembly comprises a mounting frame (1) and is characterized in that a main plate (2) is detachably connected onto the mounting frame (1), the interior of the main plate (2) is hollow, a heat insulation plate (3) is fixed at the bottom end of the main plate (2), a cooling pipe (4) penetrates through the heat insulation plate (3) in a sliding manner, the cooling pipe (4) is fixed at the bottom of the main plate (2), two symmetrically-distributed fixing blocks (5) are sleeved on the outer surface of the cooling pipe (4), the fixing blocks (5) are fixed on the side wall of the adjacent main plate (2), the cooling pipe (4) is distributed in a concave shape, a plurality of rectangular cooling fins (6) are sleeved on the outer surface of the cooling pipe (4), the intervals of the rectangular cooling fins (6) are the same, one end, located on the heat insulation plate (3), of the cooling pipe (4) is connected with a water collecting tank (7), the water collecting tank (7) is fixed to the bottom of the main board (2), a circulating water pump (8) is fixed to one side of the main board (2), a guide pipe is communicated between the circulating water pump (8) and the water collecting tank (7), and the cooling pipe (4) is communicated with the circulating water pump (8).

2. The high-frequency power supply cooling plate assembly according to claim 1, wherein the surface of the mounting frame (1) is concave, and the bottom end of the main plate (2) is in contact with the outer surface of the mounting frame (1).

3. The high-frequency power supply cooling plate assembly according to claim 1, wherein limiting grooves (9) are formed in two side walls of the main plate (2), sliding grooves (10) are formed in two side walls of the mounting frame (1), limiting rods (11) penetrate through the sliding grooves (10) in a sliding manner, the sliding grooves (10) are matched with the limiting rods (11) in size, the bottom ends of the limiting rods (11) extend into the limiting grooves (9), pull blocks (12) are fixed at the top ends of the limiting rods (11), limiting blocks (13) are fixedly sleeved on the limiting rods (11) of the pull blocks (12), compression springs (14) are fixed between the limiting blocks (13) and the sliding grooves (10), and the compression springs (14) are sleeved on the outer surfaces of the limiting rods (11).

4. A high frequency power supply heatsink plate assembly according to claim 1, wherein the outer surface of said rectangular heatsink plate (6) is in contact with the bottom end of said main plate (2).

5. The high-frequency power supply cooling plate assembly according to claim 1, wherein two symmetrically distributed cooling fans (15) are fixed to the top end of the main plate (2), and the cooling fans (15) are located right above the cooling pipes (4).

6. The high-frequency power supply cooling plate assembly according to claim 5, wherein a heat insulation layer (16) is fixed on the main plate (2), the heat insulation layer (16) is located below the cooling fan (15), a ventilation net (17) is installed on the heat insulation layer (16), and the ventilation net (17) is located right below the cooling fan (15).