CN214011416U - Insulation and voltage resistance test tool for chip device - Google Patents

Abstract

The utility model provides an insulation and voltage resistance test tool of a surface mounted device, which comprises an insulation frame, and a conductive gasket and a spring positioning needle which are arranged on the insulation frame; the conducting gasket and the spring positioning pin are respectively connected with a lead, the conducting gasket is arranged on the axis of the spring positioning pin, and the spring positioning pin is used for pressing the surface mounted device to be tested on the conducting gasket. Compared with the prior art, the dielectric strength and voltage resistance test tool for the surface mounted device improves the performability of the dielectric strength and voltage resistance test of the surface mounted device, and is favorable for improving the test capability and efficiency; a lead wire in a welding mode is not needed, waste in the aspects of material loss and the like is reduced, and the environment-friendly and reusable effects are achieved; the safety performance is improved, and the safety guarantee of the high-voltage test project of insulation and voltage resistance is enhanced; the test stability is improved, and misjudgment caused by ignition due to other reasons such as connection falling is avoided; the test satisfaction degree is higher for the sheet devices with various specifications and smaller model numbers.

Description

Insulation and voltage resistance test tool for chip device

Technical Field

The utility model relates to an electron device test technical field especially relates to a withstand voltage test fixture of paster device.

Background

The insulation voltage resistance of paster device is very crucial performance parameter to material performance, many domestic air conditioner electrical apparatus mainboard became invalid because on the mainboard chip resistor, paster electric capacity, the bearing capacity rank was not enough, because paster device is individual little, the terminal connection is inconvenient, at the insulating voltage resistance Control's of IQC (Incoming Quality Control) in-process, do not have the professional anchor clamps to the paster device, direct test causes the test procedure to strike sparks and harm the device body easily, produce the possibility that causes the erroneous judgement.

Lead wire processing is generally adopted in early stage testing, so that end damage is avoided to a certain extent, and stable testing can be kept. But the sizes of the terminals of the chip devices with different die numbers are inconsistent, the lead difficulty of the chip devices with small die numbers is high, and meanwhile, the manual welding in the lead process is easy to cause desoldering and sparking. And the lead wire mode is time-consuming and labor-consuming, the test efficiency is not high, the large-area batch insulation voltage resistance performance test cannot be realized, and the control capability of the detection project is low.

SUMMERY OF THE UTILITY MODEL

Not enough to above-mentioned prior art, the utility model aims to provide an insulation and voltage resistance test fixture of paster device, it can provide a simple structure, connect stable, repeatedly usable test fixture to paster device insulation and voltage resistance capability test.

The utility model discloses an utilize spring location needle and conducting pad piece to form both ends electrode, can stably place the paster device of various model numbers in the middle of the electrode, exert physical pressure to the paster device through the spring location needle, make the paster device withstand by the spring location needle and do not drop on the conducting pad, then connect withstand voltage test equipment from two electrode slice lead wires, can realize having certain safe repeatable paster device withstand voltage capability test.

The utility model provides an insulation withstand voltage test tool of a patch device, which comprises an insulation frame, and a conductive gasket and a spring positioning pin which are arranged on the insulation frame; the conducting gasket and the spring positioning pin are respectively connected with a lead, the conducting gasket is arranged on the axis of the spring positioning pin, and the spring positioning pin is used for pressing the surface mounted device to be tested on the conducting gasket.

Preferably, the insulating frame is a U-shaped structure, and includes two insulating plates parallel to each other and a connecting portion connecting the two insulating plates, the conductive gasket is disposed on one of the insulating plates, and the spring positioning pin is disposed on the other insulating plate.

Preferably, the insulating frame is formed by vertically connecting two insulating plates, the conductive gasket is arranged on one of the insulating plates, and the spring positioning pin is arranged on the other insulating plate.

Preferably, the spring location needle is including activity interior needle, spring and needle cover, the activity interior needle the spring with the needle cover is established from inside to outside in proper order, the both ends of spring are connected respectively the activity interior needle with the needle cover, the needle cover is fixed on insulating frame, the activity interior needle can be followed the axis of needle cover removes.

Preferably, a lead wire connected with the spring positioning pin is fixed on the needle sleeve.

Preferably, a lead connected with the spring positioning pin is fixed on the movable inner pin, and the distance between the movable inner pin and the conductive gasket can be adjusted by pulling the lead.

Preferably, the insulating frame is made of bakelite.

Preferably, the conductive pad is a heat sink.

Preferably, the conductive gasket is a metal sheet.

Compared with the prior art, the utility model provides a withstand voltage test fixture of paster device has following advantage:

1. the performability of the insulation and voltage resistance test of the surface mounted device is improved, and the test capability and efficiency are improved;

2. a lead wire in a welding mode is not needed, waste in the aspects of material loss and the like is reduced, and the environment-friendly and reusable effects are achieved;

3. the safety performance is improved, and the safety guarantee of the high-voltage test project of insulation and voltage resistance is enhanced;

4. the test stability is improved, and misjudgment caused by ignition due to other reasons such as connection falling is avoided;

5. the test satisfaction degree is higher for the sheet devices with various specifications and smaller model numbers.

The above-mentioned technical characteristics can be combined in various suitable ways or replaced by equivalent technical characteristics as long as the purpose of the invention can be achieved.

Drawings

The invention will be described in more detail hereinafter on the basis of non-limiting examples only and with reference to the accompanying drawings. Wherein:

fig. 1 is a schematic perspective view of an insulation and voltage withstand test fixture of a patch device according to an embodiment of the present invention;

fig. 2 is a side view of the dielectric strength test fixture of the chip device in fig. 1;

fig. 3 is a schematic perspective view of an insulation and voltage withstand test fixture of a patch device according to another embodiment of the present invention;

fig. 4 is a side view of the dielectric strength test tooling of the chip device in fig. 3;

fig. 5 is a schematic structural view of an insulation and voltage withstand test tool of a chip device mounted with the chip device;

fig. 6 is an operation flowchart of the dielectric breakdown voltage test of the chip device using the test tool.

Description of reference numerals:

1. an insulating frame; 2. a conductive gasket; 3. a spring locator pin; 4. a lead wire; 5. a chip mounting device; 11. 12, 14, 15, insulating plates; 13. a connecting portion; 31. a movable inner needle; 32. a spring; 33. a needle sleeve.

Detailed Description

For making the purpose, technical solution and advantages of the present invention clearer, it will be right below that the technical solution of the present invention is clearly and completely described, based on the specific embodiments of the present invention, all other embodiments obtained by the ordinary skilled person in the art without creative work belong to the scope protected by the present invention.

As shown in fig. 1 and 2, the dielectric withstand voltage test tool of the chip device 5 includes an insulating frame 1, a conductive gasket 2 and a spring positioning pin 3, the spring positioning pin 3 and the conductive gasket 2 form two end electrodes, and are respectively connected with a lead 4, and the two leads 4 are two leading-out ends of the test tool; the conductive gasket 2 is located on the axis of the spring positioning pin 3, and the spring positioning pin 3 is used for pressing the patch device 5 to be tested on the conductive gasket 2. The insulating frame 1 is of a U-shaped structure and comprises two insulating plates 11 and 12 which are parallel to each other, and the two insulating plates 11 and 12 are connected into a whole through a connecting part 13. The insulating frame is made of insulating materials, in the embodiment, the insulating frame is preferably made of bakelite, and the bakelite has high mechanical strength, good insulating property, heat resistance and corrosion resistance, and is favorable for improving the structural strength and the durability of the test tool. The conductive gasket 2 is disposed on one of the insulating plates 11, specifically, the bottom surface of the conductive gasket 2 is adhered to the surface of the insulating plate 11 by glue, and the lead 4 is connected to the conductive gasket 2, and the lead 4 can be fixed by gluing. The conductive pad 2 may be a small heat sink or a metal sheet (e.g., iron sheet); in this embodiment, a small heat sink is selected as the conductive pad 2, and the small heat sink serves as an electrode and is beneficial to heat dissipation of the chip device. The spring positioning needle 3 is arranged on the other insulating plate 12, the spring positioning needle 3 is a telescopic thimble with a spring, the spring positioning needle 3 selected in the embodiment comprises a movable inner needle 31, a spring 32 and a needle sleeve 33, the movable inner needle 31 is arranged in the needle sleeve 33, two ends of the movable inner needle 31 respectively extend out of two ends of the needle sleeve 33, the spring 32 is sleeved outside the movable inner needle 31 and is positioned in a gap between the movable inner needle 31 and the needle sleeve 33, two ends of the spring 32 are respectively connected with the outer wall of the movable inner needle 31 and the inner wall of the needle sleeve 33, when an external force is applied to push and pull the movable inner needle 31 along the axis of the needle sheath 33, the spring 32 is compressed or stretched, and when the external force is removed, under the action of the spring 32, the movable inner needle 31 is reset, and the distance between the movable inner needle 31 and the conductive gasket 2 can be flexibly adjusted by pulling the movable inner needle 31, so that the patch devices 5 with various models can be conveniently fixed. The spring positioning pin 3 vertically penetrates through the other insulating plate 12, and the needle sleeve 33 is fixed on the insulating plate 12, and the movable inner needle 31 is vertical to the conductive gasket 2. The lead wire 4 is connected with the spring positioning needle 3 in two ways, namely, the lead wire 4 is fixed on the needle sleeve 33, and the lead wire 4 is fixed on the movable inner needle 31. In this embodiment, the lead 4 is fixed on the movable inner needle 31, specifically, one end of the movable inner needle 31 close to the conductive gasket 2 is the front end of the movable inner needle 31, the other end of the movable inner needle 31 is the rear end of the movable inner needle 31, the lead 4 is connected and fixed at the rear end of the movable inner needle 31, and the lead 4 is pulled to move the movable inner needle 31 along the axis of the needle sleeve 33 so as to adjust the distance between the movable inner needle 31 and the conductive gasket 2 for material changing operation, so that the contact of the spring positioning needle 3 serving as a terminal in the test process is avoided, and the safety is improved.

In addition to the embodiments shown in fig. 1 and 2, the insulating frame 1 is replaced by a U-shaped structure (as shown in fig. 3 to 5) with an insulating frame 1 structure formed by vertically connecting two insulating plates 14 and 15, one insulating plate 14 of the insulating frame 1 is horizontally arranged, and the conductive gasket 2 is vertically arranged on the horizontally arranged insulating plate 14; the other insulating plate 15 is vertically arranged, the insulating plate 15 is parallel to the conductive gasket 2, the spring positioning needle 3 vertically penetrates through the vertically arranged insulating plate 15, the needle sleeve 33 is fixed on the insulating plate 15, and the movable inner needle 31 is perpendicular to the conductive gasket 2 at the moment. The paster device 5 that awaits measuring is placed between activity inner needle 31 and conductive gasket 2, and the paster device 5 crimping that the spring location needle 3 will await measuring is on conductive gasket 2.

Use the utility model provides a test fixture carries out the withstand voltage test of paster device 5, connect the anchor clamps of withstand voltage test instrument equipment at test fixture's two in the testing process and draw forth the end, then the operating procedure is shown in figure 6, take out spring location needle 3, get the paster device 5 that awaits measuring with tweezers clamp simultaneously, place paster device 5 between conductive gasket 2 and spring location needle 3, the end of drawing forth that makes 5 one end of paster device is pushing against conductive gasket 2, the end of drawing forth of the 5 other ends of paster device is exerted pressure by spring location needle 3, thereby fix paster device 5, because the connection of electrical apparatus has been guaranteed to conductive gasket 2 and spring location needle 3's lead wire 4, normal test can. After the test is finished, the output of the equipment is disconnected, the spring 32 needle is extracted, and the test can be carried out again after the piece is replaced.

Method of the direct anchor clamps test of traditional crocodile anchor clamps relatively uses the utility model discloses a test fixture carries out the withstand voltage test of paster device 5, has avoided the erroneous judgement that the damage of material body probably arouses to and the strike sparks of testing process. For the lead testing method, the lead 4 is connected to the testing tool in advance, so that the operation of connecting the lead to the surface mounted device to be tested in a welding mode is omitted in a certain sense, a complex lead process is not needed, and the testing tool is more feasible in large-batch testing operation; and the test fixture can be repeatedly used, and the waste in the aspects of material loss and the like is reduced.

Finally, it should be noted that: the above embodiments and examples are only used to illustrate the technical solution of the present invention, but not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments and examples, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments or examples may still be modified, or some of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the embodiments or examples of the present invention.

Claims (9)

1. The insulation and voltage withstand test tool for the chip device is characterized by comprising an insulation frame, and a conductive gasket and a spring positioning pin which are arranged on the insulation frame; the conducting gasket and the spring positioning pin are respectively connected with a lead, the conducting gasket is arranged on the axis of the spring positioning pin, and the spring positioning pin is used for pressing the surface mounted device to be tested on the conducting gasket.

2. The dielectric strength tester of patch device as claimed in claim 1, wherein the insulating frame is a U-shaped structure, and comprises two insulating plates parallel to each other and a connecting portion for connecting the two insulating plates, the conductive gasket is disposed on one of the insulating plates, and the spring positioning pin is disposed on the other insulating plate.

3. The dielectric strength tester of the patch device as claimed in claim 1, wherein the insulating frame is formed by vertically connecting two insulating plates, the conductive pad is disposed on one of the insulating plates, and the spring positioning pin is disposed on the other insulating plate.

4. The dielectric strength test fixture of paster device according to claim 1, characterized in that, the spring positioning needle includes movable inner needle, spring and needle cover, the movable inner needle, the spring and the needle cover are established from inside to outside in proper order, the both ends of spring are connected respectively the movable inner needle with the needle cover, the needle cover is fixed on the insulating frame, the movable inner needle can be followed the axis of needle cover removes.

5. The dielectric strength test fixture of a patch device according to claim 4, wherein a lead connected to the spring positioning pin is fixed to the needle hub.

6. The device according to claim 4, wherein a lead connected to the spring positioning pin is fixed to the movable inner pin, and a distance between the movable inner pin and the conductive pad is adjustable by pulling the lead.

7. The dielectric withstand voltage test tool of the patch device according to any one of claims 1 to 6, wherein the dielectric frame is made of bakelite.

8. The dielectric strength test fixture of a chip device according to any one of claims 1 to 6, wherein the conductive pad is a heat sink.

9. The dielectric strength test fixture of a chip device according to any one of claims 1 to 6, wherein the conductive pad is a metal sheet.

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