CN213991452U

CN213991452U - Efficient cooling mechanism for PCB processing

Info

Publication number: CN213991452U
Application number: CN202022551340.7U
Authority: CN
Inventors: 廖志鹏; 秦运杰
Original assignee: Longnan Junya Electronic Technology Co ltd
Current assignee: Longnan Junya Electronic Technology Co ltd
Priority date: 2020-11-06
Filing date: 2020-11-06
Publication date: 2021-08-17
Anticipated expiration: 2030-11-06

Abstract

The utility model discloses a PCB board processing is with high-efficient cooling mechanism relates to PCB board technical field. Including heat dissipation mechanism and deposit the mechanism, heat dissipation mechanism is located the inside of depositing the mechanism, deposit mechanism and heat dissipation mechanism sliding connection, heat dissipation mechanism is including accomodating the shell, the louvre has all been seted up to the both sides of accomodating the shell, the inside fixed mounting of louvre has the mounting panel, the inboard fixed mounting of mounting panel has the fan. Through setting up heat dissipation mechanism, the fan that utilizes storage shell both sides can blow produced cold gas that is located on the refrigeration board in the refrigerator to the PCB board to constitute direct current heat dissipation air conditioning wind channel, thereby accelerate the inside air flow of storage shell, thereby take away rapidly the produced a large amount of heats of PCB when being located storage shell inside, can effectively promote the cooling rate to PCB board surface, possess the effectual advantage of cooling, with the too high problem of solution circuit board temperature.

Description

Efficient cooling mechanism for PCB processing

Technical Field

The utility model relates to a PCB board technical field specifically is a PCB board processing is with high-efficient cooling mechanism.

Background

The PCB is an important electronic component, is a support body of the electronic component and is a carrier for electrical connection of the electronic component, wherein the PCB is named as a printed circuit board in Chinese; it is called a "printed" circuit board because it is made using electronic printing; in addition to holding the various small components, the primary function of the PCB is to provide electrical interconnection of the various components on the top of the PCB, which, as electronic devices become more complex, requires more and more components, and the circuitry and components on the top of the PCB become more and more dense.

In the prior art, a series of processing needs to be carried out on electronic components in the process of processing a circuit board, but soldering processing can generate a large amount of heat, if the heat is not effectively removed, certain damage can be caused to the electronic components on the circuit board, and the processing of the circuit board is difficult due to high temperature.

SUMMERY OF THE UTILITY MODEL

The utility model provides a PCB board processing is with high-efficient cooling mechanism possesses the effectual advantage of cooling to solve the too high problem of circuit board temperature.

For realizing the effectual purpose of cooling, the utility model provides a following technical scheme: a high-efficiency cooling mechanism for processing a PCB comprises a heat dissipation mechanism and a storage mechanism, wherein the heat dissipation mechanism is positioned inside the storage mechanism, the storage mechanism is connected with the heat dissipation mechanism in a sliding manner, the heat dissipation mechanism comprises a storage shell, heat dissipation holes are formed in two sides of the storage shell, a mounting plate is fixedly mounted inside the heat dissipation holes, a fan is fixedly mounted on the inner side of the mounting plate, a refrigerator is fixedly mounted at the top of the inner wall of the storage shell, and a condensation pipe is fixedly mounted at the output end of the refrigerator;

deposit the mechanism and include safety cover and slide, the bottom of safety cover and the top fixed connection of slide, the bottom of slide and the inboard sliding connection of containing shell, the inboard fixed mounting of safety cover has three board of placing, the top fixed mounting who places the board has electric putter, electric putter's bottom fixed mounting has the overlap joint board.

As a preferred technical scheme of the utility model, the outside opening part of louvre is provided with the dust screen, the dust screen is located the outer wall of storage shell, the outer wall sliding connection of storage shell has the dust screen.

As an optimal technical scheme of the utility model, the refrigeration board has been cup jointed to the outside of condenser pipe is fixed, the refrigeration board is for returning the shaped plate.

As a preferred technical scheme of the utility model, the bottom fixedly connected with pulley of slide, the spout has been seted up to the inboard of accomodating the shell, the bottom of pulley extend to the inside of spout and with the inner wall sliding connection of spout.

As a preferred technical scheme of the utility model, the groove of accomodating has been seted up to the bottom of slide, the inner wall of accomodating the groove articulates there are accomodate wheel and flexible loop bar, sliding connection between accomodate wheel and the flexible loop bar.

Compared with the prior art, the utility model provides a PCB board processing is with high-efficient cooling mechanism possesses following beneficial effect:

1. this PCB board processing is with high-efficient cooling mechanism, through setting up heat dissipation mechanism, utilize the fan of storage case both sides can blow produced cold gas that is located on the refrigeration board in the refrigerator to the PCB board, and constitute direct current heat dissipation air conditioning wind channel, thereby accelerate the inside air flow of storage case, thereby take away a large amount of heats that PCB produced when being located storage case inside rapidly, can effectively promote the cooling rate to PCB board surface, possess the effectual advantage of cooling, in order to solve the too high problem of circuit board temperature.

2. This high-efficient cooling mechanism is used in PCB board processing deposits the mechanism through setting up, through placing the PCB board between electric putter and overlap joint board for but PCB unsettled placing is on placing the board, makes every PCB all independently deposit, and the PCB board adopts transversely to place simultaneously, can not obstruct the flow of air, thereby has improved the radiating effect, has further improved the radiating effect.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a side sectional view of the protective cover structure of the present invention;

FIG. 3 is a side sectional view of the storage case structure of the present invention;

FIG. 4 is a front sectional view of the storage case structure of the present invention;

fig. 5 is a side sectional view of the structure of the refrigerating plate of the present invention.

In the figure: 1. a heat dissipation mechanism; 2. a storage mechanism; 3. a housing case; 4. a protective cover; 5. placing the plate; 6. an electric push rod; 7. a lap plate; 8. a slide plate; 9. a pulley; 10. a chute; 11. a receiving groove; 12. a storage wheel; 13. a telescopic loop bar; 14. heat dissipation holes; 15. mounting a plate; 16. a fan; 17. a dust screen; 18. a refrigerator; 19. a refrigeration plate; 20. a condenser tube.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the utility model discloses a high-efficiency cooling mechanism for processing a PCB, comprising a heat dissipation mechanism 1 and a storage mechanism 2, wherein the heat dissipation mechanism 1 is located inside the storage mechanism 2, the storage mechanism 2 is connected with the heat dissipation mechanism 1 in a sliding manner, the heat dissipation mechanism 1 comprises a storage shell 3, heat dissipation holes 14 are respectively arranged at two sides of the storage shell 3, a mounting plate 15 is fixedly arranged inside the heat dissipation holes 14, a fan 16 is fixedly arranged at the inner side of the mounting plate 15, a refrigerator 18 is fixedly arranged at the top of the inner wall of the storage shell 3, and a condensation pipe 20 is fixedly arranged at the output end of the refrigerator 18;

deposit mechanism 2 and include safety cover 4 and slide 8, the bottom of safety cover 4 and the top fixed connection of slide 8, the bottom of slide 8 and the inboard sliding connection of containing shell 3, the inboard fixed mounting of safety cover 4 has three board 5 of placing, the top fixed mounting who places board 5 has electric putter 6, the bottom fixed mounting of electric putter 6 has lap joint board 7.

Specifically, the outer opening of the heat dissipation hole 14 is provided with a dust screen 17, the dust screen 17 is located on the outer wall of the storage case 3, and the outer wall of the storage case 3 is connected with the dust screen 17 in a sliding manner.

In this embodiment, the detachable dust screen 17 is used to prevent dust on the outer side of the heat dissipation holes 14.

Specifically, the outer side of the condensation pipe 20 is fixedly sleeved with a refrigeration plate 19, and the refrigeration plate 19 is a return plate.

In this embodiment, a refrigeration plate 19 having a protection function is provided to the outside of the condensation pipe 20, thereby improving the protection function of the condensation pipe 20.

Specifically, the bottom fixedly connected with pulley 9 of slide 8, spout 10 has been seted up to the inboard of containing shell 3, the bottom of pulley 9 extend to the inside of spout 10 and with the inner wall sliding connection of spout 10.

In this embodiment, the sliding plate 8 is slid along the sliding groove 10 by the pulley 9, so that the moving stability of the sliding plate 8 is improved.

Specifically, the bottom of slide 8 has been seted up and has been accomodate groove 11, the inner wall of accomodating groove 11 articulates there are accomodate wheel 12 and flexible loop bar 13, sliding connection between accomodate wheel 12 and the flexible loop bar 13.

In this embodiment, when the below of taking in wheel 12 does not obstruct, the automatic resilience of spring can drive taking in wheel 12 and deflect on the flexible loop bar 13 to finally make taking in wheel 12 and ground contact, thereby improved the stability of placing of slide 8.

The utility model discloses a theory of operation and use flow: when using, pull out safety cover 4 earlier, when the below of taking in wheel 12 does not obstruct, the automatic resilience of spring can drive taking in wheel 12 and deflect on flexible loop bar 13, and finally make taking in wheel 12 and ground contact, thereby the stability of placing of slide 8 has been improved, then insert between electric putter 6 and lapping plate 7 with the PCB board, make the PCB board by unsettled placing on placing board 5, then push into the inside of taking in shell 3 with safety cover 4, start fan 16 and refrigerator 18, make refrigerator 18 carry out refrigeration work to condenser pipe 20, make and produce air conditioning on the refrigeration board 19, then fan 16 blows to the PCB board with the cold gas on the refrigeration board 19, thereby dispel the heat to the PCB board.

In summary, the efficient cooling mechanism for processing the PCB board is provided with the heat dissipation mechanism 1, and the fans 16 at the two sides of the storage shell 3 can blow cold air generated in the refrigerator 18 and located on the refrigeration plate 19 to the PCB board, and form a direct-current heat dissipation cold air duct, so that air flow inside the storage shell 3 is accelerated, a large amount of heat generated when the PCB is located inside the storage shell 3 is taken away quickly, the cooling rate of the surface of the PCB board can be increased effectively, and the efficient cooling mechanism has the advantage of good cooling effect, and solves the problem of overhigh temperature of the circuit board; deposit mechanism 2 through setting up, through placing the PCB board between electric putter 6 and overlap joint board 7 for but PCB unsettled place on placing board 5, make every PCB all obtain independently depositing, the PCB board adopts transversely to place simultaneously, can not obstruct the flow of air, thereby improved the radiating effect, further improved the radiating effect.

It should be noted that, in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a PCB board processing is with high-efficient cooling mechanism, includes heat dissipation mechanism (1) and deposits mechanism (2), its characterized in that: the heat dissipation mechanism (1) is located inside the storage mechanism (2), the storage mechanism (2) is connected with the heat dissipation mechanism (1) in a sliding mode, the heat dissipation mechanism (1) comprises a storage shell (3), heat dissipation holes (14) are formed in two sides of the storage shell (3), a mounting plate (15) is fixedly mounted inside the heat dissipation holes (14), a fan (16) is fixedly mounted on the inner side of the mounting plate (15), a refrigerator (18) is fixedly mounted at the top of the inner wall of the storage shell (3), and a condensation pipe (20) is fixedly mounted at the output end of the refrigerator (18);

deposit mechanism (2) including safety cover (4) and slide (8), the bottom of safety cover (4) and the top fixed connection of slide (8), the bottom of slide (8) and the inboard sliding connection of storage case (3), the inboard fixed mounting of safety cover (4) has three board (5) of placing, the top fixed mounting who places board (5) has electric putter (6), the bottom fixed mounting of electric putter (6) has lap joint board (7).

2. The efficient cooling mechanism for processing the PCB as recited in claim 1, wherein: the outside opening part of louvre (14) is provided with dust screen (17), dust screen (17) are located the outer wall of accomodating shell (3), the outer wall sliding connection of accomodating shell (3) has dust screen (17).

3. The efficient cooling mechanism for processing the PCB as recited in claim 1, wherein: the outer side of the condensation pipe (20) is fixedly sleeved with a refrigeration plate (19), and the refrigeration plate (19) is a clip-shaped plate.

4. The efficient cooling mechanism for processing the PCB as recited in claim 1, wherein: the bottom fixedly connected with pulley (9) of slide (8), spout (10) have been seted up to the inboard of storage case (3), the bottom of pulley (9) extend to the inside of spout (10) and with the inner wall sliding connection of spout (10).

5. The efficient cooling mechanism for processing the PCB as recited in claim 1, wherein: the bottom of slide (8) has been seted up and has been accomodate groove (11), the inner wall of accomodating groove (11) articulates there are accomodate wheel (12) and flexible loop bar (13), sliding connection between accomodate wheel (12) and flexible loop bar (13).