CN213987405U - Heat dissipation frame - Google Patents
Heat dissipation frame Download PDFInfo
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- CN213987405U CN213987405U CN202022964724.1U CN202022964724U CN213987405U CN 213987405 U CN213987405 U CN 213987405U CN 202022964724 U CN202022964724 U CN 202022964724U CN 213987405 U CN213987405 U CN 213987405U
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- heat dissipation
- dissipation frame
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Abstract
The utility model discloses a heat dissipation frame for support electronic equipment, include: the electronic equipment comprises a heat dissipation frame body, wherein a heat dissipation fan is arranged in the heat dissipation frame body and is used for being electrically connected with the electronic equipment; an LED lamp group; the LED lamp group includes: the main control module is used for being electrically connected with the electronic equipment; LED banks, LED banks and host system electric connection, LED banks set up in heat dissipation frame body top and with heat dissipation frame body folding joint for when LED banks expandes, form the region that can hold electronic equipment between heat dissipation frame body and the LED banks and LED banks is located behind one's back of display screen. The embodiment of the utility model provides a through set up the LED banks on the heat dissipation frame for when the LED banks expandes, form the region that can hold electronic equipment between heat dissipation frame body and the LED banks is located behind the display screen, when can making the heat dissipation frame play normal radiating effect, still possess special light effect, improve user experience.
Description
Technical Field
The utility model belongs to the technical field of electronic equipment accessory technique and specifically relates to a heat dissipation frame is related to.
Background
With the development of technology, electronic devices are becoming more and more popular. For example, the notebook computer as an electronic device inevitably generates heat, and the heat dissipation frame solves the heat dissipation problem of the notebook computer, and can enable the heat generated by the notebook computer to be diffused to the outside of the computer more quickly so as to ensure the normal operation of the notebook computer.
At present, the notebook computer cooling rack has a single function, and the use experience of a user is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a heat dissipation frame when can make the heat dissipation frame play normal radiating effect, still possesses light effect, improves the user and uses experience.
A heat dissipation stand for supporting an electronic device, the electronic device including a display screen, the heat dissipation stand comprising:
the main control module is used for being electrically connected with the electronic equipment;
the heat dissipation frame comprises a heat dissipation frame body, wherein a heat dissipation fan is arranged inside the heat dissipation frame body and is electrically connected with the main control module;
the LED lamp bank, the LED lamp bank with master control module electric connection, the LED lamp bank set up in heat dissipation frame body top and with heat dissipation frame body folding joint makes when the LED lamp bank expandes, form the region that can hold electronic equipment between heat dissipation frame body and the LED lamp bank is located behind the display screen.
Preferably, the LED lamp set is an LED lamp bar, and the LED lamp bar is a door-shaped lamp bar or an annular lamp bar or a rectangular lamp bar or an M-shaped lamp bar.
Preferably, the LED light bar comprises a plurality of intelligent integrated LED light sources which are sequentially connected in series and adopt a single-wire serial communication protocol; the intelligent integrated LED light source adopts a WS2812 series chip or a WS2813 series chip.
Preferably, heat dissipation frame body top is provided with groove structure, groove structure is used for accomodating fold condition the LED banks.
Preferably, the heat dissipation frame body includes:
a base;
the top plate and the base can be relatively rotatably connected, so that the angle of the top plate can be adjusted;
the heat radiation fan is arranged in the top plate.
Preferably, the top plate is provided with a limiting component for limiting the position of the electronic device.
Preferably, the top plate is also provided with a limiting part accommodating groove; the limiting part is movably connected with the top plate, so that the limiting part can be accommodated in the limiting part accommodating groove.
Preferably, a plurality of heat dissipation holes are formed in the top plate.
Preferably, the heat dissipation frame further includes:
and the USB module is electrically connected with the main control module and is used for being in communication connection with the electronic equipment.
Preferably, the heat dissipation frame further comprises:
and the temperature sensing module is connected with the main control module and used for acquiring different sampling voltages according to the external temperature change and transmitting the acquired signals to the main control module.
The embodiment of the utility model provides a through set up the LED banks on the heat dissipation frame, make when the LED banks expandes, form the region that can hold electronic equipment between heat dissipation frame body and the LED banks is located behind one's back of display screen, when can make the heat dissipation frame play normal radiating effect, still possess special light effect, improve user's use and experience.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic view of a first view angle structure of an open state of an LED light bar according to an embodiment of a heat dissipation frame of the present application;
fig. 2 is a schematic view of a second view angle structure of an open state of an LED light bar according to an embodiment of the heat dissipation frame of the present application;
fig. 3 is a schematic view of a third view angle structure of an open state of an LED light bar according to an embodiment of the heat dissipation frame of the present application;
fig. 4 is a fourth view structural diagram of an open state of an LED light bar according to an embodiment of the heat dissipation frame of the present application;
fig. 5 is a fifth view structural diagram of an open state of an LED light bar according to an embodiment of the heat dissipation frame of the present application;
fig. 6 is a sixth view structural diagram of an opened state of an LED light bar according to an embodiment of the heat dissipation frame of the present application;
fig. 7 is a schematic view of a seventh view angle structure of a folded state of the LED light bar according to an embodiment of the heat dissipation frame of the present application;
fig. 8 is an eighth view structural diagram of a usage state of an LED light bar according to an embodiment of the present disclosure;
fig. 9 is a ninth view structural diagram of an LED light bar in an operational state according to an embodiment of the heat dissipation frame of the present application;
fig. 10 is a tenth view structural diagram of an LED light bar in a use state according to an embodiment of the heat dissipation frame of the present application;
fig. 11 is a circuit block diagram of a heat sink according to an embodiment of the present disclosure;
fig. 12 is a partial circuit diagram of a heat sink according to an embodiment of the present disclosure;
fig. 13 is another partial circuit diagram of a heat sink according to an embodiment of the present disclosure;
fig. 14 is another partial circuit diagram of the heat dissipation frame according to the embodiment of the present application.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
It should be noted that the electronic device in the embodiment of the present application may be a mobile phone, a tablet computer, a desktop computer, a laptop computer, a handheld computer, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a cellular phone, a Personal Digital Assistant (PDA), an Augmented Reality (AR) \ Virtual Reality (VR) device, and other devices including a display screen, and the embodiment of the present application does not particularly limit the specific form of the electronic device. The following description will be given only by taking the electronic device as a notebook computer as an example.
Referring to fig. 1 to 8, an embodiment of the present application provides a heat dissipation frame for supporting an electronic device, where the electronic device includes a display screen 802, including:
the electronic equipment comprises a heat dissipation frame body, wherein a heat dissipation fan is arranged in the heat dissipation frame body and is used for being electrically connected with the electronic equipment; the heat dissipation frame includes:
the main control module is used for being electrically connected with the electronic equipment;
the heat dissipation frame comprises a heat dissipation frame body, wherein a heat dissipation fan is arranged inside the heat dissipation frame body and is electrically connected with a main control module;
LED banks, LED banks and host system electric connection, LED banks set up in heat dissipation frame body top and with heat dissipation frame body folding joint for when LED banks expanded, it can hold electronic equipment's region and LED banks be located behind one's back to form between heat dissipation frame body and the LED banks.
In some embodiments, a groove 105 structure is disposed above the heat dissipation frame body, and the groove 105 structure is used for accommodating the folded LED lamp set.
In some embodiments, the heat sink frame comprises: a base 104, a top plate 101, a group of LED lights (LED light bar 106); wherein the top plate 101 is provided with a shape setting groove 105; the LED light set is foldably connected to the top panel 101 and can be received in the recess 105 when the LED light set is folded.
Specifically, when a user normally uses the heat dissipation frame, the LED lamp set is opened from the shape groove 105 of the top plate 101 to form a certain angle with the top plate 101, and the LED lamp set is used for placing objects such as a notebook computer 801, the computer can lean against the LED lamp set, and the LED lamp set is located on the back of the notebook computer 801. When the LED lamp group is lightened, a certain lighting effect is formed. Especially, when LED light hits wall body or other article behind the screen, play and dry by the fire the atmosphere, the various effect is dazzled to the screen, improves user experience and feels.
For example, in some embodiments, the main control module may read picture data output by the display card of the electronic device, so as to identify pixel position information and RGB data information corresponding to each pixel, and generate a control signal to control a display state of the LED light group according to a position corresponding relationship between the LED light group and the display screen 802. In some embodiments, the display states of the LED lamp groups change synchronously with the picture, so that an ambilight display effect can be presented, an immersive experience is provided for a user, and the system can be used in various scenes, such as electronic contests, film watching and the like.
In other embodiments, the main control module may read audio data of the electronic device, and control each group of LED lamp groups to control light change along with the sound data according to the audio data. The LED lamp groups can control light change along with music rhythm, and can be used for various scenes such as music appreciation, jumping and the like.
In some embodiments, the base 104 and the top plate 101 are the same size, and the base 104 and the top plate 101 can rotate relative to each other.
Specifically, when the heat dissipation frame is normally used, the user can open certain angle with base 104 and roof 101 to form the user-defined angle between base 104 and the roof 101, so that the user operation can self-define the position of placing the thing such as notebook computer 801 on the heat dissipation frame, thereby do benefit to the user and watch, reduce user's eye fatigue and cervical vertebra discomfort, improve user experience.
In some embodiments, the LED light group is an LED light bar 106, and the LED light bar 106 is a circular light bar, a rectangular light bar, an M-shaped light bar, or the like.
In some embodiments, the LED light groups and the groove 105 form a ring shape.
Specifically, the LED light group is an LED light bar 106. The LED light bar 106 can be designed into different shapes, such as circular, rectangular, or specific shapes (e.g., M-shaped, S-shaped).
In some embodiments, the shapes of the LED light bars 106 and the grooves 105 are matched, so that on one hand, the LED light groups can be conveniently accommodated, and the space occupied by the heat dissipation rack is saved; on the other hand, the overall aesthetic feeling of the heat dissipation frame can be improved, so that the user experience is improved.
In some embodiments, the LED light bar 106 comprises a plurality of intelligent integrated LED light sources (light beads) connected in series in sequence using a single-wire serial communication protocol. For example, the intelligent integrated LED light source may adopt WS2812 series chips or WS2813 series chips, etc. The intelligent integrated LED light source adopting the single-wire serial communication protocol has the advantages of easiness in connection and control and lower cost. In some embodiments, the intelligent integrated LED light source of the WS2812 chip is formed by integrating the control circuit and the RGB chip in a 5050 packaged component, so as to form a complete external control pixel, and any pixel receives a signal and then outputs the signal after waveform shaping, thereby ensuring that the waveform distortion of the line cannot be accumulated. And a power-on reset circuit and a power-off reset circuit are arranged in the display device, 256-level brightness display can be realized by three primary colors (RGB) of each pixel point, full true color display of 16777216 colors is completed, the scanning frequency is not lower than 400Hz/s, a serial cascade interface can complete data receiving and decoding through a signal line, and no circuit is needed when the transmission distance of any two points is not more than 3 meters.
For example, WS2812B is an intelligent external control LED light source integrating a control circuit and a lighting circuit. Each element is a pixel. The pixel point comprises an intelligent digital interface data latch signal shaping and amplifying driving circuit, a high-precision internal oscillator and a programmable constant current control part, color height consistency of pixel point light is effectively guaranteed, a data protocol adopts a single-wire return-to-zero code communication mode, the pixel point receives data transmitted from the processing unit 200 after being electrified and reset, firstly, the transmitted 24-bit data is extracted by a first pixel point and then is transmitted to a data latch inside the pixel point, the rest data is shaped and amplified by an internal shaping processing circuit and then is transmitted and output to a next cascaded pixel point, and after transmission of one pixel point, the signal is reduced by 24-bit pixel points, an automatic shaping and transmitting technology is adopted, so that the cascading number of the pixel points is not limited by signal transmission, and only the requirement of signal transmission speed is limited.
The embodiment can realize the selection of the model of the specific intelligent integrated LED light source of the LED lamp bank, and the intelligent integrated LED light source of the WS2812 series chip or the WS2813 series chip can enable the control of the main control module on the LED lamp bank to be simpler and more efficient, thereby improving the detection efficiency and the reliability.
It should be noted that in other embodiments, parallel connected LED light sources may also be used.
In some embodiments, the heat sink body includes:
a base 104;
the top plate 101, the top plate 101 and the base 104 can be relatively rotatably connected, so that the angle of the top plate 101 can be adjusted;
the heat dissipation fan is disposed inside the top plate 101.
In some embodiments, a position limiting part 103 is disposed on the top plate 101 for limiting the position of the electronic device.
In some embodiments, the top plate 101 is further provided with a limiting portion 103; the position-limiting part 103 is movably connected with the top plate 101, so that the position-limiting part 103 can be accommodated in the position-limiting part 103 accommodating groove.
In some embodiments, a position limiting part 103 400 is further included, and the position limiting part 103 400 is disposed on the outer edge of the top plate 101 for limiting the position of the placed object.
Specifically, the present embodiment can limit the placement object on the heat dissipation frame through the limiting part 103 400, so as to prevent the placement object (electronic device) from falling or sliding off, thereby improving the protection of the placement object, such as the notebook computer 801, when the user uses the device.
In some embodiments, the device further comprises a limiting part 103 accommodating groove 500 for accommodating the limiting part 103 400.
Specifically, the limiting part 103 can be accommodated in the limiting part 103 accommodating groove 500 when the limiting part 103 is not used, so that the occupied space of the heat dissipation frame is saved, and the portability of the heat dissipation frame is improved.
In some embodiments, a plurality of louvers 102 are provided on the top plate 101. In some embodiments, the heat dissipation holes 102 are uniformly distributed on the surface of the top plate 101 for the fan to dissipate heat; in other embodiments, the heat dissipation holes 102 are disposed at positions corresponding to the fans (usually right above the fans) for dissipating heat of the fans. The top plate 101 is provided with a plurality of heat radiation holes 102, so that heat radiation can be more sufficient.
Referring to fig. 11, a circuit diagram of a heat dissipation frame 1200 according to an embodiment of the present invention is shown;
referring to fig. 12, in some embodiments, the main control module 1210 includes a processing chip 1211 with a model of GD32F150G8, where the processing chip 1211 employs an arm (advanced RISC machine) core, a 72M main frequency, a 64KB FLAS memory and an 8KB SRAM memory, and may provide two SPI, two I2C, two serial ports, five general 16-bit timers, and the like, and the abundant external interfaces can meet the requirements of the present embodiment on the main control module 1210 and also provide a hardware basis for the extension of the subsequent main control module 1210.
Referring to fig. 12, in some embodiments, the heat dissipation frame 1200 further includes:
the USB module 1230 is electrically connected to the main control module 1210 and configured to be communicatively connected to the electronic device 1100.
In some embodiments, the electronic device 1100 is a notebook computer 801. The USB module 1230 is connected to the USB interface of the notebook computer 801 via a USB cable. The power supply signal and the data signal from the notebook computer 801 can be acquired simultaneously by adopting the USB connection, wherein the power supply signal is used for supplying power to the fan and the light, and the data signal is used for controlling the working state of the fan and the light.
In some embodiments, the heat sink frame 1200 is a notebook computer 801 heat sink frame 1200. When the LED lamp set 1220 is used, the LED lamp set 1220 is opened from the shape groove 105 of the top plate 101 and forms a certain angle with the top plate 101, when the LED lamp set 1220 is used for placing objects such as a notebook computer 801, the computer can lean against the LED lamp set 1220, and the LED lamp set 1220 is located on the back of the notebook computer 801. The LED lamp set 1220 is connected to a USB interface of the notebook computer 801 through a USB cable, the LED lamp set 1220 control device is initialized, and the LED lamp set 1220 control device sends heartbeat packet data to the notebook computer 801 and receives data signals (such as RGB data and PWM data) of the notebook computer 801: the RGB data are transmitted to an intelligent integrated LED light source on an LED light group 1220 to control the LED light source to display; and transmitting the PWM data to the fan motor of the heat dissipation frame 1200 to control the fan to dissipate heat.
In some embodiments, referring to fig. 13, the heat dissipation frame 1200 further includes: the LED driving module 1240 is electrically connected to the main control module 1210 and the LED lamp set 1220, respectively, and is configured to control a working state of the LED lamp set 1220 according to a control signal of the main control module 1210.
In some embodiments, the main control module 1210 correspondingly controls the LED lamp set 1220 through the LED driving module 1240. The LED driving module 1240 may include a MOS transistor or a triode.
Referring to fig. 13, in some embodiments, because the lamp beads 130 are in a serial, cascade relationship, the processing unit 111 is connected to one lamp bead 130 in one of the LED lamp sets 1220, so as to implement display of the whole LED lamp set 1220, in order to facilitate understanding of the direct connection relationship between the lamp bead 130 and the processing unit 111, referring to fig. 13, the terminal WS _ OUT1 is connected to the sixth pin of the processing unit 111, receives a control signal of the sixth pin of the processing unit 111, and outputs the driving signal to the corresponding LED lamp set 1220 through the terminal DIO. The LED driving module 1240 includes a first MOS transistor Q1, a seventh resistor R7 and an eighth resistor R8, and is configured to control the operating state of the LED light bar 121 according to the control signal WS-OUT1 of the main control module 1210;
in some embodiments, the heat sink frame 1200 further comprises: the heat dissipation fan driving module 1250 is electrically connected to the main control module 1210 and the heat dissipation fan 1270, respectively, and is configured to control a working state of the heat dissipation module according to a control signal of the main control module 1210. In some embodiments, the main control module 1210 correspondingly controls the cooling fan 1270 through the cooling fan driving module 1250. The cooling fan driving module 1250 may include a MOS transistor or a triode.
Referring to fig. 14, a circuit diagram of a heat dissipation frame 1200 with an LED lamp set 1220 according to another embodiment of the present invention is shown;
in some embodiments, the heat dissipation frame 1200 further includes a temperature sensing module 1260, connected to the main control module 1210, for obtaining different sampling voltages according to external temperature changes, and transmitting the collected signals to the main control module 1210.
Specifically, the temperature sensing module 1260100 includes a third resistor R9 and a fourth resistor R10, wherein the first end of the third resistor R9 is connected to the power supply, the second end of the third resistor R9 is connected to the first end of the fourth resistor R10, the second end of the fourth resistor R10 is grounded, and the second end of the third resistor R9 and the first end of the fourth resistor R10 are both connected to the main control module 1210.
Specifically, in this embodiment, the third resistor R9 and the fourth resistor R10 are thermistors, and the resistance values of the thermistors change along with the temperature change, so that the voltage signal values collected by the port TEP _ ADC are different in size, the port TEP _ ADC is connected to the seventh pin of the main control chip 201 and is used for transmitting the voltage signal collected by the temperature sensing module 1260 to the main control module 1210 through the seventh pin, and the main control module 1210 controls the rotation speed of the cooling fan 1270 through the transmitted voltage signal, thereby achieving the speed regulation effect.
The following description will take the LED light group as the LED light bar 106 and the ring light bar as an example, and will be made with reference to the drawings.
Fig. 1 is a schematic view of a first view angle structure of an LED light bar 106 in an open state according to an embodiment of the present disclosure;
fig. 2 is a schematic view of a second view angle structure of the LED light bar 106 in an open state according to an embodiment of the heat dissipation frame of the present application;
fig. 3 is a schematic view of a third view angle structure of the LED light bar 106 in an open state according to an embodiment of the heat dissipation frame of the present application;
fig. 4 is a fourth view structural diagram of an opened state of the LED light bar 106 according to an embodiment of the heat dissipation frame of the present application;
fig. 5 is a fifth view structural diagram of an opened state of the LED light bar 106 according to an embodiment of the heat dissipation frame of the present application;
in fig. 1 to 5, the LED light bar 106 is annular, and the base 104 and the top plate 101 are opened at a certain angle from the state that the LED light bar 106 is opened from the groove 105. The stopper 103 is opened from the stopper 103 receiving groove.
Fig. 6 is a sixth view structural diagram of an opened state of the LED light bar 106 according to an embodiment of the heat dissipation frame of the present application. The ventilation opening 601 is arranged below the top plate 101, the ventilation opening 601 is located right below the heat dissipation fan, and the heat dissipation holes 102 above the top plate 101 and the ventilation opening 601 below the top plate 101 are in convection to better realize heat dissipation.
Fig. 7 is a schematic diagram of a seventh perspective structure of a folded heat dissipation frame according to an embodiment of the present application. The LED light bar 106 is accommodated in the groove 105, and the base 104 and the top plate 101 are folded flat. The limiting part 103 is received in the limiting part 103 receiving groove. The whole volume of the heat dissipation frame is small after storage, and the heat dissipation frame is easy to carry.
Fig. 8 is an eighth structural view illustrating a heat dissipation frame according to an embodiment of the present disclosure in a use state;
fig. 9 is a ninth perspective view of a heat dissipation frame according to an embodiment of the present disclosure;
fig. 10 is a tenth perspective structural view of an embodiment of a heat dissipation frame according to the present application.
Fig. 8 to 10 are schematic structural views of a heat dissipation frame in a use state according to an embodiment of the present application. The LED light bars 106 are annular, when the LED light bars 106 are opened from the grooves 105, an area capable of accommodating the notebook computer 801 is formed between the heat dissipation frame body and the LED light bars, the notebook computer 801 is placed on the heat dissipation frame, the LED light bars 106 are located behind the display screen 802, and the base 104 and the top plate 101 are opened at a certain angle. The position-limiting part 103 is opened from the position-limiting part 103 receiving groove to limit the displacement of the notebook computer 801.
The embodiment of the utility model provides a through set up the LED banks on the heat dissipation frame for when the LED banks expandes, form the region that can hold electronic equipment between heat dissipation frame body and the LED banks is located behind one's back of display screen 802, when can make the heat dissipation frame play normal radiating effect, still possess special light effect, improve user experience.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A heat dissipation frame, for supporting electronic equipment, the electronic equipment includes the display screen, the heat dissipation frame includes:
the main control module is used for being electrically connected with the electronic equipment;
the heat dissipation frame comprises a heat dissipation frame body, wherein a heat dissipation fan is arranged inside the heat dissipation frame body and is electrically connected with the main control module;
the LED lamp bank, the LED lamp bank with master control module electric connection, the LED lamp bank set up in heat dissipation frame body top and with heat dissipation frame body folding joint makes when the LED lamp bank expandes, form the region that can hold electronic equipment between heat dissipation frame body and the LED lamp bank is located behind the display screen.
2. The heat dissipation frame of claim 1, wherein the LED light group is an LED light bar, and the LED light bar is a door-shaped light bar or a ring-shaped light bar or a rectangular light bar or an M-shaped light bar.
3. The heat dissipation frame of claim 2, wherein the LED light bar comprises a plurality of intelligent integrated LED light sources connected in series in sequence using a single-wire serial communication protocol.
4. The heat dissipation frame of claim 1, wherein a groove structure is disposed above the heat dissipation frame body, and the groove structure is used for accommodating the LED lamp set in a folded state.
5. The heat sink stand of claim 1, wherein the heat sink stand body comprises:
a base;
the top plate and the base can be relatively rotatably connected, so that the angle of the top plate can be adjusted;
the heat radiation fan is arranged in the top plate.
6. The heat dissipation frame according to claim 5, wherein the top plate is provided with a position limiting member for limiting a position of the electronic device.
7. The heat dissipation frame according to claim 6, wherein the top plate is further provided with a stopper receiving groove; the limiting part is movably connected with the top plate, so that the limiting part can be accommodated in the limiting part accommodating groove.
8. The heat dissipation frame of claim 5, wherein the top plate has a plurality of heat dissipation holes formed therein.
9. The heat sink stand of any one of claims 1 to 8, further comprising:
and the USB module is electrically connected with the main control module and is used for being in communication connection with the electronic equipment.
10. The heat sink stand of any one of claims 1 to 8, further comprising:
and the temperature sensing module is connected with the main control module and used for acquiring different sampling voltages according to the external temperature change and transmitting the acquired signals to the main control module.
Priority Applications (1)
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CN202022964724.1U CN213987405U (en) | 2020-12-11 | 2020-12-11 | Heat dissipation frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202022964724.1U CN213987405U (en) | 2020-12-11 | 2020-12-11 | Heat dissipation frame |
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CN202022964724.1U Active CN213987405U (en) | 2020-12-11 | 2020-12-11 | Heat dissipation frame |
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