CN213972377U - Injection mold thimble mechanism - Google Patents
Injection mold thimble mechanism Download PDFInfo
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- CN213972377U CN213972377U CN202022647495.0U CN202022647495U CN213972377U CN 213972377 U CN213972377 U CN 213972377U CN 202022647495 U CN202022647495 U CN 202022647495U CN 213972377 U CN213972377 U CN 213972377U
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Abstract
The utility model discloses an injection mold thimble mechanism, which comprises a thimble bottom plate, a thimble panel, a plurality of ejector rods, a plurality of small thimble bottom plates, a plurality of small thimble panels and a plurality of small thimbles; the pin bottom plate is fixed together with the thimble panel, and the lower extreme of ejector pin is fixed between pin bottom plate and thimble panel, and the upper end of many ejector pins leans on the bottom surface at the little thimble bottom plate of polylith respectively, and polylith little thimble bottom plate is fixed together with the little thimble panel of polylith respectively, and the lower extreme of many little thimbles is fixed respectively between little thimble bottom plate of polylith and the little thimble panel of polylith, and many little thimble upper ends stretch into the die cavity. Because the utility model discloses be equipped with the little thimble bottom plate of polylith and the little thimble panel of polylith, divide into groups all little thimbles alone, establish independent little thimble board and lay little thimble under every runner spare, if in the course of working, the phenomenon of rupture takes place for one of them thimble, and that a set of thimble board of taking out the damage that can relax is repaired, is convenient for to the maintenance of work piece.
Description
Technical Field
The utility model relates to an injection mold especially relates to an injection mold thimble mechanism.
Background
The ejector plate plays a vital role in the mold, is a fixing plate for mounting the ejector pins, consists of two plates, one is an ejector pin bottom plate, and the other is an ejector pin panel, and is used for ejecting injection molding parts formed by injection molding out of a cavity of an injection mold. In mould processing in the past, all thimbles are all gathered on an thimble board, the root of whole thimble bottom plate with all thimbles is fixed simultaneously on thimble panel, the thimble can not be taken out alone, if rupture phenomenon takes place for one of them thimble, need to change the thimble, need dismantle the thimble board completely, install new thimble again, simultaneously, the root of whole thimble bottom plate with all thimbles is fixed simultaneously on thimble panel, the height of the thimble of every cave need be adjusted alone, it is very inconvenient, consume time for a long time, influence production efficiency.
Disclosure of Invention
An object of the utility model is to provide an injection mold thimble mechanism convenient to maintenance.
In order to achieve the above object, the technical solution of the present invention is:
the utility model relates to an injection mold thimble mechanism, which comprises a thimble bottom plate, a thimble panel, a plurality of ejector rods, a plurality of small thimble bottom plates, a plurality of small thimble panels and a plurality of small thimbles;
the pin bottom plate is fixed together with the thimble panel, and the lower extreme of ejector pin is fixed between pin bottom plate and thimble panel, and the upper end of many ejector pins leans on the bottom surface at the little thimble bottom plate of polylith respectively, and polylith little thimble bottom plate is fixed together with the little thimble panel of polylith respectively, and the lower extreme of many little thimbles is fixed respectively between little thimble bottom plate of polylith and the little thimble panel of polylith, and many little thimble upper ends stretch into the die cavity.
The utility model also comprises a fixed die base plate, a fixed die plate, a movable die base plate, movable die pins and a movable die base plate; the fixed die base plate is fixed with the fixed die plate, the fixed die plate is arranged opposite to the movable die plate, the movable die base plate, the movable die pins and the movable die base plate are sequentially fixed together, the fixed thimble base plate and the thimble panel are arranged between the movable die base plate and the movable die base plate, a plurality of thimble grooves are formed in the movable die plate, a plurality of movable die inserts are fixed in each thimble groove, small thimble base plates and small thimble panels which are fixed together are movably sleeved in the thimble grooves and below the movable die inserts, and the small thimble gaps penetrate in the movable die inserts.
The utility model also comprises a plurality of small guide posts; the small thimble base plate and the small thimble panel are both provided with guide pillar holes, the small guide pillars are fixed in the movable mould plate and movably sleeved in the guide pillar holes on the small thimble base plate and the small thimble panel.
After the scheme is adopted, the utility model comprises a thimble bottom plate, a thimble panel, a plurality of ejector rods, a plurality of small thimble bottom plates, a plurality of small thimble panels and a plurality of small thimbles; the small thimble structure is provided with a plurality of small thimble base plates and a plurality of small thimble panels, all the small thimbles are independently grouped, an independent small thimble plate is arranged under each sprue piece, then the small thimbles are arranged, and a method for bidirectionally fixing the small thimble base plates and the small thimble panels is used for ensuring that the small thimble base plates and the small thimble panels are independent from each other and do not influence the processing of workpieces. If one of the ejector pins is broken in the machining process, the damaged ejector pin plate can be easily taken out, the damaged ejector pin can be taken out for repair, the production efficiency is greatly improved, and the workpiece is convenient to maintain. Meanwhile, the overall height of the thimble in each hole can be independently adjusted to shorten the length of the thimble, thereby prolonging the service time of the thimble and greatly improving the efficiency and the flexibility of use.
The invention will be further described with reference to the accompanying drawings and specific embodiments.
Drawings
Fig. 1 is a top view of the present invention;
FIG. 2 is a cross-sectional view taken along line C-C of FIG. 1;
FIG. 3 is a front view of the small thimble portion of the present invention;
FIG. 4 is a side view of the small thimble portion of the present invention;
FIG. 5 is a top view of the small thimble portion of the present invention;
fig. 6 is a top view of the movable die plate of the present invention;
FIG. 7 is an isometric view of the small thimble portion of the present invention;
fig. 8 is a schematic view of the small thimble portion of the present invention engaged with the top plate;
fig. 9 is a sectional view of an embodiment of the present invention.
Detailed Description
As shown in fig. 1-8, the utility model relates to an injection mold thimble mechanism, including thimble bottom plate 1, thimble panel 2, many ejector pins 3, the little thimble bottom plate 4 of polylith, the little thimble panel 5 of polylith, many little thimbles 6, many little guide pillars 7.
The needle base plate 1 is fixed together with the thimble panel 2, and the lower extreme of ejector pin 3 is fixed between needle base plate 1 and thimble panel 2, and the upper end of many ejector pins 3 pushes up respectively and leans on the bottom surface at the little thimble base plate of polylith 4, and polylith little thimble base plate 4 is fixed together with polylith little thimble panel 5 respectively, and the lower extreme of many little thimbles 6 is fixed respectively between polylith little thimble base plate 4 and polylith little thimble panel 5, and many little thimble upper ends stretch into the die cavity. The small thimble base plate 4 and the small thimble panel 5 are both provided with guide post holes 45, the small guide posts 7 are fixed in the movable mould plate 30, and the small guide posts 7 are movably sleeved in the guide post holes 45 of the small thimble base plate 4 and the small thimble panel 5.
As shown in fig. 9, it is an embodiment of the present invention: the die comprises a fixed die base plate 10, a fixed die plate 20, a movable die plate 30, a movable die base plate 40, movable die pins 50, a movable die base plate 60 and a plurality of movable die cores 70; the fixed die base plate 10 is fixed with the fixed die plate 20, the fixed die plate 20 is arranged opposite to the movable die plate 30, the movable die base plate 40, the movable die pins 50 and the movable die base plate 60 are sequentially fixed together, the fixed thimble base plate 1 and the fixed thimble panel 2 are arranged between the movable die base plate 40 and the movable die base plate 50, a plurality of thimble grooves 301 (shown in figure 6) are formed in the movable die plate 30, a plurality of movable die inserts 70 are fixed in each thimble groove 301, the fixed small thimble base plate 4 and the fixed small thimble panel 5 are movably sleeved in the thimble grooves 301 and below the movable die inserts 70, and the small thimbles 6 are arranged in the movable die inserts 70 in a clearance-penetrating manner.
The utility model discloses a theory of operation:
as shown in fig. 1 and 2, the plurality of small thimble base plates 4 and the plurality of small thimble panels 5 fixed together are respectively movably sleeved in the plurality of thimble grooves 301 of the movable mold plate 30, all the small thimbles 6 are individually grouped, an independent small thimble plate is arranged under each sprue, and then the small thimbles 6 are arranged. When the mould is opened, the fixed thimble bottom plate 1 and the thimble panel 2 are ejected upwards to jack the ejector rod 3 upwards, the ejector rod 3 jacks up the fixed small thimble bottom plates 4 and the small thimble panels 5, and the fixed small thimble bottom plates 4 and the small thimble panels 5 jack up the small thimbles 6 upwards.
The above description is only a preferred embodiment of the present invention, and therefore the scope of the present invention should not be limited thereby, and all equivalent changes and modifications made within the scope of the claims and the specification should be considered within the scope of the present invention.
Claims (3)
1. The utility model provides an injection mold thimble mechanism which characterized in that: the ejector pin structure comprises an ejector pin bottom plate, an ejector pin panel, a plurality of ejector pins, a plurality of small ejector pin bottom plates, a plurality of small ejector pin panels and a plurality of small ejector pins;
the pin bottom plate is fixed together with the thimble panel, and the lower extreme of ejector pin is fixed between pin bottom plate and thimble panel, and the upper end of many ejector pins leans on the bottom surface at the little thimble bottom plate of polylith respectively, and polylith little thimble bottom plate is fixed together with the little thimble panel of polylith respectively, and the lower extreme of many little thimbles is fixed respectively between little thimble bottom plate of polylith and the little thimble panel of polylith, and many little thimble upper ends stretch into the die cavity.
2. The ejector pin mechanism of an injection mold according to claim 1, wherein: the fixed die base plate, the fixed die plate, the movable die base plate, the movable die pins and the movable die base plate are also included; the fixed die base plate is fixed with the fixed die plate, the fixed die plate is arranged opposite to the movable die plate, the movable die base plate, the movable die pins and the movable die base plate are sequentially fixed together, the fixed thimble base plate and the thimble panel are arranged between the movable die base plate and the movable die base plate, a plurality of thimble grooves are formed in the movable die plate, a plurality of movable die inserts are fixed in each thimble groove, small thimble base plates and small thimble panels which are fixed together are movably sleeved in the thimble grooves and below the movable die inserts, and the small thimble gaps penetrate in the movable die inserts.
3. The ejector pin mechanism of an injection mold according to claim 2, wherein: the device also comprises a plurality of small guide posts; the small thimble base plate and the small thimble panel are both provided with guide pillar holes, the small guide pillars are fixed in the movable mould plate and movably sleeved in the guide pillar holes on the small thimble base plate and the small thimble panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022647495.0U CN213972377U (en) | 2020-11-16 | 2020-11-16 | Injection mold thimble mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022647495.0U CN213972377U (en) | 2020-11-16 | 2020-11-16 | Injection mold thimble mechanism |
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| Publication Number | Publication Date |
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| CN213972377U true CN213972377U (en) | 2021-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022647495.0U Active CN213972377U (en) | 2020-11-16 | 2020-11-16 | Injection mold thimble mechanism |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113781922A (en) * | 2021-09-10 | 2021-12-10 | 武汉华星光电半导体显示技术有限公司 | Forming equipment and forming method of curved surface display panel and curved surface display panel |
| CN115815568A (en) * | 2022-12-06 | 2023-03-21 | 杭州合立机械有限公司 | Battery pack mold and processing method thereof |
-
2020
- 2020-11-16 CN CN202022647495.0U patent/CN213972377U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113781922A (en) * | 2021-09-10 | 2021-12-10 | 武汉华星光电半导体显示技术有限公司 | Forming equipment and forming method of curved surface display panel and curved surface display panel |
| CN115815568A (en) * | 2022-12-06 | 2023-03-21 | 杭州合立机械有限公司 | Battery pack mold and processing method thereof |
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