CN213970506U

CN213970506U - Semiconductor polishing machine

Info

Publication number: CN213970506U
Application number: CN202022895023.7U
Authority: CN
Inventors: 王永成
Original assignee: Shanghai Zhiling Grinding Technology Co ltd
Current assignee: Shanghai Zhiling Grinding Technology Co ltd
Priority date: 2020-12-03
Filing date: 2020-12-03
Publication date: 2021-08-17
Anticipated expiration: 2030-12-03

Abstract

The utility model discloses a semiconductor polishing machine, including the drain pan, the support frame, first slide rail, the activity shell, a supporting plate, cylinder and polishing station, four polishing stations have been set up on the support frame of polishing machine, four polishing stations use support frame top middle part evenly to set up as the centre of a circle, the fixed plate top of polishing station is provided with the second slide rail, the fly leaf bottom slides along the second slide rail, and control the removal of fly leaf through electric putter, make the fly leaf carry out the rectilinear slide along the second slide rail, be convenient for adjust the mill position of different polishing stations, keep the same wearing and tearing to the polishing pad, promote the abrasive machining precision.

Description

Semiconductor polishing machine

Technical Field

The utility model relates to a relevant field of burnishing machine specifically is a semiconductor burnishing machine.

Background

Polishing machines, also called grinders, are often used for mechanical grinding, polishing and waxing, and work on the principle that: the motor drives the sponge or wool polishing disc arranged on the polishing machine to rotate at a high speed, and the polishing disc and the polishing agent act together and rub the surface to be polished, so that the aims of removing paint surface pollution, oxide layers and shallow marks can be achieved, the rotating speed of the polishing disc is generally 1500-3000r/min, the speed is mostly continuously variable, and the polishing disc can be adjusted at any time during construction according to requirements.

The polishing machine is required to be polished by the polishing machine during semiconductor production, the existing polishing machine is provided with 4 stations, each station is a cylinder pressure disc driving part, 4 stations are placed on a large disc, the large disc rotates, each station rotates in situ, and the effect of uniform polishing of semiconductors is general.

SUMMERY OF THE UTILITY MODEL

Therefore, in order to solve the above-mentioned insufficiency, the utility model provides a semiconductor polishing machine herein.

The utility model is realized by constructing a semiconductor polishing machine, which comprises a bottom shell and a polishing station, wherein the left side and the right side of the top end of the bottom shell are locked with a support frame through bolts, the front side and the back side of the support frame are locked with a first slide rail respectively, the top end of a movable shell is locked with a support plate through bolts, the middle part of the top end of the support frame is locked with an air cylinder through bolts, a piston rod at the bottom end of the air cylinder is locked with the support plate, the polishing station is arranged at the edge of the top of the support frame, the polishing station comprises a fixed plate, a second slide rail, a movable plate, an electric push rod, a support tube, a drive motor, a drive gear, a driven gear, a connecting shaft and a grinding disc, the top end of the fixed plate is locked with a second slide rail, the bottom end of the movable plate slides along the second slide rail, and the right end of the movable plate is locked with the electric push rod through bolts, the left side of the front end of the electric push rod is mutually locked with the fixed plate through a bolt, the middle of the top end of the fixed plate is mutually locked with the supporting tube through a bolt, the front end of the supporting tube is mutually locked with the driving motor through a bolt, an output shaft at the top end of the driving motor is connected with the circle center of the driving gear, the rear end of the driving gear is mutually meshed with the driven gear, the circle center of the driven gear is connected with the connecting shaft, the bottom end of the connecting shaft is connected with the grinding disc, and the bottom end of the fixed plate is mutually locked with the supporting frame through a bolt.

Preferably, the surface of the first slide rail is smooth, and the inner wall of the movable shell is attached to the first slide rail.

Preferably, the top end surface of the supporting plate is in plane arrangement, and the top end surface of the supporting plate is provided with anti-skid grains.

Preferably, four polishing stations are arranged and are uniformly arranged in the middle of the top end of the support frame.

Preferably, the surface of the second slide rail is smooth, and the inner wall of the bottom end of the movable plate is attached to the second slide rail.

Preferably, the electric push rod and the second slide rail are arranged in parallel, and the front end and the rear end of the electric push rod are respectively locked with the movable plate and the fixed plate.

Preferably, a sliding groove is formed in the top end face of the fixing plate, and the sliding groove, the second sliding rail and the electric push rod are arranged in parallel.

Preferably, the bearing is welded at the bottom end of the driven gear, and the outer side of the bottom end of the bearing is locked with the supporting tube.

The utility model has the advantages of as follows: the utility model discloses an improve and provide a semiconductor polishing machine here, compare with equipment of the same type, have following improvement:

a semiconductor polishing machine has set up four polishing stations on the support frame of polishing machine, four polishing stations use support frame top middle part evenly to set up as the centre of a circle, and the fixed plate top of polishing station is provided with the second slide rail, and the fly leaf bottom slides along the second slide rail, and controls the removal of fly leaf through electric putter, makes the fly leaf carry out rectilinear sliding along the second slide rail, is convenient for adjust the mill position of different polishing stations, keeps the same wearing and tearing to the semiconductor, promotes the abrasive machining precision.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a top view of the present invention;

FIG. 3 is a schematic structural view of a polishing station of the present invention;

fig. 4 is the structural top view of the polishing station of the present invention.

Wherein: the polishing machine comprises a bottom shell-1, a support frame-2, a first slide rail-3, a movable shell-4, a support plate-5, a cylinder-6, a polishing station-7, a fixed plate-71, a second slide rail-72, a movable plate-73, an electric push rod-74, a support tube-75, a driving motor-76, a driving gear-77, a driven gear-78, a connecting shaft-79 and a grinding disc-710.

Detailed Description

The present invention will be described in detail with reference to the accompanying fig. 1-4, and the technical solutions in the embodiments of the present invention will be clearly and completely described, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 and 2, the present invention provides a semiconductor polishing machine through improvement, which comprises a bottom case 1 and a polishing station 7, wherein the left and right sides of the top end of the bottom case 1 are locked with a support frame 2 through bolts, the front and back sides of the support frame 2 are locked with first slide rails 3 respectively, the top end of a movable case 4 is locked with a support plate 5 through bolts, the middle part of the top end of the support frame 2 is locked with a cylinder 6 through bolts, a piston rod at the bottom end of the cylinder 6 is locked with the support plate 5, the edge of the top of the support frame 2 is provided with the polishing station 7, the surface of the first slide rail 3 is smooth, the inner wall of the movable case 4 is attached to the first slide rail 3 to limit the moving track of the movable case 4, the top end of the support plate 5 is arranged in a plane, and the top end of the support plate 5 is, four polishing stations 7 are arranged, and the four polishing stations 7 are uniformly arranged in the middle of the top end of the support frame 2, so that polishing of different positions of an object is facilitated.

Referring to fig. 2 and 3, the present invention provides a semiconductor polishing machine through improvement, a polishing station 7 includes a fixed plate 71, a second slide rail 72, a movable plate 73, an electric push rod 74, a support tube 75, a driving motor 76, a driving gear 77, a driven gear 78, a connecting shaft 79 and a grinding disc 710, the second slide rail 72 is locked at the top end of the fixed plate 71, the bottom end of the movable plate 73 slides along the second slide rail 72, the right end of the movable plate 73 is locked with the electric push rod 74 through a bolt, the left side of the front end of the electric push rod 74 is locked with the fixed plate 71 through a bolt, the middle part of the top end of the fixed plate 71 is locked with the support tube 75 through a bolt, the front end of the support tube 75 is locked with the driving motor 76 through a bolt, the output shaft at the top end of the driving motor 76 is connected with the center of the driving gear 77, the rear end of the driving gear 77 is engaged with the driven gear 78, the center of the driven gear 78 is connected with the connecting shaft 79, the bottom end of the connecting shaft 79 is connected with the grinding disc 710, the bottom end of the fixed plate 71 is locked with the support frame 2 through bolts, the surface of the second slide rail 72 is smooth, the inner wall of the bottom end of the movable plate 73 is attached to the second slide rail 72, the moving track of the movable plate 73 is limited, the electric push rod 74 is arranged in parallel with the second slide rail 72, and the front and rear ends of the electric push rod 74 are respectively locked with the movable plate 73 and the fixed plate 71, so that when the electric push rod 74 extends, the movable plate 73 slides along the second slide rail 72, a sliding slot is formed on the top end surface of the fixed plate 71, the sliding groove is arranged in parallel with the second sliding rail 72 and the electric push rod 74, so that the connecting shaft 79 penetrates through the fixing plate 71 to be connected with the grinding disc 710, the bottom end of the driven gear 78 is welded with a bearing, and the outer side of the bottom end of the bearing is locked with the support tube 75, so as to support and fix the driven gear 78 and rotate the driven gear 78.

The utility model provides a semiconductor polishing machine through improvement, which has the following working principle;

firstly, before use, the device is firstly placed on a required plane position through the bottom shell 1, then the air cylinder 6 is connected with external pneumatic control equipment, and the power connection ports of the driving motor 76 and the electric push rod 74 are connected with the external control equipment with a power supply;

secondly, when in use, a semiconductor to be polished is placed on the support plate 5, because the top end surface of the support plate 5 is in a plane arrangement, and the top end surface of the support plate 5 is provided with anti-skid lines, the polished object can be conveniently supported and prevented from skidding, four polishing stations 7 are arranged, the positions of the grinding discs 710 of different polishing stations 7 can be adjusted according to the size of the semiconductor, by controlling the electric push rod 74 to stretch, because the surface of the second slide rail 72 is smooth, and the inner wall of the bottom end of the movable plate 73 is attached to the second slide rail 72, the moving track of the movable plate 73 is limited, the electric push rod 74 and the second slide rail 72 are arranged in parallel, and the front end and the rear end of the electric push rod 74 are respectively locked with the movable plate 73 and the fixed plate 71, when the electric push rod 74 stretches, the movable plate 73 slides along the second slide rail 72, the grinding disc 710 is driven to move by the movable plate 73, the position of the grinding disc 710 is adjusted, so that the same abrasion on the semiconductor is kept, and the grinding machining precision is improved;

thirdly, the piston rod of the cylinder 6 is controlled to contract, so that the support plate 5 drives the semiconductor to move upwards, the semiconductor is in contact with the grinding disc 710, the driving motor 76 is controlled to generate power to drive the circle center of the driving gear 77 to rotate through the output shaft, the driving gear 77 drives the driven gear 78 to rotate, the driven gear 78 drives the circle center of the grinding disc 710 to rotate through the connecting shaft 79, and the semiconductor is ground and polished through the rotation of the grinding disc 710.

The utility model discloses an improvement provides a semiconductor polishing machine, four polishing stations 7 have been set up on support frame 2 of polishing machine, four polishing stations 7 use support frame 7 top middle part evenly to set up as the centre of a circle, the fixed plate 71 top of polishing station 7 is provided with second slide rail 72, fly leaf 73 bottom slides along second slide rail 72, and control fly leaf 73's removal through electric putter 74, make fly leaf 73 carry out the rectilinear sliding along second slide rail 72, be convenient for adjust the mill 710 position of different polishing stations 7, keep the same wearing and tearing to the semiconductor, promote the abrasive machining precision.

The basic principle and the main characteristics of the utility model and the advantages of the utility model have been shown and described above, and the utility model discloses the standard part that uses all can purchase from the market, and dysmorphism piece all can be customized according to the record of the description with the drawing, and the concrete connection mode of each part all adopts conventional means such as ripe bolt rivet among the prior art, welding, and machinery, part and equipment all adopt prior art, conventional model, and conventional connection mode in the prior art is adopted in addition to circuit connection, and the details are not repeated here.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A semiconductor polishing machine comprises a bottom shell (1), wherein the left side and the right side of the top end of the bottom shell (1) are mutually locked with a support frame (2) through bolts respectively, the front side and the rear side of the support frame (2) are fixedly locked with a first sliding rail (3) respectively, the top end of a movable shell (4) is mutually locked with a support plate (5) through bolts, the middle part of the top end of the support frame (2) is mutually locked with an air cylinder (6) through bolts, and a piston rod at the bottom end of the air cylinder (6) is mutually locked with the support plate (5);

the method is characterized in that: the polishing machine is characterized by further comprising a polishing station (7), the polishing station (7) is arranged at the edge of the top of the support frame (2), the polishing station (7) comprises a fixed plate (71), a second sliding rail (72), a movable plate (73), an electric push rod (74), a support tube (75), a driving motor (76), a driving gear (77), a driven gear (78), a connecting shaft (79) and a grinding disc (710), the second sliding rail (72) is fixed to the top of the fixed plate (71) in a locking mode, the bottom end of the movable plate (73) slides along the second sliding rail (72), the right end of the movable plate (73) is mutually locked with the electric push rod (74) through a bolt, the left side of the front end of the electric push rod (74) is mutually locked with the fixed plate (71) through a bolt, the middle of the top end of the fixed plate (71) is mutually locked with the support tube (75) through a bolt, and the front end of the support tube (75) is mutually locked with the driving motor (76) through a bolt, an output shaft at the top end of the driving motor (76) is connected with the circle center of the driving gear (77), the rear end of the driving gear (77) is meshed with the driven gear (78), the circle center of the driven gear (78) is connected with the connecting shaft (79), the bottom end of the connecting shaft (79) is connected with the grinding disc (710), and the bottom end of the fixing plate (71) is locked with the support frame (2) through bolts.

2. The semiconductor polishing machine according to claim 1, wherein: the surface of the first sliding rail (3) is smooth, and the inner wall of the movable shell (4) is attached to the first sliding rail (3).

3. The semiconductor polishing machine according to claim 1, wherein: the top end face of the supporting plate (5) is a plane, and anti-skid grains are arranged on the top end face of the supporting plate (5).

4. The semiconductor polishing machine according to claim 1, wherein: four polishing stations (7) are arranged, and the four polishing stations (7) are uniformly arranged in the middle of the top end of the support frame (2).

5. The semiconductor polishing machine according to claim 1, wherein: the surface of the second slide rail (72) is smooth, and the inner wall of the bottom end of the movable plate (73) is attached to the second slide rail (72).

6. The semiconductor polishing machine according to claim 1, wherein: the electric push rod (74) and the second slide rail (72) are arranged in parallel, and the front end and the rear end of the electric push rod (74) are respectively locked with the movable plate (73) and the fixed plate (71).

7. The semiconductor polishing machine according to claim 1, wherein: the top end face of the fixed plate (71) is provided with a sliding chute which is arranged in parallel with the second sliding rail (72) and the electric push rod (74).

8. The semiconductor polishing machine according to claim 1, wherein: the bottom end of the driven gear (78) is welded with a bearing, and the outer side of the bottom end of the bearing is mutually locked with the supporting pipe (75).