CN213967535U - UV glue curing device - Google Patents
UV glue curing device Download PDFInfo
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- CN213967535U CN213967535U CN202022598051.2U CN202022598051U CN213967535U CN 213967535 U CN213967535 U CN 213967535U CN 202022598051 U CN202022598051 U CN 202022598051U CN 213967535 U CN213967535 U CN 213967535U
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- lamp
- housing
- induction system
- connecting plate
- direction induction
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Abstract
The utility model relates to a UV glues solidification equipment, include: connecting plate, direction induction system, UV lamp, heat abstractor and PCB mainboard all set up on the connecting plate, direction induction system, UV lamp and heat abstractor all with PCB mainboard connection. The utility model discloses set up direction induction system, control UV through direction induction system and glue curing device's solidification work and heat dissipation work, need not to use heavy equipment, whole light and handy convenient, the first hand is used.
Description
Technical Field
The utility model relates to a UV glues solidification technology field, in particular to UV glues solidification equipment.
Background
The prior art provides a UV curing adhesive device which is too heavy, too long in irradiation time (1-10 minutes), too long in irradiation time and incapable of working for a long time (internal heat dissipation is too slow), so that time waste and energy consumption are caused.
SUMMERY OF THE UTILITY MODEL
The utility model provides a UV glues solidification equipment can replace heavy solidification UV in the past and glue equipment, and light solidification UV glues, and can solve and glue the back at solidification UV, and inside temperature risees the radiating problem in time.
In order to achieve the above object, the present invention provides the following technical solutions:
a UV glue curing apparatus comprising: connecting plate 1, direction induction system 2, UV lamp 3, heat abstractor 4 and PCB mainboard 5 all set up on the connecting plate 1, direction induction system 2, UV lamp 3 and heat abstractor 4 all with PCB mainboard 5 is connected.
Preferably, still include shell 6 and upper cover 7, upper cover 7 sets up on the shell 6 and with connecting plate 1 is connected, connecting plate 1, direction induction system 2, UV lamp 3, heat abstractor 4 and PCB mainboard 5 all set up in the shell 6.
Preferably, the PCB is further provided with a battery 8 and a charging port 9, wherein the battery 8 is arranged in the shell 6 and is connected with the PCB main board 5, and the charging port 9 is arranged on the shell 6.
Preferably, the shell 6 is provided with a nixie tube 10 and a capacity lamp 11, and the nixie tube 10 and the capacity lamp 11 are both connected with the PCB main board 5.
Preferably, a lens 12 is further included, the lens 12 being disposed below the housing 6.
Preferably, the housing 6 is further provided with a control switch 13, and the control switch 13 is connected with the PCB main board 5.
Through implementing above technical scheme, have following technological effect: the utility model provides a pair of UV glues solidification equipment sets up direction induction system, controls UV through direction induction system and glues solidification work and the heat dissipation work of solidification equipment, need not to use heavy equipment, and is whole light and handy convenient, and the first-hand usefulness is used.
Drawings
Fig. 1 is a schematic structural view (perspective view) of a UV glue curing apparatus provided by the present invention;
fig. 2 is a schematic structural diagram (exploded view) of a UV glue curing device provided by the present invention.
Detailed Description
For better understanding of the technical solutions of the present invention, the following detailed description of the embodiments provided in the present invention is provided with reference to the accompanying drawings.
Example one
As shown in fig. 1-2, the present embodiment provides a UV glue curing apparatus, including: connecting plate 1, direction induction system 2, UV lamp 3, heat abstractor 4 and PCB mainboard 5 all set up on the connecting plate 1, direction induction system 2, UV lamp 3 and heat abstractor 4 all with PCB mainboard 5 is connected. Still include shell 6 and upper cover 7, upper cover 7 sets up on the shell 6 and with connecting plate 1 is connected, connecting plate 1, direction induction system 2, UV lamp 3, heat abstractor 4 and PCB mainboard 5 all set up in the shell 6.
In this embodiment, the equal fixed mounting of direction induction system 2, UV lamp 3, heat abstractor 4 and PCB mainboard 5 is in on the connecting plate 1, through above-mentioned device is fixed to connecting plate 1, and all sets up in the shell 6, the PCB mainboard is used for the operation of transmitting electric power and each device of control to use, and is specific, after receiving corresponding instruction, MCU control on the PCB mainboard the opening of UV lamp, heat abstractor's operation and direction induction system's response etc. The UV lamp 3 emits ultraviolet rays when the curing operation is started, and the curing operation can be carried out by aiming at the part to be cured coated with the UV glue; heat abstractor 4 is used for in time dispelling the heat, after the solidification operation begins, PCB mainboard 5 can generate heat in the operation, if singly lean on the self-cooling, the required time can be longer, all can produce not good influence to the life and the result of use of equipment, heat abstractor 4 can open after the solidification operation finishes, in time dispels the heat the operation for whole device. The direction sensing device 2 is matched with the UV lamp 3 and the heat dissipation device 4 for use, when the irradiation surface of the UV glue curing device faces downwards in the starting state of the device, the direction sensing device 2 controls the UV lamp 3 to irradiate through the PCB mainboard 5 after sensing, and the curing operation is started; after the curing operation is finished, the UV adhesive curing device is inverted, and after the direction sensing device 2 senses the UV adhesive curing device, the heat dissipation device 4 is controlled by the PCB mainboard 5 to start heat dissipation work and cool in time. Furthermore, when the curing operation or the heat dissipation operation is performed, the UV glue curing device is placed in the opposite direction, and the direction sensing device 2 automatically stops the operation after sensing.
In this embodiment, the housing 6 is further provided with a control switch 13, and the control switch 13 is connected with the PCB main board 5. Further comprising a lens 12, said lens 12 being arranged below said housing 6. The control switch 13 controls whether the UV adhesive curing device starts to work, and after it is determined that the curing operation (irradiation surface is downward) or the heat dissipation operation (irradiation surface is upward) is performed, the control switch 13 is turned on, so that the corresponding operation can be performed. The ultraviolet rays emitted from the UV lamp 3 are emitted to the part to be cured coated with the UV paste through the lens 12.
Example two
As shown in fig. 1-2, the UV adhesive curing apparatus provided in this embodiment further includes a battery 8 and a charging port 9, where the battery 8 is disposed in the housing 6 and connected to the PCB main board 5, and the charging port 9 is disposed on the housing 6. The battery 8 is through charge mouthful 9 and supply the electric quantity for it, battery 8 provides required electric power for whole UV glues solidification equipment, charge mouthful 9 and can design into different interfaces, such as Type-c interface, Lightning interface and Micro USB interface.
In this embodiment, the housing 6 is provided with a nixie tube 10 and a capacity lamp 11, and the nixie tube 10 and the capacity lamp 11 are both connected with the PCB main board 5. When the UV adhesive curing device is used for curing, the UV adhesive curing device generally irradiates for 3-10 seconds, and in order to control the time of the UV adhesive curing device, the nixie tube 10 is used for displaying the working time of the curing operation, so that the UV adhesive curing device is convenient for a user to control. The UV glues the device that the solidification equipment used for charging, has sufficient electric quantity for guaranteeing that it uses the time, capacity lamp 11 can show battery 8's electric quantity to in time charge when the electric quantity is not enough.
The above is to the utility model provides a UV glues solidification equipment and has introduced in detail, to the general technical personnel in this field, according to the utility model discloses the thought of embodiment all has the change part on concrete implementation and application scope, to sum up, this description content should not be understood as right the utility model discloses a restriction.
Claims (6)
1. A UV adhesive curing apparatus, comprising: connecting plate (1), direction induction system (2), UV lamp (3), heat abstractor (4) and PCB mainboard (5) all set up on connecting plate (1), direction induction system (2), UV lamp (3) and heat abstractor (4) all with PCB mainboard (5) are connected.
2. The UV adhesive curing device according to claim 1, further comprising a housing (6) and an upper cover (7), wherein the upper cover (7) is arranged on the housing (6) and connected with the connecting board (1), and the connecting board (1), the direction sensing device (2), the UV lamp (3), the heat dissipation device (4) and the PCB main board (5) are all arranged in the housing (6).
3. The UV glue curing apparatus according to claim 2, further comprising a battery (8) and a charging port (9), wherein the battery (8) is disposed in the housing (6) and connected to the PCB main board (5), and the charging port (9) is disposed on the housing (6).
4. The UV adhesive curing device according to claim 2, wherein a nixie tube (10) and a capacity lamp (11) are arranged on the housing (6), and the nixie tube (10) and the capacity lamp (11) are both connected with the PCB main board (5).
5. The UV glue curing apparatus of claim 2, further comprising a lens (12), said lens (12) being disposed below said housing (6).
6. The UV adhesive curing device according to claim 2, wherein a control switch (13) is further disposed on the housing (6), and the control switch (13) is connected to the PCB main board (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022598051.2U CN213967535U (en) | 2020-11-11 | 2020-11-11 | UV glue curing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022598051.2U CN213967535U (en) | 2020-11-11 | 2020-11-11 | UV glue curing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213967535U true CN213967535U (en) | 2021-08-17 |
Family
ID=77262351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022598051.2U Active CN213967535U (en) | 2020-11-11 | 2020-11-11 | UV glue curing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213967535U (en) |
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2020
- 2020-11-11 CN CN202022598051.2U patent/CN213967535U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000 501 (503), building C4, Zhonghao industrial city, xiangjiaotang community, Bantian street, Longgang District, Shenzhen, Guangdong Province (engaged in production and operation activities in 201, building 61, shunchengji Industrial Park, Langkou community, Dalang street, Longhua District, Shenzhen) Patentee after: Shenzhen Aixun intelligent hardware Co.,Ltd. Address before: 518000 Room 501, building C4, Zhonghao industrial city, xiangjiaotang community, Bantian street, Longgang District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Jiecheng Information Technology Co.,Ltd. |
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| CP03 | Change of name, title or address |