CN213965419U - Water inlet filtering device of semiconductor electroplating high-pressure pump - Google Patents

Water inlet filtering device of semiconductor electroplating high-pressure pump Download PDF

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Publication number
CN213965419U
CN213965419U CN202022668507.8U CN202022668507U CN213965419U CN 213965419 U CN213965419 U CN 213965419U CN 202022668507 U CN202022668507 U CN 202022668507U CN 213965419 U CN213965419 U CN 213965419U
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China
Prior art keywords
filter
water
water inlet
seal cover
pressure pump
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CN202022668507.8U
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魏忠亮
王林
杜荣华
王健
魏冬
朱立海
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Qingdao Tairuisi Microelectronics Co Ltd
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Qingdao Tairuisi Microelectronics Co Ltd
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Abstract

The utility model discloses a high-pressure pump filter equipment of intaking is electroplated to semiconductor, be in including cartridge filter and setting the portion of intaking and the portion of play water at cartridge filter both ends, the portion of intaking with cartridge filter threaded connection, go out water portion with cartridge filter integrated into one piece, go out the last fixedly connected with filter tube of water portion, just filter tube is located inside the cartridge filter, evenly be provided with a plurality of filtration pores of crossing on the filter tube, the outside cover of filter tube is equipped with the filter screen subassembly, the filter screen subassembly is kept away from go out the fixed flexible seal cover that is provided with of portion of intaking one end, just the portion of intaking inboard is provided with flexible seal cover assorted butt joint constant head tank, flexible seal cover with the laminating of filter tube surface and sliding contact. The utility model discloses can filter the high-pressure pump and intake, reduce the input of impurity, ensure the life of high-pressure pump, reduce the clean frequency of nozzle simultaneously, improve the production efficiency that the semiconductor was electroplated.

Description

Water inlet filtering device of semiconductor electroplating high-pressure pump
Technical Field
The utility model relates to a semiconductor electroplates the field, especially relates to a high-pressure pump filter equipment that intakes is electroplated to semiconductor.
Background
Electroplating is a surface processing method in which cations of a metal to be plated in a plating solution are deposited on the surface of a base metal by electrolysis using the base metal to be plated as a cathode in a salt solution containing the metal to be plated, thereby forming a plating layer. The plating performance is different from that of the base metal, and has new characteristics. The coating can be divided into protective coating, decorative coating and other functional coatings according to the functions of the coatings. Electroplating treatment is the main process in the whole production process. According to the requirements of the parts, one or more single metal or alloy electroplating processes are selected to carry out electroplating or immersion plating and other processing on the parts, so as to achieve the purposes of corrosion resistance, wear resistance and attractive appearance.
But among the prior art straight line plating machine high-pressure pump is in the use, and the impurity in the water source of intaking gets into the high-pressure pump module through the water pump easily, causes the wearing and tearing of high-pressure pump seal assembly and leads to the high-pressure water pressure not enough, and the impurity in the water source of intaking gets into high-pressure water nozzle easily in addition, causes high-pressure water nozzle to block up, has certain defect.
Disclosure of Invention
An object of the utility model is to provide a high-pressure pump filter equipment of intaking is electroplated to semiconductor can filter the high-pressure pump and intake, reduces the input of impurity, guarantees the life of high-pressure pump, reduces the clean frequency of nozzle simultaneously, has improved the production efficiency that the semiconductor was electroplated.
The utility model discloses a realize like this:
a semiconductor electroplating high-pressure pump inlet water filtering device comprises a filter cartridge, and a water inlet part and a water outlet part which are arranged at two ends of the filter cartridge, wherein the water inlet part is in threaded connection with the filter cartridge, and the water outlet part and the filter cartridge are integrally formed;
go out fixedly connected with filter tube in the water portion, just filter tube is located inside the cartridge filter, evenly be provided with a plurality of filtration pores of crossing on the filter tube, the outside cover of filter tube is equipped with the filter screen subassembly, the filter screen subassembly is kept away from the fixed flexible seal cover that is provided with of water portion one end, just the portion inboard of intaking is provided with flexible seal cover assorted butt joint constant head tank, the flexible seal cover with the laminating of filter tube surface and sliding contact.
The water inlet portion is provided with a plurality of water inlet holes distributed in the circumferential direction in a penetrating mode, and the water inlet holes are communicated with the external space of the filtering pipeline.
The filter screen assembly comprises a raw water diversion net and a permeation water channel net, and a micron filter membrane is arranged between the raw water diversion net and the permeation water channel net.
The inside of the water outlet part is provided with a sealing groove, a sealing sleeve is magnetically adsorbed in the sealing groove, and the sealing sleeve is fixedly arranged at the end part of the filter screen assembly.
The telescopic sealing sleeve is connected with the outer connecting sleeve and the inner connecting sleeve in a sliding mode, and a positioning spring is connected between the outer connecting sleeve and the inner connecting sleeve.
The utility model has the advantages of reasonable design, can filter the high-pressure pump and intake, reduce the input of impurity, ensure the life of high-pressure pump, can also avoid the jam of high-pressure water nozzle simultaneously effectively, reduce the clean frequency of nozzle, improve the production efficiency that the semiconductor was electroplated.
Drawings
FIG. 1 is a schematic view of the whole structure of the inlet water filtering device of the semiconductor electroplating high-pressure pump of the present invention;
FIG. 2 is a schematic diagram of the internal structure of the filter cartridge of the inlet water filtering device of the semiconductor electroplating high-pressure pump according to the present invention;
FIG. 3 is an enlarged view of the structure at A in FIG. 2 of the high-pressure pump inlet water filter for semiconductor electroplating according to the present invention;
fig. 4 is a schematic view of the structure of the telescopic sealing sleeve of the water inlet filtering device of the semiconductor electroplating high-pressure pump of the utility model.
In the drawings, 1, a filter cartridge; 2. a water inlet part; 3. a water outlet part; 4. a filtration pipeline; 5. a screen assembly; 6. a telescopic sealing sleeve; 7. butting positioning grooves; 8. a water inlet hole; 9. a raw water diversion net; 10. a water passage net; 11. a micro-filtration membrane; 12. a sealing groove; 13. sealing sleeves; 14. an outer connecting sleeve; 15. an inner connecting sleeve; 16. a positioning spring; 17. and (4) filtering holes.
Detailed Description
The invention will be further explained with reference to the drawings and the specific embodiments.
Referring to fig. 1 to 4, a water inlet filtering device for a semiconductor electroplating high-pressure pump includes a filter cartridge 1, and a water inlet portion 2 and a water outlet portion 3 disposed at two ends of the filter cartridge 1, wherein the water inlet portion 2 is connected to the filter cartridge 1 by a thread, and the water outlet portion 3 is integrally formed with the filter cartridge 1.
Go out fixedly connected with filter tube 4 on the water portion 3, just filter tube 4 is located inside cartridge filter 1, evenly be provided with a plurality of filtration pores 17 of crossing on the filter tube 4, the outside cover of filter tube 4 is equipped with filter screen subassembly 5, filter screen subassembly 5 keeps away from 3 one ends of water portion are fixed and are provided with flexible seal cover 6, just 2 inboard of the portion of intaking is provided with flexible seal cover 6 assorted butt joint constant head tank 7, flexible seal cover 6 with filter tube 4 surface laminating and sliding contact.
The water inlet part 2 is provided with a plurality of water inlet holes 8 distributed circumferentially in a penetrating manner, and the water inlet holes 8 are communicated with the external space of the filter pipeline 4. Through the inlet opening 8 that the circumference distributes, can send into cartridge filter 1 with the water source dispersion of intaking, avoid the rivers velocity of flow too big and cause the damage to filter screen subassembly 5, played certain guard action.
The filter screen assembly 5 comprises a raw water diversion net 9 and a permeation water channel net 10, and a micron filter membrane 11 is arranged between the raw water diversion net 9 and the permeation water channel net 10. The micron filtration membrane 11 is fixedly supported by the raw water diversion net 9 and the permeable water channel net 10, so that the smooth operation of the filtration operation is ensured.
3 inboards of play water portion are provided with seal groove 12, magnetic adsorption has seal cover 13 in seal groove 12, seal cover 13 is fixed to be set up filter screen subassembly 5 tip. The sealing groove 12 is matched with the sealing sleeve 13 to form a good sealing effect, so that a water inlet source is prevented from directly entering the filtering pipeline 4 from the end part of the filtering screen assembly 5.
The telescopic sealing sleeve 6 is slidably connected with an outer connecting sleeve 14 and an inner connecting sleeve 15, and a positioning spring 16 is connected between the outer connecting sleeve 14 and the inner connecting sleeve 15. The telescopic sealing sleeve 6 realizes the telescopic function by utilizing the relative sliding between the outer connecting sleeve 14 and the inner connecting sleeve 15, thereby realizing the positioning and the fixing of the end part of the filtering pipeline 4.
In use, the filter screen assembly 5 is first slipped onto the filter conduit 4 and the sealing sleeve 13 is magnetically attracted into the sealing groove 12, and then the end of the telescoping sealing sleeve 6 is aligned with the docking location slot 7 of the water inlet 2 and the filter cartridge 1 is screwed, thus completing the installation of the filter device. Assemble the device into the high-pressure pump end of intaking afterwards, the water source of intaking flows in from 2 one ends of portion of intaking, and after filter screen subassembly 5's filtration, the impurity filtering is in cartridge filter 1, and the rivers large granule impurity that flows out from play water portion 3 is whole to be got rid of, has ensured the life of high-pressure pump, can also avoid the jam of high-pressure water nozzle effectively simultaneously, has reduced the clean frequency of nozzle, has improved the production efficiency that the semiconductor was electroplated.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention, therefore, any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention should be included in the scope of the present invention.

Claims (5)

1. The water inlet filtering device for the semiconductor electroplating high-pressure pump comprises a filter cylinder (1), and a water inlet part (2) and a water outlet part (3) which are arranged at two ends of the filter cylinder (1), wherein the water inlet part (2) is in threaded connection with the filter cylinder (1), and the water outlet part (3) and the filter cylinder (1) are integrally formed;
the method is characterized in that: go out fixedly connected with filter tube (4) on water portion (3), just filter tube (4) are located inside cartridge filter (1), evenly be provided with a plurality of filtration pores (17) of crossing on filter tube (4), the outside cover of filter tube (4) is equipped with filter screen subassembly (5), filter screen subassembly (5) are kept away from go out fixed flexible seal cover (6) that is provided with of water portion (3) one end, just it is provided with to intake portion (2) inboard flexible seal cover (6) assorted butt joint constant head tank (7), flexible seal cover (6) with filter tube (4) surface laminating and sliding contact.
2. The apparatus as claimed in claim 1, wherein the apparatus comprises: the water inlet part (2) is provided with a plurality of water inlet holes (8) distributed in the circumferential direction in a penetrating mode, and the water inlet holes (8) are communicated with the external space of the filtering pipeline (4).
3. The apparatus as claimed in claim 1, wherein the apparatus comprises: the filter screen assembly (5) comprises a raw water diversion screen (9) and a permeation water channel screen (10), and a micron filter membrane (11) is arranged between the raw water diversion screen (9) and the permeation water channel screen (10).
4. The apparatus as claimed in claim 1, wherein the apparatus comprises: go out water portion (3) inboard and be provided with seal groove (12), magnetic adsorption has seal cover (13) in seal groove (12), seal cover (13) are fixed to be set up filter screen subassembly (5) tip.
5. The apparatus as claimed in claim 1, wherein the apparatus comprises: the telescopic sealing sleeve (6) is in sliding connection with an outer connecting sleeve (14) and an inner connecting sleeve (15), and a positioning spring (16) is connected between the outer connecting sleeve (14) and the inner connecting sleeve (15).
CN202022668507.8U 2020-11-18 2020-11-18 Water inlet filtering device of semiconductor electroplating high-pressure pump Active CN213965419U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022668507.8U CN213965419U (en) 2020-11-18 2020-11-18 Water inlet filtering device of semiconductor electroplating high-pressure pump

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022668507.8U CN213965419U (en) 2020-11-18 2020-11-18 Water inlet filtering device of semiconductor electroplating high-pressure pump

Publications (1)

Publication Number Publication Date
CN213965419U true CN213965419U (en) 2021-08-17

Family

ID=77263805

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022668507.8U Active CN213965419U (en) 2020-11-18 2020-11-18 Water inlet filtering device of semiconductor electroplating high-pressure pump

Country Status (1)

Country Link
CN (1) CN213965419U (en)

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