CN213960650U - Device for SMT (surface mount technology) mounting of electronic device with irregular shape - Google Patents
Device for SMT (surface mount technology) mounting of electronic device with irregular shape Download PDFInfo
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- CN213960650U CN213960650U CN202023066298.6U CN202023066298U CN213960650U CN 213960650 U CN213960650 U CN 213960650U CN 202023066298 U CN202023066298 U CN 202023066298U CN 213960650 U CN213960650 U CN 213960650U
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- suction nozzle
- spring
- fixedly connected
- recess
- lug
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Abstract
The utility model discloses a device for SMT mounting of electronic devices with irregular shapes, which comprises a mounting part, wherein the bottom of the mounting part is fixedly connected with a first paster suction nozzle, the outer side of the mounting part is sleeved with a second paster suction nozzle, two sides of the second paster suction nozzle are provided with movable rods in a penetrating way, two movable rods are respectively sleeved with a first spring, the movable rods are fixedly connected with limiting plates, one end of the first spring is fixedly connected with the second paster suction nozzle, the other end of the first spring is fixedly connected with the limiting plates, the inner top of the second paster suction nozzle is fixedly connected with a conical groove, two sides of the mounting part are provided with limiting grooves, two sides of the mounting part are respectively provided with a fixed groove below the limiting grooves, the outer side of the mounting part is sleeved with a conical lug, the conical groove is matched with the conical lug, the side wall of the conical groove is provided with a plurality of lugs, the side wall of the conical lug is provided with a plurality of grooves, the lug is matched with the groove, so that the aim of conveniently replacing the suction nozzle is fulfilled.
Description
Technical Field
The utility model relates to an electron device technical field specifically is a device that carries out SMT paster to irregularly shaped electron device.
Background
The SMT paster refers to a series of process flows processed on the basis of a PCB (printed circuit board), the PCB is a printed circuit board, electronic products used by people in a common situation are all designed by adding various capacitors, resistors and other electronic components to the PCB according to a designed circuit diagram, so that various different SMT paster processing processes are needed for processing the electric appliances in different shapes and colors, the SMT paster device is automatic equipment for attaching electronic components to the PCB, and a suction nozzle is used for extracting the electronic components from the device. Because electronic components are different in size and shape, a single suction nozzle can only suck a part of electronic components, and then the suction nozzle needs to be replaced to realize the electronic components with different sizes, but the method for replacing the suction nozzle of the existing device is complex.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a carry out device of SMT paster to irregular electron device of appearance, solved the problem mentioned in the above-mentioned technical background. In order to achieve the above object, the utility model provides a following technical scheme: a device for carrying out SMT (surface mount technology) chip mounting on an electronic device with irregular shape comprises a mounting portion, wherein a first chip suction nozzle is fixedly connected to the bottom of the mounting portion, a second chip suction nozzle is sleeved on the outer side of the mounting portion, movable rods penetrate through two sides of the second chip suction nozzle, a first spring is sleeved on each of the two movable rods, a limiting plate is fixedly connected to each movable rod, one end of the first spring is fixedly connected with the second chip suction nozzle, the other end of the first spring is fixedly connected with the limiting plate, a conical groove is fixedly connected to the inner top of the second chip suction nozzle, limiting grooves are formed in two sides of the mounting portion, fixing grooves are formed in two sides of the mounting portion below the limiting grooves, a conical convex block is sleeved on the outer side of the mounting portion, the conical groove is matched with the conical convex block, and a plurality of convex blocks are formed in the side wall of the conical groove, the side wall of the conical convex block is provided with a plurality of grooves, and the convex block is matched with the grooves.
Preferably, the side wall of the conical groove is provided with a rubber sealing ring.
Preferably, a second spring is arranged above the fixed groove, the second spring is fixedly connected with a fixed plate, one end of the second spring is connected with the fixed plate, and the other end of the second spring is connected with the fixed groove.
Preferably, the fixed plate is connected with a first inclined block, one end of the movable rod is provided with a second inclined block, and the first inclined block is matched with the second inclined block.
Preferably, one end of the movable rod, which is far away from the second inclined block, is provided with anti-skid grains.
To sum up, the utility model discloses following beneficial effect has:
this kind carries out device of SMT paster to irregular electron device of appearance, when carrying out the lift to less electron device, move second paster suction nozzle toward the top of installation department, make the movable rod insert in the spacing recess, realize the top of spacing second paster suction nozzle at the installation department, when carrying out the lift to great electron device, make the movable rod extract in the spacing recess, spring one is extruded this moment, then move spacing second paster suction nozzle toward the below of installation department, then make very movable rod insert fixed recess through the elasticity that spring one resumes, make second paster suction nozzle fix on the installation department, second paster suction nozzle is in the below of second paster suction nozzle this moment, conical projection and conical groove's lateral wall laminating is in the same place simultaneously, make the top of second paster suction nozzle form an inclosed space, reached and changed the convenient purpose of suction nozzle.
Drawings
FIG. 1 is a block diagram of the present invention;
fig. 2 is the utility model discloses use the schematic structure of second paster suction nozzle.
In the figure: the mounting part 1, the first paster suction nozzle 2, the second paster suction nozzle 3, the movable rod 301, the first spring 302, the limiting plate 303, the tapered groove 304, the bump 305, the limiting groove 4, the fixed groove 5, the second spring 501, the fixed plate 502, the tapered bump 6, the groove 601, the first sloping block 7 and the second sloping block 701.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, a device for performing SMT chip mounting on an electronic device with irregular shape, comprising a mounting portion 1, wherein a suction nozzle is mounted on a chip mounting device through the mounting portion 1, a first chip suction nozzle 2 is fixedly connected to the bottom of the mounting portion 1, a second chip suction nozzle 3 is sleeved on the outer side of the mounting portion 1, the second chip suction nozzle 3 can move up and down on the outer side of the mounting portion 1, the second chip suction nozzle 3 is of an internal hollow structure, movable rods 301 are arranged on two sides of the second chip suction nozzle 3 in a penetrating manner, the movable rods 301 penetrate through the side walls of the second chip suction nozzle 3, a spring one 302 is sleeved on each of the two movable rods 301, a limiting plate 303 is fixedly connected to each movable rod 301, one end of the spring one 302 is fixedly connected to the second chip suction nozzle 3, the other end of the spring one 302 is fixedly connected to the limiting plate, a tapered groove 304 is fixedly connected to the top of the second chip suction nozzle 3, spacing recess 4 has been seted up to the both sides of installation department 1, fixed recess 5 has all been seted up in the below of spacing recess 4 to the both sides of installation department 1, the outside cover of installation department 1 is equipped with toper lug 6, toper recess 304 and the cooperation of toper lug 6, a plurality of lugs 305 have been seted up on the lateral wall of toper recess 304, be equipped with a plurality of recesses 601 on the lateral wall of toper lug 6, insert in recess 601 through lug 305, make the lateral wall of toper recess 304 and the lateral wall laminating of toper lug 6 inseparabler, the convenient purpose of change suction nozzle has been reached.
The side wall of the conical groove 304 is provided with a rubber sealing ring, the rubber sealing ring enables the side wall of the conical groove 304 and the side wall of the conical bump 6 to be attached to form a sealed space, a second spring 501 is arranged above the fixed groove 5, the second spring 501 is fixedly connected with a fixed plate 502, one end of the second spring 501 is connected with the fixed plate 502, the other end of the second spring 501 is connected with the fixed groove 5, after the movable rod 301 is completely inserted into the fixed groove 5, the fixed plate 502 downwards extrudes the movable rod 301 through the elastic force recovered by the second spring 501, the movable rod 301 downwards extrudes the second patch suction nozzle 3, the side wall of the conical groove 304 made by the second patch suction nozzle 3 extrudes the side wall of the conical bump 6, the second patch suction nozzle 3 forms a sealed space, the movable rod 301 is extruded through the elastic force recovered by the second spring 501, and the effect of fixing and limiting the second patch suction nozzle 3 is achieved, the fixed plate 502 is connected with the sloping block I7, and the one end of movable rod 301 is equipped with sloping block II 701, and the inclined plane cooperation of the inclined plane sloping block II 701 of sloping block I7, the movable rod 301 is kept away from the one end of sloping block II 701 is equipped with anti-skidding line, through anti-skidding line, conveniently extracts movable rod 301.
The utility model discloses a use method and the theory of operation of a device for SMT paster to the irregular electron device of appearance are as follows, when lifting up the less electron device, move second paster suction nozzle 3 towards the top of installation department 1, make movable rod 301 insert in spacing recess 4, realize spacing second paster suction nozzle 3 in the top of installation department, at this moment extract the electron device through first paster suction nozzle 2, when lifting up the bigger electron device, pull out movable rod 301 in spacing recess 4, spring one 302 is extruded at this moment, then move second paster suction nozzle 3 towards the bottom of installation department 1, then make movable rod 301 insert in fixed recess 5 through the elasticity that spring one 302 resumes, the inclined plane of inclined block two 701 on movable rod 301 extrudes the inclined plane of inclined block one 7 on the fixed plate 502 at this moment, make fixed plate 502 extrude spring two 501, after movable rod 301 inserts fixed recess 5 completely, the elasticity that resumes through spring two 501 this moment makes fixed plate 502 down extrude movable rod 301, movable rod 301 extrudees second paster suction nozzle 3 downwards, second paster suction nozzle 3 fixes on installation department 1 this moment, second paster suction nozzle 3 is in the below of first paster suction nozzle 2, simultaneously toper lug 6 is in the same place with the lateral wall laminating of toper recess 304, lug 305 enters into in the recess 601, make the top of second paster suction nozzle 3 form an inclosed space, use second paster suction nozzle 3 to absorb to big electron device this moment, the convenient mesh of change suction nozzle has been reached.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.
Claims (5)
1. The utility model provides a carry out device of SMT paster to irregular electron device of appearance, includes installation department (1), its characterized in that: the mounting structure comprises a mounting portion (1), wherein a first patch suction nozzle (2) is fixedly connected to the bottom of the mounting portion (1), a second patch suction nozzle (3) is sleeved on the outer side of the mounting portion (1), movable rods (301) penetrate through two sides of the second patch suction nozzle (3), a first spring (302) is sleeved on each of the two movable rods (301), a limiting plate (303) is fixedly connected to each movable rod (301), one end of the first spring (302) is fixedly connected with the second patch suction nozzle (3), the other end of the first spring (302) is fixedly connected with the limiting plate (303), and a conical groove (304) is fixedly connected to the inner top of the second patch suction nozzle (3);
spacing recess (4) have been seted up to the both sides of installation department (1), the both sides of installation department (1) are in fixed recess (5) have all been seted up to the below of spacing recess (4), the outside cover of installation department (1) is equipped with toper lug (6), toper recess (304) with toper lug (6) cooperation, a plurality of lugs (305) have been seted up on the lateral wall of toper recess (304), be equipped with a plurality of recesses (601) on the lateral wall of toper lug (6), lug (305) with recess (601) cooperation.
2. An apparatus for SMT chip mounting of electronic devices having irregular shapes according to claim 1, wherein: and a rubber sealing ring is arranged on the side wall of the conical groove (304).
3. An apparatus for SMT chip mounting of electronic devices having irregular shapes according to claim 1, wherein: a second spring (501) is arranged above the fixed groove (5), the second spring (501) is fixedly connected with a fixed plate (502), one end of the second spring (501) is connected with the fixed plate (502), and the other end of the second spring (501) is connected with the fixed groove (5).
4. An apparatus for SMT chip mounting of electronic devices having irregular shapes according to claim 3, wherein: the fixed plate (502) is connected with a first inclined block (7), one end of the movable rod (301) is provided with a second inclined block (701), and the first inclined block (7) is matched with the second inclined block (701).
5. An apparatus for SMT chip mounting of electronic devices having irregular shapes according to claim 4, wherein: and anti-skid grains are arranged at one end, far away from the second inclined block (701), of the movable rod (301).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202023066298.6U CN213960650U (en) | 2020-12-18 | 2020-12-18 | Device for SMT (surface mount technology) mounting of electronic device with irregular shape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202023066298.6U CN213960650U (en) | 2020-12-18 | 2020-12-18 | Device for SMT (surface mount technology) mounting of electronic device with irregular shape |
Publications (1)
Publication Number | Publication Date |
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CN213960650U true CN213960650U (en) | 2021-08-13 |
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CN202023066298.6U Active CN213960650U (en) | 2020-12-18 | 2020-12-18 | Device for SMT (surface mount technology) mounting of electronic device with irregular shape |
Country Status (1)
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CN (1) | CN213960650U (en) |
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2020
- 2020-12-18 CN CN202023066298.6U patent/CN213960650U/en active Active
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