CN213947049U

CN213947049U - Silicon wafer fragmentation device

Info

Publication number: CN213947049U
Application number: CN202022749678.3U
Authority: CN
Inventors: 朱亚文; 申先海
Original assignee: Chongqing Changjie Electronics Co ltd
Current assignee: Chongqing Changjie Electronics Co ltd
Priority date: 2020-11-25
Filing date: 2020-11-25
Publication date: 2021-08-13
Anticipated expiration: 2030-11-25

Abstract

The utility model provides a silicon wafer fragmentation device, which comprises a handle, a rolling head and a rolling rod, wherein the handle is connected with the rolling head, two ends of the rolling rod are connected with the rolling head through detachable parts, the transverse end is fixedly connected with a shell through double-sided adhesive or a nut, the detachable parts are a bracket, the bracket is provided with a jack for inserting a rolling shaft of the rolling rod, the bracket is connected with the rolling head through a nut, the contact surface of the bracket and the rolling head is a plane, the rolling head is provided with a screw hole for the nut to pass through, the bracket is provided with a screw hole for inserting the nut, the handle and the rolling head are integrally formed, the outer layer of the handle is provided with a rubber sleeve, and the rubber sleeve is provided with anti-skid lines, the utility model realizes the fragmentation of the silicon wafer by arranging the handle, the rolling head and the rolling rod, the detachable support is arranged, so that the rolling rod can be replaced conveniently and regularly, and the quality and efficiency of silicon wafer fragmentation are guaranteed.

Description

Silicon wafer fragmentation device

Technical Field

The utility model discloses silicon chip processing technology field, concretely relates to cracked device of silicon chip.

Background

In the processing process of the diode, the silicon wafer needs to be subjected to splitting treatment, so that a single silicon wafer for subsequent processing is obtained, and due to the lack of a special splitting device, the splitting efficiency and quality are seriously reduced.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem of above-mentioned lobe of a leaf inefficiency, the embodiment of the utility model provides a cracked device of silicon chip, including handle, rolling head and roll extrusion stick, the handle with the rolling head links to each other, roll extrusion stick both ends are connected through detachable parts on the rolling head.

Furthermore, the transverse end and the shell are fixedly connected through a double-faced adhesive tape or a nut, the detachable component is a support, and the support is provided with a jack into which a rolling shaft of the rolling rod can be inserted.

Further, the support is connected with the rolling head through a nut.

Furthermore, the contact surface of the support and the rolling head is a plane, the rolling head is provided with a screw hole for the nut to pass through, and the support is provided with a screw hole for the nut to insert.

Further, the handle and the rolling head are integrally formed.

Further, the outer layer of the handle is sleeved with a rubber sleeve.

Furthermore, the rubber sleeve is provided with anti-skid lines.

Furthermore, the rolling rod comprises a roller and a rubber rod, the through hole in the middle of the rubber rod can be used for the roller to pass through, and the length of the roller is greater than that of the rubber rod.

The utility model has the advantages that:

the utility model discloses a set up handle, rolling head and roll extrusion stick, realize cracked to the silicon chip, set up the detachable support and can be convenient for the periodic replacement roll extrusion stick to guarantee cracked quality of silicon chip and efficiency.

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural diagram of a silicon wafer cracking device in an embodiment of the present invention.

Fig. 2 is a schematic view of the rolled bar of fig. 1 with the rolled bar removed.

Fig. 3 is a schematic structural diagram of a rolling bar in an embodiment of the present invention.

Reference numerals: 10-handle, 11-rubber sleeve, 20-rolling head, 30-rolling rod, 31-rolling shaft, 32-rubber rod, 40-support, 41-jack and 50-nut.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Referring to fig. 1 to 3, fig. 1 is a schematic structural diagram of a silicon wafer cracking device in an embodiment of the present invention, the silicon wafer cracking device includes a handle 10, a rolling head 20, and a rolling rod 30, the handle 10 is connected to the rolling head 20, and two ends of the rolling rod 30 are connected to the rolling head 20 through detachable components.

In some preferred embodiments, the detachable component is a bracket 40, and the bracket 40 is provided with a socket 41 into which the roller 31 of the rolling bar 30 can be inserted.

In certain preferred embodiments, the support 40 is coupled to the roller head 20 by a nut 50.

In some preferred embodiments, the contact surface of the bracket 40 and the rolling head 20 is a plane, the rolling head 20 is provided with a screw hole through which the nut 50 can pass, and the bracket 40 is provided with a screw hole through which the nut 50 can be inserted.

In certain preferred embodiments, the handle 10 is integrally formed with the roller head 20.

In some preferred embodiments, the handle 10 is sleeved with a rubber sleeve 11, and specifically, the rubber sleeve 11 is provided with anti-skid lines.

In some preferred embodiments, the rolling rod 30 includes a roller 31 and a rubber rod 32, a through hole is formed in the middle of the rubber rod 32 for the roller 31 to pass through, and the length of the roller 31 is greater than that of the rubber rod 32.

The utility model discloses a theory of operation is: when the rolling rod is assembled for use, one bracket 40 is fixed on the rolling head 20 through the nut 50, and then one end of the rolling rod 30 is inserted into the insertion hole 41 on the bracket 40; then inserting the other end of the rolling rod 30 into the insertion hole 41 of the other bracket 40, and fixing the bracket 40 on the rolling head 20 through the nut 50; when the split silicon wafer is used, the rubber rod 32 on the rolling rod 30 splits the silicon wafer without scratching the surface of the silicon wafer; after a period of use, the rubber rod 32 may become flawed on its surface, at which time the nut 50 can be unscrewed and the roll bar 30 removed for maintenance or replacement.

In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, so that the scope of the present invention shall be determined by the scope of the appended claims.

Claims

1. A silicon chip fragmentation device is characterized in that: the rolling head comprises a handle (10), a rolling head (20) and a rolling rod (30), wherein the handle (10) is connected with the rolling head (20), and two ends of the rolling rod (30) are connected to the rolling head (20) through detachable parts.

2. The wafer fragmenting device of claim 1, wherein: the detachable component is a support (40), and the support (40) is provided with an insertion hole (41) into which a rolling shaft (31) of the rolling rod (30) can be inserted.

3. The wafer fragmenting device of claim 2, wherein: the support (40) is connected with the rolling head (20) through a nut (50).

4. A wafer fragmenting device as defined in claim 3, wherein: the contact surface of the support (40) and the rolling head (20) is a plane, a screw hole for the nut (50) to pass through is formed in the rolling head (20), and a screw hole for the nut (50) to insert into is formed in the support (40).

5. The wafer fragmenting device of claim 1, wherein: the handle (10) and the rolling head (20) are integrally formed.

6. The wafer fragmenting device of claim 1, wherein: the outer layer of the handle (10) is sleeved with a rubber sleeve (11).

7. The wafer fragmenting device of claim 6, wherein: the rubber sleeve (11) is provided with anti-skid lines.

8. The wafer fragmenting device of claim 1, wherein: the rolling rod (30) comprises a rolling shaft (31) and a rubber rod (32), a through hole in the middle of the rubber rod (32) can be used for the rolling shaft (31) to penetrate through, and the length of the rolling shaft (31) is larger than that of the rubber rod (32).