CN213945863U - Clamping and positioning device and end socket wafer polishing equipment - Google Patents

Abstract

The utility model provides a centre gripping positioner and head disk equipment of polishing for the centre gripping positioner of head disk equipment of polishing, including operation panel, centre gripping subassembly, actuating mechanism, support frame and support pressing the subassembly, the centre gripping subassembly includes first clamping jaw and the first clamping jaw centre gripping head disk second clamping jaw of cooperation, and the support frame sets up on the operation panel, supports pressing the subassembly to set up on the support frame. Then place the in-process of polishing on the operation panel with the head disk, utilize actuating mechanism to drive first clamping jaw and second clamping jaw centre gripping head disk along the first direction, support simultaneously and press the subassembly to support the head disk to press on the operation panel towards the second direction of the first direction of perpendicular to, then can press from both sides the head disk tightly to be located on the operation panel, stability when reinforcing the head disk and polishing, avoid the head disk to take place to rock at the in-process of polishing, not only make things convenient for the operator to polish the edge of head disk, reduce the operation degree of difficulty of polishing, and can improve the quality and the efficiency of polishing.

Description

Clamping and positioning device and end socket wafer polishing equipment

Technical Field

The utility model belongs to the technical field of the head processing equipment, in particular to a centre gripping positioner and head disk equipment of polishing are related to.

Background

In the process of processing and manufacturing the end socket, burrs, adhering slag and the like usually exist at the edge of a wafer of the end socket. Burrs, adhering slag and the like on the edge of the end socket wafer are easy to abrade or scratch a stamping grinding tool for stamping the end socket. The damaged punching grinding tool can damage the surface of the punched end socket, so that the edge of the end socket wafer needs to be polished into a round angle. At present, generally the manual work adopts electronic angle mill to polish to the edge of head disk, and not only work intensity of labour is big, and it is inefficient to polish, and the head disk rocks at the in-process of polishing easily moreover, leads to the quality of polishing to be difficult to guarantee.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the utility model is to provide a carry out the centre gripping positioner of centre gripping location to the head disk when polishing the head disk.

In order to achieve the above object, the utility model adopts the following technical scheme: provided is a clamping and positioning device, including:

the operation table is used for placing the end socket wafer so that an operator can polish the edge of the end socket wafer;

the clamping assembly is used for clamping and fixing the end socket wafer on the operating platform along a first direction and comprises a first clamping jaw and a second clamping jaw which is matched with the first clamping jaw to clamp the end socket wafer so as to position the end socket wafer on the operating platform;

the driving mechanism is used for driving the first clamping jaw and the second clamping jaw to clamp the end socket wafer;

the support frame is arranged on the operating platform; and

and the pressing component is used for pressing the end socket wafer on the operating platform towards a second direction, the second direction is perpendicular to the first direction, and the pressing component is arranged on the supporting frame.

Furthermore, the clamping assembly further comprises a third clamping jaw which is matched with the first clamping jaw and the second clamping jaw to clamp the end socket wafer, the first clamping jaw, the second clamping jaw and the third clamping jaw are arranged at equal intervals along the circumferential direction of the end socket wafer, the driving mechanism comprises a first roller lead screw which drives the first clamping jaw to be close to or far away from the end socket wafer, a second roller lead screw which drives the second clamping jaw to be close to or far away from the end socket wafer, and a third roller lead screw which drives the third clamping jaw to be close to or far away from the end socket wafer, the axial direction of a first lead screw of the first roller lead screw is perpendicular to the second direction, the first clamping jaw is fixed at one end of the first lead screw close to the end socket wafer, the axial direction of a second lead screw of the second roller lead screw is perpendicular to the second direction, the second clamping jaw is fixed at one end of the second lead screw close to the end socket wafer, the axial direction of a third screw rod of the third roller screw rod is perpendicular to the second direction, and the third clamping jaw is fixed at one end, close to the end socket wafer, of the third screw rod.

Further, the cross sections of the first clamping jaw, the second clamping jaw and the third clamping jaw are arc-shaped with the radian of 120 degrees, and arc-shaped concave surfaces of the first clamping jaw, the second clamping jaw and the third clamping jaw face the outer peripheral surface of the end socket wafer respectively.

Furthermore, the clamping and positioning device further comprises a lifting assembly for respectively driving the first clamping jaw, the second clamping jaw and the third clamping jaw to move up and down along the second direction, and the first roller lead screw, the second roller lead screw and the third roller lead screw are respectively connected with the corresponding lifting assembly.

Furthermore, the lifting assembly comprises a lifting cylinder and a supporting table for supporting the lifting cylinder, the cylinder body of the lifting cylinder is fixed on the supporting table, and the first roller lead screw, the second roller lead screw and the third roller lead screw are respectively connected with the corresponding piston rods of the lifting cylinder.

Furthermore, the support frame comprises a bottom plate, a support arm and a rib plate, wherein the bottom plate is supported and fixed on the operating platform, the support plate is erected on the bottom plate, one end of the support arm is connected with one side, away from the bottom plate, of the support plate, the rib plate is arranged on the side face of the support plate, the support arm extends in the direction perpendicular to the second direction, and the abutting-pressing component is fixed on one side, facing the operating platform, of the support arm.

Another object of the embodiment of the utility model is to provide a when polishing the head disk, accessible clamping and positioning device carries out the head disk equipment of polishing of centre gripping location to the head disk.

In order to achieve the above object, the utility model adopts the following technical scheme: the utility model provides an end socket disk equipment of polishing, include centre gripping positioner with locate polisher body on the operation panel.

Further, the head disk equipment of polishing still including rotate set up in revolving stage and drive on the operation panel revolving stage pivoted motor, the motor is fixed set up in on the operation panel, the revolving stage with the output of motor links to each other.

Further, head disk equipment of polishing still including being used for polishing the dust extraction that the dust that produces during the head disk was collected with be used for carrying the dust extremely dust extraction's dust absorption pipeline, dust absorption pipeline's one end with dust extraction intercommunication, dust absorption pipeline's other end port closes on the revolving stage sets up.

Further, the pressing component comprises a rotary seat which is arranged corresponding to the rotary table and used for pressing the end socket wafer against a pressing plate on the rotary table and rotatably installing the pressing plate on the support frame, the rotary seat is rotatably arranged on the support frame, and the pressing plate is fixedly installed on the rotary seat.

Further, the pressing assembly further comprises a driving device, the pressing plate moves towards the rotating platform to enable the pressing plate to press the end socket wafer against a pressing cylinder on the rotating platform, a cylinder body of the pressing cylinder is fixed on the supporting frame, the rotating seat is rotatably arranged at one end of a piston rod of the pressing cylinder, and the pressing plate is connected with one end, deviating from the pressing cylinder, of the rotating seat.

The embodiment of the utility model provides an in above-mentioned one or more technical scheme, compare with prior art, have one of following beneficial effect at least:

the embodiment of the utility model provides an in centre gripping positioner and head disk equipment of polishing, place the in-process of polishing on the operation panel with the head disk, utilize actuating mechanism to follow the first clamping jaw of first direction drive and the second clamping jaw centre gripping head disk, support simultaneously and press the subassembly to support the head disk to press on the operation panel towards the second direction of the first direction of perpendicular to, then can press from both sides the head disk tightly to be located on the operation panel, stability when reinforcing head disk is polished, avoid the head disk to take place to rock at the in-process of polishing, not only make things convenient for the operator to polish to the edge of head disk, reduce the operation degree of difficulty of polishing at the edge of head disk, and can improve the quality and the efficiency that the head disk was polished.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.

Fig. 1 is a schematic top view of a clamping and positioning device according to an embodiment of the present invention;

fig. 2 is a schematic side view of a head wafer polishing apparatus having a clamping and positioning device according to an embodiment of the present invention;

fig. 3 is a partially enlarged schematic view of a portion a in fig. 2.

Wherein, in the figures, the respective reference numerals:

1-an operation table;

2-a clamping assembly; 21-a first jaw; 22-a second jaw; 23-a third jaw; 24-a concave arc;

3-a support frame; 31-a base plate; 32-a support plate; 33-a support arm; 34-rib plate;

4-a pressing component; 41-a pressing plate; 42-a rotating base; 43-pressing cylinder;

5-a first roller screw; 6-a second roller screw rod; 7-a third roller screw;

8-a lifting assembly; 81-lifting cylinder; 82-a support table;

9-end enclosure circular sheet; 10-a rotating table; 20-a motor;

30-a dust suction device; 40-a dust suction pipeline; 50-speed reducer.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "connected" or "disposed" to another element, it can be directly on the other element or be indirectly connected to the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.

Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in some embodiments" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Referring to fig. 1, a clamping and positioning device according to an embodiment of the present invention will now be described. The embodiment of the utility model provides a clamping position device is applicable to head disk equipment of polishing to the in-process that the equipment of polishing at the head disk was polished to the edge of head disk, carries out the clamping position to the head disk. This centre gripping positioner includes operation panel 1, centre gripping subassembly 2, actuating mechanism, support frame 3 and supports and press subassembly 4, and operation panel 1 is used for placing head disk 9, and then the usable polisher body of operator is polished the head disk 9 edge of placing on operation panel 1. After placing head disk 9 on operation panel 1, in order to prevent that head disk 9 from taking place to rock at the in-process of polishing, accessible centre gripping subassembly 2 is fixed in operation panel 1 along the centre gripping of first direction with head disk 9, makes things convenient for the operator to polish to head disk 9's edge, reduces the operation degree of difficulty of polishing at head disk 9's edge. Specifically, the clamping assembly 2 includes a first clamping jaw 21 and a second clamping jaw 22 cooperating with the first clamping jaw 21 to clamp the head disc 9, and the driving mechanism is configured to drive the first clamping jaw 21 and the second clamping jaw 22 to clamp the head disc 9, so as to position the head disc 9 on the operation table 1. The support frame 3 is arranged on the operation table 1, and the abutting component 4 is arranged on the support frame 3. When the driving mechanism drives the first clamping jaw 21 and the second clamping jaw 22 to clamp the end socket wafer 9, the pressing component 4 presses the end socket wafer 9 onto the operating platform 1 towards the second direction perpendicular to the first direction, so that the end socket wafer 9 is clamped and positioned, the stability of the end socket wafer 9 during polishing is enhanced, the end socket wafer 9 is prevented from shaking easily in the polishing process, and the polishing quality of the end socket wafer 9 is guaranteed.

The embodiment of the utility model provides a clamping position device, compared with the prior art, place the in-process of polishing on operation panel 1 with head disk 9, utilize actuating mechanism to follow the first clamping jaw 21 of first direction drive and the centre gripping of second clamping jaw 22 head disk 9, support simultaneously and press 4 second directions of the first direction of perpendicular to with head disk 9 to press on operation panel 1, then can press from both sides head disk 9 tight location on operation panel 1, stability when reinforcing head disk 9 polishes, avoid head disk 9 to take place to rock at the in-process of polishing, not only make things convenient for the operator to polish to head disk 9's edge, reduce the operation degree of difficulty of polishing at head disk 9's edge, and can improve the quality and the efficiency that head disk 9 polished.

Referring to fig. 1, in some embodiments, the clamping assembly 2 further includes a third clamping jaw 23 cooperating with the first clamping jaw 21 and the second clamping jaw 22 to clamp the end socket wafer 9, the first clamping jaw 21, the second clamping jaw 22 and the third clamping jaw 23 are arranged at equal intervals along the circumference of the end socket wafer 9, the driving mechanism includes a first roller screw 5 driving the first clamping jaw 21 to be close to or away from the end socket wafer 9, a second roller screw 6 driving the second clamping jaw 22 to be close to or away from the end socket wafer 9, and a third roller screw 7 driving the third clamping jaw 23 to be close to or away from the end socket wafer 9, an axial direction of the first screw of the first roller screw 5 is perpendicular to the second direction, the first clamping jaw 21 is fixed at one end of the first screw close to the end socket wafer 9, an axial direction of the second screw 6 is perpendicular to the second direction, the second clamping jaw 22 is fixed at one end of the second screw close to the wafer 9, the axial direction of a third screw rod of the third roller screw rod 7 is vertical to the second direction, and a third clamping jaw 23 is fixed at one end of the third screw rod close to the end socket wafer 9. In this embodiment, by adopting the above technical scheme, the third clamping jaw 23 which is matched with the first clamping jaw 21 and the second clamping jaw 22 to clamp the end socket wafer 9 is arranged, and the first clamping jaw 21, the second clamping jaw 22 and the third clamping jaw 23 are arranged at equal intervals along the circumferential direction of the end socket wafer 9, so that the first clamping jaw 21, the second clamping jaw 22 and the third clamping jaw 23 are synchronously driven to work by the first roller screw 5, the second roller screw 6 and the third roller screw 7 of the driving mechanism, the first clamping jaw 21, the second clamping jaw 22 and the third clamping jaw 23 are driven to move towards the end socket wafer 9 on the operation table 1, and finally the end socket wafer 9 is clamped and positioned by the first clamping jaw 21, the second clamping jaw 22 and the third clamping jaw 23 from different directions. Because the first clamping jaw 21, the second clamping jaw 22 and the third clamping jaw 23 move oppositely from three different directions to clamp and position the end socket wafer 9, the stability of the end socket wafer 9 is further enhanced, and the end socket wafer 9 is prevented from shaking in the polishing process.

Referring to fig. 1, in some embodiments, the cross sections of the first clamping jaw 21, the second clamping jaw 22, and the third clamping jaw 23 are arc-shaped with an arc of 120 °, and the arc-shaped concave surfaces 24 of the first clamping jaw 21, the second clamping jaw 22, and the third clamping jaw 23 face the outer circumferential surface of the head wafer 9, respectively. In the embodiment, by adopting the above technical scheme, the cross sections of the first clamping jaw 21, the second clamping jaw 22 and the third clamping jaw 23 are arc-shaped with the radian of 120 degrees, the arc-shaped concave surfaces 24 of the first clamping jaw 21, the second clamping jaw 22 and the third clamping jaw 23 are respectively directed to the outer peripheral surface of the end socket wafer 9, the arc concave surfaces 24 of the first clamping jaw 21, the second clamping jaw 22 and the third clamping jaw 23 are respectively matched with the shape and the size of the peripheral surface of the end socket wafer 9, then when the first jaw 21, second jaw 22 and third jaw 23 are moved toward each other from three different directions to clamp the closure disc 9 in place, the arc-shaped concave surfaces 24 of the first clamping jaw 21, the second clamping jaw 22 and the third clamping jaw 23 just form a circular positioning cavity for accommodating the end socket circular sheet 9, so that the stability of the end socket circular sheet 9 can be well maintained, and the contact area between the clamping jaw and the end socket wafer 9 is increased, and the damage to the outer peripheral surface of the end socket wafer 9 is avoided.

Referring to fig. 1, in some embodiments, the clamping and positioning device further includes a lifting assembly 8 for driving the first clamping jaw 21, the second clamping jaw 22, and the third clamping jaw 23 to move up and down along the second direction, and the first roller screw 5, the second roller screw 6, and the third roller screw 7 are respectively connected to the corresponding lifting assembly 8. In this embodiment, through adopting above-mentioned technical scheme, through setting up lifting unit 8, then usable each lifting unit 8 drives first clamping jaw 21, second clamping jaw 22, third clamping jaw 23 lift removal respectively, makes clamping positioning device can adapt to the clamping position of the head disk 9 of co-altitude not, and the commonality is better.

Referring to fig. 2, in some embodiments, the lifting assembly 8 includes a lifting cylinder 81 and a supporting platform 82 supporting the lifting cylinder 81, a cylinder body of the lifting cylinder 81 is fixed on the supporting platform 82, and the first roller screw 5, the second roller screw 6, and the third roller screw 7 are respectively connected to a piston rod of the corresponding lifting cylinder 81. In this embodiment, through adopting above-mentioned technical scheme, adopt each lift cylinder 81 to drive first clamping jaw 21, second clamping jaw 22, third clamping jaw 23 lift removal respectively, can realize the synchronous lift removal of first clamping jaw 21, second clamping jaw 22, third clamping jaw 23 fast and stably.

Referring to fig. 2, in some embodiments, the supporting frame 3 includes a bottom plate 31 supported and fixed on the console 1, a supporting plate 32 standing on the bottom plate 31, a supporting arm 33 having one end connected to a side of the supporting plate 32 away from the bottom plate 31, and a rib 34 disposed on a side of the supporting plate 32, wherein the supporting arm 33 extends along a direction perpendicular to the second direction, and the pressing component 4 is fixed on a side of the supporting arm 33 facing the console 1. In this embodiment, by adopting the above technical scheme, the bottom plate 31 is arranged on the operation table 1, the support plate 32 is erected on the bottom plate 31, the bottom side of the support plate 32 is fixedly connected with the bottom plate 31, the top side of the support plate 32 is connected with one end of the support arm 33, the rib plates 34 are arranged on one side or two sides of the support plate 32, and the connection strength of the support plate 32 is enhanced through the rib plates 34, so that the stability of the support frame 3 supporting the abutting component 4 is enhanced, and the stability of the abutting component 4 abutting against the end enclosure wafer 9 is further improved.

Referring to fig. 2, an embodiment of the present invention further provides a head wafer polishing apparatus, which includes a polisher body (not shown) disposed on the console 1 and the clamping and positioning device provided in any of the above embodiments. Because the head wafer polishing equipment has all the technical characteristics of the clamping and positioning device provided in any embodiment, the head wafer polishing equipment has the same technical effects as the clamping and positioning device.

Referring to fig. 2 and fig. 3, in some embodiments, the end socket wafer polishing apparatus further includes a rotating table 10 rotatably disposed on the operating platform 1 and a motor 20 for driving the rotating table 10 to rotate, the motor 20 is fixedly disposed on the operating platform 1, and the rotating table 10 is connected to an output end of the motor 20. The rotary table 10 may be a three-phase asynchronous motor that is driven by a speed reducer 50 to rotate, and the speed of rotation is adjusted by a frequency converter. In this embodiment, through adopting above-mentioned technical scheme, set up revolving stage 10 through rotating on operation panel 1, utilize motor 20 drive revolving stage 10 rotatory rotation, only need place head disk 9 in revolving stage 10 like this, utilize the centre gripping positioner in above-mentioned arbitrary embodiment to fix a position head disk 9 centre gripping on revolving stage 10, through PLC control motor 20 work, just can polish to head disk 9's edge automatically, need not to rely on the manual work to polish, reduce intensity of labour, improve work efficiency. It can be understood that, in order to further improve the grinding efficiency, 2 grinding stations are arranged at positions close to the rotary table 10, one grinding station is used for rough grinding, the other grinding station is used for polishing grinding, and each grinding station can be adjusted in a front-back floating mode through an air cylinder.

Referring to fig. 1, in some embodiments, the end socket wafer polishing apparatus further includes a dust suction device 30 for collecting dust generated during polishing of the end socket wafer 9, and a dust suction duct 40 for conveying the dust to the dust suction device 30, wherein one end of the dust suction duct 40 is communicated with the dust suction device 30, and a port at the other end of the dust suction duct 40 is disposed adjacent to the rotating table 10. In this embodiment, through adopting above-mentioned technical scheme, through setting up dust extraction 30 and the dust absorption pipeline 40 of one end and dust extraction 30 intercommunication to close on revolving stage 10 setting with the other end port of dust absorption pipeline 40, then drive the dust that the rotatory in-process of polishing of head disk 9 produced at revolving stage 10, the other end port of accessible dust absorption pipeline 40 inhales dust extraction 30 and collects, and is little to the pollution of environment. It is understood that the dust suction device 30 can be, but not limited to, a dust collector, and in order to achieve better dust suction and collection effects, more than two dust suction devices 30 and dust suction pipes 40 can be correspondingly arranged.

Referring to fig. 2 and 3, in some embodiments, the pressing assembly 4 includes a pressing plate 41 disposed corresponding to the rotating table 10 for pressing the end-sealing wafer 9 against the rotating table 10, and a rotating base 42 for rotatably mounting the pressing plate 41 on the supporting frame 3, wherein the rotating base 42 is rotatably disposed on the supporting frame 3, and the pressing plate 41 is fixedly mounted on the rotating base 42. In this embodiment, through adopting above-mentioned technical scheme, rotate on support frame 3 and set up roating seat 42, with clamp plate 41 fixed mounting on roating seat 42, then when clamp plate 41 supported head disk 9 to press on revolving stage 10, clamp plate 41 can take place synchronous revolution along with revolving stage 10, then can not influence revolving stage 10 because clamp plate 41 supports pressing the interference to revolving stage 10 and drive head disk 9 rotation and polish.

Referring to fig. 2 and 3, in some embodiments, the pressing assembly 4 further includes a pressing cylinder 43 for driving the pressing plate 41 to move toward the rotating platform 10 so that the pressing plate 41 presses the end socket wafer 9 against the rotating platform 10, a cylinder body of the pressing cylinder 43 is fixed on the supporting frame 3, the rotating base 42 is rotatably disposed at one end of a piston rod of the pressing cylinder 43, and the pressing plate 41 is connected to one end of the rotating base 42 away from the pressing cylinder 43. In this embodiment, by adopting the above technical scheme, the supporting frame 3 is provided with the abutting cylinder 43, and the rotating base 42 is rotatably arranged at one end of the piston rod of the abutting cylinder 43, so that the abutting pressure of the pressing plate 41 on the end socket wafer 9 can be adjusted by using the abutting cylinder 43, and the abutting pressure of the pressing plate 41 on the end socket wafer 9 can be reasonably adjusted according to actual needs.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. The utility model provides a centre gripping positioner for head disk equipment of polishing, its characterized in that includes:

the operation table is used for placing the end socket wafer so that an operator can polish the edge of the end socket wafer;

the clamping assembly is used for clamping and fixing the end socket wafer on the operating platform along a first direction and comprises a first clamping jaw and a second clamping jaw which is matched with the first clamping jaw to clamp the end socket wafer so as to position the end socket wafer on the operating platform;

the driving mechanism is used for driving the first clamping jaw and the second clamping jaw to clamp the end socket wafer;

the support frame is arranged on the operating platform; and

and the pressing component is used for pressing the end socket wafer on the operating platform towards a second direction, the second direction is perpendicular to the first direction, and the pressing component is arranged on the supporting frame.

2. The clamping and positioning device as claimed in claim 1, wherein the clamping assembly further comprises a third clamping jaw for clamping the end socket wafer by matching with the first clamping jaw and the second clamping jaw, the first clamping jaw, the second clamping jaw and the third clamping jaw are arranged at equal intervals along the circumferential direction of the end socket wafer, the driving mechanism comprises a first roller screw for driving the first clamping jaw to be close to or away from the end socket wafer, a second roller screw for driving the second clamping jaw to be close to or away from the end socket wafer, and a third roller screw for driving the third clamping jaw to be close to or away from the end socket wafer, the axial direction of the first screw of the first roller screw is perpendicular to the second direction, the first clamping jaw is fixed at one end of the first screw close to the end socket wafer, and the axial direction of the second screw of the second roller is perpendicular to the second direction, the second clamping jaw is fixed at one end, close to the end socket wafer, of the second screw rod, the axial direction of a third screw rod of the third roller screw rod is perpendicular to the second direction, and the third clamping jaw is fixed at one end, close to the end socket wafer, of the third screw rod.

3. The clamping and positioning device as claimed in claim 2, wherein the cross sections of the first clamping jaw, the second clamping jaw and the third clamping jaw are arc-shaped with the radian of 120 degrees, and the arc-shaped concave surfaces of the first clamping jaw, the second clamping jaw and the third clamping jaw face to the outer peripheral surface of the end socket wafer respectively.

4. The clamping and positioning device of claim 3, further comprising a lifting assembly for driving said first jaw, said second jaw, and said third jaw to move up and down along said second direction, respectively, wherein said first roller lead screw, said second roller lead screw, and said third roller lead screw are connected to said respective lifting assemblies.

5. The clamping and positioning device of claim 4, wherein the lifting assembly comprises a lifting cylinder and a supporting platform for supporting the lifting cylinder, the cylinder body of the lifting cylinder is fixed on the supporting platform, and the first roller screw, the second roller screw and the third roller screw are respectively connected with the piston rods of the corresponding lifting cylinders.

6. A head wafer polishing apparatus comprising a polisher body provided on the operation table and the holding and positioning device according to any one of claims 1 to 5.

7. The end socket wafer grinding device as claimed in claim 6, further comprising a rotating table rotatably disposed on the operating platform and a motor for driving the rotating table to rotate, wherein the motor is fixedly disposed on the operating platform, and the rotating table is connected with an output end of the motor.

8. The end socket wafer polishing device as claimed in claim 7, further comprising a dust collection device for collecting dust generated during polishing of the end socket wafer and a dust collection pipeline for conveying the dust to the dust collection device, wherein one end of the dust collection pipeline is communicated with the dust collection device, and a port at the other end of the dust collection pipeline is arranged close to the rotating table.

9. The end socket wafer polishing device as claimed in claim 7, wherein the pressing assembly comprises a pressing plate disposed corresponding to the rotating table to press the end socket wafer against the rotating table and a rotating base rotatably mounted on the supporting frame, the rotating base being rotatably mounted on the supporting frame, the pressing plate being fixedly mounted on the rotating base.

10. The end socket wafer polishing device as claimed in claim 9, wherein the pressing assembly further comprises a pressing cylinder for driving the pressing plate to move towards the rotating table so that the pressing plate presses the end socket wafer against the rotating table, a cylinder body of the pressing cylinder is fixed on the support frame, the rotating seat is rotatably arranged at one end of a piston rod of the pressing cylinder, and the pressing plate is connected with one end of the rotating seat, which is far away from the pressing cylinder.

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