CN213907258U - Power module PCB layout structure for treadmill - Google Patents
Power module PCB layout structure for treadmill Download PDFInfo
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- CN213907258U CN213907258U CN202022818788.0U CN202022818788U CN213907258U CN 213907258 U CN213907258 U CN 213907258U CN 202022818788 U CN202022818788 U CN 202022818788U CN 213907258 U CN213907258 U CN 213907258U
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Abstract
The utility model discloses a power module PCB layout structure used on a running machine, which comprises a transversely extending PCB and an electric element group arranged on the upper surface of the PCB, wherein the electric element group comprises a transformer, a first transistor and a second transistor; the transformer is arranged on the upper surface of the PCB in the middle, and the left side and the right side of the upper surface of the PCB are respectively provided with a first heat dissipation supporting aluminum plate and a second heat dissipation supporting aluminum plate which are vertically arranged; the transformer is positioned in a region between the first heat dissipation support aluminum plate and the second heat dissipation support aluminum plate, and heat dissipation gaps are reserved among the transformer, the first heat dissipation support aluminum plate and the second heat dissipation support aluminum plate; the first transistor and the second transistor are respectively arranged on the inner side surfaces of the first heat dissipation supporting aluminum plate and the second heat dissipation supporting aluminum plate, and the first transistor, the second transistor and the transformer are arranged at intervals. The heat dissipation of the transformer is facilitated, the influence of heat on electrical elements on the PCB is reduced, and the service life of the PCB is prolonged.
Description
Technical Field
The utility model relates to a power module PCB board layout structure especially indicates a power module PCB board layout structure for on treadmill.
Background
In the prior art, a transformer on a power module PCB generates heat in the operation process, the heat accumulation can influence the normal operation of other electrical elements, and the PCB on the treadmill is not provided with a heat dissipation device for dissipating heat of the transformer, so that the function of the power module is insensitive or damaged under the condition that the treadmill operates for a long time. In addition, the electronic elements on the PCB are not good in arrangement reasonableness, and the heat dissipation performance of the whole PCB structure is limited;
therefore, there is a need for an improved PCB board for a treadmill.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a power module PCB layout structure for a treadmill, which is advantageous for heat dissipation of a transformer, thereby reducing the influence of heat on other electrical components on the PCB and increasing the service life of the PCB.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a power module PCB layout structure used on a treadmill comprises a transversely extending PCB and an electric element group arranged on the upper surface of the PCB, wherein the electric element group comprises a transformer, a first transistor and a second transistor; wherein:
the transformer is arranged on the upper surface of the PCB in the middle, and the left side and the right side of the upper surface of the PCB are respectively provided with a first heat dissipation supporting aluminum plate and a second heat dissipation supporting aluminum plate which are vertically arranged; the transformer is positioned in a region between the first heat dissipation support aluminum plate and the second heat dissipation support aluminum plate, and heat dissipation gaps are reserved among the transformer, the first heat dissipation support aluminum plate and the second heat dissipation support aluminum plate;
the first transistor and the second transistor are respectively arranged on the inner side surfaces of the first heat dissipation supporting aluminum plate and the second heat dissipation supporting aluminum plate, and the first transistor, the second transistor and the transformer are arranged at intervals.
As a preferable scheme, the electrical component group further includes an input terminal, an output terminal, an X capacitor, an EMI inductor, a first filter capacitor, a second filter capacitor, a high-voltage capacitor, and a bridge rectifier;
the input terminal is positioned at the front end of the upper surface of the PCB; the X capacitor, the EMI inductor, the bridge rectifier and the high-voltage capacitor are sequentially arranged on the upper surface of the PCB at intervals from right to left, and the X capacitor, the EMI inductor, the bridge rectifier and the high-voltage capacitor are uniformly positioned in the rear side area of the input terminal and the front side area of the transformer; the first filter capacitor and the second filter capacitor are arranged at the left side and the right side at intervals and are located on the rear side of the transformer, and the output terminal is located at the rear end of the upper surface of the PCB and is located in the rear side area of the first filter capacitor.
As a preferable scheme, the first transistor and the second transistor are respectively screwed on the inner side surfaces of the first heat dissipation supporting aluminum plate and the second heat dissipation supporting aluminum plate.
As a preferable scheme, the front end of the first heat dissipation supporting aluminum plate exceeds the front end of the second heat dissipation supporting aluminum plate, and the rear end of the second heat dissipation supporting aluminum plate exceeds the rear end of the first heat dissipation supporting aluminum plate.
As a preferable scheme, the first filter capacitor, the second filter capacitor and the second transistor are arranged right-to-left.
As a preferred scheme, the front end and the rear end of the PCB are both provided with installation positioning holes.
As a preferable scheme, an avoiding notch is formed at the lower side of the rear end of the first heat dissipation support aluminum plate.
Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme:
the heat dissipation support aluminum plates are arranged on the left side and the right side of the PCB, and the transformer is positioned between the two heat dissipation support aluminum plates, so that the heat dissipation of the transformer is facilitated, the influence of heat on other electrical elements on the PCB is reduced, and the service life of the PCB is prolonged; meanwhile, the radiating support aluminum plates are arranged on the two sides of the PCB and play a role in reinforcing the PCB structure, particularly when the PCB is installed and applied, the radiating support aluminum plates have the radiating and supporting protection functions, when the shell is collided, pressed and the like, a supporting space is defined by the limited radiating support aluminum plates, and the electrical elements on the PCB cannot be easily influenced;
secondly, one side of the transistor is fixed on the radiating fin, so that the stability of the transistor is improved, the transistor cannot fall off under the condition of shaking, and the normal operation of the PCB is ensured; the transistor is better installed, positioned and protected in bearing mode, and the heat dissipation effect is good.
To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a perspective view of a preferred embodiment of the present invention;
FIG. 2 is a top view of the preferred embodiment of the present invention;
fig. 3 is a front view of a preferred embodiment of the present invention;
fig. 4 is a schematic circuit diagram of a preferred embodiment of the present invention.
The attached drawings indicate the following:
10. PCB board 20, electric component group
21. Transformer 22a, first transistor
22b, a second transistor 23, an input terminal
24. Output terminal 25, X capacitance
26. EMI inductor 27a, first filter capacitor
27b, a second filter capacitor 28, a high voltage capacitor
29. Bridge rectifier 30a, first heat dissipation support aluminum plate
30b, a second heat dissipation support aluminum plate 101, and a positioning hole
301. Avoiding the gap.
Detailed Description
Referring to fig. 1 to 4, a specific structure of a preferred embodiment of the present invention is shown, which includes a PCB 10 extending laterally and an electrical component group 20 disposed on an upper surface of the PCB 10, wherein the electrical component group 20 includes a transformer 21, a first transistor 22a, and a second transistor 22 b; wherein:
the transformer 21 is arranged on the upper surface of the PCB 10 in the middle, and the first heat dissipation support aluminum plate 30a and the second heat dissipation support aluminum plate 30b which are vertically arranged are respectively arranged on the left side and the right side of the upper surface of the PCB 10; the transformer 21 is located in a region between the first heat dissipation support aluminum plate 30a and the second heat dissipation support aluminum plate 30b, and heat dissipation gaps are reserved between the transformer 21 and the first heat dissipation support aluminum plate 30a and the second heat dissipation support aluminum plate 30 b; the transformer 21 is an electrical component with large heat dissipation on the PCB, so that the transformer 21 is favorably and pertinently cooled by the heat dissipation support plate arranged for the transformer 21, and adverse effects on the transformer 21 and other electronic components caused by failure of timely heat dissipation of the transformer 21 are avoided;
the first transistor 22a and the second transistor 22b are respectively mounted on the inner side surfaces of the first heat dissipation supporting aluminum plate 30a and the second heat dissipation supporting aluminum plate 30b, and the first transistor 22a and the second transistor 22b are arranged at intervals from the transformer 21.
Specifically, the electrical component group 20 further includes an input terminal 23, an output terminal 24, an X capacitor 25 (collectively called as X2 (X1/X3/MKP)) for suppressing power supply electromagnetic interference, an EMI filter, a spark elimination circuit, etc. to ensure that the finished electronic product meets EMC requirements, an EMI inductor 26 (Common mode inductor, also called as Common mode Choke, is commonly used in a switching power supply of a computer for filtering Common mode electromagnetic interference signals, in the board design, the Common mode inductor also serves as EMI filter for suppressing electromagnetic wave radiation emission generated by a high-speed signal line, a first filter capacitor 27a (filter capacitor, an energy storage device installed at two ends of a rectifier circuit for reducing ac ripple factor and improving high-efficiency smooth dc output, in all circuits that need to convert ac power to dc power, the filter capacitor is arranged, so that the working performance of the electronic circuit is more stable, and meanwhile, the interference of alternating ripple waves to the electronic circuit is reduced), a second filter capacitor 27b, a high-voltage capacitor 28 (the high-voltage capacitor generally refers to a capacitor above 1kv or a capacitor above 10 kv; in the transmission line, a series compensation station can be formed by utilizing a high-voltage capacitor, the work conveying efficiency is improved in the work operation, and a bridge rectifier 29 (the bridge rectifier is formed by connecting four rectifier silicon chips in a bridge mode and encapsulating the four rectifier silicon chips by using insulating plastic materials; the function of the device is to convert alternating current generated by the alternating current generator into direct current so as to realize power supply to electric equipment and charge a storage battery; meanwhile, the current of the storage battery can be limited from flowing back to the generator, so that the generator is protected from being burnt out by the reverse current;
wherein, the input terminal 23 is located at the front end of the upper surface of the PCB board 10; the X capacitor 25, the EMI inductor 26, the bridge rectifier 29, and the high-voltage capacitor 28 are sequentially arranged on the upper surface of the PCB 10 from right to left at intervals, and the four capacitors are all located in the rear area of the input terminal 23 and in the front area of the transformer 21; the first filter capacitor 27a and the second filter capacitor 27b are arranged at left and right intervals and are located at the rear side of the transformer 21, and the output terminal 24 is located at the rear end of the upper surface of the PCB board 10 and is located in the rear side area of the first filter capacitor 27 a.
Furthermore, the front end of the first heat dissipation supporting aluminum plate 30a exceeds the front end of the second heat dissipation supporting aluminum plate 30b, and the rear end of the second heat dissipation supporting aluminum plate 30b exceeds the rear end of the first heat dissipation supporting aluminum plate 30a, the heat dissipation supporting aluminum plates adapt to the arrangement of electrical elements, so that the space arrangement of the PCB is more reasonable, the overall heat dissipation effect of the PCB is improved, meanwhile, the heat dissipation supporting aluminum plates are arranged on two sides of the PCB and play a role in reinforcing the PCB structure, especially when the PCB is installed and applied, the heat dissipation supporting aluminum plates have the functions of heat dissipation and support protection, when a shell is collided and pressed, a supporting space is defined by the limited heat dissipation supporting aluminum plates, and the electrical elements on the PCB cannot be easily influenced; the front end and the rear end of the PCB 10 are both provided with mounting positioning holes 101; the first filter capacitor 27a, the second filter capacitor 27b and the second transistor 22b are arranged right and left.
Preferably, the first transistor 22a and the second transistor 22b are respectively screwed on the inner side surfaces of the first heat dissipation supporting aluminum plate 30a and the second heat dissipation supporting aluminum plate 30b, so that the stability of the transistors is improved, the transistors cannot fall off under the condition of shaking, the normal operation of the PCB is ensured, the arrangement of the PCB is more compact, the space of the PCB is reasonably utilized, and the heat dissipation effect is better; an avoidance notch 301 is formed at the lower side of the rear end of the first heat dissipation support aluminum plate 30 a.
The utility model discloses a design focus lies in:
the heat dissipation support aluminum plates are arranged on the left side and the right side of the PCB, and the transformer is positioned between the two heat dissipation support aluminum plates, so that the heat dissipation of the transformer is facilitated, the influence of heat on other electrical elements on the PCB is reduced, and the service life of the PCB is prolonged; meanwhile, the radiating support aluminum plates are arranged on the two sides of the PCB and play a role in reinforcing the PCB structure, particularly when the PCB is installed and applied, the radiating support aluminum plates have the radiating and supporting protection functions, when the shell is collided, pressed and the like, a supporting space is defined by the limited radiating support aluminum plates, and the electrical elements on the PCB cannot be easily influenced;
secondly, one side of the transistor is fixed on the radiating fin, so that the stability of the transistor is improved, the transistor cannot fall off under the condition of shaking, and the normal operation of the PCB is ensured; the transistor is better installed, positioned and protected in bearing mode, and the heat dissipation effect is good.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.
Claims (7)
1. The utility model provides a power module PCB board layout structure for on treadmill which characterized in that: the circuit board comprises a PCB board extending transversely and an electric element group arranged on the upper surface of the PCB board, wherein the electric element group comprises a transformer, a first transistor and a second transistor; wherein:
the transformer is arranged on the upper surface of the PCB in the middle, and the left side and the right side of the upper surface of the PCB are respectively provided with a first heat dissipation supporting aluminum plate and a second heat dissipation supporting aluminum plate which are vertically arranged; the transformer is positioned in a region between the first heat dissipation support aluminum plate and the second heat dissipation support aluminum plate, and heat dissipation gaps are reserved among the transformer, the first heat dissipation support aluminum plate and the second heat dissipation support aluminum plate;
the first transistor and the second transistor are respectively arranged on the inner side surfaces of the first heat dissipation supporting aluminum plate and the second heat dissipation supporting aluminum plate, and the first transistor, the second transistor and the transformer are arranged at intervals.
2. The power module PCB board layout structure for use on a treadmill of claim 1, wherein: the electric element group also comprises an input terminal, an output terminal, an X capacitor, an EMI inductor, a first filter capacitor, a second filter capacitor, a high-voltage capacitor and a bridge rectifier;
the input terminal is positioned at the front end of the upper surface of the PCB; the X capacitor, the EMI inductor, the bridge rectifier and the high-voltage capacitor are sequentially arranged on the upper surface of the PCB at intervals from right to left, and the X capacitor, the EMI inductor, the bridge rectifier and the high-voltage capacitor are uniformly positioned in the rear side area of the input terminal and the front side area of the transformer; the first filter capacitor and the second filter capacitor are arranged at the left side and the right side at intervals and are located on the rear side of the transformer, and the output terminal is located at the rear end of the upper surface of the PCB and is located in the rear side area of the first filter capacitor.
3. The power module PCB board layout structure for use on a treadmill of claim 1, wherein: the first transistor and the second transistor are respectively screwed on the inner side surfaces of the first heat dissipation support aluminum plate and the second heat dissipation support aluminum plate.
4. The power module PCB board layout structure for use on a treadmill of claim 1, wherein: the front end of the first heat dissipation support aluminum plate exceeds the front end of the second heat dissipation support aluminum plate, and the rear end of the second heat dissipation support aluminum plate exceeds the rear end of the first heat dissipation support aluminum plate.
5. The power module PCB board layout structure for use on a treadmill of claim 2, wherein: the first filter capacitor, the second filter capacitor and the second transistor are arranged right-to-left.
6. The power module PCB board layout structure for use on a treadmill of claim 1, wherein: the front end and the rear end of the PCB are both provided with installation positioning holes.
7. The power module PCB board layout structure for use on a treadmill of claim 1, wherein: an avoiding notch is formed at the lower side of the rear end of the first heat dissipation support aluminum plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022818788.0U CN213907258U (en) | 2020-11-30 | 2020-11-30 | Power module PCB layout structure for treadmill |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022818788.0U CN213907258U (en) | 2020-11-30 | 2020-11-30 | Power module PCB layout structure for treadmill |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213907258U true CN213907258U (en) | 2021-08-06 |
Family
ID=77124581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022818788.0U Active CN213907258U (en) | 2020-11-30 | 2020-11-30 | Power module PCB layout structure for treadmill |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213907258U (en) |
-
2020
- 2020-11-30 CN CN202022818788.0U patent/CN213907258U/en active Active
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